阅读说明：本技术 散热组件及电子设备 (Heat dissipation assembly and electronic equipment ) 是由 徐波 于 2019-09-29 设计创作，主要内容包括：本发明公开一种散热组件及电子设备,该散热组件包括：元器件,元器件的数量至少为一个；集热部,集热部具有第一内腔,第一内腔填充有导热介质,集热部与元器件相接触；散热部,散热部与集热部相接触,散热部具有第二内腔,第二内腔填充有散热介质,散热介质为相变介质,第二内腔中设有毛细结构。该散热组件中,元器件的热量聚集在集热部上,再通过散热部将聚集在集热部上的热量辐射出去。由于散热部周围的元器件的热量都聚集在集热部上,因此不会阻碍散热部内相变介质的流动,从而使得散热部内部的热传递循环顺利完成,进而提高了电子设备的安全性和可靠性。(The invention discloses a heat radiation component and an electronic device, wherein the heat radiation component comprises: the number of the components is at least one; the heat collecting part is provided with a first inner cavity, heat conducting media are filled in the first inner cavity, and the heat collecting part is in contact with the components; the heat dissipation part is in contact with the heat collection part and is provided with a second inner cavity, a heat dissipation medium is filled in the second inner cavity and is a phase change medium, and a capillary structure is arranged in the second inner cavity. In the heat radiation component, the heat of the components is collected on the heat collection part, and then the heat collected on the heat collection part is radiated out through the heat radiation part. Because the heat of the components around the heat dissipation part is gathered on the heat collection part, the flow of a phase change medium in the heat dissipation part is not obstructed, so that the heat transfer circulation in the heat dissipation part is smoothly completed, and the safety and the reliability of the electronic equipment are further improved.)

1. A heat sink assembly, comprising:

at least one component (100), wherein the number of the components (100) is at least one;

a heat collecting part (200), wherein the heat collecting part (200) is provided with a first inner cavity (210), the first inner cavity (210) is filled with a heat conducting medium, and the heat collecting part (200) is in contact with the component (100);

the heat dissipation part (300), the heat dissipation part (300) is in contact with the heat collection part (200), the heat dissipation part (300) is provided with a second inner cavity (310), the second inner cavity (310) is filled with a heat dissipation medium, the heat dissipation medium is a phase change medium, and a capillary structure (320) is arranged in the second inner cavity (310).

2. The heat dissipation assembly of claim 1, wherein a projection of a contact surface of the component (100) and the heat collection portion (200) coincides with a projection of the first cavity (210) in a first direction, wherein the first direction is perpendicular to the contact surface.

3. The heat dissipation assembly of claim 1, wherein the heat transfer medium is a liquid metal.

4. The heat dissipation assembly of claim 1, wherein the heat transfer medium has a phase transition temperature, and wherein the heat transfer medium is a solid medium when the temperature of the heat transfer medium is below the phase transition temperature; when the temperature of the heat-conducting medium is higher than the phase transition temperature, at least one part of the heat-conducting medium is a liquid medium.

5. The heat dissipating assembly according to claim 1, wherein the heat dissipating part (300) has a bar structure, and the heat collecting part (200) is located at one end of the heat dissipating part (300).

6. The heat dissipation assembly of claim 1, wherein the component (100) and the heat dissipation portion (300) are respectively disposed on two sides of the heat collection portion (200), the heat dissipation portion (300) has a strip structure, the heat collection portion (200) has a first side (201) and a second side (202) opposite to each other in a second direction, the heat dissipation portion (300) has a third side (301) and a fourth side (302) opposite to each other, the first side (201) is flush with the third side (301), the second side (202) is flush with the fourth side (302), and the second direction is perpendicular to an extending direction of the strip structure.

7. The heat dissipation assembly of claim 1, wherein the heat dissipation portion (300) comprises a first substrate (330) and a second substrate (340) disposed opposite to each other, the first substrate (330) and the second substrate (340) enclose the second cavity (310), the heat collection portion (200) comprises a third substrate (220), the third substrate (220) and the second substrate (340) are located on two sides of the first substrate (330), and the third substrate (220) and the first substrate (330) enclose the first cavity (210).

8. The heat dissipation assembly of claim 1, wherein the heat dissipation portion (300) comprises a first substrate and a second substrate that are disposed opposite to each other, the first substrate and the second substrate enclosing the second cavity (310), the heat collection portion (200) comprises a third substrate and a fourth substrate that are disposed opposite to each other, the third substrate and the fourth substrate enclosing the first cavity (210), the third substrate contacting the component (100), and the third substrate or the fourth substrate contacting the first substrate.

