阅读说明：本技术 电动车辆的逆变器模块 (inverter module of electric vehicle ) 是由 宋雨男 毛康炜 李近朱 柯林·哈赫 纳森·钟 聂忠 王端阳 唐一帆 于 2019-08-23 设计创作，主要内容包括：本申请提供一种为电动车辆提供电力的逆变器模块。所述逆变器模块可包括一个电源模块或多个电源模块。所述电源模块可包括电容器和与电容器相连的散热器。电源模块可包括耦合到散热器上的陶瓷板。电源模块可包括具有多个狭缝的定位器和位于所述多个狭缝内的多个晶体管。定位器和多个晶体管可位于陶瓷板的第一表面上。电源模块可包括位于定位器的第一表面上的叠层母线排。电源模块可包括耦合到叠层母线排上的栅极驱动印刷电路板。电源模块可包括位于栅极驱动印刷电路板第一表面上的介电凝胶盘。(the present application provides an inverter module for providing power to an electric vehicle. The inverter module may include one power module or a plurality of power modules. The power module may include a capacitor and a heat sink coupled to the capacitor. The power module may include a ceramic board coupled to the heat sink. The power module may include a positioner having a plurality of slots and a plurality of transistors positioned within the plurality of slots. The locator and the plurality of transistors may be located on a first surface of the ceramic board. The power module may include a laminated bus bar on the first surface of the fixture. The power module may include a gate drive printed circuit board coupled to the laminated bus bar. The power module may include a dielectric gel pad on a first surface of the gate drive printed circuit board.)

1. an inverter module for providing power to an electric vehicle, comprising:

A power module, the power module comprising:

a capacitor;

A heat sink coupled to a first surface of the capacitor;

a first ceramic plate coupled to a first surface of the heat sink;

A second ceramic plate coupled to a first surface of the heat sink;

A locator having a plurality of slits;

A plurality of transistors located in the plurality of slits,

The locator and the plurality of transistors are located on the first surface of the first ceramic board and on a first surface of the second ceramic board;

A laminated bus bar located on a first surface of the fixture;

A gate drive printed circuit board coupled to a first surface of the laminated bus bar; and

And the dielectric adhesive disc is positioned on the first surface of the grid drive printed circuit board.

2. The inverter module of claim 1, further comprising:

An interior region defined by the dielectric gel tray,

the inner area having the gate drive printed circuit board, the laminated bus bar, the plurality of transistors, the retainer, the first ceramic board, the second ceramic board, and the heat spreader located therein; and

At least one fastener by which the dielectric gel disk is coupled to a capacitor.

3. the inverter module of claim 1, further comprising:

At least one clip connecting the plurality of transistors to the plurality of slots of the positioner.

4. The inverter module of claim 1, further comprising:

A positive DC bus bar coupled to a side surface of the power module by a bracket.

5. The inverter module of claim 1, further comprising:

A negative DC bus bar coupled to a side surface of the power module through a bracket.

6. The inverter module of claim 1, further comprising:

a positive Y capacitor bus bar coupled to a side surface of the power module through a bracket, and

The positive Y capacitor bus bar has a first positive electrical component extending along the first side surface of the standoff and a second positive electrical component extending along the second side surface of the standoff.

7. the inverter module of claim 1, further comprising:

A negative Y capacitor bus bar coupled to a side surface of the power module through a bracket, and

The negative Y capacitor bus bar has a first negative electrical component extending along a first side surface of the rack and a second negative electrical component extending along a second side surface of the rack.

8. The inverter module of claim 1, further comprising:

a grounded Y capacitor bus bar coupled to the positive DC bus bar of the power module by a bracket; and the grounded Y capacitor bus bar is coupled to the first side surface of the bracket.

9. the inverter module of claim 1, further comprising:

an inverter housing assembly defining an interior region; and

A plurality of power modules located in the interior region.

10. The inverter module of claim 1, further comprising:

an electromagnetic interference shield on a first surface of a plurality of power modules, the plurality of power modules located in an interior region of the inverter module, and the electromagnetic interference shield located within the interior region; and

a control panel located on a first surface of the EMI shield, the control panel located within the interior region.

11. The inverter module of claim 1, further comprising:

at least one voltage connector located in an interior region of the inverter module.

12. the inverter module of claim 1, further comprising:

A first temperature sensor disposed adjacent to the inlet of the inverter case assembly, the first temperature sensor being located in an interior region of the inverter module; and

A second temperature sensor disposed adjacent to an outlet of the inverter case assembly, the second temperature sensor being located in the interior region.

13. the inverter module of claim 1, further comprising:

a thermally conductive pad;

A discharge plate coupled to the heat conductive pad;

A bracket coupled to the discharge plate;

A temperature sensor; and

A wire clamp coupled to the temperature sensor, the bracket, the discharge plate and the heat conductive pad, and

the thermal pad, the discharge plate, the bracket, the temperature sensor, and the clip are located in an interior region of the inverter module.

14. The inverter module of claim 1, comprising:

Three power modules, a triplet coupled in the inverter module; and

the inverter module is located in an electric vehicle.

15. A method of providing electrical power to an electric vehicle via an inverter module, the method comprising:

Providing a capacitor;

Coupling a heat sink to a first surface of the capacitor;

Placing a first ceramic plate on a first surface of the heat sink;

Placing a second ceramic plate on a first surface of the heat sink;

providing a locator having a plurality of slots;

Placing a plurality of transistors in the plurality of slits, the retainer and the plurality of transistors being located on a first surface of the first ceramic plate and a first surface of the second ceramic plate;

Providing a laminated bus bar onto a first surface of the fixture;

Coupling a gate drive printed circuit board to a first surface of the laminated bus bar; and

a dielectric gel disk is placed on a first surface of the gate drive printed circuit board.

16. The method of claim 15, further comprising:

Providing a dielectric gel tray defining an interior region;

disposing each of the gate drive printed circuit board, the laminated bus bar, the plurality of transistors, the locator, the first ceramic board, the second ceramic board, and the heat spreader in the interior region defined by the dielectric gel tray; and

The dielectric gel disk is coupled to the capacitor by at least one fastener.

17. The method of claim 15, further comprising:

Providing a bracket proximate a side surface of the power module;

Coupling a positive DC bus bar to the side surface of the power module using the bracket; and

Coupling a negative DC bus bar to the side surface of the power module using the bracket.

18. The method of claim 15, further comprising:

Providing a bracket in close proximity to a side surface of the power module;

Coupling a positive Y capacitor bus bar to a side surface of a power module using the bracket;

The positive Y capacitor bus bar has a first positive electrical component extending along the first side surface of the bracket and a second positive electrical component extending along the second side surface of the bracket;

Coupling a negative Y capacitor bus bar to a side surface of a power module using the bracket; and

The negative Y capacitor bus bar has a first negative electrical component extending along a first side surface of the rack and a second negative electrical component extending along a second side surface of the rack.

19. the method of claim 15, further comprising:

Providing an inverter case assembly defining an interior region of the inverter module;

placing a plurality of power modules in the interior region;

Placing an electromagnetic interference shield on a first surface of the plurality of power modules, the electromagnetic interference shield being located in the interior region; and

Providing a control board onto a first surface of the EMI shield, the control board being located in the interior region.

20. an electric vehicle comprising:

an inverter module that provides power to the electric vehicle, the inverter module including:

A power module, the power module comprising:

A capacitor;

a heat sink coupled to a first surface of the capacitor;

a first ceramic plate coupled to a first surface of the heat sink;

a second ceramic plate coupled to a first surface of the heat sink;

A locator having a plurality of slits;

a plurality of transistors located in the plurality of slits,

The locator and the plurality of transistors are located on a first surface of the first ceramic board and a first surface of the second ceramic board;

A laminated bus bar located on a first surface of the fixture;

a gate drive printed circuit board coupled to a first surface of the laminated bus bar; and

And the dielectric adhesive disc is positioned on the first surface of the grid drive printed circuit board.

Technical Field

the present application relates to the field of vehicle power, and more particularly to an inverter module for an electric vehicle.

background

the battery pack may include electrochemical materials to provide power to the various electrical components connected thereto. Such a battery pack may provide electrical energy to different electrical systems.

disclosure of Invention

The systems and methods described herein relate to a multi-phase inverter module formed as a power module (also referred to as a half-bridge module, half-bridge inverter module, or sub-module) having three permutations, for example, in a triplet arrangement for use in an electric vehicle drive system. The inverter module may be coupled to a drive train unit of an electric vehicle and may provide a three-phase voltage to the drive train unit. For example, each power supply module may generate a single phase voltage and thus three half bridge modules arranged in triplets may provide a three phase voltage.

at least one aspect of the present application relates to an inverter module that provides power for an electric vehicle. The inverter module may include a power module. The power module may include a capacitor. The power module may include a heat sink coupled to the first surface of the capacitor. The power module may include a first ceramic board coupled to the first surface of the heat sink. The power module may include a second ceramic board coupled to the first surface of the heat sink. The power module may include a retainer having a plurality of slots. The power module may include a plurality of transistors positioned within the plurality of slots. The locator and the plurality of transistors may be located on a first surface of the first ceramic board and on a first surface of the second ceramic board. The power module may include a laminated bus bar on the first surface of the fixture. The power module may include a gate drive printed circuit board coupled to the first surface of the laminated bus bar. The power module may include a dielectric gel pad on a first surface of the gate drive printed circuit board.

At least one aspect of the present application relates to a method of providing power to an electric vehicle via power provided by an inverter module. The method may include providing a capacitor. The method can include coupling a heat sink to the capacitor first surface. The method may include placing a first ceramic plate on a first surface of the heat sink. The method may include placing a second ceramic plate on the first surface of the heat sink. The method may include providing a locator having a plurality of slots. The method may include placing a plurality of transistors within the plurality of slots. The locator and the plurality of transistors may be located on a first surface of the first ceramic board and a first surface of the second ceramic board. The method can include providing a laminated bus bar onto a first surface of a fixture. The method may include coupling a gate drive printed circuit board to a first surface of the laminated bus bar. The method may include placing a dielectric gel disk on a first surface of a gate drive printed circuit board.

