阅读说明：本技术 高集成智能功率模块及空调器 (High-integration intelligent power module and air conditioner ) 是由 甘弟 冯宇翔 于 2018-06-13 设计创作，主要内容包括：本发明公开一种高集成智能功率模块及空调器,该高集成智能功率模块包括：散热基板；电路布线层,设置于散热基板的一侧表面,电路布线层具有供高集成智能功率模块的电子元件安装的安装位；整流桥、PFC功率开关管模块及多个IPM模块,设置于对应的电路布线层的安装位上；其中,整流桥、PFC功率开关管模块及多个IPM模块通过电路布线层依次电连接。本发明解决了电控板采用多个分立的元器件实现时器件较多,导致空调器装配复杂,以及自身的功耗较大,发热等也较严重,导致空调的热效率,不利于空调器实现节能减排的问题。(The invention discloses a high-integration intelligent power module and an air conditioner, wherein the high-integration intelligent power module comprises: a heat-dissipating substrate; the circuit wiring layer is arranged on one side surface of the heat dissipation substrate and is provided with a mounting position for mounting an electronic element of the highly integrated intelligent power module; the rectifier bridge, the PFC power switch tube module and the IPM modules are arranged on the installation positions of the corresponding circuit wiring layers; the rectifier bridge, the PFC power switch tube module and the IPM modules are electrically connected in sequence through a circuit wiring layer. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the components are more, so that the air conditioner is complex to assemble, the power consumption of the air conditioner is higher, the heating is serious, the heat efficiency of the air conditioner is caused, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated.)

1. A highly integrated smart power module, comprising:

a heat-dissipating substrate;

the circuit wiring layer is arranged on one side surface of the heat dissipation substrate and is provided with a mounting position for mounting an electronic element of the high-integration intelligent power module;

the rectifier bridge, the PFC power switch tube module and the IPM modules are arranged on the corresponding installation positions of the circuit wiring layer; wherein the content of the first and second substances,

the rectifier bridge, the PFC power switch tube module and the IPM modules are electrically connected in sequence through the circuit wiring layer.

2. The high integrated smart power module of claim 1, wherein said plurality of power modules comprises at least a fan IPM module and a compressor IPM module.

3. The high-integration intelligent power module according to claim 2, wherein the compressor IPM module comprises a compressor power driving chip and a plurality of first power switch tubes, wherein a plurality of output terminals of the compressor power driving chip are connected to controlled terminals of the plurality of first power switch tubes in a one-to-one correspondence; wherein the content of the first and second substances,

the first power switch tube is a SiC type IGBT, a SiC type MOSFET or a GaN type HEMT.

4. The high integrated smart power module of claim 3, wherein said compressor IPM module further comprises a plurality of fast recovery diodes, the number and location of said fast recovery diodes corresponding to said first power switch; wherein the content of the first and second substances,

the fast recovery diode is a silicon diode.

5. The high-integration intelligent power module according to claim 2, wherein the fan IPM module comprises a fan power driving chip and a plurality of second power switch tubes, wherein a plurality of output terminals of the fan power driving chip are connected to controlled terminals of the plurality of second power switch tubes in a one-to-one correspondence; wherein the content of the first and second substances,

and the second power switch tube is a reverse conducting IGBT.

6. The highly integrated smart power module of claim 1, wherein the PFC power switch module comprises a PFC power switch tube, a PFC power driving chip, and a first diode, wherein an output terminal of the PFC power driving chip is connected to a controlled terminal of the PFC power switch tube, an input terminal of the PFC power switch tube is used for connecting an external inductor and is connected to an anode of the first diode, and a cathode of the first diode is connected to input terminals of the plurality of IPM modules; wherein the content of the first and second substances,

the third power switch tube is a SiC type IGBT, a SiC type MOSFET or a GaN type HEMT;

the first diode is a silicon diode.

7. The highly integrated smart power module according to any of claims 1 to 6, further comprising an insulating layer interposed between the heat dissipation substrate and the circuit wiring layer; wherein the content of the first and second substances,

the thickness of insulating layer is 70 ~ 150 um.

