阅读说明：本技术 高集成智能功率模块及电器设备 (High-integration intelligent power module and electrical equipment ) 是由 刘东子 冯宇翔 于 2018-06-13 设计创作，主要内容包括：本发明公开一种高集成智能功率模块及电器设备,该高集成智能功率模块包括：电路布线基板,电路布线基板的一侧表面设置有多个安装位；控制模块、整流桥、PFC功率开关模块及多个功率模块,设置于对应的安装位上；其中,控制模块与PFC功率开关模块之间通过各自的安装位和电路布线基板的电路布线电气连接；控制模块与多个功率模块之间通过各自的安装位和电路布线基板的电路布线电气连接。本发明解决了电控板采用多个分立的元器件实现时器件较多,装配复杂,以及自身的功耗较大,发热等也较严重,导致空调的热效率低,不利于空调器节能减排的问题。(The invention discloses a high-integration intelligent power module and electrical equipment, wherein the high-integration intelligent power module comprises: a circuit wiring substrate, wherein a plurality of mounting positions are arranged on one side surface of the circuit wiring substrate; the control module, the rectifier bridge, the PFC power switch module and the power modules are arranged on the corresponding mounting positions; the control module is electrically connected with the PFC power switch module through respective mounting positions and circuit wiring of the circuit wiring substrate; the control module is electrically connected to the plurality of power modules through the respective mounting positions and the circuit wiring of the circuit wiring board. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the components are more, the assembly is complex, the power consumption of the electric control board is larger, the heating is serious, the heat efficiency of the air conditioner is low, and the energy conservation and emission reduction of the air conditioner are not facilitated.)

1. A highly integrated smart power module, comprising:

a circuit wiring substrate, one side surface of which is provided with a plurality of mounting positions;

the control module, the rectifier bridge, the PFC power switch module and the power modules are arranged on the corresponding mounting positions;

the control module is electrically connected with the PFC power switch module through respective installation positions and circuit wiring of the circuit wiring substrate; the control module is electrically connected to the plurality of power modules through the respective mounting positions and the circuit wiring of the circuit wiring substrate.

2. The highly integrated smart power module of claim 1, wherein the highly integrated smart power module further comprises a heat sink plate,

the heat dissipation plate is arranged on one side of the circuit wiring substrate, which is provided with the control module, the rectifier bridge, the power switch module and the power modules, and is attached to or arranged in a gap with the control module, the rectifier bridge, the power switch module and the power modules;

or the heat dissipation plate is arranged on one side of the circuit wiring substrate, which is opposite to the control module, the rectifier bridge, the power switch module and the plurality of power modules.

3. The high integrated smart power module of claim 1, wherein the plurality of power modules includes at least a fan drive power module and a compressor drive power module.

4. The highly integrated smart power module of claim 1 further comprising an insulating layer attached to a side of the heat sink plate adjacent to the circuit wiring substrate.

5. The highly integrated smart power module of claim 1 further comprising a package housing that encapsulates the circuit wiring substrate, heat sink, control module, rectifier bridge, PFC power switch module, and plurality of power modules.

6. The high integrated smart power module of claim 5,

the heat dissipation plate is positioned inside the packaging shell or at least partially exposed outside the packaging shell,

and/or the presence of a gas in the gas,

the circuit wiring substrate is arranged inside the packaging shell or at least partially exposed outside the packaging shell.

7. The highly integrated smart power module as claimed in any one of claims 1 to 6, wherein said circuit wiring substrate has first and second ends opposite in a lengthwise direction thereof,

a first power supply pin, a second power supply pin, a power supply ground pin, a serial input pin, a serial output pin, a relay control port pin, a temperature sampling port pin, a debugging platelet port pin, an EE programming port pin, an MCU scanning port pin and an electronic expansion valve control port pin are sequentially arranged on one side edge of the circuit wiring substrate from the first end to the second end;

the other side of the circuit wiring substrate is sequentially provided with a first U-phase output pin, a first V-phase output pin, a first W-phase output pin, a second U-phase output pin, a second V-phase output pin, a second W-phase output pin, an alternating current input pin, an alternating current output pin, a PFC input pin, a PFC output pin, a bus voltage positive electrode pin and a bus voltage negative electrode pin from the first end to the second end.

