阅读说明：本技术 一种异形显示面板、其制作方法及异形显示装置 (Special-shaped display panel, manufacturing method thereof and special-shaped display device ) 是由 吴薇 伍黄尧 周秀峰 沈柏平 于 2019-09-27 设计创作，主要内容包括：本发明公开了一种异形显示面板、其制作方法及异形显示装置,利用在非显示区内的芯片焊接区的空间,芯片焊接区用于焊接芯片,即利用非显示区中被芯片遮挡区域的空间,设置显示测试焊盘垫,在异形显示面板出厂之前,利用位于芯片焊接区内的显示测试焊盘垫对异形显示区进行显示检测,在测试合格之后,已完成显示测试焊盘垫的功能,会在芯片焊接区焊接芯片,芯片焊接区会被焊接的芯片遮挡,不会影响在下边框处设置的各元件的功能。相对于现有下边框设计方式,将显示测试焊盘垫设置在芯片焊接区,可以压缩芯片焊接区两侧的边框,使得下边框处所占用的空间较小,保证异形显示区实现所需的外形,以满足客户要求。(The invention discloses a special-shaped display panel, a manufacturing method thereof and a special-shaped display device, wherein the space of a chip welding area in a non-display area is utilized, the chip welding area is used for welding a chip, namely, the space of an area, shielded by the chip, in the non-display area is utilized, a display test pad is arranged, before the special-shaped display panel leaves a factory, the display test pad in the chip welding area is utilized to perform display detection on the special-shaped display area, after the test is qualified, the function of the display test pad is completed, the chip can be welded in the chip welding area, the chip welding area can be shielded by the welded chip, and the function of each element arranged at a lower frame cannot be influenced. For current lower frame design, will show that test pad sets up at the chip bonding area, can compress the frame of chip bonding area both sides for the shared space of lower frame department is less, guarantees that special-shaped display area realizes required appearance, in order to satisfy customer's requirement.)

1. A special-shaped display panel is characterized by comprising a special-shaped display area and a non-display area surrounding the special-shaped display area;

a chip bonding area is included in the non-display area, and a plurality of display test pad pads are included in the chip bonding area.

2. The shaped display panel as claimed in claim 1, wherein at least two display test pad areas are included within the chip pad area, and a plurality of the display test pad areas are disposed within each of the display test pad areas.

3. The shaped display panel of claim 2, further comprising a chip output pad area and a chip input pad area spaced apart within the chip bonding area, the chip output pad area being proximate to the shaped display area relative to the chip input pad area; the display test bonding pad area is located in an area between the chip output pad area and the chip input pad area.

4. The shaped display panel according to claim 3, wherein a gate driving circuit, a multiplexing circuit and a test switch circuit are included in a non-display area other than the chip bonding area;

the test switch circuit is positioned between the multi-path selection circuit and the chip welding area, and the grid drive circuit is distributed in the non-display area at the two sides of the multi-path selection circuit;

each display test pad is electrically connected with the corresponding gate driving circuit, the multi-path selection circuit and the test switch circuit through a first routing wire.

5. The shaped display panel according to claim 4, wherein the chip output pad area includes a plurality of chip output terminals therein, and each of the chip output terminals is electrically connected to the gate driving circuit, the multiplexing circuit and the test switch circuit through a second trace.

6. The shaped display panel of claim 5, wherein the first traces and the second traces do not overlap.

7. The shaped display panel as claimed in claim 5, further comprising a chip covering said chip bonding pad area, said chip input pad area including a plurality of chip input terminals therein;

the output terminal of the chip is welded with the chip output terminal in the chip output pad area, and the input terminal of the chip is welded with the chip input terminal in the chip input pad area.

8. The shaped display panel according to any of claims 1 to 6, wherein the outer contour of the shaped display area is a perfect circle; the non-display area is in a shape of a perfect circular ring.

9. A shaped display device comprising a shaped display panel as claimed in any one of claims 1-8.

10. A method for manufacturing the shaped display panel according to any one of claims 1 to 8, comprising:

manufacturing a display device in the special-shaped display area, and manufacturing a plurality of display test pad pads in a chip welding area of the non-display area;

after the test needles are electrically connected with the display test pad pads, test signals are introduced to test the display device;

and after the test is qualified, welding a chip on the chip welding area.