8. The highly integrated smart power module according to any of claims 1 to 6, wherein said heat dissipating substrate is a highly thermally conductive heat dissipating substrate.

9. The highly integrated smart power module of any of claims 1 to 6 further comprising a metallic tie-wire connecting said rectifier bridge, said PFC power switch module, said plurality of IPM modules and said circuit routing layer by an ultrasonic bonding process.

10. An air conditioner characterized by comprising the highly integrated smart power module as recited in any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of integrated circuits, in particular to a high-integration intelligent power module and an air conditioner.

Background

With the development of scientific and technological progress and social productivity, the problems of resource excessive consumption, environmental pollution, ecological destruction, climate warming and the like are increasingly prominent, and the green development, energy conservation and emission reduction become the transformation development direction of various enterprises and industrial fields. Therefore, how to reduce energy consumption of refrigeration equipment with large energy consumption, such as air conditioners, refrigerators and the like, and energy conservation becomes an effort direction of researchers.

Disclosure of Invention

The invention mainly aims to provide a high-integration intelligent power module and an air conditioner, and aims to improve the integration level of the high-integration intelligent power module, realize the integrated drive control of a fan and a compressor, reduce the volume of an electric control board, facilitate the installation problem and realize energy conservation and emission reduction.

To achieve the above object, the present invention provides a highly integrated smart power module, which includes:

a heat-dissipating substrate;

the circuit wiring layer is arranged on one side surface of the heat dissipation substrate and is provided with a mounting position for mounting an electronic element of the high-integration intelligent power module;

the rectifier bridge, the PFC power switch tube module and the IPM modules are arranged on the corresponding installation positions of the circuit wiring layer; wherein the content of the first and second substances,

the rectifier bridge, the PFC power switch tube module and the IPM modules are electrically connected in sequence through the circuit wiring layer.

Optionally, the plurality of power modules comprises at least a fan IPM module and a compressor IPM module.

Optionally, the compressor IPM module includes a compressor power driving chip and a plurality of first power switching tubes, where a plurality of output ends of the compressor power driving chip are connected to controlled ends of the plurality of first power switching tubes in a one-to-one correspondence manner; wherein the content of the first and second substances,

the first power switch tube is a SiC type IGBT, a SiC type MOSFET or a GaN type HEMT.

Optionally, the compressor IPM module further includes a plurality of fast recovery diodes, and the number and the positions of the fast recovery diodes are set corresponding to the first power switch tube; wherein the content of the first and second substances,

the fast recovery diode is a silicon diode.

Optionally, the fan IPM module includes a fan power driving chip and a plurality of second power switching tubes, wherein a plurality of output ends of the fan power driving chip are connected to controlled ends of the plurality of second power switching tubes in a one-to-one correspondence manner; wherein the content of the first and second substances,

and the second power switch tube is a reverse conducting IGBT.

Optionally, the PFC power switch module includes a PFC power switch tube, a PFC power driving chip, and a first diode, an output end of the PFC power driving chip is connected to a controlled end of the PFC power switch tube, an input end of the PFC power switch tube is used for connecting an external inductor and is connected to an anode of the first diode, and a cathode of the first diode is connected to input ends of the plurality of IPM modules; wherein the content of the first and second substances,

the third power switch tube is a SiC type IGBT, a SiC type MOSFET or a GaN type HEMT;

the first diode is a silicon diode.

Optionally, the highly-integrated smart power module further includes an insulating layer, and the insulating layer is sandwiched between the heat dissipation substrate and the circuit wiring layer; wherein the content of the first and second substances,

the thickness of insulating layer is 70 ~ 150 um.

Optionally, the heat dissipation substrate is a high thermal conductivity heat dissipation substrate.

Optionally, the highly integrated smart power module further includes a metal binding wire, and the metal binding wire connects the rectifier bridge, the PFC power switching tube module, the plurality of IPM modules, and the circuit wiring layer through an ultrasonic bonding process.

The invention also provides an air conditioner, which comprises the high-integration intelligent power module; the highly integrated smart power module includes: a heat-dissipating substrate; the circuit wiring layer is arranged on one side surface of the heat dissipation substrate and is provided with a mounting position for mounting an electronic element of the high-integration intelligent power module; the rectifier bridge, the PFC power switch tube module and the IPM modules are arranged on the corresponding installation positions of the circuit wiring layer; the rectifier bridge, the PFC power switch tube module and the IPM modules are electrically connected in sequence through the circuit wiring layer.

