阅读说明：本技术 晶体管压接封装结构 (Transistor crimping packaging structure ) 是由 蔡放 曾嵘 陈政宇 余占清 尚杰 周雁南 张英成 白羽 于 2019-10-22 设计创作，主要内容包括：本发明提供了一种晶体管压接封装结构,涉及电力电子开关技术领域。所述晶体管压接封装结构包括第一压接块、第二压接块、弹力压接组件、电路板和晶体管；所述第一压接块与所述第二压接块相对压合设置,所述弹力压接组件、所述电路板和所述晶体管设置在所述第一压接块与所述第二压接块之间,所述弹力压接组件将所述晶体管压接在所述电路板上。这样,结构简单、可靠性高、空间利用率高,而且后期加工封装、拆卸和维护方便。(The invention provides a transistor crimping and packaging structure, and relates to the technical field of power electronic switches. The transistor crimping and packaging structure comprises a first crimping block, a second crimping block, an elastic crimping component, a circuit board and a transistor; the first compression joint block and the second compression joint block are arranged in a pressing mode relatively, the elastic compression joint component, the circuit board and the transistor are arranged between the first compression joint block and the second compression joint block, and the elastic compression joint component enables the transistor to be compressed on the circuit board. Like this, simple structure, reliability are high, space utilization is high, and later stage processing encapsulation, dismantlement and maintenance are convenient moreover.)

1. The transistor crimping and packaging structure is characterized by comprising a first crimping block (1), a second crimping block (2), an elastic crimping component (3), a circuit board (4) and a transistor (5); the first compression joint block (1) and the second compression joint block (2) are arranged in a pressing mode relatively, the elastic compression joint component (3), the circuit board (4) and the transistor (5) are arranged between the first compression joint block (1) and the second compression joint block (2), and the elastic compression joint component (3) enables the transistor (5) to be compressed on the circuit board (4).

2. The transistor crimp package structure according to claim 1, wherein the elastic force crimp component (3) comprises a third crimp block (31), a crimp guide post (34) and a crimp disc spring (35); the third crimping block (31) is provided with a mounting hole (33), the crimping guide post (34) is arranged in the mounting hole (33), and the crimping disc spring (35) is arranged between the third crimping block (31) and the crimping guide post (34) and used for supporting the crimping guide post (34) to press the transistor (5).

3. The transistor crimping and packaging structure according to claim 2, wherein the elastic crimping component (3) further comprises a clamp spring (36), the clamp spring (36) is sleeved on one end of the crimping guide pillar (34) extending out of the third crimping block (31), and the other end of the crimping guide pillar (34) is used for compressing the transistor (5).

4. The transistor crimping and packaging structure according to claim 2, wherein the crimping guide pillar (34) comprises a first section (341) and a second section (342), the second section (342) has a larger diameter than the first section (341), the first section (341) is inserted into the mounting hole (33), the crimping disc spring (35) is sleeved on the first section (341) and abuts against an end face of the second section (342), and the second section (342) is used for compressing the transistor (5).

5. The transistor crimping and packaging structure according to claim 1, further comprising a fixing screw (6), wherein a first through hole (32) is formed in the elastic crimping component (3), a threaded hole (11) is formed in the first crimping block (1), and the fixing screw (6) penetrates through the first through hole (32) and is screwed with the threaded hole (11) so that the elastic crimping component (3) is connected with the first crimping block (1).

6. Transistor crimp packaging according to claim 1, characterized in that the transistor (5) is soldered onto the circuit board (4).

7. The transistor crimped package structure according to claim 1, wherein the circuit board (4) is a copper substrate.

8. The transistor crimp package structure according to claim 1, wherein the first and second crimp blocks (1, 2) are made of oxygen-free copper.

9. The transistor crimp package structure according to claim 1, further comprising a positioning pillar (7), wherein a positioning groove (8) is formed on the first crimp block (1) and/or the second crimp block (2), the positioning pillar (7) is connected to the circuit board (4), and the positioning pillar (7) is matched with the positioning groove (8) to determine a position of the circuit board (4) relative to the first crimp block (1) and/or the second crimp block (2).

10. The transistor crimping and packaging structure according to claim 1, wherein the circuit board (4) is circular and the transistors (5) are arranged on the circuit board (4) in a circular array, or wherein the circuit board (4) is rectangular and the transistors (5) are arranged on the circuit board (4) in a matrix.

Technical Field

The invention relates to the technical field of power electronic switches, in particular to a transistor crimping and packaging structure.

Background

A Power Semiconductor Device (also called a Power electronic Device) is a core Device of a Power electronic Device for realizing electric energy conversion and circuit control. Among them, the MOSFET transistor is widely used in various electronic products and devices. At the same time, the packaging technology of MOSFET transistors has also developed rapidly. There is an urgent need in the market for semiconductor device packaging technology with low manufacturing cost, multi-functional integration, and high reliability.