Technical Field

The invention relates to the technical field of display, in particular to a special-shaped display panel, a manufacturing method thereof and a special-shaped display device.

Background

At present, with rapid development and popularization of internet technologies, wearable devices increasingly come into daily life of people, and special-shaped display devices such as smart watches are particularly prominent. The traditional watch only plays a role in timing and decoration, and the emerging special-shaped display device not only has the function of the traditional watch, but also can realize the functions of voice communication, short messages, map navigation and the like, and the functions can not be realized by a special-shaped display panel carried by the special-shaped display device.

The narrow frame design of the special-shaped display panel, such as a circular display panel, can improve the overall display effect. In the prior art, a narrow-frame display is manufactured normally by compressing the sizes of elements at a frame, so that the compression ratio is limited, the process requirement can be improved, the production yield can be reduced, and the performance of a product can be influenced to a certain extent.

Therefore, how to compress the lower frame to ensure the required irregular shape is a technical problem to be solved in the field.

Disclosure of Invention

The embodiment of the invention provides a special-shaped display panel, a manufacturing method thereof and a special-shaped display device, which are used for solving the problem that the size of a lower frame is larger in the prior art.

The embodiment of the invention provides a special-shaped display panel, which comprises a special-shaped display area and a non-display area surrounding the special-shaped display area;

a chip bonding area is included in the non-display area, and a plurality of display test pad pads are included in the chip bonding area.

In a possible implementation manner, in the above-mentioned special-shaped display panel provided in the embodiment of the present invention, at least two display test pad regions arranged at intervals are included in the chip bonding region, and a plurality of display test pad pads are arranged in each display test pad region.

In a possible implementation manner, in the above special-shaped display panel provided in the embodiment of the present invention, the chip bonding area further includes a chip output pad area and a chip input pad area that are arranged at an interval, and the chip output pad area is close to the special-shaped display area relative to the chip input pad area; the display test bonding pad area is located in an area between the chip output pad area and the chip input pad area.

In a possible implementation manner, in the above-mentioned special-shaped display panel provided in the embodiment of the present invention, the non-display area outside the chip bonding area includes a gate driving circuit, a multiplexing circuit, and a test switch circuit;

the test switch circuit is positioned between the multi-path selection circuit and the chip welding area, and the grid drive circuit is distributed in the non-display area at the two sides of the multi-path selection circuit;

each display test pad is electrically connected with the corresponding gate driving circuit, the multi-path selection circuit and the test switch circuit through a first routing wire.

In a possible implementation manner, in the above-mentioned special-shaped display panel provided in the embodiment of the present invention, the chip output pad region includes a plurality of chip output terminals, and each of the chip output terminals is electrically connected to the gate driving circuit, the multi-path selecting circuit, and the test switch circuit through a second trace.

In a possible implementation manner, in the special-shaped display panel provided in the embodiment of the present invention, the first trace and the second trace are not overlapped with each other.

In a possible implementation manner, in the above special-shaped display panel provided in the embodiment of the present invention, the display panel further includes a chip covering the chip bonding pad, and the chip input pad area includes a plurality of chip input terminals;

the output terminal of the chip is welded with the chip output terminal in the chip output pad area, and the input terminal of the chip is welded with the chip input terminal in the chip input pad area.

In a possible implementation manner, in the above special-shaped display panel provided in the embodiment of the present invention, an outer contour of the special-shaped display area is a perfect circle; the non-display area is in a shape of a perfect circular ring.

On the other hand, the embodiment of the invention also provides a special-shaped display device which comprises the special-shaped display panel provided by the embodiment of the invention.

On the other hand, an embodiment of the present invention further provides a method for manufacturing the special-shaped display panel, including:

manufacturing a display device in the special-shaped display area, and manufacturing a plurality of display test pad pads in a chip welding area of the non-display area;

after the test needles are electrically connected with the display test pad pads, test signals are introduced to test the display device;

and after the test is qualified, welding a chip on the chip welding area.

