阅读说明：本技术 一种自动内循环和流量控制的水镀装置 (Automatic water-plating device of inner loop and flow control ) 是由 夏一娇 于 2019-10-18 设计创作，主要内容包括：本发明公开了一种自动内循环和流量控制的水镀装置,入池区中,铜膜的内外侧分别设有第一内进液管和第一外进液管,第一内进液管的液体穿过第二入池钛蓝到达铜膜的内侧面,第一外进液管流出的液体穿过第一入池钛蓝到达铜膜的外侧表面；出池区中,铜膜的内外侧设有第二内进液管和第二外进液管,第二内进液管的液体穿过第二出池钛蓝到达铜膜的内表面,第二外进液管流出的液体穿过第一出池钛蓝到达铜膜的外侧表面；铜膜的内侧设有第二出池钛蓝和第二内进液管,电镀池的上侧边缘设有带铜离子浓度探测器回液槽。本发明有效地解决了电解液在镀液池内循环不均匀的现象,导流板能灵活地调节电解液的流向,系统还能够根据铜膜的厚度实时反馈来调整电流大小。(The invention discloses a water plating device with automatic internal circulation and flow control.A first internal liquid inlet pipe and a first external liquid inlet pipe are respectively arranged on the inner side and the outer side of a copper film in a pool entering area, liquid in the first internal liquid inlet pipe passes through a second pool entering titanium blue to reach the inner side surface of the copper film, and liquid flowing out of the first external liquid inlet pipe passes through the first pool entering titanium blue to reach the outer side surface of the copper film; in the tank outlet area, a second inner liquid inlet pipe and a second outer liquid inlet pipe are arranged on the inner side and the outer side of the copper film, liquid in the second inner liquid inlet pipe penetrates through the second tank outlet titanium blue to reach the inner surface of the copper film, and liquid flowing out of the second outer liquid inlet pipe penetrates through the first tank outlet titanium blue to reach the outer surface of the copper film; the inner side of the copper film is provided with a second tank titanium blue and a second inner liquid inlet pipe, and the edge of the upper side of the electroplating tank is provided with a liquid return groove with a copper ion concentration detector. The invention effectively solves the problem of uneven circulation of the electrolyte in the plating bath, the flow direction of the electrolyte can be flexibly adjusted by the guide plate, and the system can also adjust the current according to the real-time feedback of the thickness of the copper film.)

1. A water plating device with automatic internal circulation and flow control comprises an electroplating pool, wherein a steering conductive roller is arranged in the electroplating pool, a copper film bypasses the steering conductive roller after entering the electroplating pool and is discharged from the electroplating pool, and the water plating device is characterized in that the left side and the right side of the electroplating pool are respectively provided with a pool inlet area and a pool outlet area which are symmetrical,

In the tank entering area, a first tank entering titanium blue and a first outer liquid inlet pipe are arranged on the outer side of the copper film, liquid flowing out of the first outer liquid inlet pipe penetrates through the first tank entering titanium blue to reach the outer side surface of the copper film, a second tank entering titanium blue and a first inner liquid inlet pipe are arranged on the inner side of the copper film, and liquid flowing out of the first inner liquid inlet pipe penetrates through the second tank entering titanium blue to reach the inner side surface of the copper film;

In the tank outlet area, a first tank outlet titanium blue and a second outer liquid inlet pipe are arranged on the outer side of the copper film, liquid flowing out of the second outer liquid inlet pipe penetrates through the first tank outlet titanium blue to reach the outer side surface of the copper film, a second tank outlet titanium blue and a second inner liquid inlet pipe are arranged on the inner side of the copper film, and liquid flowing out of the second inner liquid inlet pipe penetrates through the second tank outlet titanium blue to reach the inner side surface of the copper film;

The electroplating device is characterized in that a liquid return groove is formed in the edge of the upper side of the electroplating tank, a plurality of copper ion concentration detectors are arranged in the liquid return groove, and the copper ion concentration detectors are connected with proportional valves at inlets of the liquid inlet pipes through a closed-loop control system.

