Intelligent power module, manufacturing equipment and method of intelligent power module
阅读说明:本技术 智能功率模块、智能功率模块的制作设备及方法 (Intelligent power module, manufacturing equipment and method of intelligent power module ) 是由 严允健 冯宇翔 于 2019-10-08 设计创作,主要内容包括:本发明公开一种智能功率模块、智能功率模块的制作设备及方法,该智能功率模块包括:安装基板,安装基板的一侧表面设置有电路布线层,电路布线层包括第一安装位、第二安装位和第三安装位;逆变功率模块,安装于安装基板的第一安装位上;PFC功率模块,PFC功率模块包括散热片、PFC功率开关管及PFC二极管,散热片设置于第二安装位上,PFC功率开关管及PFC二极管贴装于散热片上;驱动芯片,安装于第三安装位上,驱动芯片分别与逆变功率模块和PFC功率模块电连接。本发明解决了智功率模块小空间高集成的设计中,大功率器件散热不及时的问题。(The invention discloses an intelligent power module, and a manufacturing device and a method of the intelligent power module, wherein the intelligent power module comprises: the circuit wiring layer comprises a first mounting position, a second mounting position and a third mounting position; the inverter power module is arranged on a first installation position of the installation substrate; the PFC power module comprises a radiating fin, a PFC power switch tube and a PFC diode, the radiating fin is arranged on the second mounting position, and the PFC power switch tube and the PFC diode are attached to the radiating fin; and the driving chip is arranged on the third installation position and is respectively and electrically connected with the inverter power module and the PFC power module. The invention solves the problem that the heat dissipation of a high-power device is not timely in the small-space high-integration design of the intelligent power module.)
1. A smart power module, comprising:
the circuit wiring layer comprises a first mounting position, a second mounting position and a third mounting position;
the inverter power module is arranged on a first installation position of the installation substrate;
the PFC power module comprises a radiating fin, a PFC power switch tube and a PFC diode, the radiating fin is arranged on the second mounting position, and the PFC power switch tube and the PFC diode are attached to the radiating fin;
and the driving chip is arranged on the third installation position and is electrically connected with the inverter power module and the PFC power module respectively.
2. The smart power module of claim 1 wherein the PFC power switch is an IGBT;
the PFC power module also comprises a fast recovery diode, and the fast recovery diode is arranged and attached to the heat sink;
the fast recovery diode and the IGBT are connected in anti-parallel.
3. The smart power module of claim 1, wherein the heat sink comprises a copper substrate and a silver plating layer coated on a surface of the copper substrate.
4. The smart power module of claim 1 wherein the thickness of the heat sink is positively correlated to the magnitude of current flowing through the PFC power module;
and/or the size of the heat sink is positively correlated with the magnitude of the current flowing through the PFC power module.
5. The smart power module of claim 1, wherein the heat sink comprises a first heat sink and a second heat sink, the PFC power switch disposed on the first heat sink, the PFC diode disposed on the second heat sink.
6. The smart power module of claim 1 wherein the heat sink is further coated with a solder material for eutectic soldering with the PFC power switch tube and the PFC diode tube.
7. An apparatus for manufacturing an intelligent power module, comprising:
the chip carrier is used for placing the radiating fins;
the manipulator is used for carrying the PFC power module wafer onto the heat dissipation sheet;
the image acquisition device is used for acquiring an image of the PFC power module wafer;
the main controller is respectively electrically connected with the manipulator and the image acquisition device and is used for determining the position relation between the PFC power module wafer and the heat dissipation sheet according to the image of the motion platform acquired by the image acquisition device; and placing the PFC power module wafer to the target position of the heat radiating fin according to the position relation.
8. The apparatus for manufacturing a smart power module as recited in claim 7, further comprising:
the guide rail is used for placing the chip carrier and transporting the radiating fin to a preset position when the radiating fin is placed on the chip carrier;
and the stopper is arranged corresponding to the position of the image acquisition device and used for limiting the guide rail.
9. A manufacturing method of an intelligent power module is characterized by comprising the following steps:
preparing a heat radiating fin and a PFC power module wafer, wherein the PFC power module wafer comprises a PFC power switch chip and a PFC diode chip;
placing the radiating fin on a chip carrier, and drawing tin on the surface of one side of the radiating fin by using a soldering tin wire;
placing the PFC power module wafer on a target position on the surface of the heat radiating fin;
and pressing and die bonding the PFC power module wafer and the heat sink.