The invention has the following beneficial effects:

according to the special-shaped display panel, the manufacturing method of the special-shaped display panel and the special-shaped display device, the space of a chip welding area in a non-display area is utilized, the chip welding area is used for welding a chip, namely, the space of an area, shielded by the chip, in the non-display area is utilized, a display test pad is arranged, before the special-shaped display panel leaves a factory, the display test pad in the chip welding area is utilized to perform display detection on the special-shaped display area, after the test is qualified, the function of the display test pad is completed, the chip can be welded in the chip welding area, the chip welding area can be shielded by the welded chip, and the function of each element arranged at a lower frame cannot be influenced. Compared with the existing lower frame design mode, the display test pad is arranged on the chip welding area, frames on two sides of the chip welding area can be compressed, the performance and the size of each element at the lower frame can be kept, the occupied space at the lower frame is small, and the special-shaped display area is guaranteed to achieve the required appearance so as to meet the requirements of customers.

Drawings

FIG. 1 is a schematic structural diagram of a prior art irregular-shaped display panel;

fig. 2 is a schematic structural diagram of a special-shaped display panel according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a chip bonding area in the special-shaped display panel according to the embodiment of the invention;

fig. 4 is another schematic structural diagram of the special-shaped display panel according to the embodiment of the present invention;

fig. 5 is a schematic structural diagram of a lower bezel of the special-shaped display panel according to the embodiment of the present invention;

fig. 6 is a schematic diagram of a circuit structure in the special-shaped display panel according to the embodiment of the invention;

fig. 7 is a schematic structural diagram of a chip bonding area in the special-shaped display panel provided in the embodiment of the present invention after a chip is bonded;

FIG. 8 is a schematic diagram of an anomalous display device according to an embodiment of the invention;

fig. 9 is a flowchart of a method for manufacturing a special-shaped display panel according to an embodiment of the present invention.

Detailed Description

At present, in the existing special-shaped display panel, as shown in fig. 1, an IC chip 1 is bound to a lower portion of a lower frame, i.e., a non-display area, located in the display area, and a test pad 2 for displaying a test is respectively disposed on two sides of the IC chip, so that the space occupied by the lower frame is large, the space occupied by the special-shaped display area adjacent to the lower frame is compressed, and the special-shaped display area cannot realize a desired shape, for example, a perfect circle shape, and thus cannot meet the customer requirements.

The embodiment of the invention provides a special-shaped display panel, a manufacturing method thereof and a special-shaped display device, aiming at the problem that the size of a lower frame of the special-shaped display panel in the prior art is larger. In order to make the purpose, technical solution and advantages of the present invention clearer, specific embodiments of the special-shaped display panel, the manufacturing method thereof and the special-shaped display device provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the preferred embodiments described below are only for illustrating and explaining the present invention and are not to be used for limiting the present invention. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.

The special-shaped display panel provided by the embodiment of the invention, as shown in fig. 2, comprises a special-shaped display area a and a non-display area B surrounding the special-shaped display area a;

a chip pad C is included in the non-display area B, and a plurality of display test pad pads 100 are included in the chip pad C.

Specifically, the special-shaped display panel may be a liquid crystal display panel or an organic light emitting display panel, which is not limited herein. A plurality of sub-pixels arranged in an array are generally disposed in the special-shaped display area a, and each sub-pixel is correspondingly provided with a thin film transistor, wherein the array can be divided into a row direction and a column direction. In order to drive the sub-pixels SP arranged in the array to display a picture, a data signal line and a scanning signal line are further arranged in the display area, and the scanning signal line and the data signal line respectively extend along two directions of the array. Generally, a chip bonding pad C is disposed at a lower frame of the non-display area B for bonding a chip, and the display test pad 100 is used for connecting an external test probe, so as to perform a pre-factory test on the display pixels in the special-shaped display area a through a signal line.