2. the automatic internal circulation and flow control water-plating device of claim 1, wherein said first external liquid inlet pipe, said first internal liquid inlet pipe, said second external liquid inlet pipe and said second internal liquid inlet pipe are all provided with a plurality of liquid spraying holes, and as the distance between said liquid spraying holes and the corresponding proportional valve increases, the aperture of said liquid spraying holes decreases and the distance between two adjacent liquid spraying holes decreases.

3. The automatic internal circulation and flow control water plating device as recited in claim 1, wherein a first baffle plate is further disposed in the tank inlet region, the first baffle plate corresponds to the first outer liquid inlet pipe in position, and guides the liquid flowing out of the first outer liquid inlet pipe to the titanium blue position of the first tank inlet.

4. the automatic internal circulation and flow control water plating apparatus of claim 3 wherein the first baffle is fixed to the plating cell by a first baffle shaft and the first baffle rotates about the first baffle shaft.

5. The automatic internal circulation and flow control water plating apparatus of claim 3 wherein the first baffle is S-shaped in cross-section.

6. the automatic internal circulation and flow control water plating device as recited in claim 1, wherein the first internal liquid inlet pipe is located between the copper film and the second titanium blue pool, and a first internal pipe liquid spraying hole is formed in the first internal liquid inlet pipe and faces the lower side of the second titanium blue pool.

7. The automatic internal circulation and flow control water plating device as recited in claim 1, wherein a second baffle plate is further disposed in the tank outlet area, the second baffle plate corresponds to the second external liquid inlet pipe in position and guides the liquid flowing out of the second external liquid inlet pipe to the titanium blue position of the first tank outlet.

8. The automatic internal circulation and flow control water plating apparatus of claim 7 wherein the second baffle is fixed to the plating cell by a second baffle shaft and the second baffle rotates about the second baffle shaft.

9. The automatic internal circulation and flow control water plating apparatus of claim 7 wherein the second baffle is S-shaped in cross-section.

10. the automatic internal circulation and flow control water plating device as recited in claim 1, wherein the second internal liquid inlet pipe is located between the copper film and the second pool titanium blue, and a second internal pipe liquid spraying hole is formed in the second internal liquid inlet pipe and faces the lower side of the second pool titanium blue.

Technical Field

The invention relates to the technical field of automatic production equipment, in particular to a water plating device with automatic internal circulation and flow control.

Background

On the automatic production line of lithium batteries, the copper film needs to be electroplated by using a plating solution tank. In the prior art, corresponding electroplating regions are formed by different copper ion concentrations of titanium blue along with the moving of a copper film, and in order to realize the movement of copper ions, a pumping external circulation system is adopted for control in the traditional method. Specifically, an external pump is adopted to extract electrolyte in the tank, the electrolyte flows back to the interior of the titanium blue, and the electrolyte with high copper ion content in the titanium blue is circulated to other areas in the tank.

However, the structure needs an additional pumping device, the volume of the product is increased, the corresponding cost is increased, meanwhile, the mode easily causes inconsistent flow direction, the concentration of the electrolyte in the tank is regionally uneven, and further turbulence in the tank is caused; but also affects the stability of the copper film during the run in the bath.

The above-mentioned drawbacks are worth solving.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention provides a water plating device with automatic internal circulation and flow control.