At least one aspect of the present application relates to a method. The method may provide an inverter module to provide power for an electric vehicle. The inverter module may include a power module. The power module may include a capacitor. The power module may include a heat sink coupled to the first surface of the capacitor. The power module may include a first ceramic board coupled to the first surface of the heat sink. The power module may include a second ceramic board coupled to the first surface of the heat sink. The power module may include a retainer having a plurality of slots. The power module may include a plurality of transistors located within the plurality of slots. The locator and the plurality of transistors may be located on a first surface of the first ceramic board and on a first surface of the second ceramic board. The power module may include a laminated bus bar on the first surface of the fixture. The power module may include a gate drive printed circuit board coupled to the first surface of the laminated bus bar. The power module may include a dielectric adhesive pad on a first surface of the gate driving printed circuit board.

at least one aspect of the present application relates to an electric vehicle. The electric vehicle may include an inverter module to provide power to the electric vehicle. The inverter module may include a power module. The power module may include a capacitor. The power module may include a heat sink coupled to the first surface of the capacitor. The power module may include a first ceramic board coupled to the first surface of the heat sink. The power module may include a second ceramic board coupled to the first surface of the heat sink. The power module may include a retainer having a plurality of slots. The power module may include a plurality of transistors located within the plurality of slots. The locator and the plurality of transistors may be located on a first surface of the first ceramic board and on a first surface of the second ceramic board. The power module may include a laminated bus bar on the first surface of the fixture. The power module may include a gate drive printed circuit board coupled to the first surface of the laminated bus bar. The power module may include a dielectric adhesive pad on a first surface of the gate driving printed circuit board.

these and other aspects and embodiments of the present application are described in detail below. The foregoing summary, as well as the following detailed description, includes illustrative examples of various aspects and embodiments, and is provided to provide an overview or framework for understanding the nature and character of the subject matter claimed herein. The accompanying drawings of the present application provide an illustration and a further understanding of the various aspects and embodiments of the various applications, and are incorporated in and constitute a part of this specification.

Drawings

the figures are not intended to be drawn to scale. Like reference numbers and designations in the various drawings indicate like elements. For purposes of brevity, not every component may be labeled in every drawing.

FIG. 1 is an exemplary exploded view of a single phase power module of a multi-phase inverter module of a drive unit of an electric vehicle according to one illustrative embodiment;

FIG. 2 is an exemplary exploded view of a subassembly having positive and negative connecting bus bars of a multi-phase inverter module of a drive unit of an electric vehicle according to one illustrative embodiment;

FIG. 3 is an exemplary exploded view of an inverter housing of a multi-phase inverter module of a drive unit of an electric vehicle in accordance with one illustrative embodiment;

FIG. 4 is an exemplary exploded view of a multi-phase inverter module of a drive unit of an electric vehicle in accordance with one illustrative embodiment;

FIG. 5 is a cross-sectional view of an exemplary electric vehicle with a battery pack installed;

FIG. 6 is a flow chart depicting an exemplary method of providing a battery cell for a battery pack of an electric vehicle; and

Fig. 7 is a flow chart depicting an exemplary method of providing a battery cell for a battery pack of an electric vehicle.

Detailed Description

the following is a detailed description and embodiments of the various concepts of the battery of the electric vehicle battery pack of the present application. The various concepts introduced above and discussed in greater detail below may be implemented in any of numerous ways.

The systems and methods described herein relate to an inverter module that may be formed from one or more power modules that provide power to an electric vehicle. Each power module may generate or provide single phase power. A plurality of power modules may be coupled together to form a multi-phase inverter module. For example, three power modules 100 may be coupled together in groups of three to form a three-phase power module to provide three-phase power to electrical components in an electric vehicle.

fig. 1 depicts a cross-section of a power module 100. The power module 100 may be one of a multi-phase inverter module (e.g., the inverter module 400 of fig. 4) located within a drive train unit of an electric vehicle to provide power to the respective electric vehicle. For example, the power module 100 may be coupled in groups of three with two other power modules 100 to form a three-phase inverter module (e.g., the inverter module 400 of fig. 4). Each power module 100 may be formed of identical components and dimensions to provide inverter functionality based at least in part on module design (e.g., ease of assembly) and ability to adapt to a variety of different inverter applications.

the power module 100 described herein may be formed to provide a compact design in an inverter module (e.g., the inverter module 400 of fig. 4) arranged in groups of three. For example, the power module 100 may be formed to have a length of 220mm to 230 mm. The power module 100 may be formed to have a width of 80mm to 90 mm. The power module 100 may be formed to have a height of 60mm to 70 mm. The size and dimensions of the power module 100 described herein may vary outside of these ranges. As shown in fig. 1, the power module 100 includes at least one capacitor 105 having a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). Capacitor 105 may comprise a dc link single phase capacitor ("DCLSP capacitor"), a dc link filter capacitor, or an automotive, industrial, or commercial inverter, which functions as an X capacitor. Capacitor 105 may include a housing or outer surface and may be formed from a variety of different materials including, but not limited to, a plastic material or a non-conductive material. The size of the capacitor 105 may vary and may be selected based at least in part on the size of the power module 100. For example, the length of the capacitor 105 may be 140mm to 155mm (e.g., 150 mm). The width of the capacitor 105 may be 60mm to 70mm (e.g., 66 mm). The height of the capacitor 105 may be 30mm to 40mm (e.g., 32 mm).

capacitor 105 may include terminals 107, 109 and a voltage divider 110. The terminals 107, 109 may include a positive terminal 107 and a negative terminal 109. For example, the positive terminal 107 may extend from or be coupled to a first side surface of the voltage divider 110 and the negative terminal 109 may extend from or be coupled to a second side surface of the voltage divider 110. Thus, the voltage divider 110 may be disposed or placed to separate the positive terminal 107 from the negative terminal 109 of the capacitor 105. Capacitor 105 may include one or more capacitor elements located within capacitor 105. For example, the capacitor 105 may accommodate a single capacitor film cartridge or multiple capacitor film cartridges (e.g., three to four capacitor film cartridges). The capacitor film cartridge may be coupled to the positive terminal 107 and the negative terminal 109 by one or more tabs. The capacitor membrane cartridge, and thus the capacitor 105, may have a capacitance value of 200 to 400 nanofarads (nF), for example 300 nF. The capacitance value may vary within or outside this range.

The positive terminal 107 may correspond to a wire or terminal of the positive bus bar of the capacitor 105. The negative terminal 109 may correspond to a lead or terminal of a negative bus bar of the capacitor 105. For example, the capacitor 105 may include a positive bus bar and a negative bus bar, such as located within a housing of the capacitor 105. The positive terminal 107 may include a lead, terminal, or extension of the positive bus bar that extends out of the capacitor 105 to couple to a lead of other components of the power module 100, such as, but not limited to, a transistor of the power module 100 (e.g., the lead 130 of the transistor 125). The negative terminal 109 may include a lead, terminal or extension of the negative bus bar that extends out of the capacitor 105 to couple to a lead of another component of the power module 100, such as, but not limited to, a transistor of the power module 100 (e.g., the lead 130 of the transistor 125).

A voltage divider 110 may be located between the positive terminal 107 and the negative terminal 109 to electrically isolate or insulate the positive terminal 107 and the negative terminal 109. The shape and size of the voltage divider 110 may vary and may be selected based at least in part on the shape and size of the positive terminal 107 and the negative terminal 109. For example, the thickness or bandwidth of the voltage divider 110 may be 0.5mm to 1.5 mm. The length of the voltage divider 110 may be 130mm to 145mm (e.g., 140 mm). The height of the voltage divider 110 may be 20mm to 30mm (e.g., 25 mm). The thickness, width, length, or height of the voltage divider 110 may vary within or outside of these ranges.

The power module 100 may include at least one heat sink 115 having a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). The second surface of the heat sink 115 may be coupled to or in contact with or on the first surface of the capacitor 105. The heat spreader 115 may comprise a variety of different materials such as, but not limited to, an electrically conductive material, a metallic material, or aluminum. The heat sink 115 may provide active cooling to the capacitor 105. For example, the heat sink 115 can be disposed proximate at least one surface, where the capacitor 105 and a first surface (e.g., a top surface) of the heat sink 115 can provide active cooling to the first surface of the capacitor 105. For example, the heat sink 115 may have a shape that defines one or more cooling channels formed in the heat sink 115. The cooling channels may receive and be shaped to allow coolant to flow through the heat sink 115 such that the heat sink 115 may provide active cooling to components and electronics (e.g., capacitor 105, transistor 125) disposed proximate to a surface of the heat sink 115.

the length of the heat sink 115 may be 200mm to 225mm (e.g., 215 mm). The height (e.g., thickness) of the heat spreader 115 may be 5mm to 20mm (e.g., 10 mm). The width of the heat sink 115 may be 45mm to 65mm (e.g., 52 mm). The length, height, and width of the heat spreader 115 can vary within and outside of these ranges. The heat sink 115 may be located in the power supply module 100 such that the heat sink 115 surrounds, is disposed proximate to, or encompasses a portion of the terminals 107, 109 of the capacitor 105 coupled to a transistor (e.g., transistor 125) of the power supply module 100. For example, the heat sink 115 may include a small hole 117 (e.g., hole, aperture) formed in a middle portion of the heat sink 115. The capacitor 105 may be coupled to the heat sink 115 such that the voltage divider 110, the positive terminal 107, and the negative terminal 109 extend through the aperture 117 of the heat sink 115. Thus, the heat sink 115 may be configured to surround the surfaces of the voltage divider 110, the positive terminal 107, and the negative terminal 109 to provide active cooling to the voltage divider 110, the positive terminal 107, the negative terminal 109, and the transistor 125. The heat sink 115 may be configured such that the cooling surface and the coolant flowing through the heat sink 115 are configured closer to the electrical components. Thus, the heat sink 115 may provide active cooling to each capacitor 105, positive terminal 107, negative terminal 109, and transistors of the power module 100 to reduce the value of electrical induction in the power module 100 and to reduce electromagnetic interference noise in the inverter module. The width of the heat sink apertures 117 may be 10mm to 20mm (e.g., 12 mm). The length of the heat sink apertures 117 may be 140mm to 120mm (e.g., 150 mm). The height (or depth) of the heat sink apertures 117 may be 3mm to 15mm (e.g., 4mm to 8 mm). The width, length, or height of the heat sink apertures 117 can vary within or outside of these ranges.

the power module 100 may include one or more ceramic plates 120 coupled to or in contact with the first surface of the heat sink 115. For example, and as shown in fig. 1, power module 100 may include first and second ceramic boards 120. Each of the first and second ceramic plates 120 may include a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). Each second surface of the first and second ceramic plates 120 may be coupled to or in contact with or on the first surface of the heat sink 115. Ceramic board 120 may insulate heat spreader 115 from one or more transistors (e.g., transistor 125) located in power module 100. Ceramic board 120 may include a ceramic-based material and may electrically insulate heat sink 115 from transistors (e.g., transistor 125) located in power module 100. For example, ceramic board 120 may prevent a short circuit condition between heat spreader 115 and a transistor (e.g., transistor 125) located in power module 100. The ceramic plate 120 may have a length of 100mm to 220 mm. The ceramic plate 120 may have a width of 40mm to 55 mm. The ceramic plate 120 may have a height (or thickness) of 2mm to 10 mm.