9. The heat dissipation assembly of claim 1, wherein the capillary structure (320) is disposed on a surface of the second cavity (310), the second cavity (310) has a first surface (311) and a second surface (312) that are disposed opposite to each other, a plurality of support pillars (350) are disposed in the second cavity (310), the plurality of support pillars (350) are arranged between the first surface (311) and the second surface (312) at intervals, and two ends of each support pillar (350) are respectively connected to the capillary structure (320); or the first surface (311) is provided with the capillary structure (320), one end of the supporting column (350) is connected with the capillary structure (320), and the other end of the supporting column (350) is connected with the second surface (312).

10. The heat dissipation assembly of claim 1, wherein the number of the components (100) is multiple, and the multiple components (100) are arranged at intervals.

11. An electronic device comprising the heat dissipation assembly of any of claims 1-10.

Technical Field

The invention relates to the technical field of heat dissipation, in particular to a heat dissipation assembly and electronic equipment.

Background

The components of the electronic equipment can generate heat during working, and if the heat cannot be radiated in time, the heat can be accumulated, so that the normal use of corresponding functions can be influenced, and even the electronic equipment can be damaged.

The traditional heat dissipation method is mainly to stick a metal plate around the components and radiate heat. However, with the progress of technology and the development of electronic devices, the functions of the electronic devices are more and more diversified, which means that more components need to be integrated inside the electronic devices, and the conventional heat dissipation method is not suitable. To the situation, the heat dissipation device filled with the phase change medium can be contacted with the component, and the heat dissipation device radiates heat through the phase change medium to achieve the purpose of heat dissipation.

However, other components are distributed around the heat dissipation device, and heat generated by the components can block the flow of the phase-change medium, so that the phase-change medium inside the heat dissipation device is intercepted, and heat transfer circulation inside the heat dissipation device cannot be completed, so that the heat dissipation performance of the heat dissipation device is reduced, and the safety and reliability of electronic equipment are reduced. This problem is particularly pronounced when more components are distributed around the heat spreader device.

Disclosure of Invention

The invention discloses a heat dissipation assembly and electronic equipment, and aims to solve the problem that the electronic equipment is low in safety and reliability.

In order to solve the problems, the invention adopts the following technical scheme:

a heat dissipation assembly, comprising:

at least one component, wherein the number of the components is at least one;

the heat collecting part is provided with a first inner cavity, heat conducting media are filled in the first inner cavity, and the heat collecting part is in contact with the component;

the heat dissipation part is in contact with the heat collection part and is provided with a second inner cavity, a heat dissipation medium is filled in the second inner cavity and is a phase change medium, and a capillary structure is arranged in the second inner cavity.

An electronic device comprises the heat dissipation assembly.

The technical scheme adopted by the invention can achieve the following beneficial effects:

in the heat dissipation assembly disclosed by the invention, the heat collection part is in contact with the component, the heat of the component is transferred to the heat collection part, and the heat collected on the heat collection part is radiated out through the heat dissipation part, so that the purpose of heat dissipation is achieved. In this structure, the heat of the components around the heat dissipation part is gathered on the heat collection part, so that the flow of the phase change medium in the heat dissipation part is not obstructed, the heat transfer circulation in the heat dissipation part is smoothly completed, and the safety and the reliability of the electronic equipment are improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the disclosure;

FIG. 2 is a cross-sectional view of a heat sink assembly according to an embodiment of the present disclosure;

fig. 3 is a top view of a heat dissipation assembly according to an embodiment of the disclosure.

Description of reference numerals:

100-component, 200-heat collecting part, 201-first side, 202-second side, 210-first inner cavity, 220-third substrate, 230-first filling hole, 300-heat radiating part, 301-third side, 302-fourth side, 310-second inner cavity, 311-first side, 312-second side, 320-capillary structure, 330-first substrate, 340-second substrate, 350-supporting column and 360-second filling hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to fig. 3, the embodiment of the present invention discloses a heat dissipation assembly, which may be applied to an electronic device, and specifically includes a component 100, a heat collection portion 200, and a heat dissipation portion 300.

The number of the components 100 is at least one, and the components 100 may be a central processing unit, a sensor, and other functional chips.

The heat collecting part 200 is in contact with the component 100, and the heat collecting part 200 has a first inner cavity 210, and the first inner cavity 210 is filled with a heat conducting medium. The heat transfer medium near the contact surface between the component 100 and the heat collecting portion 200 has a higher temperature, and the heat transfer medium far from the contact surface between the component 100 and the heat collecting portion 200 has a lower temperature, so that the heat transfer medium flows from a high-temperature region to a low-temperature region, and heat is uniformly distributed on the entire heat collecting portion 200. Specifically, the main body of the heat collecting unit 200 may be made of a metal material with good thermal conductivity, such as copper, and the heat collecting unit 200 is provided with a first filling hole 230, the first filling hole 230 is communicated with the first inner cavity 210, and the heat conducting medium is filled into the first inner cavity 210 through the first filling hole 230.