Specifically, in the above-mentioned special-shaped display panel provided in the embodiment of the present invention, the space of the chip bonding area C in the non-display area B is used for bonding a chip, that is, the space of the area shielded by the chip in the non-display area B is used for setting the display test pad 100, before the special-shaped display panel leaves the factory, the display test pad 100 in the chip bonding area C is used for performing display detection on the special-shaped display area a, after the test is qualified, the function of the display test pad 100 is completed, the chip is bonded to the chip bonding area C, and the chip bonding area C is shielded by the bonded chip, so that the function of each element set at the lower frame is not affected. Compared with the existing lower frame design mode shown in fig. 1, the display test pad 100 is arranged on the chip welding area C, frames on two sides of the chip welding area C can be compressed, performance and size of each element on the lower frame can be kept, occupied space on the lower frame is small, and the special-shaped display area a is guaranteed to achieve a required shape so as to meet customer requirements.

Optionally, in the above-mentioned special-shaped display panel provided in the embodiment of the present invention, as shown in fig. 2, an outer contour of the special-shaped display area a may be a perfect circle; the non-display area B may have a regular circular shape. The requirements of customers for applying the special-shaped display panel to the special-shaped display device are favorably met. In addition, the shape of the special-shaped display area a and the special-shaped display panel may also be other shapes, such as a rectangle with rounded corners, a triangle, an ellipse, and the like, which is not limited herein. The following description is given by taking the outer contour of the special-shaped display area a as a perfect circle.

Optionally, in the above-mentioned special-shaped display panel provided in the embodiment of the present invention, as shown in fig. 3, at least two display test pad regions C1 disposed at intervals may be included in the chip bonding region C, and a plurality of display test pad regions 100 are disposed in each display test pad region C1.

Generally, the chip pad C is located at the lower frame of the non-display area B, and for convenience of soldering the chip, the chip pad C may be located in a middle area of the lower frame of the special-shaped display panel, that is, the chip pad C may be considered to be located at a central axis of the special-shaped display area a, for convenience of displaying that the test pad 100 is connected to the to-be-tested element (for example, the gate driving circuit, the multiplexing circuit, the test switch circuit, and other elements), a display test pad area C1 may be respectively disposed at the left and right sides in the chip pad C, the display test pad 100 in the left display test pad area C1 is generally connected to the to-be-tested element at the left side, and the display test pad 100 in the right display test pad area C1 is generally connected to the to-be-tested element at the right side, so as.

The plurality of display test pad areas 100 disposed in the display test pad area C1 are independent of each other, and may be arranged in various ways, for example, in a row or in multiple rows, which is not limited herein.

Optionally, in the above-mentioned special-shaped display panel provided in the embodiment of the present invention, as shown in fig. 3, a chip output pad C2 and a chip input pad C3 may be further included in the chip bonding pad C, and the chip output pad C2 is closer to the special-shaped display area a than the chip input pad C3, so that the chip output terminal 500 in the chip output pad C2 is electrically connected to the signal line in the special-shaped display area a to provide an electrical signal for display;

the display test pad area C1 is located in the area between the chip output pad area C2 and the chip input pad area C3, that is, the display test pad area C1 is set in the free area between the chip output pad area C2 and the chip input pad area C3 in the chip bonding area C, so that the display test pad 100 is set in the chip bonding area C to compress the frames on both sides of the chip bonding area C, so that the space occupied by the lower frame is small, and the special-shaped display area a is ensured to realize a required shape to meet the customer requirements, without affecting the functions of the chip output pad area C2 and the chip input pad area C3.

Optionally, in the special-shaped display panel provided in the embodiment of the present invention, as shown in fig. 4, the non-display area B outside the chip bonding area C generally further includes a gate driving circuit 200, a multiplexer circuit 300(Demux) and a test switch circuit 400(VT SW); the test switch circuit 400 is located between the multi-path selection circuit 300 and the chip welding area C, and the gate driving circuit 200 is distributed in the non-display area B at two sides of the multi-path selection circuit 300; as shown in fig. 5, each display test pad 100 is electrically connected to the corresponding gate driving circuit 200, the multiplexing circuit 300 and the test switch circuit 400 through the first traces 101, 102, 103. Specifically, the gate driving circuit 200 is electrically connected to the corresponding display test pad 100 through the first trace 101, the multi-path selecting circuit 200 is electrically connected to the corresponding display test pad 100 through the first trace 102, the test switch circuit 400 is electrically connected to the corresponding display test pad 100 through the first trace 103, and the number of the first traces 101, 102, and 103 is set according to actual needs, which is not limited herein.