The power module 100 may include a plurality of transistors 125. The plurality of transistors 125 may be coupled to or in contact with or on a first surface of the ceramic board 120. Each transistor 125 may include a plurality of conductive lines 130. Transistor 125 may comprise a discrete Insulated Gate Bipolar Transistor (IGBT), a gate bipolar transistor semiconductor die, a TO-247 transistor, or a TO-247 discrete gate bipolar transistor package (e.g., TO-247 transistor, switch). Each transistor 125 may include one or more conductive lines 130. For example, each transistor 125 may include three conductive lines 130. The three conductive lines 130 may each correspond to at least one terminal of the transistor 125. For example, the first conductive line 130 may correspond to a base terminal or a base conductive line. The second conductive line 130 may correspond to a collector terminal or a collector conductive line. The third wire 130 may correspond to an emitter terminal or an emitter wire. The wire 130 may have a substantially straight or unbent shape. When transistor 125 is fully coupled into power module 100, conductor 130 may be bent, shaped, or otherwise manipulated to couple to a respective one or more components (e.g., gate drive printed circuit board 160, capacitor 105) within power module 100. For example, the conductive line 130 may be formed such that it extends perpendicular to a first surface (e.g., top surface) of the transistor 125. For example, the conductive line 130 may be formed such that it has a curved shape and extends upward with respect to a first surface (e.g., a top surface) of the transistor 125.

The plurality of transistors 125 may be organized in a predetermined arrangement. For example, the plurality of transistors 125 may be configured with one or more rows of the plurality of transistors 125, and the rows may be configured such that the conductive lines 130 of each transistor 125 are immediately adjacent or neighboring one another to allow for easy coupling to components of the power supply module 100 (e.g., the gate drive printed circuit board 160). For example, the first plurality of transistors 125 may be arranged in a first row and the second plurality of transistors 125 may be arranged in a second row. Each row of transistors 125 may include the same number of transistors or the rows of transistors 125 may include a different number of transistors 125. Transistors 125 in the same row may be configured such that one or more sides contact the sides of a single transistor 125 or two transistors 125 (e.g., one transistor 125 on each side) in the same row. Thus, the transistors 125 may be arranged in a uniform row along the first surface of the ceramic plate 120. The first plurality of transistors 125 may be spaced apart from the second plurality of transistors 125. The first plurality of transistors 125 may be evenly spaced or symmetrical with the second plurality of transistors 125 with respect to the first surface of the ceramic plate 120. For example, each transistor 125 of the first plurality of transistors 125 may be spaced apart from a corresponding transistor 125 of the second plurality of transistors 125 by the same distance. First plurality of transistors 125 may be asymmetrically spaced from second plurality of transistors 125 relative to a first surface of ceramic plate 120. For example, one or more transistors 125 of the first plurality of transistors 125 may be spaced apart from a corresponding transistor 125 of the second plurality of transistors 125 by different distances. One or more transistors 125 of the first plurality of transistors 125 may be spaced apart (e.g., center-to-center spacing) with respect to each other by a spacing of 15mm to 20mm (e.g., 17.5 mm). One or more transistors 125 of the second plurality of transistors 125 may be spaced apart (e.g., center-to-center spacing) with respect to each other by a spacing of 15mm to 20mm (e.g., 17.5 mm). One or more transistors 125 of the first plurality of transistors 125 may be spaced 10mm to 20mm (e.g., 14mm) apart relative to one or more transistors 125 of the second plurality of transistors 125.

The power module 100 may include at least one temperature sensor 135, such as a transistor temperature sensing printed circuit board 135. Transistor temperature sensing printed circuit board 135 (or other temperature sensor) may include control electronics to communicate or monitor the temperature of various components of power module 100, such as, but not limited to, transistor 125. For example, a transistor temperature sensing printed circuit board 135 may be disposed proximate to the plurality of transistors 125 to provide temperature data corresponding to the plurality of transistors 125. For example, transistor temperature sensing printed circuit board 135 may be located between ceramic board 120 and plurality of transistors 125, or between heat spreader 115 and ceramic board 120. The transistor temperature sensing printed circuit board 135 may collect or retrieve temperature data corresponding to the plurality of transistors 125. The transistor temperature sensing printed circuit board 135 may collect or retrieve temperature data corresponding to a single transistor 125, a group of transistors 125, or all of the plurality of transistors 125. For example, temperature sensing may be extrapolated to predict the gate bipolar transistor junction temperature. The transistor temperature sensing printed circuit board 135 may be configured such that it compresses and seals against the grease pocket on the ceramic adjacent to the transistor 125. For example, the transistor temperature sensing printed circuit board 135 may be located at a distance of 0mm (e.g., contact) to 2mm from the transistor 125. The distance between the transistor temperature sensing printed circuit boards 135 may vary outside of these ranges.

The power module 100 may include a locator 140 (also referred to herein as a locator rail or locator frame). The locator 140 can include a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). The second surface of the retainer 140 may be coupled to, in contact with, or on the first surface of the ceramic board 120 or the heat sink 115. The locator 140 may comprise a non-conductive material or a plastic material. The length of the positioner 140 may be 200mm to 225mm (e.g., 215 mm). The height (e.g., thickness) of the locator 140 can be 5mm to 20mm (e.g., 10 mm). The width of the locator 140 may be 45mm to 65mm (e.g., 52 mm). The length, height, and width of the locator 140 can vary within and outside of these ranges. The retainer 140 may include a plurality of slots 142 (e.g., apertures, holes, recesses) formed in the frame of the retainer 140 to hold or couple the various components of the power module 100 where appropriate. The positioner 140 may include a plurality of slots 142 to hold or couple to the transistors 125. At least one slot 142 of the locator 140 may be configured or coupled at least on a transistor 125 of the plurality of transistors 125.

A plurality of clips 145 may couple the transistors 125 to the positioner 140 (e.g., to retain the transistors 125 in the slots 142 of the positioner 140). For example, a plurality of transistors 125 may each be located in at least one slot 142 of the retainer 140, and the clips 145 may include spring clips coupled to the retainer 140 and the sides of the transistors 125 to hold or compress the transistors 125 in the respective slots 142 to hold the transistors 125 in place and in contact with the retainer 140. Fasteners 167 can be used to couple the transistor 125 to the positioner 140. The retainer 140 may comprise a plastic retainer or a plastic material.

The slot 142 of the retainer 140 may include an aperture, hole, recess formed in the frame of the retainer 140. The slots 142 may have different shapes, sizes, and the shape, size, and size of a particular slot 142 may be selected based at least in part on the shape, size, or size of the components of the power supply module 100. For example, the positioner 140 may include a slot 142 for a transistor 125, fastener, clip, thermistor, or thermal pad. The transistor slots may often have a substantially rectangular shape, which may be selected based on the particular transistors 125 intended for the power supply module 100. The fastener slot may have a substantially circular shape and may include a threaded interior surface to couple to a threaded portion of a fastener. The thermistor slot may have a substantially circular shape. The power module 100 may include only one thermistor, and thus only one thermistor slit may be used. However, two thermistor slots can be formed to provide symmetry and ease of manufacture. For example, having two thermistor slots may allow the positioner 140 to rotate, and the thermistor of the power module 100 may be located in either thermistor slot. The locator 140 may form any number of slots 142, and the number of slots 142 may be selected based at least in part on the type of power module 100 component. For example, the total number of slits 142 formed in the positioner 140 may be eight slits 142 to twenty-four slits 142.

The locators 140 may act as rails or frames for the manufacturing process of the power module 100, for example, during pick and place automation processes, increasing the efficiency of the manufacturing process. For example, the locators 140 may hold different components or parts of the power module 100 from moving around during the manufacturing process, resulting in a reduction in the amount of fastening during the manufacturing process (e.g., identifying and moving the parts to the correct position). Using the positioner 140 as a guide for an automated device (e.g., a pick and place automated machine), the power module 100 may be formed faster and more efficiently. The positioner 140 may reduce the amount of human interaction with a particular manufacturing method so that the power module 100 may be formed using only the pick and place machine and grease dispenser device (or other form of fluid device).

The power module 100 may include a laminated bus bar 150. The laminated bus bar 150 can include a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). The second surface of the laminated bus bar 150 may couple to or contact the first surface of the fixture 140 and a portion of or on the first surface of the transistors 125 located in the slots 142 of the fixture 140. The conductive lines 130 of the transistors 125 may be coupled to portions of the laminated bus bar 150. For example, the laminated bus bar 150 may include a plurality of conductors 157. Each of the plurality of conductors 157 of the laminated bus bar 150 may be coupled to at least one conductor 130 of the plurality of transistors 125. For example, the at least two conductors 157 of the laminated bus bar 150 may be coupled to at least two conductors of transistors 125 of the plurality of transistors 125. The length of the two conductors present in the coupling laminate bus bar 150 may be 200mm to 225 mm. The laminated bus bar 150 can have a height (e.g., thickness) of 5mm to 20 mm. The width of the laminated bus bar 150 may be 45mm to 65 mm. The length, height, and width of the laminated bus bar 150 can vary within and outside of these ranges. The laminated bus bar 150 may include a conductive material such as, but not limited to, copper.