10. The method of manufacturing a smart power module as claimed in claim 9, wherein the method of manufacturing a smart power module further comprises the steps of:
obtaining a wafer image of the PFC power module after lamination and die bonding;
and marking the heat radiating fin and the PFC power module wafer when the PFC power module wafer is detected to have poor welding.
Technical Field
The invention relates to the technical field of electronic circuits, in particular to an intelligent power module, and manufacturing equipment and a manufacturing method of the intelligent power module.
Background
Intelligent Power Module (IPM) is a Power-driven product that combines Power electronics and integrated circuit technology. The intelligent power module integrates a power switch device and a high-voltage driving circuit and is internally provided with fault detection circuits such as overvoltage, overcurrent and overheat. The intelligent power module has large working current and high temperature, the internal temperature of the intelligent power module can be increased in a high-temperature state, and if the intelligent power module does not dissipate heat in time, devices integrated in the intelligent power module are easy to damage.
Disclosure of Invention
The invention mainly aims to provide an intelligent power module, and manufacturing equipment and a manufacturing method of the intelligent power module, and aims to solve the problems that the intelligent power module is small in space and high in integration, high-power heat dissipation is not timely, or the heat dissipation effect is poor.
In order to achieve the above object, the present invention provides an intelligent power module, including:
the circuit wiring layer comprises a first mounting position, a second mounting position and a third mounting position;
the inverter power module is arranged on a first installation position of the installation substrate;
the PFC power module comprises a radiating fin, a PFC power switch tube and a PFC diode, the radiating fin is arranged on the second mounting position, and the PFC power switch tube and the PFC diode are attached to the radiating fin;
and the driving chip is arranged on the third installation position and is electrically connected with the inverter power module and the PFC power module respectively.
Optionally, the PFC power switch tube is an IGBT;
the PFC power module also comprises a fast recovery diode, and the fast recovery diode is arranged and attached to the heat sink;
the fast recovery diode and the IGBT are connected in anti-parallel.
Optionally, the heat sink includes a copper substrate and a silver plating layer coated on the surface of the copper substrate.
Optionally, the thickness of the heat sink is positively correlated with the magnitude of the current flowing through the PFC power module;
and/or the size of the heat sink is positively correlated with the magnitude of the current flowing through the PFC power module.
Optionally, the heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin, the PFC power switching tube is disposed on the first heat dissipation fin, and the PFC diode is disposed on the second heat dissipation fin.
Optionally, the heat sink is further coated with a welding material, and the welding material is used for eutectic welding with the PFC power switching tube and the PFC diode tube.
Optionally, the intelligent power module further includes a package housing, and the inverter power module, the driver chip, the PFC power module, and the mounting substrate are packaged in the package housing.
The invention also provides a manufacturing method of the intelligent power module, which comprises the following steps:
preparing a heat radiating fin and a PFC power module wafer, wherein the PFC power module wafer comprises a PFC power switch chip and a PFC diode chip;
placing the radiating fin on a chip carrier, and drawing tin on the surface of one side of the radiating fin by using a soldering tin wire;
placing the PFC power module wafer on a target position on the surface of the heat radiating fin;
and pressing and die bonding the PFC power module wafer and the heat sink.
Optionally, the manufacturing method of the intelligent power module further includes the following steps:
obtaining a wafer image of the PFC power module after lamination and die bonding;
and marking the heat radiating fin and the PFC power module wafer when the PFC power module wafer is detected to have poor welding.
The invention also provides a manufacturing device of the intelligent power module, which comprises:
the chip carrier is used for placing the radiating fins;
the manipulator is used for carrying the PFC power module wafer onto the heat dissipation sheet;
the image acquisition device is used for acquiring an image of the PFC power module wafer;
the main controller is respectively electrically connected with the manipulator and the image acquisition device and is used for determining the position relation between the PFC power module wafer and the heat dissipation sheet according to the image of the motion platform acquired by the image acquisition device; and placing the PFC power module wafer to the target position of the heat radiating fin according to the position relation.
Optionally, the manufacturing apparatus of the smart power module further includes:
the guide rail is used for placing the chip carrier and transporting the radiating fin to a preset position when the radiating fin is placed on the chip carrier;
and the stopper is arranged corresponding to the position of the image acquisition device and used for limiting the guide rail.