Specifically, the main function of the multi-path selection circuit Demux is to connect a plurality of Data lines Data in the special-shaped display area a with one Data signal sector line Fanout a, so that the Data lines Data are provided with Data signals by matching the Data lines Data with the Data signal sector line Fanout a in a time-sharing manner and by time-sharing opening of the one Data signal sector line Fanout a and a plurality of switch elements, and thus, the number of the Data signal sector line Fanout a can be reduced relative to the number of the Data lines Data, and a subsequent chip IC can be electrically connected with the Data signal sector line Fanout a through a chip output terminal 500 in a chip output pad area C2. Based on this, the multiplexer circuit Demux, as shown in fig. 6, generally includes: a plurality of first thin film transistors T1, and a plurality of clock control signal lines CKH R, CKHG, and CKH B; wherein the content of the first and second substances,

each first thin film transistor T1 corresponds to each Data line Data one by one; the first thin film transistors T1 are divided into multiple groups (shown by dashed boxes), each group of the first thin film transistors T1 corresponds to one data signal sector trace Fanout a; fig. 6 shows a case where two sets of first thin film transistors T1 respectively correspond to two data signal sector lines Fanout a; the source of each first thin film transistor T1 in each group of first thin film transistors T1 is electrically connected to the corresponding Data signal sector trace Fanout a, the gate is electrically connected to different clock control signal lines CKH R, CKH G, and CKH B, and the drain is electrically connected to different Data lines Data.

In specific application, the clock control signal lines CKH R, CKH G, and CKH B are periodically and sequentially loaded with the turn-on voltage, so that the first thin film transistors T1 correspondingly connected in each group of the first thin film transistors T1 are periodically and sequentially in a conducting state, and when the first thin film transistors T1 are in the conducting state, the Data signal sector routing Fanout a is conducted with the corresponding Data lines Data, so as to load the Data signals required by the corresponding Data lines Data.

Specifically, the test switch circuit VT SW is mainly used for testing before the array substrate is not mounted with the chip IC, and a Data signal can be loaded to the Data line Data of the special-shaped display area through the test switch circuit VT SW, so as to test whether the display area meets the quality inspection standard.

Specifically, the main function of the gate driving circuit 200 is to provide a gate-on signal to the gate line in the special-shaped display area a.

Therefore, the gate driving circuit 200, the multiplexing circuit 300 and the test switch circuit 400 are electrically connected to the corresponding display test pad pads 100 through the first traces 101, 102 and 103.

Optionally, in the above-mentioned special-shaped display panel provided in the embodiment of the present invention, as shown in fig. 5, a plurality of chip output terminals 500 may be included in the chip output pad region C2, and each chip output terminal 500 is electrically connected to the gate driving circuit 200, the multiplexing circuit 300 and the test switch circuit 400 through second routing lines 501, 502 and 503, so that the chip output terminal 500 transmits an electrical signal received from a chip to a corresponding circuit to control display. Specifically, the gate driving circuit 200 is electrically connected to the corresponding display test pad 100 through the second trace 501, the multi-path selecting circuit 200 is electrically connected to the corresponding display test pad 100 through the second trace 502, the test switch circuit 400 is electrically connected to the corresponding display test pad 100 through the second trace 503, and the number of the second traces 501, 502, and 503 is set according to actual needs, which is not limited herein.

Optionally, in the special-shaped display panel provided in the embodiment of the present invention, in order to ensure normal operation of the special-shaped display area a, as shown in fig. 5, the first traces 101, 102, and 103 and the second traces 501, 502, and 503 are insulated from each other, so as to ensure that the two traces do not short. The two films can be insulated from each other in a mode of being arranged on different films, the two films can be overlapped with each other at the moment, the two films can also be overlapped with each other to save space, or the two films can be insulated from each other in a mode of being arranged on the same film and not being overlapped with each other, or the two films can be insulated from each other in a mode of being arranged on a jumper wire, and limitation is not performed.