8. The highly integrated smart power module as recited in any of claims 1 to 6, having first and second ends opposite in a lengthwise direction thereof,

a first power supply pin, a second power supply pin, a power supply ground pin, a serial input pin, a serial output pin, an MCU (microprogrammed control unit) scanning port pin, a bus voltage positive electrode pin and a bus voltage negative electrode pin are sequentially arranged on one side edge of the circuit wiring substrate from the first end to the second end;

the other side of the circuit wiring substrate is sequentially provided with a first U-phase output pin, a first V-phase output pin, a first W-phase output pin, a second U-phase output pin, a second V-phase output pin, a second W-phase output pin, an alternating current input pin, an alternating current output pin, a PFC input pin and a PFC output pin from the first end to the second end.

9. An electrical device comprising a highly integrated smart power module according to any of claims 1 to 8.

10. The electrical apparatus of claim 9, wherein the electrical apparatus is an air conditioner or a refrigerator.

Technical Field

The invention relates to the technical field of electronic circuits, in particular to a high-integration intelligent power module and electrical equipment.

Background

With the development of scientific and technological progress and social productivity, the problems of resource excessive consumption, environmental pollution, ecological destruction, climate warming and the like are increasingly prominent, and the green development, energy conservation and emission reduction become the transformation development direction of various enterprises and industrial fields. Therefore, how to reduce energy consumption of refrigeration equipment with large energy consumption, such as air conditioners, refrigerators and the like, and energy conservation becomes an effort direction of researchers.

Disclosure of Invention

The invention mainly aims to provide a highly-integrated intelligent power module and electrical equipment, and aims to improve the integration level of the integrated intelligent power module, realize the integrated drive control of a fan and a compressor, reduce the volume of an electric control board, solve the problem of convenience in installation and realize energy conservation and emission reduction.

To achieve the above object, the present invention provides a highly integrated smart power module, which includes:

a circuit wiring substrate, one side surface of which is provided with a plurality of mounting positions;

the control module, the rectifier bridge, the PFC power switch module and the power modules are arranged on the corresponding mounting positions;

the control module is electrically connected with the PFC power switch module through respective installation positions and circuit wiring of the circuit wiring substrate; the control module is electrically connected to the plurality of power modules through the respective mounting positions and the circuit wiring of the circuit wiring substrate.

Optionally, the highly integrated smart power module further comprises a heat sink plate,

the heat dissipation plate is arranged on one side of the circuit wiring substrate, which is provided with the control module, the rectifier bridge, the power switch module and the power modules, and is attached to or arranged in a gap with the control module, the rectifier bridge, the power switch module and the power modules;

or the heat dissipation plate is arranged on one side of the circuit wiring substrate, which is opposite to the control module, the rectifier bridge, the power switch module and the plurality of power modules.

Optionally, the plurality of power modules includes at least a fan drive power module and a compressor drive power module.

Optionally, the highly integrated smart power module further includes an insulating layer, and the insulating layer is attached to one side of the heat dissipation plate close to the circuit wiring substrate.

Optionally, the highly integrated smart power module further includes a package housing that packages the circuit wiring substrate, the heat dissipation plate, the control module, the rectifier bridge, the PFC power switch module, and the plurality of power modules.

Optionally, the heat dissipation plate is located inside the packaging shell or at least partially exposed outside the packaging shell,

and/or the circuit wiring substrate is positioned inside the packaging shell or at least partially exposed outside the packaging shell.

