阅读说明：本技术 一种以石墨烯-金属复合材料为导电线路的pcb及其制作方法以及一种电机 (PCB with graphene-metal composite material as conducting circuit, manufacturing method of PCB and motor ) 是由 黄迎春 刘焕明 郑兴平 于 2018-06-21 设计创作，主要内容包括：本发明提供了一种以石墨烯-金属复合材料为导电线路的PCB和一种电机以及一种PCB的制作方法。其中,所述PCB包括一层或多层基材板以及所述基材板表面的底层导电线丝,所述底层导电线丝有石墨烯-金属复合材料层。所述石墨烯-金属复合材料层作为所述PCB的导电线路的主要导体,相比纯铜质材料,石墨烯-金属复合材料的导电性能高于纯铜质材料,且石墨烯-金属复合材料的密度更低,因此本发明所提供的PCB在维持电路电功率条件下可减低铜量和总重量,克服了制约PCB进一步轻型化的短板。本发明所提供的PCB在维持导电线厚度下能承担更高电路电功率功率,扩宽PCB应用市场。(The invention provides a PCB (printed circuit board) taking a graphene-metal composite material as a conducting circuit, a motor and a manufacturing method of the PCB. Wherein the PCB comprises one or more layers of substrate boards and a bottom layer conductive filament on the surface of the substrate boards, the bottom layer conductive filament having a graphene-metal composite layer. Compared with a pure copper material, the graphene-metal composite material layer is used as a main conductor of the conducting circuit of the PCB, the conducting performance of the graphene-metal composite material is higher than that of the pure copper material, and the density of the graphene-metal composite material is lower, so that the PCB provided by the invention can reduce the copper amount and the total weight under the condition of maintaining the electric power of the circuit, and overcomes the defect of a short board which restricts the further lightening of the PCB. The PCB provided by the invention can bear higher electric power of a circuit under the condition of maintaining the thickness of the conducting wire, and the application market of the PCB is widened.)

1. The PCB is characterized by comprising one or more layers of base material plates and a bottom layer conductive wire on the surface of the base material plates, wherein the bottom layer conductive wire is provided with a graphene-metal composite material layer.

2. The PCB of claim 1, wherein the metal element in the graphene-metal composite material layer is any one or more of copper, zinc, chromium, gallium, indium, iron, nickel, silver, platinum and gold.

3. The PCB of claim 2, wherein the metal element in the graphene-metal composite layer is copper, and the graphene-metal composite is a copper-graphene-in-copper composite.

4. The PCB of claim 3, wherein a base of the bottom layer conductive filament is a copper-containing filament.

5. An electrical machine comprising a machine stator, wherein the machine stator comprises a PCB as claimed in any one of claims 1 to 4.

6. A method for manufacturing a PCB is characterized by comprising the following steps:

manufacturing a base material plate, wherein the surface of the base material plate is covered with a metal foil;

etching the metal foil into an underlying conductive wire;

dispersing graphene oxide in an ionic liquid, wherein the ionic liquid contains metal ions;

taking the ionic liquid as electroplating liquid, taking the bottom layer conductive wire on the surface of the substrate plate as a cathode substrate, and depositing a current control pulse on the cathode substrate to obtain a graphene-metal composite material coating, wherein the current control pulse comprises a positive pulse period when the current is negative on the deposition surface and a pause period when the current is zero; alternatively, the first and second electrodes may be,

and taking the ionic liquid as electroplating liquid, taking the bottom layer conductive wire on the surface of the substrate plate as a cathode substrate, and depositing a voltage control pulse on the cathode substrate to obtain the graphene-metal composite material coating, wherein the voltage control pulse comprises a positive pulse period when the voltage is a negative value on the deposition surface and a pause period when the voltage is zero.

7. The method according to claim 6, wherein the ionic liquid is a choline chloride and ethylene glycol system, and the molar ratio of the choline chloride to the ethylene glycol is 1-4: 2; or the ionic liquid is a choline chloride and urea system, and the molar ratio of the choline chloride to the urea is 1-4: 2.