According to the intelligent power module, the radiating fin is attached between the PFC power module and the circuit wiring layer, the PFC power switching tube and the PFC diode of the PFC power module are attached to the radiating fin through processes such as eutectic welding, the welding firmness of the radiating fin and the PFC power module is improved, and the problem that a solder hole is generated in the welding process or the use thermal cycle process is solved. Therefore, in the process that the driving chip drives the PFC power module to work, heat generated by the PFC power module is quickly diffused through the radiating fin, so that the heat is uniformly distributed on the radiating fin before flowing into the insulating layer. When the part of heat is longitudinally conducted to the radiating fins, the point-like heat source is rapidly changed into a surface heat source form based on the ultrahigh transverse heat conduction capability of the radiating fins, and the heat source is rapidly conducted to the mounting substrate and then conducted out of the intelligent power module through the mounting substrate. The invention can quickly dissipate the heat of the PFC power module by the quick heat conduction effect of the heat dissipation sheet, thereby solving the problems that the heat dissipation of a high-power device is not timely or the heat dissipation effect of the intelligent power module is poor in the design of small space and high integration of the intelligent power module.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of an intelligent power module according to the present invention;
FIG. 2 is a schematic flow chart illustrating a method for manufacturing an intelligent power module according to an embodiment of the present invention;
fig. 3 is a detailed flowchart of one embodiment of step S300 in the manufacturing method of the intelligent power module according to the present invention;
FIG. 4 is a schematic flow chart illustrating a method for manufacturing an intelligent power module according to another embodiment of the present invention;
FIG. 5 is a schematic structural diagram of an embodiment of an apparatus for manufacturing an intelligent power module according to the present invention;
fig. 6 is a schematic structural diagram of another embodiment of an apparatus for manufacturing an intelligent power module according to the present invention.
The reference numbers illustrate:
reference numerals
Name (R)
Reference numerals
Name (R)
10
100
Chip carrier
20
200
30
300
Image acquisition device
40
400
31
500
32
PFC
600
33
PFC diode
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an intelligent power module.
An intelligent Power module, i.e., ipm (intelligent Power module), is a Power driving product combining Power electronics and integrated circuit technology. The intelligent power module can be used for driving a compressor or a fan, and of course, in other embodiments, the intelligent power module can also be applied to a frequency converter and the like. In the intelligent power module, the inverter power module 20 and the driving chip 40 for driving the inverter power module 20 to operate may be integrated, and the MCU or the like for controlling the driving chip 40 to operate may be integrated in the intelligent power module.
It can be understood that the intelligent power module of the present embodiment is further integrated with the
When the intelligent power module works, the power switch tube integrated in the intelligent power module, especially the heat generation of the
In order to improve the heat dissipation performance of the
In order to solve the above problem, referring to fig. 1, in an embodiment of the present invention, the smart power module includes:
the mounting structure comprises a mounting substrate 10, wherein a
an inverter power module 20 mounted on the first mounting position of the mounting substrate 10;
the
and the driving chip 40 is mounted on the third mounting position, and the driving chip 40 is electrically connected with the inverter power module 20 and the
In this embodiment, the mounting substrate 10 may be implemented by any one of an aluminum substrate, an aluminum alloy substrate, a copper substrate, and a copper alloy substrate. The mounting substrate 10 is a mounting carrier for the power switch and the driving device, and the shape of the mounting substrate 10 may be determined according to the specific position, number and size of the power switch, and may be a square, but is not limited to a square. The mounting substrate 10 is provided with a
When the mounting substrate 10 is realized using the aluminum nitride ceramic mounting substrate 10, the aluminum nitride ceramic mounting substrate 10 includes an insulating heat dissipation layer and a
The inverter power module 20 is provided with a plurality of power switching tubes, and the power switching tubes may be gallium nitride (GaN) power switching tubes, Si-based power switching tubes, or SiC-based power switching tubes. In practical application, the number of the power switch tubes can be four, or a multiple of four, or six, or a multiple of six, the six power switch tubes form an inverter circuit, and the inverter circuit is applied to electrical equipment such as an inverter power supply, a frequency converter, refrigeration equipment, metallurgical mechanical equipment, electric traction equipment and the like, and particularly applied to frequency conversion household appliances to drive loads such as a compressor, a fan and the like to work. When the intelligent power module works, the driving chip 40 outputs a corresponding PWM control signal to drive and control the corresponding power switching tube to be turned on/off, thereby outputting driving power to drive the motor and other loads to work.