The existing packaging structure of the MOSFET transistor has the defects of complex structure, poor reliability and low space utilization rate, and is inconvenient to process, package, disassemble and maintain in the later period.

Disclosure of Invention

The invention aims to provide a transistor compression joint packaging structure which is simple in structure, high in reliability and space utilization rate, and convenient to process, package, disassemble and maintain in the later period.

The technical scheme provided by the invention is as follows:

a transistor crimping and packaging structure comprises a first crimping block, a second crimping block, an elastic crimping component, a circuit board and a transistor; the first compression joint block and the second compression joint block are arranged in a pressing mode relatively, the elastic compression joint component, the circuit board and the transistor are arranged between the first compression joint block and the second compression joint block, and the elastic compression joint component enables the transistor to be compressed on the circuit board.

In a preferred embodiment of the present invention, the elastic force crimping component comprises a third crimping block, a crimping guide pillar and a crimping disc spring; the third crimping block is provided with a mounting hole, the crimping guide pillar is arranged in the mounting hole, and the crimping disc spring is arranged between the third crimping block and the crimping guide pillar and used for supporting the crimping guide pillar to press the transistor.

In a preferred embodiment of the present invention, the elastic crimping component further includes a clamp spring, the clamp spring is sleeved on one end of the crimping guide pillar, which extends out of the third crimping block, and the other end of the crimping guide pillar is used for pressing the transistor.

In a preferred embodiment of the present invention, the pressing guide pillar includes a first section and a second section, the diameter of the second section is larger than that of the first section, the first section is inserted into the mounting hole, the pressing disc spring is sleeved on the first section and abuts against an end surface of the second section, and the second section is used for pressing the transistor.

In a preferred embodiment of the present invention, the transistor compression-bonding package structure further includes a fixing screw, the elastic compression-bonding component is provided with a first through hole, the first compression-bonding block is provided with a threaded hole, and the fixing screw penetrates through the first through hole and is screwed with the threaded hole, so that the elastic compression-bonding component is connected with the first compression-bonding block.

In a preferred embodiment of the invention, the transistor is soldered to the circuit board.

In a preferred embodiment of the present invention, the circuit board is a copper substrate.

In a preferred embodiment of the present invention, the first and second crimping blocks are made of oxygen-free copper.

In a preferred embodiment of the present invention, the transistor press-bonding package structure further includes a positioning column, the first press-bonding block and/or the second press-bonding block is provided with a positioning groove, the positioning column is connected to the circuit board, and the positioning column is matched with the positioning groove to determine a position of the circuit board relative to the first press-bonding block and/or the second press-bonding block.

In a preferred embodiment of the present invention, the circuit board is circular, and the transistors are arranged on the circuit board in a circular array, or the circuit board is rectangular, and the transistors are arranged on the circuit board in a matrix.

The transistor crimping and packaging structure provided by the invention has the beneficial effects that:

the first compression joint block and the second compression joint block are arranged in a pressing mode relatively, the elastic compression joint component, the circuit board and the transistor are arranged between the first compression joint block and the second compression joint block, and the elastic compression joint component enables the transistor to be compressed on the circuit board. Like this, simple structure, reliability are high, space utilization is high, and later stage processing encapsulation, dismantlement and maintenance are convenient moreover.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic overall structure diagram of a transistor crimping and packaging structure according to an embodiment of the present invention.

Fig. 2 is an exploded schematic view of a transistor crimping and packaging structure according to an embodiment of the present invention.

Fig. 3 is a schematic full-sectional structure diagram of a transistor crimping and packaging structure provided in an embodiment of the present invention.

Fig. 4 is an exploded view of the spring crimping assembly.

Icon: 100-transistor crimping package structure; 1-a first crimp block; 11-a threaded hole; 2-a second crimp block; 3-elastic force crimping component; 31-a third crimp block; 32-a first via; 33-mounting holes; 34-crimping the guide post; 341-first stage; 342-a second segment; 35-crimping disc springs; 36-a clamp spring; 4-a circuit board; 5-a transistor; 6-fixing screws; 7-a positioning column; 8-positioning groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention conventionally put into use, or the orientations or positional relationships that the persons skilled in the art conventionally understand, are only used for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the equipment or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

To the defects that the existing packaging structure of the MOSFET transistor is complicated, poor in reliability and low in space utilization rate, and the packaging, the disassembly and the maintenance are inconvenient and the like in the later processing, the embodiment provides a transistor crimping packaging structure to improve the defects.

Referring to fig. 1 to 3, the transistor press-bonding package structure 100 includes a first press-bonding block 1, a second press-bonding block 2, an elastic press-bonding component 3, a circuit board 4, a transistor 5, a fixing screw 6 and a positioning post 7.

The first compression joint block 1 and the second compression joint block 2 are arranged oppositely in a compression joint mode, the elastic compression joint component 3, the circuit board 4 and the transistor 5 are arranged between the first compression joint block 1 and the second compression joint block 2, and the transistor 5 can be compressed on the circuit board 4 through the elastic compression joint component 3.