The laminated bus bar 150 may include two input terminals 152, 154 (e.g., a positive input terminal and a negative input terminal) disposed at or along a first side and an output terminal 155 on a second, different side of the laminated bus bar 150. For example, the two input terminals 152, 154 may be located on opposite or opposite sides of the output terminal 155. The first and second input terminals 152, 154 may comprise a conductive material, such as, but not limited to, copper. The first and second input terminals 152, 154 may be formed in a variety of different shapes to accommodate coupling to inverter bus bars (e.g., positive bus bars, negative bus bars). The first and second input terminals 152, 154 may have or include a straight shape, or a curved or bent shape. For example, the first and second input terminals 152, 154 can include a first portion that is parallel to a first surface (e.g., a top surface) of the laminated bus bar 150 and a second portion that is perpendicular to the first surface of the laminated bus bar 150. The first input terminal 152 may be coupled to a positive inverter bus bar (not shown) to receive a positive voltage and provide the positive voltage to power the module 100. The second input terminal 154 may be coupled to a negative bus bar (not shown) to receive a negative voltage and provide the negative voltage to power the module 100. The first input terminal 152 may be located at a different level or height relative to the side surface of the laminated bus bar 150 than the second input terminal 154. For example, the first input terminal 152 may be located at a first level or a first height, and the second input terminal 154 may be located at a second level or a second height. The first level or height may be greater than the second level or height. The first level or height may be less than the second level or height.

output terminal 155 may include a conductive material such as, but not limited to, copper. The output terminals 155 can be formed in a variety of different shapes to accommodate coupling to an inverter phase bus bar. The output terminal 155 may be formed in a straight line shape or a curved or bent shape. For example, the output terminals 155 can include a first portion that is parallel to a first surface (e.g., top surface) of the laminated bus bar 150 and a second portion that is perpendicular to the first surface of the laminated bus bar 150. Output terminals 155 may be coupled to a phase bus bar to provide the supply generated by power module 100 to other electrical components of the electric vehicle.

the power module 100 may include a gate driving Printed Circuit Board (PCB) 160. The gate driving printed circuit board 160 may include a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). The second surface of the gate drive printed circuit board 160 may be coupled to or in contact with or on the first surface of the laminated bus bar 150. The gate drive printed circuit board 160 may include control electronics to control one or more components of the power module 100 or communication electronics to communicate and receive or transmit signals to the control board of the inverter module. The gate drive printed circuit board 160 may include control electronics and may generate and provide control signals to the transistors 125. For example, the conductive lines 130 of the transistors 125 may extend through the locators 140 and the laminated bus bar 150 to couple to a portion or surface of the gate drive printed circuit board 160. The gate drive printed circuit board 160 may generate control signals, for example, to turn on or off, turn on or turn off one or more transistors 125. The gate driving printed circuit board 160 may have a length of 140mm to 220 mm. The height (e.g., thickness) of the gate driving printed circuit board 160 may be 5mm to 10 mm. The width of the gate driving printed circuit board 160 may be 60mm to 100 mm. The length, height, and width of the gate driving printed circuit board 160 may vary within and outside of these ranges.

The power module 100 may include a dielectric gel tray 165. The dielectric gel tray 165 can include a first surface (e.g., a top surface), a second surface (e.g., a bottom surface) and can define an interior region including the second surface. A second surface of the dielectric gel pad 165 may be coupled to or in contact with or on the gate drive printed circuit board 160. The dielectric gel pad 165 may be coupled to the capacitor 105 by one or more fasteners 167. For example, the dielectric gel disk 165 may form a housing over the gate drive printed circuit board 160, the laminated bus bar 150, the retainer 140, the transistors 125, the transistor temperature sensing printed circuit board 135, the ceramic board 120, the heat sink 115 such that each of the gate drive printed circuit board 160, the laminated bus bar 150, the retainer 140, the transistors 125, the transistor temperature sensing printed circuit board 135, the ceramic board 120, and the heat sink 115 is located within an interior region defined by the dielectric gel disk 165 so as to be covered by the dielectric gel disk 165 when the dielectric gel disk 165 is coupled to the capacitor 105. For example, the dielectric gel disk 165 may include or form an interior region that covers, masks, or may be located around various components of the power module 100.

The dielectric gel tray 165 (e.g., an encapsulating composite container) may comprise a polycarbonate material, or other form of high temperature plastic. The dielectric gel disk 165 may be formed using different injection molding techniques. The dielectric gel tray 165 may be located on one or more components of the power supply module 100 and operate as an insulator for the components (e.g., electronics) of the power supply module 100. The gel tray 165 may be formed to have a length of 160mm to 230 mm. The gel tray 165 may be formed to have a width of 80mm to 90 mm. The gel tray 165 may be formed to have a height of 40mm to 60 mm. The size and dimensions of the gel tray 165 may vary within or outside of these ranges.

The gel tray 165 includes one or more capacitive apertures 170. The capacitive aperture 170 may be used as an input or an output of the power module 100. For example, the capacitive aperture 170 may serve as a hole or access point to couple a power source (e.g., a DC power source) to the power module 100. The gel pad 165 may include a first capacitive aperture 170 coupling the first input terminal 152 of the laminated bus bar 150 to the positive bus bar to provide positive power to the power module 100. The gel pad 165 may include a second capacitive aperture 170 coupling the second input terminal 154 of the laminated bus bar 150 to the negative bus bar to provide negative power to the power module 100. The gel pad 165 may include a third capacitive aperture 170 coupling the output terminal 155 of the laminated bus bar 150 to the phase bus bar to provide the output voltage generated by the power module 100 to other components of the electric vehicle. For example, the capacitive aperture 170 may be formed as a hole or access point to provide power (e.g., voltage) generated by the power module 100 to other systems of the electric vehicle, such as a drive train unit.

during development and manufacture of power module 100, technical or physical compromises may be made with respect to the various components of power module 100 to meet one or more needs or desires of a particular electric drive system. For example, tradeoffs may be made among cost, engineering flexibility, manufacturing, packaging design, thermal design, or electrical design of one or more components of the respective power module 100. These tradeoffs can result in undesirable design changes that can affect the performance of the power module 100. The power module 100 described herein may alleviate the problems associated with these tradeoffs and provide a power module 100 that includes a gated bipolar transistor 125, a gated bipolar transistor temperature sensing printed circuit board 135, a coolant temperature sensor (e.g., coolant temperature sensor 310 of fig. 3), a thermal pad (e.g., thermal pad 320 of fig. 3), and an emi shield (e.g., emi shield 410 of fig. 4) to reduce or reduce emi noise in an inverter module (e.g., inverter module 400 of fig. 4). Thus, the power module 100 described herein may strike a balance between high performance (e.g., low electrical parasitics, high current capacity, low component temperatures, etc.), high power density, low volume, low cost, and having properties that allow it to be compatible with mass production.

Fig. 2 depicts subassembly 200. The subassembly 200 may transfer power (e.g., direct current, direct voltage) from the battery compartment or junction box to each phase of a power module (e.g., power module 100 of fig. 1). The sub-assemblies may filter power and provide high voltage sensing to a control board (e.g., control board 415 of fig. 4) of an inverter module (inverter module 400 of fig. 4) or a control board (e.g., gate drive printed circuit board 160 of fig. 1) of a power module 100 within an inverter module (inverter module 400 of fig. 4) using positive and negative bus bars. For example, the subassembly 200 may be coupled to the power module 100 to transfer power to the power module 100 through one or more conduits formed by the positive and negative bus bars of the subassembly 200. The subassembly 200 may be coupled to a single power module 100 or to multiple power modules 100. The subassembly 200 may include one or more positive input apertures 205 to couple to the positive input 152 of each power supply module 100 and one or more negative input apertures 210 to couple to the negative input 154 of each power supply module 100. For example, and as shown in FIG. 2, the subassembly 200 may include three positive input apertures 205 and three negative input apertures 210. Accordingly, the subassembly 200 may transfer power to three power modules 100 coupled in triplets into a three-phase power module (e.g., the three-phase power module 405 of fig. 4).

the subassembly 200 may include a positive dc connection bus bar 215. The positive dc connection bus bar 215 may be coupled to a positive input or positive input terminal (e.g., the positive input 152) of the power module 100. The positive dc connection bus bar 215 may provide or divert positive dc power from the battery box or junction box to the positive input of the respective power module 100. The positive dc connecting bus bar 215 may include an electrically conductive material, a metallic material, or a metallic material (e.g., copper). The positive dc connecting bus bar 215 may include a conductive path that may function as or act within the subassembly 200.

the subassembly 200 may include a negative dc electrical connection bus bar 220. The negative dc connection bus bar 220 may be coupled to a negative input or negative input terminal (e.g., negative input terminal 154) of the power module 100. The negative dc electrical connection bus bar 220 may provide or divert negative dc power from the battery pack or junction box to the negative input of the respective power module 100. The negative dc connection bus bar 220 may include a conductive material, a metallic material, or a metallic material (e.g., copper). The negative dc electrical connection bus bar 220 may include a conductive path that may function as or act in the subassembly 200.

The subassembly 200 may include a positive Y capacitor bus bar 225. The positive Y capacitor bus bar 225 may couple the positive input terminal 152 of the power module 100 to the positive dc connection bus bar 215. The positive Y capacitor bus bar 225 may filter the dc power when it is provided to the input terminals of the power module 100. The positive Y capacitor bus bar 225 may include line filter capacitors. For example, the positive Y capacitor bus bar 225 may filter the positive direct current provided to the positive input terminal (e.g., the positive input terminal 152) of the power module 100 to reduce or mitigate noise, such as, but not limited to, common mode noise. The positive Y capacitor bus bar 225 may include a conductive material, a metallic material, or a metallic material (e.g., copper). The positive Y capacitor bus bar 225 may include a conductive path that may function as or act within the subassembly 200.

