阅读说明：本技术 覆铜层压板、印刷电路板及印刷电路板的制造方法 (Copper-clad laminate, printed wiring board, and method for manufacturing printed wiring board ) 是由 王宏远 王和志 于 2019-08-21 设计创作，主要内容包括：本发明提供了一种覆铜层压板,其包括绝缘基板以及覆盖于绝缘基板表面的铜箔层；绝缘基板包括至少一层第一绝缘层,第一绝缘层为由纤维制成的表面纤维毡与树脂共同形成的共混物或无纺布增强复合材料与树脂共同形成的共混物；铜箔层贴设于第一绝缘层的外表面。本发明还提供了一种印刷电路板,其包括由本发明的覆铜层压板制得。本发明还提供了一种印刷电路板的制作方法。与相关技术相比,本发明的覆铜层压板及印刷电路板介电性能优。(the invention provides a copper-clad laminated board, which comprises an insulating substrate and a copper foil layer covering the surface of the insulating substrate; the insulating substrate comprises at least one first insulating layer, wherein the first insulating layer is a blend formed by a surface fiber felt made of fibers and resin or a blend formed by a non-woven fabric reinforced composite material and resin; the copper foil layer is attached to the outer surface of the first insulating layer. The invention also provides a printed circuit board which comprises the copper-clad laminate. The invention also provides a manufacturing method of the printed circuit board. Compared with the related art, the copper-clad laminate and the printed circuit board have excellent dielectric properties.)

1. A copper clad laminate comprising an insulating substrate and a copper foil layer covering the surface of the insulating substrate,

The insulating substrate comprises at least one first insulating layer, wherein the first insulating layer is a blend formed by a surface fiber felt made of fibers and a resin or a blend formed by a non-woven fabric reinforced composite material and the resin; the copper foil layer is attached to the outer surface of the first insulating layer.

2. The copper-clad laminate according to claim 1, wherein the fiber volume content of the first insulating layer is 20 to 85% of the total volume of the first insulating layer.

3. The copper-clad laminate according to claim 2, wherein the fiber is any one of a glass fiber, a quartz fiber, and an organic fiber.

4. The copper-clad laminate according to claim 1, wherein the first insulating layer comprises two layers and is disposed at a distance from each other; the insulating substrate further comprises a second insulating layer which is clamped between the two first insulating layers, and the copper foil layer is attached to one side, far away from the second insulating layer, of the first insulating layer; the second insulating layer is made of fiber reinforced composite materials.

5. The copper-clad laminate according to claim 4, wherein the fiber volume content of the second insulating layer is equal to the fiber volume content of the first insulating layer in a volume fraction of the total volume of the second insulating layer, and the fiber volume content of the first insulating layer is 20 to 85% of the total volume of the first insulating layer.

6. The copper-clad laminate according to claim 1, wherein the resin is a blend of a resin matrix and a filler; the resin matrix is any one or more of polyphenyl ether, cyanate ester, epoxy resin, benzoxazine, hydrocarbon resin, bismaleimide, polytetrafluoroethylene, polyester and polyimide; the filler includes at least one of organic microspheres, silica, and titanium dioxide.

7. the copper-clad laminate according to claim 6, wherein the filler has a particle size of 0.1 to 5 μm.

8. A printed circuit board produced from the copper-clad laminate according to any one of claims 1 to 8.

9. A method for manufacturing a printed circuit board according to claim 8, comprising at least the steps of:

Step S10, impregnating resin into the surface fiber felt or non-woven fabric, and drying to obtain a first insulating layer prepreg;

Step S20, laying the copper foil layer and the first insulating layer, and then carrying out hot-pressing solidification according to a set process to obtain a copper-clad laminated board;

and step S30, carrying out exposure, development, etching and surface treatment on the copper-clad laminate according to a designed circuit to obtain the printed circuit board.