Alternatively, the circuit wiring substrate has first and second ends opposed in a longitudinal direction thereof,

a first power supply pin, a second power supply pin, a power supply ground pin, a serial input pin, a serial output pin, a relay control port pin, a temperature sampling port pin, a debugging platelet port pin, an EE programming port pin, an MCU scanning port pin and an electronic expansion valve control port pin are sequentially arranged on one side edge of the circuit wiring substrate from the first end to the second end;

the other side of the circuit wiring substrate is sequentially provided with a first U-phase output pin, a first V-phase output pin, a first W-phase output pin, a second U-phase output pin, a second V-phase output pin, a second W-phase output pin, an alternating current input pin, an alternating current output pin, a PFC input pin, a PFC output pin, a bus voltage positive electrode pin and a bus voltage negative electrode pin from the first end to the second end.

Optionally, having first and second ends opposite in their lengthwise direction,

a first power supply pin, a second power supply pin, a power supply ground pin, a serial input pin, a serial output pin, an MCU (microprogrammed control unit) scanning port pin, a bus voltage positive electrode pin and a bus voltage negative electrode pin are sequentially arranged on one side edge of the circuit wiring substrate from the first end to the second end;

the other side of the circuit wiring substrate is sequentially provided with a first U-phase output pin, a first V-phase output pin, a first W-phase output pin, a second U-phase output pin, a second V-phase output pin, a second W-phase output pin, an alternating current input pin, an alternating current output pin, a PFC input pin and a PFC output pin from the first end to the second end.

The invention also provides electric equipment which comprises the high-integration intelligent power module; a circuit wiring substrate, one side surface of which is provided with a plurality of mounting positions;

the control module, the rectifier bridge, the PFC power switch module and the power modules are arranged on the corresponding mounting positions;

the control module is electrically connected with the PFC power switch module through respective installation positions and circuit wiring of the circuit wiring substrate; the control module is electrically connected to the plurality of power modules through the respective mounting positions and the circuit wiring of the circuit wiring substrate.

Optionally, the electrical appliance is an air conditioner or a refrigerator.

The high-integration intelligent power module can shorten the distance between the control module and the rectifier bridge, between the PFC power switch module and among the plurality of power modules and reduce the electromagnetic interference caused by overlong jumper wires and excessive wires by integrally installing the control module, the rectifier bridge, the PFC power switch module and the plurality of power modules on the corresponding installation positions on the surface of one side of the circuit wiring substrate without connecting the control module, the rectifier bridge, the PFC power switch module and the plurality of power modules by wires. Meanwhile, the components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the number of components is large, so that the electric control board is difficult to assemble when being assembled to electric equipment, and the heat efficiency of the air conditioner is low, and the air conditioner is not beneficial to realizing energy conservation and emission reduction due to large power consumption, serious heating and the like of the air conditioner.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a highly integrated smart power module according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of another embodiment of the highly integrated smart power module of the present invention;

FIG. 3 is a schematic structural diagram of a highly integrated smart power module according to yet another embodiment of the present invention;

FIG. 4 is a schematic circuit diagram of an embodiment of a highly integrated smart power module according to the present invention;

FIG. 5 is a schematic diagram of an embodiment of the control module of FIG. 4;

FIG. 6 is a schematic diagram of a pin structure of an embodiment of the highly integrated smart power module of the present invention;

fig. 7 is a schematic diagram of a pin structure of another embodiment of the highly integrated intelligent power module according to the invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Circuit wiring board	11	PFC driving chip
130	Pin	12	Fan power driving chip
				10	Control module	13	Compressor power driving chip
20	Rectifier bridge	60	Heat radiation plate
				30	PFC power switch module	70	Packaging shell
40	Multiple power modules	80	Metal lead wire
				50	Insulating layer

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a high-integration intelligent power module.