The subassembly 200 may include a negative Y capacitor bus bar 230. The negative Y capacitor bus bar 230 may couple the negative input terminal 154 of the power module 100 to the negative dc electrical connection bus bar 220. The negative Y capacitor bus bar 230 may filter the dc power when the dc power is provided to the input terminals of the power module 100. The negative Y capacitor bus bar 230 may include line filter capacitors. For example, the negative Y capacitor bus bar 230 may filter the negative dc power provided to the negative input terminal of the power module 100 to reduce or mitigate noise, such as, but not limited to, common mode noise. The negative Y capacitor bus bar 230 may include a conductive material, a metallic material, or a metallic material (e.g., copper). The negative Y capacitor bus bar 230 may include a conductive path that may function as or act as a conduit in the subassembly 200.

the subassembly 200 may include a grounded Y capacitor bus bar 235. The grounded Y capacitor bus bar 235 may filter the dc power when it is provided to the input terminals of the power module 100. The grounded Y capacitor bus bar 235 may include line filter capacitors. The grounded Y capacitor bus bar 235 may filter the dc current on the ground terminals of the power module 100 to reduce or mitigate noise, such as, but not limited to, common mode noise. The grounded Y capacitor bus bar 235 may comprise a conductive material, a metallic material, or a metallic material (e.g., copper). The grounded Y capacitor bus bar 235 may include a conductive path that may function as or act as a conduit in the subassembly 200.

the subassembly 200 may include a bracket 240. The support 240 may comprise a plastic support, a plastic material, or a dielectric material. The bracket 240 may hold or align each of the positive dc connection bus bar 215, the negative dc connection bus bar 220, the positive Y capacitor bus bar 225, the negative Y capacitor dc connection bus bar 210, and the ground Y capacitor 235 so that they may be coupled to the appropriate components of the power module 100. For example, the positive dc connection bus bar 215, the negative dc connection bus bar 220, the positive Y capacitor bus bar 225, the negative Y capacitor dc connection bus bar 210, and the ground Y capacitor 235 may each be coupled to the power module 100 by a bracket 240. The bracket 240 may be coupled to at least one side surface or edge surface of the power module 100.

Fig. 3 depicts an inverter case assembly 300. The inverter case assembly 300 may correspond to a base unit or a base member of an inverter module (e.g., the inverter module 400 of fig. 4). For example, each of the different components of the inverter case 300 may be located within the inverter case assembly 300 to provide a compact inverter module. The inverter case assembly 300 may be formed in a rectangular shape, a square shape, an octagonal shape, or a circular shape. The specific shape or size of the inverter case assembly 300 may be selected based at least in part on the shape and size of the power module 100 or the shape and size of the space within the electric vehicle drive train unit in which the inverter case assembly 300 is located. The length of the inverter case assembly 300 may be 270mm to 320mm (e.g., 280 mm). The width of the inverter case assembly 300 may be 280mm to 360mm (e.g., 290 mm). The height of the inverter case assembly 300 may be 120mm to 132mm (e.g., 127 mm). The size and dimensions of the inverter case assembly 300 described herein may vary within or outside of these ranges.

The inverter case assembly 300 may include an inverter case 305. The inverter housing 305 may house one or more power modules 100 of fig. 1 to form an inverter module of a drive train unit of an electric vehicle. For example, the inverter housing 305 may house three single phase power modules 100 of fig. 1 to form a three phase inverter module of a drive train unit of an electric vehicle. The inverter casing 305 may form an exterior surface or casing of the inverter case assembly 300. The inverter housing 305 may include or define an interior region 307 in which components of the inverter module are located or concealed. For example, the inverter housing 305 may contain, house, or define the interior region 307 to house a coolant temperature sensor (e.g., coolant temperature sensor 310), a spring clip (e.g., spring clip 315), a thermal pad (e.g., thermal pad 320), an active discharge plate (e.g., active discharge plate 325), a plastic bracket (e.g., plastic bracket 330), and a high voltage connector (e.g., high voltage connector 335). The inverter case 305 may be formed in a rectangular shape, a square shape, an octagonal shape, or a circular shape. The shape and size of the inverter housing 305 may be selected based in part on the shape and size of the power module 100 intended to be located within the respective inverter housing 305. The length of the inverter housing 305 may be 270mm to 290mm (e.g., 280 mm). The width of the inverter housing 305 may be 280mm to 300mm (e.g., 290 mm). The height of the inverter housing 305 may be 120mm to 132mm (e.g., 127 mm). The size and dimensions of the inverter housing 305 described herein may vary within or outside of these ranges.

The inverter case assembly 300 may include a coolant temperature sensor 310. The coolant temperature sensor 310 may be configured to measure a temperature in the interior region 307 of the inverter case assembly 300. For example, the coolant temperature sensor 310 may measure the temperature of the coolant flow as it is provided to or removed from the inverter case assembly 300. The inverter case assembly 300 may include a single coolant temperature sensor 310 or a plurality of coolant temperature sensors 310. The coolant temperature sensor 310 may be disposed adjacent to, in close proximity to, or in a predetermined distance (e.g., less than 1mm) from the inlet coolant header to measure the temperature of the coolant fluid provided to the inverter case assembly 300 or the outlet coolant header to measure the temperature of the coolant fluid discharged from the inverter case assembly 300. For example, the inverter housing 305 may include at least two coolant temperature sensors 310, with a first coolant temperature sensor 310 coupled to or located at an inlet of the inverter housing 305 and a second coolant temperature sensor 310 coupled to or located at an outlet of the inverter housing 305. The coolant temperature sensor 310 may include a temperature sensor. The coolant temperature sensor 310 may measure, record, and transmit temperature data corresponding to cooling (e.g., active cooling) or coolant flow in the inverter housing 305. For example, the coolant temperature sensor 310 may provide temperature data (e.g., temperature readings) of the respective coolant fluid as it is provided to or removed from the inverter case assembly 300.

the inverter case assembly 300 may include a spring clip 315. The spring clip 315 may include a clip or fastener. The spring clip 315 may comprise a metallic material, a plastic material, or an alloy material. The spring clips 315 may couple together different components located in the inverter case assembly 300. The spring clips 315 may be coupled to an active discharge plate (e.g., active discharge plate 325) to couple together the various components located in the inverter case assembly 300. For example, the spring clips 315 may couple at least one of the coolant temperature sensor 310 and the plastic mount (e.g., plastic mount 330) to an active discharge plate (e.g., active discharge plate 325) such that at least one of the coolant temperature sensor 310 and the plastic mount 330 is located between the spring clips 315 and the active discharge plate.

The inverter case assembly 300 may include a thermal pad 320. The thermal pad 320 may comprise a non-conductive material such as, but not limited to, aluminum oxide, aluminum nitride, a silicon material, or a silicon aluminum hybrid material. The thermal pad 320 may provide cooling, heat dissipation, or heat removal for various components located within the inverter case assembly 300. For example, the thermal pad 320 may include an electrically conductive material and may help conduct heat away from components within the inverter housing 305 to be cooled, such as, but not limited to, cooling the power module 100 or the active resistors of the inverter module 400. The thermal pad 320 may be coupled to or in contact with an active discharge plate (e.g., active discharge plate 325) to provide cooling, heat dissipation, or heat removal for the active discharge plate. The thermal pad 320 may be coupled to the active discharge plate to provide heat dissipation or heat exhaust for heat generated at or from the active discharge plate.

The inverter case assembly 300 may include an active discharge plate 325. The active discharge plate 325 may include an active discharge circuit or circuit board. For example, the active discharge plate 325 may include a circuit having at least one capacitor, at least one resistor, or at least one switching element. The active discharge plates 325 may discharge voltage or current during shutdown of one or more power modules 100 of an inverter module (e.g., the inverter module 400 of fig. 4). The active discharge plate 325 may be located between the thermal pad 320 and a plastic support (e.g., plastic support 330).

The inverter case assembly 300 may include a bracket 330. The bracket 330 may comprise a plastic material. The bracket 330 may be located between the coolant temperature sensor 310 and the active discharge plate 325. The bracket 330 may be configured to couple together various components located in the inverter case assembly 300. For example, the bracket 330 may couple the spring clip 315 to at least one coolant temperature sensor 310. The bracket 330 may couple the thermal pad 320 to the active discharge plate 325.

The inverter enclosure 300 may include a high voltage connector 335. The inverter enclosure 300 may include a single high voltage connector 335 or a plurality of high voltage connectors 335 (e.g., two high voltage connectors). Each high voltage connector 335 may be coupled to at least one input terminal of the inverter housing 305. The high voltage connector 335 may include a dc connector, an electrical wire, or an electrical connector to provide voltage to one or more electrical components in the inverter module. For example, the high voltage connector 335 may provide a voltage of a first voltage range to the inverter module assembly 300. For example, the high voltage connector 335 may have a voltage of 0V to 1000V. The high voltage connector 335 may be coupled to at least one positive bus bar or at least one negative bus bar to provide a single phase voltage to each power supply module 100 through its respective positive input 152 or negative input 154. For example, and as illustrated in fig. 3, the inverter case assembly 300 may include a positive high voltage connector 335 and a negative high voltage connector 335. The positive high voltage connector 335 may be coupled to a positive busbar row (not shown, coupled to the positive input 152 of the power module 100 located in the inverter case assembly 300). The negative high voltage connector 335 may be coupled to a negative bus bar (not shown, coupled to the negative input 154 of the power module 100 located in the inverter case assembly 300).

the inverter case assembly 300 may include an input joint 340. For example, the input fitting 340 may include a coolant input fitting that may receive a tube, hose, or conduit such that coolant may be provided to the inverter case assembly 305. For example, the input fitting 340 may include an aperture, hole, or threaded hole to receive or couple to a pipe, hose, or conduit. The inverter case assembly 300 may include an output terminal 345 (or output). The output fitting 345 may include a coolant output tube fitting that may receive a tube, hose, or conduit such that coolant may be removed from the inverter case assembly 305. For example, the output fitting 345 may include an aperture, hole, or threaded hole to receive or couple to a pipe, hose, or conduit. The output fitting 345 may include an output hose hook and may receive or be coupled to a tube, hose, or conduit to discharge coolant from the inverter case assembly 300.