[ technical field ] A method for producing a semiconductor device

The invention relates to the technical field of copper-clad laminates, in particular to a copper-clad laminate and a printed circuit board.

[ background of the invention ]

in recent years, with the development of electronic information technology, electronic equipment mounting has been reduced in size and density, information has been increased in capacity and speed, and a demand for a printed wiring board having high comprehensive properties such as heat resistance, water absorption, chemical resistance, mechanical properties, dimensional stability, and dielectric properties has been increased.

[ summary of the invention ]

the invention aims to provide a copper-clad laminate and a printed circuit board with excellent dielectric properties.

In order to achieve the above object, the present invention provides a copper clad laminate, which includes an insulating substrate and a copper foil layer covering a surface of the insulating substrate; the insulating substrate comprises at least one first insulating layer, wherein the first insulating layer is a blend formed by a surface fiber felt made of fibers and a resin or a blend formed by a non-woven fabric reinforced composite material and the resin; the copper foil layer is attached to the outer surface of the first insulating layer.

Preferably, the fiber volume content of the first insulation layer is 20% to 85% of the total volume of the first insulation layer.

Preferably, the fiber is any one of glass fiber, quartz fiber and organic fiber.

Preferably, the first insulating layer comprises two layers and is arranged at intervals; the insulating substrate further comprises a second insulating layer which is clamped between the two first insulating layers, and the copper foil layer is attached to one side, far away from the second insulating layer, of the first insulating layer; the second insulating layer is made of fiber reinforced composite materials.

Preferably, the volume fraction of the fiber volume content of the second insulation layer in the total volume of the second insulation layer is equal to the volume fraction of the fiber volume content of the first insulation layer in the total volume of the first insulation layer, and the fiber volume content of the first insulation layer is 20% -85% of the total volume of the first insulation layer.

Preferably, the resin is a blend of a resin matrix and a filler; the resin matrix is any one or more of polyphenyl ether, cyanate ester, epoxy resin, benzoxazine, hydrocarbon resin, bismaleimide, polytetrafluoroethylene, polyester and polyimide; the filler includes at least one of organic microspheres, silica, and titanium dioxide.

Preferably, the filler has a particle size of 0.1 to 5 microns.

The invention also provides a printed circuit board, which is characterized in that the printed circuit board is prepared from the copper-clad laminate.

the invention also provides a manufacturing method of the printed circuit board, which at least comprises the following steps:

Step S10, impregnating resin into the surface fiber felt or non-woven fabric, and drying to obtain a first insulating layer prepreg;

Step S20, laying the copper foil layer and the first insulating layer, and then carrying out hot-pressing solidification according to a set process to obtain a copper-clad laminated board;

And step S30, carrying out exposure, development, etching and surface treatment on the copper-clad laminate according to a designed circuit to obtain the printed circuit board.

Compared with the prior art, the copper-clad laminate comprises an insulating substrate and a copper foil layer covering the surface of the insulating substrate; the insulating substrate comprises at least one first insulating layer, wherein the first insulating layer is a blend formed by a surface fiber felt made of fibers and a resin or a blend formed by a non-woven fabric reinforced composite material and the resin; the copper foil layer is attached to the outer surface of the first insulating layer. In the structure, the fibers of the first insulating layer are uniformly distributed, so that the dielectric property of the insulating substrate is effectively improved, and the copper-clad laminate has excellent dielectric property. The printed circuit board adopts the copper-clad laminate, so that the dielectric property of the printed circuit board is effectively optimized.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

FIG. 1 is a schematic structural view of a copper-clad laminate according to a first embodiment of the present invention;

FIG. 2 is a schematic view showing the distribution of fibers in the first insulating layer of the copper-clad laminate of the present invention;

Fig. 3 is a schematic flow chart illustrating a method for manufacturing a printed circuit board according to a first embodiment of the invention;

Fig. 4 is a schematic structural view of a copper-clad laminate according to a second embodiment of the present invention.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.