In many electrical appliances such as air conditioners, washing machines, refrigerators, and the like, motors are provided to drive other loads to operate. For example, a conventional air conditioner generally includes an indoor unit and an outdoor unit, wherein the outdoor unit and the indoor unit are both provided with a motor and an electric control board for driving the motor to operate. Regarding the electric control board of the outdoor unit, the electric control board of the outdoor unit is mostly provided with an intelligent power module for driving the compressor, an intelligent power module for driving the fan, a main control module, a power module and other functional modules. These functional modules adopt the circuit module of discrete or partial integration to realize mostly, and the scattered each part of arranging at automatically controlled PCB board, but because automatically controlled board self structure, strong and weak electric isolation, prevent signal interference, heat dissipation etc. requirement, require the interval between each functional module to guarantee in safe distance for the automatically controlled board of off-premises station's volume is great, is unfavorable for the installation. Or disperse these on polylith circuit board, adopt the mode of wire jumper again to realize between main control module and other functional modules to and mutual electrical connection between each functional module, but the dispersion sets up each functional module and can lead to the wire jumper more and long, leads to electrical apparatus EMC performance to descend. And the electric control board of these two kinds of structures all can appear the device of electric control board more, lead to the assembly of off-premises station complicated, still can increase the manufacturing cost of air conditioner simultaneously, and the maintenance rate also can increase, is unfavorable for the stable use of air conditioner. More importantly, when the electric control board is realized by adopting a plurality of components, the energy consumption of the components is large, the heating is serious, the heat efficiency of the air conditioner is low, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated.

To solve the above problem, referring to fig. 1 to 5, in an embodiment of the present invention, the highly integrated smart power module 40 includes:

a circuit wiring substrate 100 having a plurality of mounting sites provided on one surface of the circuit wiring substrate 100;

the control module 10, the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 are arranged on the corresponding mounting positions;

wherein, the control module 10 and the PFC power switch module 30 are electrically connected with the circuit wiring inside the circuit wiring substrate 100 through respective mounting positions; the control module 10 and the plurality of power modules 40 are electrically connected to each other through the circuit wiring in the circuit wiring board 100 by their respective mounting positions.

Referring to fig. 4, fig. 4 is a schematic circuit diagram of an embodiment of the highly integrated smart power module 40; the input end of the rectifier bridge 20 is used for accessing an alternating current power supply, and the output end of the rectifier bridge 20 is connected with the input end of the PFC power switch module 30; the output end of the PFC power switch module 30 is connected to the power input ends of the plurality of power modules 40; the control terminals of the control module 10 are connected to the controlled terminal of the PFC power switch module 30 and the controlled terminals of the power modules 40 in a one-to-one correspondence. The control module 10 drives the PFC power switch module 30 to correct the dc voltage output by the rectifier bridge 20 and output the corrected dc voltage to the control module 10, so as to provide a stable working voltage for the control module 10, and output the dc power supply with the corrected power factor to each power module 40, and output a corresponding control signal at the control module 10, so as to control the plurality of power modules 40 to drive corresponding loads to work.

In this embodiment, the circuit wiring substrate 100 may be implemented by a circuit substrate made of a material such as a PCB, a lead frame, a cardboard, a half-glass fiber board, or a glass fiber board, so as to provide a mounting substrate for the circuit modules such as the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40, and the circuit wiring substrate 100 is provided with circuit wirings and mounting positions, i.e., pads. The circuit wiring is formed by forming corresponding lines and pads on the circuit wiring substrate 100 according to the circuit design of the highly integrated smart power module 40, and the circuit wiring may be specifically realized by copper foil laying, and etching the copper foil according to the preset circuit design, thereby forming a circuit wiring layer. The control module 10 is electrically connected with the PFC power switch module 30 through respective installation positions and circuit wiring; and the control module 10 and the plurality of power modules 40 are electrically connected by the respective mounting locations and the circuit wiring. The shape of the circuit wiring substrate 100 may be determined according to the specific positions and sizes of the control module 10 and the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 provided on the circuit wiring substrate 100, and may be a square shape, but is not limited to a square shape. It is understood that the control module 10 and the PFC power switch module 30 may also be electrically connected through metal leads 80, and that the control module 10 and the plurality of power modules 40 may also be electrically connected through metal leads 80.

In this embodiment, the rectifier bridge 20 may be implemented by combining four surface mount diodes, and the rectifier bridge 20 formed by the four surface mount diodes converts the input ac power into dc power and outputs the dc power.