the inverter case assembly 300 may include one or more connection points 350. The connection point 350 may include a threaded insert, hole, or socket. The connection points 350 may be formed on different surfaces of the inverter housing 305. For example, the connection point 350 may be formed in the interior region 307 of the inverter housing 305. The connection point 350 may be formed along one or more edges or side surfaces of the inverter housing 305. The connection point 350 may be used to couple one or more power modules 100 in the inverter housing 305. For example, a three-phase power module (e.g., the three-phase power module 405 of fig. 4) may be coupled to the inverter housing 305 using one or more connection points 350. The connection point 350 may couple the inverter housing 305 in a drive train unit of an electric vehicle. The connection points 350 may couple a cover or top surface to the inverter housing 305 to seal the inverter housing assembly 300. For example, the connection points 350 may receive fasteners (e.g., screws, bolts) to couple the cover or top surface to the inverter casing 305 to seal the inverter case assembly 300.

fig. 4 depicts an inverter module 400. The inverter module 400 may form a triplet of three power modules 100 coupled or arranged for use in an electric vehicle drive system. The inverter module 400 may be coupled to a drive train unit of an electric vehicle and may provide a single phase voltage or a multi-phase voltage (e.g., a three phase voltage) to the drive train unit. For example, each power module 100 may produce a single phase voltage and thus a triplet of three power modules 100 coupled or arranged may provide a three phase voltage.

the inverter module 400 may form a rectangular shape, a square shape, an octagonal shape, or a circular shape. The particular shape or size of the inverter module 400 may be selected based at least in part on the shape and size of the power module 100 located therein or the shape and size of the space of the drive train unit of the electric vehicle in which the inverter module 400 is intended to be located. The length of the inverter module 400 may be 270mm to 290mm (e.g., 280 mm). The width of the inverter module 400 may be 280mm to 300mm (e.g., 290 mm). The height of the inverter module 400 may be 120mm to 132mm (e.g., 127 mm). The size and dimensions of the inverter module 400 described herein may vary within or outside of these ranges.

The inverter module 400 may include the inverter case assembly 300 of fig. 3. The inverter module 400 may include a three-phase power module 405. A three-phase power module 405 may be located within the inverter case assembly 300. The three-phase module 405 may include a plurality of power modules 100. For example, the three-phase power module 405 may include three single-phase power modules 100 to provide and form the three-phase power module 405. The power supply modules 100 may be arranged in triads such that the first, second and third power supply modules 100 are each disposed adjacent to one another in triads, and have their respective positive inputs 152 and negative inputs 154 each aligned with one another, and their respective output terminals 155 aligned with one another. For example, each of the positive input terminals 152 of the first, second, and third power supply modules 100 may be configured to be at the same level or the same height with respect to the side surface of the power supply module 100. Each of the first, second, and third negative input terminals 154 of the first, second, and third power supply modules 100 may be configured to be at the same level or the same height with respect to a side surface of the power supply module 100. The output 155 of each of the first, second and third power modules 100 may be configured such that it is at the same level or the same height with respect to the side surface of the power module 100. The arrangement of the first, second and third power modules 100 in triplets may provide a compact size for the three-phase power module 405 that houses each of the first, second and third power modules 100. For example, the alignment of the input terminals 152, 154 and the output terminals 155 may allow one or more bus bars coupled to each power module 100 to be configured adjacent and parallel to each other to provide a compact inverter module 400. The power module 100 may be formed as a modular unit of similar shape, size and dimensions such that it is interchangeable within the three-phase power module 405 and the inverter module 400. Thus, a single power module 100 can be replaced, serviced, or repaired without replacing the entire inverter module 400. Each power module 100 in the common inverter module 400 may have the same shape, size, and dimension or one or more half-bridge modules 305 in the common inverter module 400 may have different shapes, sizes, or dimensions.

The three-phase power module 405 may include a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). The three-phase power module 405 may be located within the interior region 307 of the inverter case assembly 300 such that the second surface may be in contact with, in close proximity to, or in an adjacent configuration (e.g., atop the interior surface of the inverter case assembly 300). The three-phase power module 405 may be located in an interior region of the inverter case assembly 300 to complete the cooling channels and provide structural rigidity to each power module 100 of the three-phase power module 405.

the inverter module 400 may include an electromagnetic interference (emi) shield 410. The emi shield 410 may include a current sensor core. The emi shield 410 may include a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). The second surface of the emi shield 410 may be coupled or in contact with or located above the first surface of the three-phase power module 405. For example, the EMI shield 410 may be coupled or in contact with, or located on, a first surface of each power module 100 forming the three-phase power module 405.

The inverter module 400 may include a control and high voltage circuit board 415 (also referred to herein as a control board). The control panel 415 can include a first surface (e.g., a top surface) and a second surface (e.g., a bottom surface). The second surface of the control board 415 may be coupled to or in contact with or on the first surface of the emi shield 410. The control board 415 may include a plurality of floating connectors or receiving components that may be coupled to connectors of the gate drive printed circuit board 160 of the three phase power module 405. For example, the control board 415 may be coupled to or plugged into six floating connectors of the gate drive printed circuit board 160 of each power module 100 forming the three-phase power module 405. The three-phase power module 405, the emi shield 410, and the control board 415 may each be located in an interior area defined by the inverter case assembly 300 such that a side or side of the inverter case assembly 300 extends around or about each of the three-phase power module 405, the emi shield 410, and the control board 415 when the three-phase power module 405, the emi shield 410, and the control board 415 are located in the inverter case assembly 300.

One or more wires or wire harnesses may be coupled to the control board 415 to connect circuitry, such as, but not limited to, control circuitry of the control board 415. The wires or wire harnesses may provide signal paths for the control board to transmit control signals from components of the inverter module 400 or control circuitry external to the inverter module 400 or to receive control signals or other forms of signal feedback. When the inverter module 400 is assembled, the inverter module 400 may be coupled to, mounted to, or located within a drive unit of an electric vehicle.

In operation, the inverter module 400 may receive high voltage direct current from a battery pack system or junction box and convert the high voltage to multi-phase alternating current to drive an alternating current motor. For example, the inverter module 400 may receive high voltage dc power from a battery pack system or junction box and convert the high voltage to three phase ac power to a three phase ac motor. The transistor 125 in each power module 100 forming the three-phase power module 405 may convert direct current power to alternating current power (e.g., convert direct current power to alternating current power). The inverter module 400 may provide high voltage for heat dissipation to the transistors 125 and a predetermined range (e.g., voltage required or desired for a particular application of the inverter module 400), while reducing or providing low electromagnetic interference noise. The modular design of the inverter module 400 described herein may provide high power density, low emi noise, low cost, ease of manufacture, reduced scrap or rejection rates during production, efficient heat dissipation, and high voltage isolation.

fig. 5 depicts an exemplary cross-section 500 of an electric vehicle 505 with a battery pack 510 installed. The battery pack 510 may include an inverter module 400 having three power modules 100 to provide three-phase power to an electric vehicle 505 through the battery pack 510. For example, each power module 100 may generate single phase power and may be coupled in groups of three in the inverter module 400 to generate three phase power for the electric vehicle 505. The battery pack 510 may correspond to a power train unit 510 of the electric vehicle 505. For example, the battery pack 510 may be located in or be a component of the drive train unit 510. The drive train unit 510 (and battery pack 510) may provide power to the electric vehicle 505. For example, the drive train unit 510 may include components of an electric vehicle 505 that generate or provide electrical power to drive wheels or move the electric vehicle 505. The drive train unit 510 may be a component of an electric vehicle drive system. The electric vehicle drive system may transmit or provide power to different components of the electric vehicle 505. For example, an electric vehicle drive train system may transmit power from the battery pack 510 or the drive train unit 510 to the axles or wheels of the electric vehicle 505.

The electric vehicle 505 may include an automated, semi-automated, or non-automated human operated vehicle. The electric vehicle 505 may include a hybrid vehicle that is operated by an on-board power source and by gasoline or other power source. Electric vehicle 505 may include automobiles, cars, trucks, buses, industrial vehicles, motorcycles, and other transportation vehicles. The electric vehicle 505 may include a chassis 515 (sometimes referred to herein as a frame, an internal frame, or a carrier structure). The chassis 515 may support various components of the electric vehicle 505. The chassis 515 may span a front portion 520 (sometimes referred to herein as a hood or bonnet portion), a main body portion 525, and a rear portion 530 (sometimes referred to herein as a compartment portion) of the electric vehicle 505. The front portion 520 may include a portion of the electric vehicle 505 from a front bumper to a front wheel well of the electric vehicle 505. The body portion 525 may include a portion of the electric vehicle 505 from a front wheel well to a rear wheel well of the electric vehicle 505. The rear portion 530 may include a portion of the electric vehicle 505 from the rear wheel well to a rear bumper of the electric vehicle 505.

The battery pack 510 including the inverter module 400 having three power modules 100 may be mounted or placed in the electric vehicle 505. The battery pack 510 may include or be coupled to power converter components. For example, the power converter components may include an inverter module 400 having a three-phase power module 405. The battery pack 510 may be mounted to the chassis 515 in the front 520, body 525 (as shown in the example of fig. 5), or rear 530 of the electric vehicle 505. The battery pack 510 may be coupled to a first bus bar 535 and a second bus bar 540 that are connected or electrically coupled to other electrical components of the electric vehicle 505 to provide power from the battery pack 510. For example, each power module 100 may be coupled to a first bus bar 535 and a second bus bar 540 to provide power from the battery pack 510 to other electrical components of the electric vehicle 505.