The driving chips 40 are correspondingly disposed on the third mounting position, the number of the driving chips 40 may be one, for example, the HVIC driving chip 40, and the driving chip 40 is an integrated chip, in which four, six or seven driving circuits for driving the power switching tubes are integrated, and the integrated configuration may be specifically performed according to the number of the driven power switching tubes. The number of the driving chips 40 may also correspond to the number of the power switch tubes, that is, each driving chip 40 drives one power switch tube to operate. When the intelligent power module works, the driving chip 40 outputs a corresponding control signal to control the conduction of the power switching tubes in the
The
In an embodiment, the
The PFC
The intelligent power module provided by the invention is characterized in that the
Referring to fig. 1, in an embodiment, the
the
the fast recovery diode and the IGBT are connected in anti-parallel.
In this embodiment, the fast recovery diode is a high-power anti-parallel diode, and is used to realize fast turn-off of the PFC
In some embodiments, the
Referring to fig. 1, in an embodiment, the
In this embodiment, the
Referring to fig. 1, in an embodiment, the thickness of the
and/or, the size of the
It can be understood that, considering that the larger the current of the
In addition, in order to make the heat dissipation area have a large enough area, so as to improve the heat dissipation effect of the PFC
Referring to fig. 1, in an embodiment, the
In this embodiment, the
Referring to fig. 1, in an embodiment, the smart power module further includes a
In this embodiment, the
The invention also provides a manufacturing method of the intelligent power module,
referring to fig. 2, the method for manufacturing the smart power module includes the following steps:
step S100, preparing a heat radiating fin and a PFC power module wafer, wherein the PFC power module wafer comprises a PFC power switch chip and a PFC diode chip;
in this embodiment, the heat sink may be implemented by using a copper base or an aluminum base, and the surface of the copper base is plated with a silver layer to increase the contact area between the PFC power switch tube and the heat sink, and to increase the mounting surface of the
S200, placing the radiating fin on a chip carrier, and drawing tin on the surface of one side of the radiating fin by using a soldering tin wire;
in this embodiment, the heat sink may be placed on the chip carrier by a robot device. The heat sink is transported to a corresponding position by a vehicle such as a rail, and then solder is drawn on the heat sink by using a solder wire. Here, the two surfaces of the heat sink may be painted with tin, respectively, or painted with tin on the side where the chip is fixed.
Step S300, placing the PFC power module wafer on a target position on the surface of the heat radiating fin;
in this embodiment, after the heat sink is subjected to tin drawing, the PFC power switch wafer and the PFC diode chip wafer may be placed on the heat sink after tin drawing by the manipulator device, in this process, the PFC power switch wafer and the PFC diode chip wafer may be photographed by the image acquisition device, positions of the PFC power switch wafer and the PFC diode chip wafer may be detected according to a chip image obtained by photographing, a positional relationship between the wafer and the heat sink may be obtained by calculating a distance between the wafer and the heat sink according to the position of the wafer, and an experience may be placed at a preset target position according to the positional relationship.
And S400, laminating and die bonding the PFC power switch tube, the PFC diode chip and the heat radiating fin.
In this embodiment, the intelligent power module is provided with a heat sink attached between the PFC power module wafer and the circuit wiring layer, and the PFC power switching tube and the PFC diode in the PFC power module wafer are attached to the heat sink by eutectic soldering or other processes, which is beneficial to improving the soldering firmness between the heat sink and the PFC power module wafer, to reduce the occurrence of problems with solder voiding during soldering or during use of thermal cycling, therefore, in the process that the driving chip drives the PFC power module to work, the heat generated by the PFC power module is quickly diffused through the radiating fin, so that heat is uniformly distributed over the heat sink before it flows into the insulating layer, and when this portion of heat is conducted longitudinally to the heat sink, based on the ultrahigh transverse heat conduction capability of the radiating fins, the point-shaped heat source is rapidly changed into a surface heat source form, and the heat source is rapidly conducted to the mounting substrate and then conducted out of the intelligent power module through the mounting substrate. Through the quick heat conduction effect of the radiating fins, the problems that the intelligent power module is small in space and high in integration, high-power heat dissipation is not timely, or the heat dissipation effect is poor can be solved.
Referring to fig. 3, in an embodiment, the step of placing the PFC power module wafer on the pre-installation position of the heat sink surface specifically includes:
step S310, obtaining an image of the PFC power module wafer;
step S320, determining the position relation between the PFC power module wafer and the heat radiating fin according to the image;
and S330, placing the PFC power module wafer to the target position according to the acquired position relation.