In this embodiment, the PFC power switch module 30 may be implemented by only a PFC switch, or may further form a PFC circuit with other components such as a diode and an inductor to implement power factor correction on the dc power supply. The PFC circuit may be implemented by a passive PFC circuit to form a boost PFC circuit, a buck PFC circuit, or a boost PFC circuit. It is understood that, in practical applications, the positions and the connection relationship between the PFC power switch module 30 and the rectifier bridge 20 may be adaptively adjusted according to the setting type of the PFC circuit, and are not limited herein. The PFC power switch module 30 adjusts the power factor of the dc power input by the rectifier bridge 20 based on the control of the control module 10, and the adjusted dc power may generate driving voltages of various values, for example, voltages of 5V and 15V, through an external switching power circuit, and be respectively used for supplying power to the MCU and each IPM driver IC.

In this embodiment, the control module 10 may have a driving circuit unit and a control circuit unit, the driving circuit unit further integrates a real-time detection circuit capable of continuously detecting parameters such as current, temperature, and voltage of each element in the rectifier bridge 20, the PFC power switch module 30, and the power module 40, and when a fault such as a severe overload, a direct short circuit, or an overheating temperature, and an overvoltage of driving voltage occurs, the control circuit unit can control the soft turn-off of the power device in the power module 40, and simultaneously send a fault signal to the control circuit unit, so that the control circuit unit controls the other circuit modules to operate, thereby preventing the other circuit modules from being damaged due to the fault. In addition, a bridge arm pair tube interlocking circuit and a driving power supply under-voltage protection circuit can be further integrated in the control module 10, so that the power module 40 can be ensured to run safely and stably.

In this embodiment, each power module 40 is integrated with a plurality of power switching tubes, and the plurality of power switching tubes form a driving inverter circuit, for example, six power switching tubes form a three-phase inverter bridge circuit, or four power switching tubes form a two-phase inverter bridge circuit. Each power switch tube can be realized by adopting an MOS tube or an IGBT.

According to the invention, the control module 10, the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 are integrally installed on the corresponding installation positions on the surface of one side of the circuit wiring substrate 100, no conducting wire is needed for connection, the distances between the control module 10 and the rectifier bridge 20, between the PFC power switch module 30 and the plurality of power modules 40 can be shortened, and the electromagnetic interference caused by overlong jumper wires and excessive jumper wires can be reduced. Meanwhile, the components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the number of components is large, so that the electric control board is difficult to assemble when being assembled to electric equipment, and the heat efficiency of the air conditioner is low, and the air conditioner is not beneficial to realizing energy conservation and emission reduction due to large power consumption, serious heating and the like of the air conditioner.

Referring to fig. 1-5, in an alternative embodiment, the highly integrated smart power module 40 further includes a heat sink 60,

the heat dissipation plate 60 is disposed on one side of the circuit wiring substrate 100 where the control module 10, the rectifier bridge 20, the power switch module, and the plurality of power modules 40 are disposed, and the heat dissipation plate 60 is disposed in close contact with or spaced apart from the control module 10, the rectifier bridge 20, the power switch module, and the plurality of power modules 40;

alternatively, the heat sink 60 is disposed on a side of the circuit wiring board 100 facing away from the control module 10, the rectifier bridge 20, the power switch module, and the plurality of power modules 40.

In this embodiment, the heat sink 60 may be made of a material such as a copper or aluminum substrate or ceramic, or a mixture of the above materials. The heat dissipation plate 60 is disposed close to one side of the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 or disposed far from one side of the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40, so as to accelerate heat generated by the rectifier bridge 20, the PFC power switch module 30 and the plurality of power modules 40 to be conducted to the air, and increase the heat dissipation capability of the highly integrated intelligent power.

Referring to fig. 1-5, in an alternative embodiment, the plurality of power modules 40 includes at least a fan drive power module 40 and a compressor drive power module 40.