The highly integrated intelligent power module is provided with the heat dissipation substrate, the circuit wiring layer is arranged on the heat dissipation substrate, so that the rectifier bridge, the PFC power switch module and the IPM modules are integrated on the heat dissipation substrate, and the DC voltage output by the rectifier bridge is corrected by the PFC power switch module and then is output to each IPM module, so that each IPM module drives the corresponding load to work. According to the invention, the PFC power switch module and the plurality of IPM modules are integrated on the heat dissipation substrate, and thus, the heat generated by the PFC power switch module, the plurality of IPM modules and other components and circuit modules on the heat dissipation substrate can be dissipated quickly through the first heat dissipation substrate when the components and circuit modules work, so that the heat dissipation rate of each component can be improved. In addition, the functional modules are integrated on a heat dissipation substrate, so that the integration level of the integrated intelligent power module can be improved, the integrated driving control of a fan and a compressor is realized, the size of an electric control board is reduced, and the installation is convenient. Meanwhile, the components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the components are more, so that the air conditioner is complex to assemble, the power consumption of the air conditioner is higher, the heating is serious, the heat efficiency of the air conditioner is caused, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated. The high-integration intelligent power module has high integration level, small volume and strong anti-interference capability, is suitable for a frequency converter of a driving motor and various inverter power supplies to realize the functions of frequency conversion speed regulation, metallurgical machinery, electric traction, servo drive and the like, and is particularly suitable for driving the motors of compressors and fans of air conditioners, refrigerators and the like to work.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a functional block diagram of an embodiment of a highly integrated smart power module according to the present invention;

FIG. 2 is a schematic circuit diagram of an embodiment of the highly integrated smart power module of FIG. 1;

fig. 3 is a schematic structural diagram of an embodiment of the highly integrated smart power module according to the invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Heat radiation substrate	30	Multiple IPM modules
110	Circuit wiring layer	31	Compressor IPM module
				120	Insulating layer	311	Compressor power driving chip
130	Metal binding wire	32	Fan IPM module
				10	Rectifier bridge	321	Fan power driving chip
20	PFC power switch module

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a high-integration intelligent power module.

In many electrical appliances such as air conditioners, washing machines, refrigerators, and the like, motors are provided to drive other loads to operate. For example, a conventional air conditioner generally includes an indoor unit and an outdoor unit, wherein the outdoor unit and the indoor unit are both provided with a motor and an electric control board for driving the motor to operate. Taking an electric control board of the outdoor unit as an example, most of the electric control boards of the outdoor unit are provided with a compressor IPM module for driving a compressor, a fan IPM module for driving a fan, a power module and other functional modules. These functional modules adopt the circuit module of discrete or partial integration to realize mostly, and the scattered each part of arranging at automatically controlled PCB board, but because automatically controlled board self structure, strong and weak electric isolation, prevent signal interference, heat dissipation etc. requirement, require the interval between each functional module to guarantee in safe distance for the automatically controlled board of off-premises station's volume is great, is unfavorable for the installation. Or disperse these on polylith circuit board, adopt the mode of wire jumper again to realize between main control module and other functional modules to and mutual electrical connection between each functional module, but the dispersion sets up each functional module and can lead to the wire jumper more and long, leads to electrical apparatus EMC performance to descend. And the electric control board of these two kinds of structures all can appear the device of electric control board more, lead to the assembly of off-premises station complicated, still can increase the manufacturing cost of air conditioner simultaneously, and the maintenance rate also can increase, is unfavorable for the stable use of air conditioner. More importantly, when the electric control board is realized by adopting a plurality of components, the energy consumption of the components is large, the heating is serious, the heat efficiency of the air conditioner is low, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated.