Optionally, in the above-mentioned special-shaped display panel provided in the embodiment of the present invention, as shown in fig. 7, a chip 600 covering the chip bonding pad C may be further included, and the chip input pad C3 includes a plurality of chip input terminals 700 therein;

the output terminals 601 of the chip 600 are soldered to the chip output terminals 500 in the chip output pad area C2, and the input terminals 602 of the chip 600 are soldered to the chip input terminals 700 in the chip input pad area C3.

Specifically, after completing the performance test of the special-shaped display panel, the display test pad 100 has completed its function, and the chip 600 bound to the special-shaped display panel covers the chip bonding area C, i.e., the chip 600 can shield the display test bonding area C1, so as to compress the frames on both sides of the chip bonding area C, so that the space occupied by the lower frame is smaller, and the special-shaped display area a is ensured to realize a required shape, so as to meet the customer requirements.

Based on the same inventive concept, an embodiment of the present invention further provides a special-shaped display device, for example, a smart watch as shown in fig. 8, including the special-shaped display panel provided in the embodiment of the present invention. Other essential components of the special-shaped display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the present invention. The implementation of the special-shaped display device can be seen in the above embodiment of the special-shaped display panel, and repeated descriptions are omitted.

Based on the same inventive concept, the embodiment of the invention also provides a manufacturing method of the special-shaped display panel, and as the principle of solving the problems of the manufacturing method is similar to that of the special-shaped display panel method, the implementation of the manufacturing method can refer to the implementation of the special-shaped display panel, and repeated parts are not repeated.

The method for manufacturing the special-shaped display panel provided by the embodiment of the invention, as shown in fig. 9, specifically includes the following steps:

s101, manufacturing a display device in a special-shaped display area, and manufacturing a plurality of display test pad pads in a chip welding area of a non-display area; as shown in fig. 5, a plurality of chip output terminals 500 are also formed in the chip output pad C2 in the chip bonding pad, and a plurality of chip input terminals 700 are also formed in the chip input pad C3 in the chip bonding pad. The display device fabricated in the special-shaped display area may be an organic electroluminescent display device, or may be another display device, which is not limited herein.

S102, after the testing needle is electrically connected with each display testing pad, testing signals are introduced to test the display device; the display test is realized by loading a test electrical signal to the display test pad and transmitting the test electrical signal to the corresponding gate driving circuit 200, the multi-path selection circuit 300 and the test switch circuit 400 through the first wires 101, 102 and 103; after the test, the test pad 100 is shown to have completed its function.

And S103, after the test is qualified, welding a chip on the chip welding area, as shown in FIG. 7, the chip 600 bound on the special-shaped display panel covers the chip welding area C, namely the chip 600 can shield the display test welding area C1 to compress the frames on two sides of the chip welding area C, so that the space occupied by the lower frame is smaller, and the special-shaped display area A is ensured to realize the required appearance to meet the customer requirement.

According to the special-shaped display panel, the manufacturing method of the special-shaped display panel and the special-shaped display device, the space of the chip welding area in the non-display area is utilized, the chip welding area is used for welding a chip, namely the space of the area, shielded by the chip, in the non-display area is utilized, the display test pad is arranged, before the special-shaped display panel leaves a factory, the display test pad in the chip welding area is utilized to perform display detection on the special-shaped display area, after the test is qualified, the function of the display test pad is completed, the chip can be welded in the chip welding area, the chip welding area can be shielded by the welded chip, and the functions of all elements arranged at the lower frame cannot be influenced. Compared with the existing lower frame design mode, the display test pad is arranged on the chip welding area, frames on two sides of the chip welding area can be compressed, the performance and the size of each element at the lower frame can be kept, the occupied space at the lower frame is small, and the special-shaped display area is guaranteed to achieve the required appearance so as to meet the requirements of customers.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.