In this embodiment, the motion platform includes a guide rail, the chip carrier is movable on the guide rail, the stopper is mounted on the guide rail according to a set position, the image of the motion platform is acquired by the image acquisition device, specifically, the heat sink is photographed when the carrier on which the heat sink is mounted moves to the stopper and stops, however, when the manipulator carries the wafer and is close to the heat sink, the wafer image of the chip is photographed, so as to obtain a position relationship between the PFC power module wafer and the heat sink, and then the manipulator is controlled according to the position relationship to place the PFC power module wafer at a target position on the heat sink.
Wherein the step of determining the positional relationship between the PFC power module wafer and the heat sink according to the image comprises:
preprocessing the acquired image of the PFC power module wafer;
obtaining an edge image from the preprocessed image by using an edge detection algorithm;
extracting invariant moment features from the edge image;
obtaining the three-dimensional coordinates of the wafer by adopting a classification algorithm according to the invariant moment characteristics;
and establishing a Jacobian matrix model according to the three-dimensional coordinates of the wafer, and obtaining the position relation between the PFC power module wafer on the motion platform and the target position under joint space coordinates.
Referring to fig. 4, further, after the PFC power module wafer is placed at the target position, the method for manufacturing the smart power module further includes:
s500, obtaining a wafer image of the PFC power module after lamination and die bonding;
step S600, when the PFC power module wafer is detected to have poor welding, marking the heat radiating fin and the PFC power module wafer.
In this embodiment, the image of the PFC power module wafer is collected, the solder joints between the PFC power module wafer and the heat sink are tested and compared with the qualified parameters in the database to check whether the defects such as the cold solder joint, the wafer drift and the like exist, and the defects are marked through a display or an automatic mark, so that the repair personnel can repair the defects.
The present invention also provides a manufacturing apparatus of an intelligent power module, and referring to fig. 5, the manufacturing apparatus of the intelligent power module includes:
a
the
an
the
a
and the
In this embodiment, the
It can be understood that the manufacturing equipment of the intelligent power module further comprises a heating module, so that after the solder wires are heated to 350 +/-10 ℃, the solder wires are uniformly drawn on the copper heat dissipation sheet with silver plated on the surface, and then the chip wafer is pressed on the heat dissipation sheet, and the chip is welded to the heat dissipation sheet. After the die attach of the chip wafer is completed, the heat sink and other electronic components of the smart power module, such as the wafers of the power device, the driving chip and other devices, may be attached to the corresponding mounting positions, specifically: firstly, thinning the wafer to reduce the on-resistance and reduce the power consumption; and scribing the power chip, and bonding the chip on the mounting substrate, wherein in the process, a chip mounter can be adopted to realize chip mounting, and the chip mounting process can also be realized through a die bonding process.
Referring to fig. 6, in an embodiment, the fabrication apparatus of the smart power module may further include an Automatic Optical Inspection (AOI) system that implements AOI, so that after the fabrication of the mounting substrate patch is completed, the smart power module is subjected to welding defect detection based on an optical principle through the AOI detection system. The AOI system comprises a
It is understood that in another embodiment, the AOI system further includes a fixture base 101, a stop bar 102, a detector body 103, a fixture 104, a conveyor 105, a detection table 106, a fixture clamp 107, an uptake device 108, a moving rail 109, a display module 110, and the like. Two gag lever posts set up respectively in unable adjustment base 101's both ends, detector main part 103 then sets up on unable adjustment base 101, the surface of detector main part 103 is provided with the vent, and the top of detector main part 103 is connected with mount 104, the inboard of mount is provided with conveyer 105, and conveyer 105's top is fixed with detects platform 106, conveyer 7 is connected with detecting platform 106 through the buckle, the both sides of detecting platform 106 are provided with fixation clamp 107, it sets up in the top of fixation clamp to intake device 108, the fixation clamp is telescoping device, the movable guide is used for driving intake device 108 and removes. Before realizing AOI and detecting, can place the mounting substrate to examining test table 106 inboard through
In the detection process, the pickup device 108 moves through the movable guide rail, detects the welding point, and outputs the detection result to the control module of the AOI detection system, so as to complete the automatic detection of the mounting substrate. In the embodiment, the image is acquired, the test welding spots are compared with qualified parameters in the database, the defects on the mounting substrate are detected through image processing, and the defects are marked through a display or an automatic mark for repair by maintenance personnel.
The invention also provides an air conditioner which comprises the intelligent power module. The detailed structure of the intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the intelligent power module is used in the air conditioner of the present invention, the embodiment of the air conditioner of the present invention includes all technical solutions of all embodiments of the intelligent power module, and the achieved technical effects are also completely the same, and are not described herein again.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
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