The technical scheme of the invention is as follows:

A water plating device with automatic internal circulation and flow control comprises an electroplating pool, wherein a steering conductive roller is arranged in the electroplating pool, a copper film bypasses the steering conductive roller after entering the electroplating pool and is discharged from the electroplating pool, and the water plating device is characterized in that the left side and the right side of the electroplating pool are respectively provided with a pool inlet area and a pool outlet area which are symmetrical,

in the tank entering area, a first tank entering titanium blue and a first outer liquid inlet pipe are arranged on the outer side of the copper film, liquid flowing out of the first outer liquid inlet pipe penetrates through the first tank entering titanium blue to reach the outer side surface of the copper film, a second tank entering titanium blue and a first inner liquid inlet pipe are arranged on the inner side of the copper film, and liquid flowing out of the first inner liquid inlet pipe penetrates through the second tank entering titanium blue to reach the inner side surface of the copper film;

In the tank outlet area, a first tank outlet titanium blue and a second outer liquid inlet pipe are arranged on the outer side of the copper film, liquid flowing out of the second outer liquid inlet pipe penetrates through the first tank outlet titanium blue to reach the outer side surface of the copper film, a second tank outlet titanium blue and a second inner liquid inlet pipe are arranged on the inner side of the copper film, and liquid flowing out of the second inner liquid inlet pipe penetrates through the second tank outlet titanium blue to reach the inner side surface of the copper film;

The electroplating device is characterized in that a liquid return groove is formed in the edge of the upper side of the electroplating tank, a plurality of copper ion concentration detectors are arranged in the liquid return groove, and the copper ion concentration detectors are connected with proportional valves at inlets of the liquid inlet pipes through a closed-loop control system.

The invention according to the above aspect is characterized in that the turning conductive roller is located at a boundary between the pool inlet area and the pool outlet area.

The invention according to the scheme is characterized in that a pool entering conductive roller is arranged at an inlet of the electroplating pool and comprises a first pool entering conductive roller and a second pool entering conductive roller, the rotating directions of the first pool entering conductive roller and the second pool entering conductive roller are opposite, and the first pool entering conductive roller and the second pool entering conductive roller enter the electroplating pool in sequence.

The invention according to the scheme is characterized in that the outlet of the electroplating pool is provided with a pool outlet conductive roller, the pool outlet conductive roller comprises a first pool outlet conductive roller and a second pool outlet conductive roller, the rotation directions of the first pool outlet conductive roller and the second pool outlet conductive roller are opposite, and the first pool outlet conductive roller and the second pool outlet conductive roller pass through the electroplating pool in sequence and then pass through the electroplating pool.

The invention according to the above scheme is characterized in that the first outer liquid inlet pipe, the first inner liquid inlet pipe, the second outer liquid inlet pipe and the second inner liquid inlet pipe are all pure titanium pipes.

The invention according to the above scheme is characterized in that the first outer liquid inlet pipe, the first inner liquid inlet pipe, the second outer liquid inlet pipe and the second inner liquid inlet pipe are all provided with a plurality of liquid spraying holes, the hole diameter of each liquid spraying hole is reduced along with the increase of the distance between the liquid spraying hole and the corresponding proportional valve, and the distance between two adjacent liquid spraying holes is also reduced.

The invention according to the above scheme is characterized in that a first guide plate is further arranged in the tank inlet area, the first guide plate corresponds to the first outer liquid inlet pipe in position, and the first guide plate guides liquid flowing out of the first outer liquid inlet pipe to the first tank inlet titanium blue.

Furthermore, the first guide plate is fixed on the electroplating pool through a first guide plate shaft, and the first guide plate rotates around the first guide plate shaft.

Furthermore, a first outer pipe liquid spraying hole is formed in the first outer liquid inlet pipe and faces the rotating direction of the first guide plate.

Further, the cross section of the first guide plate is S-shaped.

Furthermore, the first guide plate comprises a straight section and an arc section provided with two ends of the straight section, and the first outer liquid inlet pipe is positioned on the circumferential track of the arc section.

The invention according to the scheme is characterized in that the first inner liquid inlet pipe is positioned between the copper film and the second titanium blue entering the pool, a first inner pipe liquid spraying hole is formed in the first inner liquid inlet pipe, and the first inner pipe liquid spraying hole faces to the lower side of the second titanium blue entering the pool.

the invention according to the above scheme is characterized in that a second guide plate is further arranged in the pool outlet area, the second guide plate corresponds to the second outer liquid inlet pipe in position, and the second guide plate guides liquid flowing out of the second outer liquid inlet pipe to the titanium blue position of the first pool outlet.