In order to solve the above problem, referring to fig. 1 to 3, in an embodiment of the present invention, the highly integrated smart power module includes:

a heat dissipating substrate 100;

a circuit wiring layer 110 disposed on one side surface of the heat dissipation substrate 100, wherein the circuit wiring layer 110 has a mounting position for mounting an electronic component of the highly integrated smart power module;

the rectifier bridge 10, the PFC power switch module 20 and the plurality of IPM modules 30 are disposed at the corresponding mounting positions of the circuit wiring layer 110; wherein the content of the first and second substances,

the rectifier bridge 10, the PFC power switch module 20, and the plurality of IPM modules are electrically connected in sequence through the circuit wiring layer 110.

In this embodiment, the PFC power switch module 20 corrects the dc voltage output by the rectifier bridge 10 and outputs the corrected dc voltage to each IPM module, so as to control the plurality of IPM modules 30 to drive the corresponding loads to work.

In this embodiment, the heat dissipation substrate 100 may be implemented by a circuit substrate made of a material such as a PCB, a lead frame, a cardboard, a half-glass fiber board, or a glass fiber board, or may be a substrate made of a material with high heat conduction and dissipation performance, such as aluminum and aluminum alloy, copper and copper alloy, or aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic. The shape of the heat dissipation substrate 100 may be determined according to specific positions and sizes of the rectifier bridge 10, the PFC power switch module 20, and the plurality of IPM modules 30 integrated on the heat dissipation substrate 100 in the highly integrated smart power module, and may be a square shape, but is not limited to the square shape. In a specific implementation, the rectifier bridge 10, the PFC power switch module 20, and the plurality of IPM modules 30 may be disposed on one heat dissipation substrate 100 to be integrally disposed into a highly integrated intelligent power module, or may be separately disposed on two heat dissipation substrates 100 and then packaged into a whole by a packaging material.

In some embodiments, the insulating layer 120 may be further disposed on the heat dissipation substrate 100 according to a material of the heat dissipation substrate 100, for example, when the heat dissipation substrate 100 is implemented by a material having a conductive property, such as an aluminum material or a copper material, the insulating layer 120 may be made of a material, such as a thermoplastic adhesive or a thermosetting adhesive, so as to implement a fixed connection and insulation between the heat dissipation substrate 100 and the circuit wiring layer 110. The insulating layer 120 may be implemented by using a high thermal conductivity insulating layer 120 implemented by mixing one or more materials of epoxy resin, alumina, and high thermal conductivity filling material.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view of the highly integrated intelligent power module of the present invention, the heat dissipation substrate 100 is further provided with a circuit wiring layer 110, and the circuit wiring layer 110 forms corresponding lines and mounting locations, i.e., pads, on the heat dissipation substrate 100 for mounting electronic components in the rectifier bridge 10, the PFC power switch module 20, and the IPM modules 30 according to the circuit design of the highly integrated intelligent power module. Specifically, after the insulating layer 120 is provided on the mounting substrate, a copper foil is laid on the insulating layer 120 and etched in accordance with a preset circuit design, thereby forming the circuit wiring layer 110. After the electronic components of the circuit modules, such as the rectifier bridge 10, the PFC power switch module 20, and the plurality of IPM modules 30, are integrated in the circuit wiring layer 110 on the heat dissipation substrate 100, the electrical connection between the circuit modules may be realized by the metal binding wires 130.

In this embodiment, the rectifier bridge 10 may be implemented by combining four chip diodes, and the four chip diodes are respectively labeled as D11, D12, D13, and D14, and the rectifier bridge 10 converts the input ac power into dc power and outputs the dc power.

In this embodiment, the PFC power switch module 20 may be implemented by only a PFC switch, or may further form a PFC circuit with other components such as a diode and an inductor to implement power factor correction on the dc power supply. The PFC circuit may be implemented by a passive PFC circuit to form a boost PFC circuit, a buck PFC circuit, or a boost PFC circuit. It is understood that, in practical applications, the positions and the connection relationship between the PFC power switch module 20 and the rectifier bridge 10 may be adaptively adjusted according to the setting type of the PFC circuit, and are not limited herein. The PFC power switch module 20 adjusts the power factor of the dc power input by the rectifier bridge 10, and outputs the adjusted dc power to the power input terminal of each IPM module, so that each power module drives the corresponding load to work. The regulated dc power may also be used to generate various values of driving voltage, such as 5V and 15V, through an external switching power circuit to power the driving ICs of each IPM.