In this embodiment, the fan driving power module 41 integrated in the high-integration intelligent power module 40 is used for driving the wind wheel motor, and the compressor driving power module 42 is used for driving the compressor motor, but in other embodiments, the power module 40 may also be used for driving frequency converters and various inverter power supplies of other motors, and is applied to the fields of variable frequency speed regulation, metallurgical machinery, electric traction, servo driving, and variable frequency household appliances such as air conditioners. The fan driving power module 41 and the compressor driving power module 42 are respectively integrated with a plurality of power switching tubes such as IGBTs and MOS tubes, the number of the plurality of power switching tubes may be four or six, the specific number may be set according to the type of the motor, the driving power, and the like, and the present disclosure is not limited thereto.

Referring to fig. 5, in an optional embodiment, the control module 10 includes an MCU, a PFC driver chip 11, a fan power driver chip 12, and a compressor power driver chip 13, where a first control end of the MCU is connected to a signal input end of the PFC driver chip 11; a plurality of second control ends of the MCU are connected with a plurality of signal input ends of the fan power driving chip 12 in a one-to-one correspondence manner; a plurality of third control ends of the MCU are connected with a plurality of signal input ends of the compressor power driving chip 13 in a one-to-one correspondence manner; a plurality of output ends of the fan power driving chip 12 are connected with a plurality of controlled ends of the fan driving power module 40 in a one-to-one correspondence manner; a plurality of output terminals of the compressor power driving chip 13 are connected to a plurality of controlled terminals of the compressor driving power module 40 in a one-to-one correspondence.

In this embodiment, the MCU is integrated with a timing controller, a memory, a data processor, and a software program and/or module stored in the memory and operable on the data processor, and outputs a corresponding timing control signal to the PFC driver chip 11, the fan power driver chip 12, and the compressor power driver chip 13 by operating or executing the software program and/or module stored in the memory and calling the data stored in the memory, so that the PFC driver chip 11 converts the received timing control signal into a corresponding driving signal to drive the power switch tube in the PFC power switch module 30 to operate. The fan power driving chip 12 converts the received timing control signal into a corresponding driving signal to drive the corresponding power switching tube in the fan power driving chip 12 to turn on/off, thereby driving the fan to work. And the compressor power driving chip 13 converts the received timing control signal into a corresponding driving signal to drive the corresponding power switch tube in each power module 40 to turn on/off, so as to drive the compressor to work.

Referring to fig. 1 to 5, in an alternative embodiment, the highly integrated smart power module 40 further includes an insulating layer 50, and the insulating layer 50 is attached to a side of the heat dissipation plate 60 close to the circuit wiring substrate 100.

In this embodiment, the insulating layer 50 may be made of insulating materials such as insulating glue, silicon nitride, and organic insulating film, for example, when the insulating glue is used for implementation, the insulating glue may be covered on the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 to reflect external electromagnetic interference, so as to prevent external electromagnetic radiation from interfering with the normal operation of the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40, and reduce the interference influence of electromagnetic radiation in the surrounding environment on the electronic components in the highly integrated smart power module 40. Or to achieve electrical isolation of non-electrically connected portions between the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40. The heat dissipation plate 60 and the insulating layer 50 may be formed by integrally pressing ceramic and metal, and the heat dissipation capability of the highly integrated smart power module 40 is accelerated by the high insulation property and the high thermal conductivity of ceramic. In this embodiment, the heat dissipation plate 60 may be attached to the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 through the insulating layer 50, so as to improve the heat dissipation efficiency of each electronic component.

Referring to fig. 1 to 5, in an alternative embodiment, the highly integrated smart power module 40 further includes a package housing 70 that encapsulates the circuit wiring substrate 100, the heat dissipation plate 60, the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40.

In the present embodiment, the package housing 70 may be a resin holder of an epoxy resin molding compound, and the package housing 70 may be formed of any one of a thermosetting material and a thermoplastic material.