The heat dissipation portion 300 is in contact with the heat collection portion 200, the heat dissipation portion 300 has a second inner cavity 310, and the second inner cavity 310 is filled with a heat dissipation medium, which may be a phase change medium. Meanwhile, a capillary structure 320 is disposed in the second inner cavity 310. The heat of the heat collecting portion 200 is first transferred to the region (i.e., evaporation region) where the heat dissipating portion 300 contacts the heat collecting portion 200, and the temperature of the evaporation region is increased, so that the heat dissipating medium in the second cavity 310 on the side close to the evaporation region absorbs the heat to evaporate, and a large amount of heat is taken away. The evaporated heat dissipation medium reaches a region where the temperature of the heat dissipation part 300 is low (i.e., a condensation region), and vapor of the heat dissipation medium is rapidly condensed into liquid and releases heat due to the low temperature of the condensation region. At the same time, the capillary structure 320 in the second interior chamber 310 transports the condensed heat-dissipating medium back to the evaporation zone again. The structure enables heat to be radiated continuously without causing heat accumulation. Specifically, the main body of the heat dissipation portion 300 may be made of a material having a high thermal conductivity, such as copper. The main bodies of the heat dissipating part 300 and the heat collecting part 200 may be made of the same material, so that the heat conductivity coefficient is the same and the heat conductivity is better. The heat dissipation part 300 is provided with a second filling hole 360, and the heat dissipation medium is filled into the second inner cavity 310 through the second filling hole 360. The heat dissipation medium and the heat conduction medium may be made of the same material or different materials. Specifically, the heat dissipation medium may use degassed pure water, so that it does not cause environmental pollution. The capillary structure 320 above may be a copper mesh.

In the embodiment of the present invention, the heat of the components 100 around the heat dissipating part 300 is collected on the heat collecting part 200, so that the flow of the heat dissipating medium in the heat dissipating part 300 is not obstructed, the heat transfer cycle inside the heat dissipating part 300 is smoothly completed, and the safety and reliability of the electronic device are improved. Meanwhile, the combination mode of the components, the heat collecting part and the heat radiating part is relatively flexible, so that the heat radiating requirements of different electronic equipment can be met.

In another embodiment, the number of the components 100 may be multiple, and the multiple components 100 are arranged at intervals, in order to improve the integration level of the heat dissipation assembly. At the moment, the heat dissipation assembly can simultaneously dissipate heat of a plurality of components together, so that the integration level of the heat dissipation assembly is improved, and the heat dissipation performance of the heat dissipation assembly is improved.

In an alternative embodiment, the heat dissipating part 300 includes a first substrate and a second substrate that are opposite to each other and surround the second cavity 310, and the heat collecting part 200 includes a third substrate and a fourth substrate that are opposite to each other and surround the first cavity 210, the third substrate is in contact with the component 100, and the third substrate or the fourth substrate is in contact with the first substrate. In this case, the heat collecting unit 200 and the heat radiating unit 300 are separated from each other and connected to each other by welding, adhering, or the like, so that the heat collecting unit 200 and the heat radiating unit 300 can be exchanged with each other, thereby improving the maintainability of the heat radiating unit.

Since the heat collecting portion 200 and the heat dissipating portion 300 are separately disposed, the heat dissipating portion 300 and the heat collecting portion 200 may not be in close contact with each other, and a gap may be formed at a connection position, which may reduce heat conduction efficiency, thereby affecting heat dissipating performance of the heat dissipating assembly. In order to solve the problem, specifically, the heat dissipating part 300 includes a first substrate 330 and a second substrate 340 that are oppositely disposed, the first substrate 330 and the second substrate 340 enclose the second cavity 310, the heat collecting part 200 includes a third substrate 220, the third substrate 220 and the second substrate 340 are located at two sides of the first substrate 330, and the third substrate 220 and the first substrate 330 enclose the first cavity 210. In this scheme, the heat collecting part 200 and the heat dissipating part 300 are processed into an integrated structure, so that the heat collecting part 200 and the heat dissipating part 300 are in tight contact, the heat conduction efficiency of the heat collecting part 200 and the heat dissipating part 300 is high, and the heat dissipating performance of the heat dissipating assembly is improved.