Furthermore, the second guide plate is fixed on the electroplating pool through a second guide plate shaft, and the second guide plate rotates around the second guide plate shaft.

Furthermore, a second outer pipe liquid spraying hole is formed in the second outer liquid inlet pipe and faces the rotating direction of the second guide plate.

Further, the cross section of the second guide plate is S-shaped.

furthermore, the second guide plate comprises a straight section and an arc section provided with two ends of the straight section, and the second outer liquid inlet pipe is positioned on the circumferential track of the arc section.

The invention according to the above scheme is characterized in that the second inner liquid inlet pipe is located between the copper film and the second pool titanium blue, a second inner pipe liquid spraying hole is formed in the second inner liquid inlet pipe, and the second inner pipe liquid spraying hole faces the lower side of the second pool titanium blue.

The invention according to the scheme has the advantages that the mode of regional strong pressure multi-point liquid inlet and equal-height overflow liquid return is adopted, the phenomenon that the electrolyte circulates unevenly in the plating bath is effectively solved, the S-shaped guide plate can flexibly adjust the flow direction of the electrolyte according to the consumption of the electrolyte, the copper ion concentration detector in the overflow groove can feed back in real time according to the thickness of a copper film, and the system can adjust the current according to the feedback.

Drawings

FIG. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a side view of the present invention.

In the figure, 111, a first bath conductive roller; 112. a second pond-entering conductive roller; 121. a first pool outlet conductive roller; 122. a second pool outlet conductive roller; 130. a steering conductive roller;

200. An electroplating pool; 211. first tank titanium blue; 212. second, titanium blue enters the pool; 221. first tank-discharging titanium blue; 222. second tank titanium blue is discharged; 230. a first inner liquid inlet pipe; 231. a first inner tube liquid spray hole; 240. a first outer liquid inlet pipe; 241. a first outer tube liquid spray hole; 250. a second outer liquid inlet pipe; 251. a second outer tube liquid spray hole; 260. a second inner liquid inlet pipe; 261. a second inner tube liquid spray hole; 270. a first baffle; 271. a first baffle shaft; 280. a second baffle; 281. a second baffle shaft; 291. a left liquid returning tank and a right liquid returning tank; 292. left and right copper ion concentration detectors; 293. a front liquid return tank and a rear liquid return tank; 294. front and rear copper ion concentration detectors;

300. A proportional valve;

400. And (5) a copper film.

Detailed Description

The invention is further described with reference to the following figures and embodiments:

as shown in figures 1 and 2, the water plating device with automatic internal circulation and flow control comprises a plating tank 200, wherein the left side and the right side of the plating tank 200 are respectively provided with a tank inlet area and a tank outlet area which are symmetrical. The electroplating pool 200 is internally provided with a steering conductive roller 130, the copper film 400 bypasses the steering conductive roller 130 and goes out of the electroplating pool after entering the electroplating pool 200, the walking path of the copper film 400 divides the electroplating pool 200 into an inner area and an outer area, the upper part of the copper film 400 is an inner area, and the lower part of the copper film 400 is an outer area. Preferably, the turning conductive roller 130 is located at the junction of the bath inlet area and the bath outlet area, so that the whole copper film 400 moves more smoothly.

The entrance of the electroplating pool 200 is provided with a pool entering conductive roller, the pool entering conductive roller comprises a first pool entering conductive roller 111 and a second pool entering conductive roller 112, the first pool entering conductive roller 111 and the second pool entering conductive roller 112 have opposite rotation directions, and the first pool entering conductive roller 111 and the second pool entering conductive roller 112 enter the electroplating pool 200 in sequence. The outlet of the electroplating pool 200 is provided with a pool outlet conductive roller, the pool outlet conductive roller comprises a first pool outlet conductive roller 121 and a second pool outlet conductive roller 122, the rotation directions of the first pool outlet conductive roller 121 and the second pool outlet conductive roller 122 are opposite, and the first pool outlet conductive roller 121 and the second pool outlet conductive roller 122 pass through the electroplating pool 200 in sequence and then pass out.