In this embodiment, the transistors 5 are selected as MOSFETs and are of a crimping type, and a plurality of transistors 5 are crimped on one circuit board 4 at the same time, thereby realizing parallel connection of the plurality of transistors 5. Compared with the traditional single welding type MOSFET, the parallel connection quantity can be greatly reduced.

The arrangement layout of the transistors 5 on the circuit board 4 can be adjusted according to actual use conditions. In this embodiment, the circuit board 4 is circular, and the transistors 5 are arranged on the circuit board 4 in a circular array. In other embodiments, the circuit board 4 may also be rectangular, and the transistors 5 are arranged on the circuit board 4 in a matrix.

The transistor 5 is soldered to the circuit board 4 and serves for initial fixing, positioning and current flow. The circuit board 4 is selected to be a copper substrate. The copper substrate has good mechanical property and heat conduction effect, has great current carrying capacity, has the heat conduction effect which is many times better than that of an aluminum substrate and an iron substrate, and is suitable for heat dissipation of high-frequency circuits, areas with large high and low temperature changes and precise communication equipment.

The first compression joint block 1 and the second compression joint block 2 are made of oxygen-free copper selectively, and the size and parameters can be corrected according to actual use conditions. The outer sides of the first and second crimping blocks 1 and 2 may be additionally provided with a heat sink or the like according to actual needs.

The positioning column 7 is connected to the circuit board 4, positioning grooves 8 are formed in the first press-connection block 1, the second press-connection block 2 and the elastic press-connection component 3, and after the transistor press-connection packaging structure 100 is assembled, the positioning column 7 is matched with the positioning grooves 8 to determine the position of the circuit board 4 relative to the first press-connection block 1, the second press-connection block 2 and the elastic press-connection component 3. Set up reference column 7 and can play fixed spacing effect.

The elastic crimping component 3 is provided with a first through hole 32, the first crimping block 1 is provided with a threaded hole 11, and the fixing screw 6 penetrates through the first through hole 32 and is screwed with the threaded hole 11, so that the elastic crimping component 3 is connected with the first crimping block 1. The elastic crimping component 3 and the first crimping block 1 can be locked together by arranging the fixing screw 6, and looseness and falling are prevented.

Referring to fig. 3 and 4, the elastic force crimping component 3 includes a third crimping block 31, a crimping guide pillar 34, a crimping disc spring 35 and a clamp spring 36; the third crimping block 31 is also made of oxygen-free copper, the third crimping block 31 is provided with a mounting hole 33, the crimping guide post 34 is arranged in the mounting hole 33, and the crimping disc spring 35 is arranged between the third crimping block 31 and the crimping guide post 34 and used for supporting the crimping guide post 34, so that the effects of fixing the crimping disc spring 35 and conducting electricity are achieved. The clamp spring 36 is sleeved on one end of the compression joint guide post 34 extending out of the third compression joint block 31 to prevent the compression joint guide post 34 from falling off from the mounting hole 33 accidentally, and the other end of the compression joint guide post 34 is used for pressing the transistor 5.

The elasticity of the press disc spring 35 can ensure that the other end of the press guide pillar 34 provides enough pressing force to the transistor 5, the magnitude of the pressing force, and the size and the number of the press disc springs 35 can be determined by the requirements of the transistor 5.

Specifically, the crimping guide post 34 includes a first section 341 and a second section 342, the diameter of the second section 342 is larger than that of the first section 341, the first section 341 is inserted into the mounting hole 33, the crimping disc spring 35 is sleeved on the first section 341 and abuts against the end surface of the second section 342, and the second section 342 is used for pressing the transistor 5.

The transistor crimping packaging structure 100 provided by the embodiment has the following beneficial effects:

1. the structure design is integrated, and all components are integrally arranged together in a stacked manner, so that the structure is simple, the reliability is high, the space utilization rate is high, and the later-stage processing packaging, dismounting and maintenance are convenient;

2. the transistors 5 are pressed tightly by adopting the compression disc spring 35, so that the parallel connection quantity of the transistors 5 is greatly reduced;

3. the crimping disc spring 35 provides pressure for the transistor 5 through the crimping guide pillar 34, so that the thermal resistance of a contact surface is reduced, and meanwhile, the heat dissipation capacity of the whole structure can be enhanced by using the copper-based circuit board 4;

4. the crimping guide post 34 not only plays a role in fixing the crimping disc spring 35, but also plays a role in conducting electricity, and current directly acts on the transistor 5 through the crimping guide post 34, so that the current capacity of the whole structure is increased;

5. the compression using the compression disc spring 35 ensures that sufficient pressure is provided to the transistor 5. And the pressure that crimping dish spring 35 is right can not change because of external pressure, and then is bigger to whole outside pressure application scope, and overall structure's application scope is wider.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.