In the above embodiment, the heat dissipation portion 300 is easily deformed by an external force or a thermal contraction stress, and the second cavity 310 is recessed. In an alternative embodiment, the capillary structure 320 is disposed on a surface of the second cavity 310, the second cavity 310 has a first surface 311 and a second surface 312 disposed opposite to each other, and a plurality of support pillars 350 are disposed in the second cavity 310, the plurality of support pillars 350 are arranged at intervals between the first surface 311 and the second surface 312, the first surface 311 is disposed with the capillary structure 320, one end of each support pillar 350 is connected to the capillary structure 320, and the other end of each support pillar 350 is connected to the second surface 312. This configuration makes the heat dissipation member 300 have high rigidity, prevents the second cavity 310 from being recessed, and effectively controls the deformation of the heat dissipation member 300. In another preferred embodiment, the first surface 311 and the second surface 312, and even the entire surface of the second cavity 310, can be provided with the capillary structure 320, and the two ends of the supporting column 350 are respectively connected with the capillary structure 320. At this time, the capillary structure 320 has a supporting function on the second cavity 310, so that the second cavity 310 is further prevented from being recessed, and the rigidity of the heat dissipation part is enhanced. Meanwhile, the larger the distribution area of the capillary structure 320 is, the faster the heat dissipation medium flows back to the evaporation area, so that the heat dissipation effect of the heat dissipation assembly is better.

The specific arrangement manner of the components 100 on the heat collecting portion 200 may affect the heat collecting performance of the heat collecting portion 200, and specifically, in the first direction, the projection of the contact surface between the components 100 and the heat collecting portion 200 coincides with the projection of the first inner cavity 210, and the first direction is perpendicular to the contact surface between the components 100 and the heat collecting portion 200. At this time, the contact surface between the component 100 and the second inner cavity 310 is entirely located in the area where the second inner cavity 310 is located, so that the heat conduction performance between the component 100 and the heat collecting part 200 is better, and the heat collecting performance of the heat collecting part 200 is further improved. This structure allows the structure of the second cavity 310 to better match the arrangement structure of the components 100 on the heat collecting portion 200, so that the structure of the heat dissipation assembly is more optimized.

In an alternative embodiment, the heat transfer medium may be a liquid metal. Since the liquid metal has a large latent heat capacity and fluidity, it is possible to uniformly distribute heat on the heat collecting part 200, thereby further improving the heat collecting performance of the heat collecting part 200. Specifically, the heat transfer medium may be an alloy of gallium, indium, tin, or the like.

In a preferred embodiment, the heat-conducting medium may also be a phase-change medium having a phase-change temperature, and when the temperature of the heat-conducting medium is lower than the phase-change temperature, the heat-conducting medium is a solid medium; when the temperature of the heat-conducting medium is higher than the phase transition temperature, at least one part of the heat-conducting medium is a liquid medium. When the heat-conducting medium is converted from the solid medium to the liquid medium, heat is absorbed, and therefore a part of heat is taken away, so that the heat collecting portion 200 also has certain heat dissipation performance, and the heat dissipation performance of the heat dissipation assembly is further improved. Specifically, when the heat transfer medium is in a liquid state, it may be a liquid metal.

Specifically, the heat dissipating part 300 has a bar structure, and the heat collecting part 200 is disposed at one end of the heat dissipating part 300, so that the evaporation area and the condensation area of the heat dissipating part 300 are relatively far away from each other, and thus the circulation path of the heat dissipating medium is relatively long, the heat dissipating medium is sufficiently cooled, and the heat dissipating effect of the heat dissipating assembly is good.

In a preferred embodiment, the component 100 and the heat dissipating portion 300 are respectively disposed on two sides of the heat collecting portion 200, the heat dissipating portion 300 is a strip structure, the heat collecting portion 200 has a first side 201 and a second side 202 opposite to each other in the second direction, the heat dissipating portion 300 has a third side 301 and a fourth side 302 opposite to each other, the first side 201 and the third side 301 are flush, the second side 202 and the fourth side 302 are flush, and the second direction is perpendicular to the extending direction of the strip structure. In this case, since the contact area between the heat dissipating unit 300 and the heat collecting unit 200 is large, the heat conduction efficiency is high, and the heat dissipating effect of the heat dissipating module is good.

In an alternative embodiment, the heat sink 300 may also be a heat pipe, and the heat pipe has a fast heat transfer performance, so that the heat sink 300 has better heat dissipation performance. In addition, the heat pipe has mature processing technology and lower manufacturing cost, so the manufacturing cost of the heat dissipation assembly can be reduced.

Based on the heat dissipation assembly according to any of the above embodiments of the present invention, an embodiment of the present invention further discloses an electronic device, and the disclosed electronic device has the heat dissipation assembly according to any of the above embodiments.

The electronic device disclosed by the embodiment of the invention can be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the electronic device may also be other devices, and the embodiment of the present invention is not limited thereto.

In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.