According to the invention, the first pool entering conductive roller 111 and the second pool entering conductive roller 112 are matched with each other, so that the tensioning of the copper film 400 entering the pool is realized, and the copper film 400 can enter the pool entering area from a specific angle; through the mutual matching of the first tapping conductive roller 121 and the second tapping conductive roller 122, the tapping tension of the copper film 400 is realized, and the copper film 400 can be tapped from a specific angle.

1. in the pond-entering area:

The first pool titanium blue 211 and the first outer liquid inlet pipe 240 are arranged on the outer side of the copper film 400, liquid flowing out of the first outer liquid inlet pipe 240 penetrates through the first pool titanium blue 211 to reach the outer side surface of the copper film 400, the second pool titanium blue 212 and the first inner liquid inlet pipe 230 are arranged on the inner side of the copper film 400, and liquid flowing out of the first inner liquid inlet pipe 230 penetrates through the second pool titanium blue 212 to reach the inner side surface of the copper film 400.

Preferably, a first guide plate 270 is further disposed in the tank entering region, the first guide plate 270 is fixed on the electroplating tank 200 through a first guide plate shaft 271, and the first guide plate 270 rotates around the first guide plate shaft 271. The first guide plate 270 corresponds to the first outer liquid inlet pipe 240, and guides the liquid flowing out from the first outer liquid inlet pipe 240 to the first titanium blue 211. The first outer liquid inlet pipe 240 is located at the lower side of the first titanium blue 211 and the second titanium blue 212, and the first outer liquid inlet pipe 240 is located within the range of the rotation circumference of the first baffle 270.

Preferably, the cross-section of the first baffle 270 is S-shaped, and the opening of the S-shape faces the direction of rotation of the first baffle 270. In this embodiment, the first guide plate 270 includes a straight section and an arc section having two ends of the straight section, and the first outer liquid inlet pipe 240 is located on a circumferential track of the arc section. The shape of the first baffle 270 is matched, so that the liquid coming in from the first outer liquid inlet pipe 240 is sufficiently guided by the first baffle 270.

Be equipped with first outer tube hydrojet hole 241 on first outer feed liquor pipe 240, first outer tube hydrojet hole 241 is towards first guide plate 270 pivoted direction for the rotation direction of first guide plate 270 can fully be cooperated to the liquid that flows in from first outer feed liquor pipe 240, and then guarantees that it can arrive first side of going into pond titanium blue 211 smoothly.

The first inner liquid inlet pipe 230 is located between the copper film 400 and the second titanium blue 212, a first inner pipe liquid spraying hole 231 is formed in the first inner liquid inlet pipe 230, and the first inner pipe liquid spraying hole 231 faces the lower side of the second titanium blue 212. The orientation of the liquid spray holes 231 of the first inner tube can enable the liquid flowing in to be matched with the boundary of the whole electroplating pool 200, so that the liquid can smoothly reach the side surface of the second pool titanium blue 212, and further the full reaction of the liquid and the second pool titanium blue 212 is ensured.

2. In the effluent area:

The outer side of the copper film 400 is provided with a first pool titanium blue 221 and a second outer liquid inlet pipe 250, liquid flowing out of the second outer liquid inlet pipe 250 passes through the first pool titanium blue 221 and reaches the outer side surface of the copper film 400, the inner side of the copper film 400 is provided with a second pool titanium blue 222 and a second inner liquid inlet pipe 260, and liquid flowing out of the second inner liquid inlet pipe 260 passes through the second pool titanium blue 222 and reaches the inner side surface of the copper film 400.