8. The method according to claim 7, wherein the metal ions are any one or more of copper ions, zinc ions, chromium ions, gallium ions, indium ions, iron ions, nickel ions, silver ions, platinum ions, and gold ions.

9. The method according to claim 8, wherein the metal ions are copper ions, the concentration of the copper ions in the ionic liquid is 1-60 mM, and the concentration of the graphene oxide in the ionic liquid is 0.2-1.0 g/L.

10. The method according to claim 6, wherein the duration of the forward pulse period of the current control pulse is 10 to 100ms, and the current density is-1.5 to-0.1 ASD; the duration of the pause period of the current control pulse is 10-100 ms.

11. The method according to claim 6, wherein the duration of the forward pulse period of the voltage control pulse is 10-100 ms, the voltage is-4.5-1.3V; the duration of the pause period of the voltage control pulse is 10-100 ms.

12. The method according to claim 6, further comprising stirring the ionic liquid with a stirrer at a speed of 50 to 200r/min during the pulse plating.

13. A manufacturing method of a PCB is characterized by specifically comprising the following steps:

manufacturing a base material plate, wherein the surface of the base material plate is covered with a metal foil;

dispersing graphene oxide in an ionic liquid, wherein the ionic liquid contains metal ions;

taking the ionic liquid as electroplating liquid, taking the metal foil on the surface of the substrate plate as a cathode substrate, and depositing a current control pulse on the cathode substrate to obtain a graphene-metal composite material coating, wherein the current control pulse comprises a positive pulse period when the current is negative on the deposition surface and a pause period when the current is zero; alternatively, the first and second electrodes may be,

taking the ionic liquid as electroplating liquid, taking the bottom layer conductive wire on the surface of the substrate plate as a cathode substrate, and depositing a voltage control pulse on the cathode substrate to obtain a graphene-metal composite material coating, wherein the voltage control pulse comprises a positive pulse period when the voltage is a negative value on the deposition surface and a pause period when the voltage is zero;

and simultaneously etching the metal foil on the surface of the substrate plate and the graphene-metal composite material layer on the surface of the metal foil to form a conductive circuit.

Technical Field

The invention relates to the technical field of Printed Circuit Board (PCB) manufacturing processes, in particular to a PCB with a graphene-metal composite material as a conductive circuit, a manufacturing method of the PCB and a motor.

Background

Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component as a support for electronic components. The PCB without packaging electronic components mainly comprises a substrate board and a conductive circuit on the surface of the substrate board, wherein the substrate board is mainly used as a supporting body and an insulating layer and needs to have certain mechanical strength and voltage breakdown resistance, and the conventional substrate board generally adopts light boards such as a paper substrate, an epoxy glass fabric substrate or a phenolic resin board. And the conducting circuit on the surface of the substrate plate is mostly formed by etching the inner layer to form bottom copper and electroplating on the bottom copper substrate to form secondary copper, and finally, a copper conducting circuit with thicker copper thickness is formed. The copper conductive circuit in the total weight of the whole PCB has a large proportion, and when the base material board material is developed to be extremely light, the weight of the copper conductive circuit becomes a short board which restricts the further lightening of the PCB.

In addition, the copper conducting circuit is provided with a wiring resistor, the wiring resistor of the copper conducting circuit can be obviously changed due to severe temperature rise, oxidation and corrosion can occur along with the prolonging of the service time, the wiring resistor is further changed, and even the copper conducting circuit is notched or broken, so that the electric signal transmission is directly influenced.

Disclosure of Invention

The invention aims to provide a PCB (printed circuit board) taking a graphene-metal composite material as a conductive circuit, a motor applying the PCB to the motor and a manufacturing method of the PCB. The graphene-metal composite material is used as the conductive circuit, so that the total weight of the conductive circuit can be reduced, and the conductive performance, the stability of the routing resistance and the corrosion resistance of the conductive circuit can be improved.