Fig. 6 depicts a flow chart of a method 600 for providing the inverter module 400 to provide power to an electric vehicle 505. The inverter module 400 may include a single power module 100 or multiple power modules 100 to provide power to different electrical components of the electric vehicle 505. The method 600 may include providing a capacitor 105 (step 605). The capacitor 105 may be located within the inverter module case assembly 300. The capacitor 105 may form a base portion or bottom of the power module 100 of the inverter module 400. The capacitor 105 may be formed with a positive terminal 107 and a negative terminal 109. The positive and negative terminals 107, 109 may be configured such that they extend perpendicular to a first surface (e.g., top surface) of the capacitor 105. Providing the capacitor 105 may include placing a voltage divider 110 between the positive terminal 107 and the negative terminal 109 to electrically isolate the positive terminal 107 from the negative terminal 109. One or more capacitor elements (not shown) may be located in the capacitor 105. For example, a single capacitor film cartridge or a plurality of capacitor film cartridges (e.g., 3-4 capacitor film cartridges) may be located within the capacitor 105. One or more tabs may couple the capacitor diaphragm cartridge to the positive terminal 107 and the negative terminal 109.

The method 600 may include coupling a heat sink 115 (step 610). For example, the heat sink 115 may be coupled to the capacitor 105. A second surface (e.g., bottom surface) of the heat spreader 115 can be located on the first surface of the capacitor 105. One or more mounting legs formed on a second surface of the heat sink 115 can be coupled to one or more mounting holes formed on the capacitor 105 to couple the heat sink 115 with the capacitor 105. The heat sink 115 may be configured such that the aperture 117 (e.g., open interior area) of the heat sink 115 surrounds or is located around the positive terminal 107 and the negative terminal 109 of the capacitor 105. For example, the heat sink 115 may be configured to provide active cooling to components and electronics (e.g., capacitor 105, transistor 125) disposed in close proximity to a surface of the heat sink 115, such as, but not limited to, the positive terminal 107 and the negative terminal 109 of the capacitor 105. The positive and negative terminals 107, 109 may extend through the apertures 117 such that the positive and negative terminals 107, 109 are surrounded on multiple sides by the surface of the heat sink 115. The heat sink 115 may provide active cooling to the first surface of the capacitor 105 and the positive and negative terminals 107, 109 of the capacitor 105.

the method 600 may include configuring the ceramic plate 120 (step 615). At least one ceramic plate 120 may be located on a first surface of the heat sink 115. For example, a single ceramic plate 120 or a plurality of ceramic plates 120 (e.g., two or more) may be located on the first surface of the heat spreader 115. For example, a first ceramic board 120 may be located on a first portion of a first surface of the heat sink 115, while a second ceramic board 120 may be located on a second portion of the first surface of the heat sink 115. The ceramic plate 120 may be formed using a ceramic-based material. Ceramic plate 120 may be configured to electrically insulate heat spreader 115 from transistors (e.g., transistors 125) located in power module 100, e.g., ceramic plate 120 may be located on a top surface of heat spreader 115 to prevent a short circuit condition between heat spreader 115 and transistors (e.g., transistors 125) located in power module 100.

The method 600 may include providing a locator 140 (step 620). The locator 140 may be formed using a non-conductive material or a plastic material. The locator 140 may be located on a first surface of the ceramic board 120. A plurality of slits 142 may be formed in the retainer 140. For example, a first row of slits 142 may be formed along a first side of the positioner 140, while a second row of slits 142 may be formed along a second side of the positioner 140. The rows of slits 142 may include the same number of slits 142 or a different number of slits 142. The positioner 140 may be configured such that at least one ceramic plate 120 is positioned below a respective row of slits 142. For example, a first row of slits 142 may be aligned with a first ceramic plate 120, while a second row of slits 142 may be aligned with a second ceramic plate 120.

The method 600 may include configuring one or more transistors 125 (step 625). At least one transistor 125 may be located in at least one slot 142 of the positioner 140. For example, each transistor 125 may be located in or coupled to at least one slot 142 of the positioner 140. Accordingly, the transistor 125 and the locator 140 may be located on a first surface of the ceramic board 120. The transistors 125 may be organized or configured based on the arrangement of the slots 142 of the positioner 140. For example, the transistors 125 may be arranged in first and second rows corresponding to the first and second rows of slits 142, 142. Each transistor 125 may include a plurality of conductive lines 130. The conductive lines 130 may be bent, shaped, or otherwise manipulated to couple to respective one or more components (e.g., gate drive printed circuit board 160, capacitor 105) in the power module 100. For example, the conductive line 130 may be formed or configured such that it extends perpendicular to a first surface (e.g., top surface) of the transistor 125. For example, the conductive lines 130 may be formed such that they have a curved shape and extend upward relative to a first surface (e.g., top surface) of the transistors 125 to couple to other components of the power module 100 (e.g., the laminated bus bar 150, the gate drive printed circuit board 160). Configuring the transistors 125 may include a center-to-center spacing of the transistors 125 relative to each other of 15mm to 20mm (e.g., 17.5 mm).

The method 600 may include providing a bus bar 150 (step 630). For example, at least one laminated bus bar 150 may be located in the power module 100. The laminated bus bar 150 may be located on a first surface of the locator 140 and the plurality of transistors 125. For example, the second surface of the laminated bus bar 150 may be located on or in contact with the first surface of the fixture 140 and the first surface portion of the transistors 125 located in the slots 142 of the fixture 140. The conductive lines 130 of the transistors 125 may be coupled to portions of the laminated bus bar 150. For example, the laminated bus bar 150 may include a plurality of conductors 157. Each of the plurality of conductors 157 of the laminated bus bar 150 may be coupled to at least one conductor 130 of the plurality of transistors 125.

providing the bus bar 150 can include forming at least two input terminals 152, 154 (e.g., a positive input terminal and a negative input terminal) at or along a first side or edge of the laminated bus bar 150. Providing the bus bar 150 can include forming the output terminal 155 on a second, different side or a second, different edge (as compared to the first side or edge) of the laminated bus bar 150. For example, the two input terminals 152, 154 may be formed at the side opposite or opposite to the output terminal 155. The first and second input terminals 152, 154 may be formed using a conductive material, such as, but not limited to, copper. The output terminal 155 may be formed using a conductive material, such as, but not limited to, copper. The first and second input terminals 152, 154 may be formed in a variety of different shapes to be suitable for coupling to inverter bus bars (e.g., positive bus bars, negative bus bars). For example, the first and second input terminals 152, 154 may be formed in a straight line shape, or a curved or bent shape. The first input terminal 152 may be configured to be coupled to the positive bus bar to receive a positive voltage and provide a positive voltage to power the module 100. The second input terminal 154 may be configured to be coupled to a negative bus bar (not shown) to receive a negative voltage and provide a negative voltage to power the module 100. For example, the first input terminal 152 may be formed at a different level or height relative to the side surface of the laminated bus bar 150 than the second input terminal 154. The first input terminal 152 may be formed at a first level or a first height, and the second input terminal 154 may be formed at a second level or a second height. The first level or height may be greater than the second level or height. The first level or height may be less than the second level or height. The output terminal 155 may be formed in a straight shape, or a curved or bent shape. The output terminals 155 may be configured to couple to a phase bus bar (not shown) to provide power generated by the power module 100 to other electrical components of the electric vehicle 505.

the method 600 may include coupling a driver Printed Circuit Board (PCB)160 (step 635). For example, the gate driving printed circuit board 160 may be located on a first surface of the laminated bus bar 150. The gate drive printed circuit board 160 may include control electronics and may generate and provide control signals to the transistors 125. For example, a second surface (e.g., a bottom surface) of the gate drive printed circuit board 160 may be located on or in contact with a first surface (e.g., a top surface) of the laminated bus bar 150 such that the conductive lines 130 of the transistors 125 may extend through the locators 140 and the laminated bus bar 150 to couple to portions or surfaces of the gate drive printed circuit board 160. The gate drive printed circuit board 160 may generate control signals, for example, to turn on or off, turn on or turn off one or more transistors 125.

The method 600 may include configuring the gel tray 165 (step 640). For example, the gel tray 165 may be formed using a poly-carbon material, or other form of high temperature plastic. The gel tray 165 may be formed with an interior region that covers, masks, or may be located around various components of the power module 100. One or more fasteners 167 may couple the gel tray 165 to the capacitor 105. The gel pad 165 may be located on the first surface of the gate driving printed circuit board 160. The interior area may have located therein a gate drive printed circuit board 160, a laminated bus bar 150, a plurality of transistors 125, a locator 140, a first ceramic board 120, a second ceramic board 120, and a heat sink 115.

One or more capacitive vents 170 may be formed on at least one side surface of the gel disk 165. For example, the capacitive aperture 170 may be formed as a hole or access point to couple a power source (e.g., a direct current power source) to the power module 100. The capacitive aperture 170 may be used as an input or an output of the power module 100. The first capacitive aperture 170 may be formed to couple the first input terminal 152 of the laminated bus bar 150 to the positive bus bar to provide a positive power supply to the power supply module 100. The second capacitive aperture 170 may be formed to couple the second input terminal 154 of the laminated bus bar 150 to the negative bus bar to provide a negative power supply to the power module 100. The third capacitive aperture 170 may be formed to couple the output terminal 155 of the laminated bus bar 150 to a phase bus bar to provide the output voltage generated by the power module 100 to other components of the electric vehicle.

the inverter module 400 may be provided to house or contain the power module 100 or a plurality of power modules 100. For example, the inverter case assembly 300 may be provided to define an interior region 307 of the inverter module 400. Providing the power module 100 may include placing the power module 100 in the interior region 307 of the inverter case assembly 300. For example, a single power module 100 may be located in the interior region 307 of the inverter case assembly 300 or multiple power modules 100 may be located in the interior region 307 of the inverter case assembly 300. For example, three power modules 100 may be located in the interior region 307 of the inverter case assembly 300 to form a three-phase power module 405 of the inverter module 400. The emi shield 410 may be located on a first surface of multiple power modules 100 or a single power module 100. An electromagnetic interference shield 410 may be located in the interior region 307. The control board 415 may be located on a first surface of the emi shield 410. The control panel 415 may be located in the interior region 307.