Preferably, a second guide plate 280 is further disposed in the pond outlet area, the second guide plate 280 corresponds to the second outer liquid inlet pipe 250 in position, and guides the liquid flowing out of the second outer liquid inlet pipe 250 to the first pond outlet titanium blue 221.

the second baffle 280 is fixed on the electroplating bath 200 by a second baffle shaft 281, and the second baffle 280 rotates around the second baffle shaft 281. The second guide plate 280 corresponds to the second outer liquid inlet pipe 250 in position, and guides the liquid flowing out from the second outer liquid inlet pipe 250 to the first tank titanium blue 221. The second outer liquid inlet pipe 250 is positioned at the lower side of the first titanium blue outlet 221 and the second titanium blue outlet 222, and the second outer liquid inlet pipe 250 is positioned within the range of the rotation circumference of the second baffle 280.

Preferably, the second baffle 280 has an S-shaped cross section, and the opening of the S-shape faces the direction of rotation of the second baffle 280. In this embodiment, the second guide plate 280 includes a straight section and an arc section having two ends of the straight section, and the second outer liquid inlet pipe 250 is located on a circumferential track of the arc section. The shape of the second baffle 280 is matched, so that the liquid coming in from the second outer liquid inlet pipe 250 is sufficiently guided by the second baffle 280.

The second outer liquid inlet pipe 250 is provided with a second outer pipe liquid spraying hole 251, and the second outer pipe liquid spraying hole 251 faces to the rotating direction of the second guide plate 280, so that liquid flowing in from the second outer liquid inlet pipe 250 can fully match with the rotating direction of the second guide plate 280, and the liquid can smoothly reach the side face of the first outlet titanium blue 221.

The second inner liquid inlet pipe 260 is located between the copper film 400 and the second pool titanium blue 222, a second inner pipe liquid spraying hole 261 is formed in the second inner liquid inlet pipe 260, and the second inner pipe liquid spraying hole 261 faces the lower side of the second pool titanium blue 222. The orientation of the liquid spraying holes 261 of the second inner tube can enable the liquid flowing in to match the boundary of the whole electroplating pool 200, so that the liquid can smoothly reach the side surface of the second pool titanium blue 222, and further the full reaction between the liquid and the second pool titanium blue 222 is ensured.

In this embodiment, the first flow guiding plate 270 and the second flow guiding plate 280 function as a guiding function for the flowing direction of the electrolyte, and the flowing direction of the electrolyte flowing through the titanium blue can be adjusted according to the difference between the copper ion concentration of the electrolyte and the process requirement.

In this embodiment, the first outer liquid inlet pipe 240, the first inner liquid inlet pipe 230, the second outer liquid inlet pipe 250, and the second inner liquid inlet pipe 260 are all pure titanium pipes, which can not only satisfy the mutual reflection between the copper film 400 and the titanium blue, but also play a sufficient role in supporting.

First outer feed liquor pipe 240, first interior feed liquor pipe 230, feed liquor pipe 260 is equallyd divide in the outer feed liquor pipe of second 250 and the second and is connected in the proportional valve 300 that corresponds, and all be equipped with a plurality of hydrojet holes on each feed liquor pipe, along with the increase of hydrojet hole and the proportional valve 300 distance that corresponds, the aperture in hydrojet hole reduces thereupon, and the interval in two adjacent hydrojet holes also reduces thereupon, the aperture and the interval in hydrojet hole can set up according to specific operational environment requirement, no longer describe here any more.

The invention manufactures the liquid spraying holes according to the pressure attenuation method, namely the distance and the aperture of the liquid spraying holes are manufactured according to the pressure attenuation principle, and the traditional circulation mode of pumping external circulation plating bath electrolyte is replaced by strong pressure internal circulation, so that the cost is saved, fluid with uniform flow velocity and uniform flow direction can be obtained, and the circulation effect is better. The strong pressure multiple point feed liquor forms more regular laminar flow direction in the pond, cooperates each guide plate to more conveniently change the flow direction of electrolyte.