In this embodiment, each IPM module integrates a plurality of power switching tubes, and the plurality of power switching tubes form a driving inverter circuit, for example, six power switching tubes form a three-phase inverter bridge circuit, or four power switching tubes form a two-phase inverter bridge circuit. Each power switch tube can be realized by adopting an MOS tube or an IGBT. The plurality of power switch tubes are connected with the power inverter bridge circuit and used for driving loads such as a fan and a compressor to work, and after each power switch tube is arranged on the corresponding mounting position of the circuit wiring layer 110, the power switch tubes can be electrically connected with the circuit wiring layer 110 through conductive materials such as soldering tin and the like, and a current loop is formed. Each power switch tube can also be attached to the corresponding mounting position of the circuit wiring layer 110 through a flip-chip process. It is understood that the electronic components in the PFC power switch module 20, the rectifier bridge 10 and the power modules 30 may be implemented by using a bare wafer, or may be implemented by using a packaged patch component.

The highly integrated intelligent power module of the present invention is configured with the heat dissipation substrate 100, and the circuit wiring layer 110 is disposed on the heat dissipation substrate 100, so as to integrate the rectifier bridge 10, the PFC power switch module 20, and the plurality of IPM modules 30 on the heat dissipation substrate 100, and output the dc voltage output by the rectifier bridge 10 to each IPM module after being corrected by the PFC power switch module 20, so that each IPM module drives the corresponding load to work. According to the invention, the PFC power switch module 20 and the plurality of IPM modules 30 are integrated on the heat dissipation substrate 100, so that the heat generated by the PFC power switch module 20, the plurality of IPM modules 30 and other components and circuit modules on the heat dissipation substrate 100 can be quickly dissipated through the first heat dissipation substrate 100 when the circuit modules work, and the heat dissipation rate of each component can be improved. In the invention, all components in the highly integrated intelligent power module are not connected by wires, the distance between a PFC power switch tube Q21 module and each IPM module can be shortened, the electromagnetic interference caused by overlong jumper wires and excessive jumper wires is reduced, in addition, the functional modules are integrated on one heat dissipation substrate 100, the integration level of the integrated intelligent power module can be improved, the integrated drive control of a fan and a compressor is realized, the volume of an electric control board is reduced, and the installation is convenient. Meanwhile, the components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the components are more, so that the air conditioner is complex to assemble, the power consumption of the air conditioner is higher, the heating is serious, the heat efficiency of the air conditioner is caused, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated. The high-integration intelligent power module has high integration level, small volume and strong anti-interference capability, is suitable for a frequency converter of a driving motor and various inverter power supplies to realize the functions of frequency conversion speed regulation, metallurgical machinery, electric traction, servo drive and the like, and is particularly suitable for driving the motors of compressors and fans of air conditioners, refrigerators and the like to work.

Referring to fig. 1 to 3, in an alternative embodiment, the plurality of IPM modules 30 includes at least a fan IPM module 32 and a compressor IPM module 31.

In this embodiment, the fan IPM module 32 integrated in the IPM module 30 is used to drive the wind turbine motor, and the compressor IPM module 31 is used to drive the compressor motor, but in other embodiments, the IPM module 30 may also be used to drive frequency converters and various inverter power supplies of other motors, and is applied to the fields of variable frequency speed regulation, metallurgical machinery, electric traction, servo drive, and variable frequency household appliances such as air conditioners. The fan IPM module 32 and the compressor IPM module 31 are respectively integrated with a plurality of power switching tubes such as IGBTs and MOS tubes, the number of the plurality of power switching tubes may be four or six, the specific number may be set according to the type of the motor, the driving power, and the like, and the present disclosure is not limited thereto.

Referring to fig. 1 to 3, in an alternative embodiment, the compressor IPM module 31 includes a compressor power driving chip 311 and a plurality of first power switching tubes (Q311, Q312, Q313, Q314, Q315, Q316), wherein a plurality of output terminals of the compressor power driving chip 311 are connected to controlled terminals of the plurality of first power switching tubes in a one-to-one correspondence; wherein the content of the first and second substances,

the first power switch tube is a SiC type IGBT, a SiC type MOSFET or a GaN type HEMT.