Specifically, the package case 70 may cover the heat dissipation plate 60, and the circuit wiring substrate 100, the insulating layer 50, the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 are packaged in the package case 70, so that a surface of the heat dissipation plate 60 is entirely or partially exposed outside the package case 70, thereby accelerating heat dissipation of each component. Alternatively, the package case 70 is wrapped around the circuit wiring board 100, the heat sink 60, the insulating layer 50, the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40, so that the package case 70 is integrally formed with the circuit wiring board 100, the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40. When the package case 70 is integrally formed with the circuit wiring board 100, the heat sink 60, the insulating layer 50, the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40, the package case may be integrally formed by a plastic molding or potting process.

Referring to fig. 1 to 5, in an alternative embodiment, the heat dissipation plate 60 is located inside the package housing 70 or at least partially exposed outside the package housing 70,

and/or the presence of a gas in the gas,

the circuit wiring substrate 100 is located inside the package housing 70 or at least partially exposed outside the package housing 70.

It is understood that in the above alternative embodiment, the heat dissipation plate 60 may be inside the package housing 70 or at least partially exposed outside the package housing 70. When the heat dissipation plate 60 is located inside the package case 70, heat generated by the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 is conducted to the heat dissipation plate 60 through the insulating layer 50, then conducted to the package case 70 through the heat dissipation plate 60, and conducted to the air through the package case 70, so that the heat dissipation rate of the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 is increased. Or one side of the heat dissipation plate 60 is partially or completely exposed outside the package housing 70, so that the heat generated by the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 is conducted to the heat dissipation plate 60 through the insulating layer 50, and then is directly dissipated to the air through the heat dissipation plate 60, thereby further increasing the contact area between the heat and the air and improving the heat dissipation rate.

In this embodiment, when the heat dissipation plate 60 is disposed on the side of the circuit wiring substrate 100 where the control module 10, the rectifier bridge 20, the power switch module and the power modules 40 are disposed, the side of the circuit wiring substrate 100 where no circuit element is disposed may also be partially or completely exposed outside the package housing 70, so that the heat generated by the rectifier bridge 20, the PFC power switch module 30 and the power modules 40 can be directly dissipated to the air through the circuit wiring substrate 100, thereby further increasing the contact area between the heat and the air and increasing the heat dissipation rate.

It is understood that when one side of the circuit wiring substrate 100 is also partially or completely exposed outside the package housing 70, the insulating layer 50 is disposed between the circuit wiring and the substrate on the circuit wiring substrate 100.

Referring to fig. 6 or 7, in an alternative embodiment, the circuit wiring substrate 100 has first and second ends a and B opposite in a length direction thereof,

referring to fig. 6, a first power pin VCC1, a second power pin VCC2, a power pin COM, a serial input pin RXD, a serial output pin TXD, a relay control port pin (FAN-HCON, FAN-LCON, WAY-CON, POWERCON, and HEATCON), a temperature sampling port pin (TH1 to TH2), a debug platelet port pin (T-CLK, T-DATA), an EE programming port pin (WC, SCL, SDA), an MCU programming port pin (ELME, MD0, 1, RES, TRST, TMS, TDI, TDO, and TCK), and an electronic expansion valve control port pin (PMV1 to PMV4) are sequentially disposed on one side of the circuit wiring substrate 100 from the first end a to the second end B;

the other side of the circuit wiring substrate 100 is provided with a first U-phase output pin U1, a first V-phase output pin V1, a first W-phase output pin W1, a second U-phase output pin U2, a second V-phase output pin V2, a second W-phase output pin W3, an alternating current input pin AC-L, an alternating current output pin AC-N, PFC, an input pin PFC +, a PFC output pin PFC-, a bus voltage positive pin P, and a bus voltage negative pin N in sequence from the first end a to the second end B.

Referring to fig. 7, alternatively, a first power pin VCC1, a second power pin VCC2, a power ground pin COM, a serial input pin RXD, a serial output pin TXD, an MCU scan/write port pin (ELME, MD0, MD1, RES, TRST, TMS, TDI, TDO, and TCK), a bus voltage positive pin P, and a bus voltage negative pin N are sequentially disposed on one side of the circuit wiring substrate 100 from the first end a to the second end B;

the other side of the circuit wiring substrate 100 is provided with a first U-phase output pin U1, a first V-phase output pin V1, a first W-phase output pin W1, a second U-phase output pin U2, a second V-phase output pin V2, a second W-phase output pin W2, an alternating current input AC-L pin, an alternating current output pin AC-N, PFC input pin PFC + and PFC output pin PFC-.