The edge of the upper side of the electroplating pool 200 is provided with a liquid return tank, a plurality of copper ion concentration detectors are arranged in the liquid return tank, and the copper ion concentration detectors are connected with proportional valves at the inlets of the liquid inlet pipes through a closed-loop control system. The copper ion concentration detectors in the overflow grooves can feed back in real time according to the thickness of the copper film, and the system can adjust the current according to the feedback to form a complete closed-loop control system.

Specifically, left and right liquid return grooves 291 are arranged on the left and right sides of the electroplating tank 200, and a plurality of left and right copper ion concentration detectors 292 are arranged in the left and right liquid return grooves 291; front and rear liquid return grooves 293 are formed in front and rear sides of the plating tank 200, and a plurality of front and rear copper ion concentration detectors 294 are provided in the front and rear liquid return grooves 293.

the overflow return ports are located at two longitudinal ends of the plating tank 200, so that in the plating tank 200 of fig. 1, the electrolyte on the inner side flows to the back side and the electrolyte on the outer side flows to the front side with the center as a boundary, thereby forming a regular flowing direction. The invention adopts a method of overflow of the overflow groove and liquid return, so that the electrolyte of the whole plating bath 200 forms a complete circulation system. Meanwhile, the concentration change of the liquid in the electroplating pool 200 is monitored through a copper ion concentration detector, whether the consumption of copper ions in the electrolyte is within the process requirement can be monitored in real time, and the automatic control of the concentration of the electric ions is realized through automatically adjusting the flow of the inlet liquid according to the change of the concentration of the electrolyte in the tank. Compared with the traditional water plating equipment, the control is more convenient and stable, the efficiency is higher, and the cost is lower.

The realization principle of the invention is as follows:

Because the titanium blue is a conductive anode and a copper ball containing container for supplementing the copper ion concentration, the copper ion concentration of the electrolyte around and in the titanium blue is much higher than that of the electrolyte in other areas.

In the copper film 400 as a cathode during the plating process, the surface current density is different for each area, which results in different consumption of copper ions in the electrolyte for each area. In order to ensure the consistency of the electroplating effect on the surface of the copper film 400, the concentration of the plating solution in each area is detected and adjusted. The ideal plating solution effect is achieved by adjusting the opening degree of the proportional valve 300 through the feedback value of the copper ion concentration detector installed in each liquid return tank. The specific control mode is as follows: when the copper ion concentration of the return liquid in the area is detected to be higher, the opening degree of the proportional valve 300 on the corresponding liquid inlet pipe is increased; otherwise, the proportional valve 300 is decreased in opening. The process is controlled in a full-automatic closed loop mode, and the concentration of the plating solution in the electroplating pool 200 is always maintained within the range of the process requirement.

the invention adopts a liquid inlet mode with adjustable multi-point liquid spraying angles, can achieve uniform flow velocity and uniform flow in the width direction, can generate laminar flow with uniform flow velocity and adjustable flow direction in the plating bath under the combined action of the guide plate and the liquid inlet angle, and can bring out the electrolyte with high copper ion content in the titanium blue when the electrolyte flows through the titanium blue, and the electrolyte uniformly and uniformly tends to the surface of the copper film 400. Because an overflow liquid returning method is adopted, the low-concentration electrolyte can float to the position of the liquid level and finally overflow. Therefore, the electrolyte flows from bottom to top in both the direction of the inlet (inlet) of the copper film 40 and the direction of the outlet (outlet) of the copper film 400 (the specific gravity of the electrolyte consuming copper ions is lower than that of the electrolyte containing copper ions in the course of electroplating). Forming a nearly closed laminar flow path.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

The invention is described above with reference to the accompanying drawings, which are illustrative, and it is obvious that the implementation of the invention is not limited in the above manner, and it is within the scope of the invention to adopt various modifications of the inventive method concept and technical solution, or to apply the inventive concept and technical solution to other fields without modification.