In this embodiment, the compressor power driving chip 311 is configured to receive a control signal input by an external MCU, and convert the control signal into a corresponding driving signal to drive the corresponding power switch tube in the compressor IPM module 31 to turn on/off, so as to drive the compressor to work. In this embodiment, the number of the first power switching tubes may be four or six, and in this embodiment, six first power switching tubes are labeled as Q311, Q312, Q313, Q314, Q315, and Q316. The six first power switch tubes form a three-phase inverter bridge circuit, and the three-phase inverter bridge circuit comprises three-phase upper bridge arm power switch tubes and three-phase lower bridge arm power switch tubes. The three-phase upper bridge arm power switching tube and the three-phase lower bridge arm power switching tube can be completely or partially realized by adopting MOS tubes, can be completely or partially realized by adopting IGBT, and can be completely or partially realized by adopting HEMT. So set up, be favorable to according to the fast characteristics of device switching speed that SiC, GaN material made to reduce the switching loss of high integrated intelligent power module, and then be favorable to practicing thrift the electric energy, reduce the module and generate heat. Further, the IGBT and/or the MOSFET may be implemented by using a power transistor made of SiC material. The HEMT can be realized by adopting a power tube made of GaN material. In this embodiment, six power switching tubes of the three-phase upper bridge arm power switching tube and the three-phase lower bridge arm power switching tube may be implemented by using IGBTs.

Referring to fig. 1 to 3, further, based on the above embodiment, the compressor IPM module 31 further includes a plurality of fast recovery diodes, and the number and the position of the fast recovery diodes are arranged corresponding to the first power switch tube; wherein the content of the first and second substances,

the fast recovery diodes (D11, D12, D13, D14, D15, D16) are silicon diodes.

In this embodiment, the number and the positions of the fast recovery diodes correspond to those of the first power switching tubes, in this embodiment, the number of the fast recovery diodes may be selected to be six, the six fast recovery diodes are respectively marked as D11, D12, D13, D14, D15, and D16, and the fast recovery diodes are high-power anti-parallel diodes and are used for realizing fast turn-off of the first power switching tubes. Wherein, when setting up to SiC MOSFET or SiC IGBT, perhaps GaN HEMT device based on the power switch tube, reduce power module's switching loss to lower, and then be favorable to practicing thrift the electric energy, reduce the module under the condition that generates heat, the diode that the quick recovery diode optional adopted Si material to make realizes, when can guaranteeing that power module's self consumption is lower, reduces the manufacturing cost of high integrated intelligent power module.

Referring to fig. 1 to 3, in an alternative embodiment, the fan IPM module 32 includes a fan power driving chip 321 and a plurality of second power switching tubes (Q321, Q322, Q323, Q324, Q325, Q326), where a plurality of output terminals of the fan power driving chip 321 are connected to controlled terminals of the plurality of second power switching tubes in a one-to-one correspondence; wherein the content of the first and second substances,

and the second power switch tube is a reverse conducting IGBT.

In this embodiment, the fan power driving chip 321 is configured to receive a control signal input by an external MCU, and convert the control signal into a corresponding driving signal to drive the power switch tube in the fan IPM module 32 to be turned on/off, so as to drive the fan to work. In this embodiment, the number of the second power switching tubes may be four or six, and in this embodiment, six second power switching tubes are labeled as Q321, Q322, Q323, Q324, Q325, and Q326. And the six second power switching tubes form a three-phase inverter bridge circuit, and the three-phase inverter bridge circuit comprises three-phase upper bridge arm power switching tubes and three-phase lower bridge arm power switching tubes. It can be understood that the power for driving the fan is generally lower than that of the compressor, that is, the current for driving the fan is lower, and the heat generation is relatively lower, so that the three-phase upper arm power switching tube and the three-phase lower arm power switching tube in this embodiment may be implemented by all or part of the reverse conducting IGBTs. In the reverse conducting IGBT, a Fast Recovery Diode (FRD) which is packaged together with an IGBT power switch tube in an anti-parallel mode is integrated on the same chip, and therefore the size of an inverter bridge circuit is reduced. So set up, be favorable to improving power density, reduce high integrated intelligent power module's volume, manufacturing cost and encapsulation process, still be favorable to improving high integrated intelligent power module's reliability simultaneously.