In this embodiment, VCC1 is the positive power supply terminal VCC1 of the intelligent power module 40, VCC1 is generally 15V for connecting to the power supply on the high voltage side of the power module 40, VCC2 is generally 5V for connecting to the power supply on the low voltage side of the power module 40, power ground COM is the power common ground, and the serial input pin RXD and the serial output pin TXD are used to realize the communication connection between the MCU and the external device. The number of the relay control ports is provided with a plurality of, and the relay control ports are FAN-HCON, FAN-LCON, WAY-CON, POWERCON and HEATCON respectively. The number of temperature sampling ports includes TH1, TH2, TH 3. The debugging small plate port pin is used for accessing the testing small plate and is provided with two pins of T-CLK and T-DATA. The EE programming port pin is used for programming the program software in the MCU and is provided with three pins of WC, SCL and SDA. The MCU sweep write port pins have ELME, MD0, MD1, RES, TRST, TMS, TDI, TDO, TCK and other pins. The electronic expansion valve control port pins are provided in plurality and are respectively PMV1, PMV2, PMV3 and PMV 4. The first U-phase output pin U1, the first V-phase output pin V1 and the first W-phase output pin W1 are respectively used for connecting with a three-phase winding of the direct current fan. The second U-phase output pin U2, the second V-phase output pin V2 and the second W-phase output pin W2 are used for connecting three-phase windings of the compressor. The alternating current input pin AC-L and the alternating current output pin AC-N are respectively used for accessing alternating current. The PFC input pin PFC + and the PFC output pin PFC-are used for being connected with a PFC inductor, so that a PFC power switch, a diode, the PFC inductor and the like form a PFC circuit. The bus voltage positive pole pin P and the bus voltage negative pole pin N are respectively used for accessing the direct current output by the PFC circuit.

It is understood that in the above embodiment, the electronic components in the control module 10, the rectifier bridge 20, the power switch module and the plurality of power modules 40 may be implemented by packaged components, and are packaged with the package housing 70 for the second time. Or a bare chip to reduce the packaging process during the fabrication of the highly integrated smart power module 40. The invention combs the pins of each port again, simplifies the original specification of a plurality of ports, can reduce the pin number of the ports, is convenient for connecting with an external circuit, simplifies the layout of a high-integration intelligent module on a PCB (printed circuit board) arranged on an electric control board, has fewer pins of the high-integration intelligent power module 40, can reduce the number and difficulty of external welding pins, internalizes detailed ports, and makes each port more clear and concise.

It is understood that the pins 130 are disposed on the corresponding mounting positions of the circuit wiring substrate 100, and are electrically connected to the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 through circuit wirings, respectively.

In this embodiment, the pins 130 may be gull-wing-shaped or straight-through, and the plurality of pins 130 are soldered to one of the boards of the circuit wiring substrate 100 on which the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40 are disposed, or are soldered to the other board of the board opposite to the control module 10, the rectifier bridge 20, the PFC power switch module 30, and the plurality of power modules 40, and are electrically connected to the control module 10, the rectifier bridge 20, the PFC power switch module 30, the plurality of power modules 40, and the like through circuit wiring.

The invention also provides electrical equipment which comprises the high-integration intelligent power module. The detailed structure of the highly integrated intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the air conditioner of the present invention uses the above-mentioned high-integration intelligent power module, the embodiments of the air conditioner of the present invention include all technical solutions of all embodiments of the above-mentioned high-integration intelligent power module, and the achieved technical effects are also completely the same, and are not described herein again.

In this embodiment, the electrical equipment may be refrigeration equipment such as an air conditioner and a refrigerator.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.