In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:

in one aspect, an embodiment of the present invention provides a PCB using a graphene-metal composite as a conductive circuit, where the PCB includes one or more substrate boards and a bottom conductive filament on a surface of the substrate board, and the bottom conductive filament has the graphene-metal composite layer.

The graphene-metal composite material layer is formed by a graphene-metal composite material layer, wherein the metal element in the graphene-metal composite material layer is copper, zinc, chromium, gallium, indium, iron, nickel, silver, platinum or gold, or the metal element comprises any two or more of the elements.

And wherein more preferably, the metal element is copper, and the graphene-metal composite is a copper-graphene-inclusive composite.

Preferably, the base of the bottom layer conductive wire is a copper-containing wire.

Compared with the prior art, the PCB provided by the invention has the following beneficial effects:

1. the conducting circuit of the existing PCB is formed by etching the inner layer to form bottom copper and electroplating on the bottom copper substrate to form secondary copper, so that the copper in the conducting circuit is thicker, the total weight of the total copper conducting circuit is larger, and further lightening of the PCB is restricted. Compared with a pure copper material, the graphene-metal composite material layer provided by the invention is used as a main conductor of a conducting circuit of the PCB, the conducting performance of the graphene-metal composite material is higher than that of the pure copper material, and the density of the graphene-metal composite material is lower, so that the PCB provided by the invention can reduce the copper content and the total weight under the condition of maintaining the electric power of a circuit, and overcomes the defect of a short board which restricts the further lightening of the PCB. The PCB provided by the invention can bear higher electric power of a circuit under the condition of maintaining the thickness of the conducting wire, and the application market of the PCB is widened.

2. The graphene composite material has good mechanical property, heat conducting property and corrosion resistance, compared with the existing PCB, the PCB provided by the invention has the advantages of wear resistance, mechanical damage resistance, heat dissipation and corrosion resistance, during the use period of the PCB or after long-term use, the obvious change of the wiring resistance of the conducting circuit due to severe temperature rise can be avoided, the phenomenon that the conducting circuit generates a gap or is broken due to oxidation and corrosion can be prevented, and the influence on the transmission of electric signals is avoided.

In another aspect, an embodiment of the present invention provides an electric machine, where the electric machine includes an electric machine stator, and the electric machine stator includes the PCB provided in any one of the above technical solutions.

In another aspect, an embodiment of the present invention provides a method for manufacturing the PCB, including:

manufacturing a base material plate, wherein the surface of the base material plate is covered with a metal foil;

etching the metal foil into an underlying conductive wire;

dispersing graphene oxide in an ionic liquid, wherein the ionic liquid contains metal ions;

taking the ionic liquid as electroplating liquid, taking the bottom layer conductive wire on the surface of the substrate plate as a cathode substrate, and depositing a current control pulse on the cathode substrate to obtain a graphene copper composite material coating, wherein the current control pulse comprises a positive pulse period when the current is negative on the deposition surface and a pause period when the current is zero; alternatively, the first and second electrodes may be,

and taking the ionic liquid as electroplating liquid, taking the bottom layer conductive wire on the surface of the substrate plate as a cathode substrate, and depositing a voltage control pulse on the cathode substrate to obtain the graphene-copper composite material coating, wherein the voltage control pulse comprises a positive pulse period when the voltage is negative on the deposition surface and a pause period when the voltage is zero.

In the technical scheme, in the positive pulse period, metal ions in the ionic liquid are reduced on a cathode substrate (namely the surface of the bottom layer conductive wire filament on the surface of the substrate plate), and an ultrathin metal coating is formed by deposition. During the pause period, the neutral graphene oxide is adsorbed on the surface of the ultrathin metal coating by van der waals force. In a subsequent positive pulse period, the graphene oxide adsorbed on the surface of the ultrathin metal coating releases oxidation functional groups and is firstly reduced into graphene; and then reducing metal ions in the ionic liquid, covering the reduced graphene, and finally forming a graphene composite material coating.