Referring to fig. 1 to 3, in an alternative embodiment, the PFC power switch module 20 includes a PFC power switch Q21, a PFC power driver chip 21 and a first diode D21, an output terminal of the PFC power driver chip 21 is connected to a controlled terminal of the PFC power switch Q21, an input terminal of the PFC power switch Q21 is used for connecting an external inductor and is connected to an anode of the first diode D21, and a cathode of the first diode D21 is connected to input terminals of the IPM modules; wherein the content of the first and second substances,

the third power switch tube is a SiC type IGBT, a SiC type MOSFET or a GaN type HEMT;

the first diode D21 is a silicon diode.

In this embodiment, the PFC power driving chip 21 converts the received timing control signal into a corresponding driving signal to drive the power switch in the PFC power switch module 20 to operate. In this embodiment, the third power switch tube may be implemented by an MOS tube, an IGBT, or an HEMT. In this embodiment, the first diode D21, the switch tube, the external inductor, and the energy storage capacitor form a PFC circuit to adjust the power factor of the dc input to the rectifier bridge 10, and output the adjusted dc to the power input terminal of each IPM module, so that each power module drives the corresponding load to work. The first diode D21 may be implemented by a silicon diode.

Referring to fig. 1 to 3, in an alternative embodiment, the highly integrated smart power module further includes an insulating layer 120, and the insulating layer 120 is sandwiched between the heat dissipation substrate 100 and the circuit wiring layer 110; wherein the content of the first and second substances,

the thickness of the insulating layer 120 is 70-150 um.

In this embodiment, the insulating layer 120 may be implemented by using an insulating material with high thermal conductivity, and the insulating layer 120 is used to implement electrical isolation and electromagnetic shielding between the circuit wiring layer 110 and the heat dissipation substrate 100, and reflect external electromagnetic interference, so as to prevent external electromagnetic radiation from interfering with normal operations of the PFC power switch module 20 and the plurality of IPM modules 30, and reduce interference influence of electromagnetic radiation in the surrounding environment on electronic components in the high-integrated intelligent power module. The heat dissipation substrate 100 and the insulating layer 120 may be formed by pressing ceramic and metal together, and the heat dissipation capability of the highly integrated smart power module is accelerated by the high insulation property and the high thermal conductivity of the ceramic. The thickness of insulating layer 120 can select to be 70 ~ 150um, so set up, is favorable to shortening the distance between power components such as heat dissipation base plate 100 and power switch tube, rectifier bridge 10 to accelerate the radiating rate of power switch tube through heat dissipation base plate 100.

Referring to fig. 1 to 3, in an alternative embodiment, the highly integrated smart power module further includes a metal binding-wire 130, and the metal binding-wire 130 connects the rectifier bridge 10, the PFC power switch module 20, the plurality of IPM modules, and the circuit wiring layer 110 through an ultrasonic bonding process.

In this embodiment, the metal binding-wire 130 is used to realize the electrical connection among the rectifier bridge 10, the PFC power switch module 20, the plurality of IPM modules, and the circuit wiring layer 110. The metal binding wire 130 may connect the rectifier bridge 10 and the circuit wiring layer 110, or the PFC power switch module 20 and the circuit wiring layer 110, or a plurality of IPM modules 30 and the circuit wiring layer 110 through an ultrasonic bonding process, so that the modules are electrically connected through metal leads and the circuit wiring layer 110. It can be understood that the radian of the metal binding-wire 130 between the modules can be adjusted, and the volume of the highly integrated intelligent power module can be reduced by adjusting the radian of the metal binding-wire 130.

The invention also provides an air conditioner which comprises the high-integration intelligent power module. The detailed structure of the highly integrated intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the air conditioner of the present invention uses the above-mentioned high-integration intelligent power module, the embodiments of the air conditioner of the present invention include all technical solutions of all embodiments of the above-mentioned high-integration intelligent power module, and the achieved technical effects are also completely the same, and are not described herein again.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.