Preferably, the ionic liquid is a choline chloride and ethylene glycol system, and the molar ratio of the choline chloride to the ethylene glycol is 1-4: 2; or the ionic liquid is a choline chloride and urea system, and the molar ratio of the choline chloride to the urea is 1-4: 2.

Preferably, the metal ion is a copper ion, a zinc ion, a chromium ion, a gallium ion, an indium ion, an iron ion, a nickel ion, a silver ion, a platinum ion, or a gold ion, or the metal ion includes any two or more of the foregoing ions.

Preferably, the metal ions are copper ions, the concentration of the copper ions in the ionic liquid is 1-60 mM, and the concentration of the graphene oxide in the ionic liquid is 0.2-1.0 g/L.

Preferably, the duration of the forward pulse period of the current control pulse is 10-100 ms, and the current density is-1.5 to-0.1 ASD; the duration of the pause period of the current control pulse is 10-100 ms.

Preferably, the duration of the forward pulse period of the voltage control pulse is 10-100 ms, and the voltage is-4.5 to-1.3V; the duration of the pause period of the voltage control pulse is 10-100 ms.

Further, the method comprises the step of stirring the ionic liquid by using a stirrer during the pulse electroplating, wherein the stirring speed is 50-200 r/min.

In another aspect, an embodiment of the present invention provides another method for manufacturing the PCB, which specifically includes:

manufacturing a base material plate, wherein the surface of the base material plate is covered with a metal foil;

dispersing graphene oxide in an ionic liquid, wherein the ionic liquid contains metal ions;

taking the ionic liquid as electroplating liquid, taking the metal foil on the surface of the substrate plate as a cathode substrate, and depositing a current control pulse on the cathode substrate to obtain a graphene-metal composite material coating, wherein the current control pulse comprises a positive pulse period when the current is negative on the deposition surface and a pause period when the current is zero; alternatively, the first and second electrodes may be,

taking the ionic liquid as electroplating liquid, taking the bottom layer conductive wire on the surface of the substrate plate as a cathode substrate, and depositing a voltage control pulse on the cathode substrate to obtain a graphene-metal composite material coating, wherein the voltage control pulse comprises a positive pulse period when the voltage is a negative value on the deposition surface and a pause period when the voltage is zero;

and simultaneously etching the metal foil on the surface of the substrate plate and the graphene-metal composite material layer on the surface of the metal foil to form a conductive circuit.

According to the method provided by the invention, ionic liquid is selected as a solvent of the graphene oxide, so that the graphene oxide is more easily dissolved and uniformly dispersed, and sufficient graphene oxide can be adsorbed on the surface of the ultrathin metal coating of the cathode substrate due to Van der Waals force; the ion liquid contains no water and is used as electroplating liquid, so that hydrogen generated in electrodeposition can be avoided, the hydrogen embrittlement phenomenon of a coating can be avoided, and no wastewater is discharged. The ionic liquid almost has no steam generation, is easy to regenerate and can be recycled, and the green and environment-friendly production can be really realized. The method has the advantages of low cost, simple process and no need of preparation environments such as high temperature and high vacuum.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and it will be apparent to those skilled in the art that other relevant drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic cross-sectional view of a PCB provided in embodiment 1.

FIG. 2 is a graph showing the change in pulse current density at a current density of-0.5 ASD.

FIG. 3 is a graph showing the voltage change at a current density of-0.5 ASD.

Fig. 4 is a macroscopic view of the graphene-copper composite plating layer according to embodiment 1.

Fig. 5 is a raman spectrum of the graphene-copper composite material according to embodiment 1.

The reference numbers in the figures illustrate:

10-a substrate sheet; 20-a bottom layer conductive filament; 30-graphene-metal composite layer.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the invention without inventive step, are within the scope of the invention.