To couple the power modules 100 together, the sub-assembly 200 may be coupled to a side surface of the power modules 100. For example, the subassembly 200 may be coupled to the power module 100 to transfer direct current to the power module 100 through one or more conduits formed by the positive 215 and negative 220 bus bars of the subassembly 200. The subassembly 200 may be formed using a carrier 240. The support 240 may be provided or configured proximate (e.g., contacting, less than 0.5mm) a side surface of the power module 100. The positive dc bus bar 215 can be coupled to a side surface of the power module 100 using brackets 240. The negative dc bus bar 220 may be coupled to a side surface of the power module 100 using brackets 240. Forming the subassembly 200 can include coupling the positive Y capacitor bus bar 225 to a side surface of the power module using the bracket 240. The positive Y capacitor bus bar 225 can include a first positive electrical component extending along a first side surface of the standoff 240 and a second positive electrical component extending along a second side surface of the standoff 240. For example, the positive Y capacitor bus bar 225 can be configured such that it wraps around at least one surface of the carrier 240 (e.g., a clip on a surface of the carrier 240). Forming the subassembly 200 can include coupling the negative Y capacitor bus bar 230 to a side surface of the power module using the bracket 240. The negative Y capacitor bus bar 230 can have a first negative electrical component extending along a first side surface of the shelf 240 and a second negative electrical component extending along a second side surface of the shelf 240. For example, the negative Y capacitor bus bar 230 can be configured such that it wraps around at least one surface of the carrier 240 (e.g., a clip on a surface of the carrier 240).

the subassembly 200 may be coupled to a single power module 100 or to multiple power modules 100. The subassembly 200 may be formed with one or more positive input apertures 205 to couple to the positive input 152 of each power supply module 100 and one or more negative input apertures 210 to couple to the negative input 154 of each power supply module 100. For example, the subassembly 200 may be formed with three positive input apertures 205 and three negative input apertures 210. Thus, the subassembly 200 can transfer direct current to three power modules 100 coupled in triplets to form the three phase power module 405 of the inverter module 400.

the inverter module 400 may be formed using components, such as transistors 125, to provide greater design control for each aspect of the inverter module packaging. For example, an inverter module 400 having multiple power module 100 components may be suitable for a variety of different inverter applications, such as a drive train unit for an electric vehicle drive system (e.g., electric vehicle 505 of fig. 5). The inverter module 400 may be designed such that the subcomponents may be assembled in a top-down manner or individually to provide a streamlined mounting and simpler manufacturing process compared to other inverter systems of electric vehicles. For example, the components of the inverter module 400 described herein may be mounted in a vertical orientation. Because the inverter module 400 may be modular with respect to at least one power module 100 and each phase of each power module 100, the respective power module 100 may be produced and tested before moving to its next assembly step.

the power module 100 may be formed as a single subsystem, such as the inverter module 400, to provide a compact design. Thus, when multiple power modules 100 are coupled to one another or configured to form a three-phase power module 405, the overall inverter module 400 may have a compact design and maintain gaps for tolerances and electrical isolation. The inverter modules described herein include a modular design with one or more single-phase power modules 100 and thus may be designed for a variety of different applications, including for different phase or voltage applications. For example, the inverter module 400 may be used for three-phase inverters and three-phase inverter applications. The inverter module 400 may be used in a multi-phase inverter such as a two-phase inverter or a more than three-phase inverter and a two-phase inverter application or a more than three-phase inverter application.

the modular design may provide a lower reject rate in production, since for example one third of the other inverter systems may need to be removed if there is a problem in the quality inspection step. The inverter module 400 may reduce or have less electromagnetic interference noise than other inverter systems of the electric vehicle. For example, the modular design of the inverter module 400 described herein may provide or create efficient heat dissipation via the heat sink 115 for forming the transistors 125, discharge resistors, or capacitors 185 of the respective power modules 100 to maintain these components in their intended operating ranges.

The packaging of the transistors 125, the laminated bus bar 150, the positive dc link bus bar 215 (described below with reference to fig. 2), the negative dc link bus bar 220, the positive Y capacitor bus bar 225, the negative Y capacitor bus bar 230, the grounded Y capacitor bus bar 235, and the capacitors 105 can be a challenging problem when designing and producing the inverter module. The position of each component relative to each other can be critical or important to provide adequate heat dissipation and to provide reduced or low electromagnetic interference noise. The inverter module 400 may include at least one heat sink 115 in each power module 100. The positive and negative terminals 107, 109 of the capacitor 105 in each power module 100 may extend through (e.g., up through, down through) an opening, hole, or aperture formed in the middle region of the respective heat sink 115 and a wire 130 coupled to (e.g., directly coupled to) a transistor 125. Transistors 125 can be arranged such that they are disposed at a predetermined distance from each other (e.g., disposed one behind the other, disposed with the sides in contact with each other, disposed in close proximity to each other) to form a small inductive loop.

since each phase of the inverter module 400 or each power module 100 is modularized, the quality inspection step may be performed after each power module 100 is generated or after a plurality of power modules 100 are generated in the assembly line. The capacitors 105 may be located within the three-phase power module 405 and within the inverter module 400 such that each capacitor 105 may be actively cooled by air in the environment surrounding the inverter module 400 (e.g., outside the inverter module 400), by coolant within the radiator 115, or by a combination of air in the environment surrounding the inverter module 400 and coolant in the radiator 115. Thus, the capacitors 185 may operate at a predetermined operating temperature (e.g., a desired operating temperature) for the respective capacitors 105. The predetermined operating temperature may be selected based at least in part on the particular application of the inverter module 400. For example, the predetermined operating temperature may be-40 ℃ to 85 ℃.

Fig. 7 depicts a method 70 of providing a power module 100. The power module 100 may be coupled to one or more other power modules 100 to form an inverter module 400 to provide power for the electric vehicle 505. The method 700 may include providing a power module 100 (step 705). The power module 700 may include a capacitor 105. The power module 700 may include a heat sink 115 coupled to a first surface of the capacitor 105. The power module 700 may include a first ceramic board 120 coupled to a first surface of the heat sink 115. The power module 700 may include a second ceramic board 120 coupled to a first surface of the heat sink 115. The power module 700 may include a positioner 140 having a plurality of slots 142. The power module 700 may include a plurality of transistors 125 positioned in the plurality of slots 142. The locator 140 and the plurality of transistors 125 may be located on a first surface of the first ceramic board 120 and a first surface of the second ceramic board 120. The power module 700 may include a laminated bus bar 150 on a first surface of the fixture 140. The power module 700 may include a gate drive printed circuit board 160 coupled to a first surface of the laminated bus bar 150. The power module 700 may include a dielectric gel pad 165 on a first surface of the gate drive printed circuit board 160.

Although acts or operations may be depicted in the drawings or described in a particular order, such acts are not necessarily required to be performed in the particular order shown or described, or in sequential order, and all shown or described acts may not be required. The actions described herein may be performed in a different order.

having now described some illustrative embodiments, it is to be understood that the foregoing is illustrative and not limiting, having been given by way of example. Features which are described herein in the context of separate embodiments may also be implemented in combination in a single embodiment. Features which are described in the context of a single embodiment can also be provided in multiple embodiments separately or in different subcombinations. Embodiments or elements or acts of the systems and methods referred to herein in the singular may also include embodiments comprising a plurality of these elements, and any embodiment or element or act referred to herein in the plural may also include embodiments comprising only a single element. Reference to the singular or plural form is not intended to limit the presently disclosed systems or methods and their components, functions or elements to a single or plural configuration. Any action or element referenced based on any action or element may include embodiments in which the action or element is based, at least in part, on any action or element.

The phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of "including," "comprising," "having," "containing," "involving," "characterized by," and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items and alternative embodiments consisting of the items listed thereafter exclusively. In one embodiment, the systems and methods described herein are composed of one, each combination of more than one, or all of the described elements, acts, or components.

Any embodiment or element or act of the systems and methods herein in the singular may include an embodiment comprising a plurality of such elements, and any embodiment or element or act described in the plural may include an embodiment comprising only a single element. Reference to the singular or plural form is not intended to limit the presently disclosed systems or methods and their components, functions or elements to a single or plural configuration. Any action or element referenced based on any information, action, or element may include embodiments in which the action or element is based, at least in part, on any information, action, or element.

any embodiment disclosed herein may be combined with any other embodiment, and references to "an embodiment," "some embodiments," "an embodiment," etc. are not necessarily mutually exclusive and are intended to indicate that a particular feature, structure, or characteristic described in connection with the embodiment may be included on at least one embodiment. As used herein, such terms do not necessarily all refer to the same embodiment. Any embodiment may be combined with any other embodiment in any manner consistent with aspects and embodiments disclosed herein, including and exclusive of such combinations.

references to "or" may be construed as inclusive such that any feature described using "or" may mean any single, greater than one, or all of the described terms. Reference to at least one consecutive list of terms may be interpreted as being inclusive or indicating any singular, greater than one, or all of the recited terms. For example, reference to "at least one of 'a' and 'B'" may include only 'a', only 'B', and both 'a' and 'B'. Such that use of "including" or other open-ended terms may include additional items.

Where technical features in the drawings, detailed description and any claims are followed by reference signs, the reference signs have been included to increase the intelligibility of the drawings, detailed description and claims. Accordingly, the reference signs do not have any limiting effect on any claim element, whether present or absent.

changes may be made in the elements and acts, such as in the sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations, etc., without materially departing from the teachings and advantages of the subject matter disclosed herein. For example, elements shown as integrally formed may be constructed of multiple parts or elements, the position of elements may be reversed or otherwise varied, and the nature or number of discrete elements or positions may be altered or varied. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement and operation of the disclosed elements without departing from the scope of the present invention.

the systems and methods described herein may be embodied in other specific forms without departing from the characteristics thereof. For example, the voltage along the battery cell terminals may be greater than 5V. The foregoing embodiments are illustrative, and not limiting, of the systems and methods described. The scope of the systems and methods described herein is, therefore, indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are intended to be embraced therein.

the systems and methods described herein may be embodied in other specific forms without departing from the characteristics thereof. For example, the description for positive and negative electrical characteristics may be reversed. For example, elements described as negative elements may alternatively be configured as positive elements, while elements described as positive elements may alternatively be configured as negative elements. Further, references to parallel, orthogonal, perpendicular, or other configurations or orientations include variations within + -10% or + -10 degrees of purely perpendicular, parallel, or orthogonal configurations. References to "about," "approximately," "substantially," or other terms of degree include variations of ± 10% from the given measure, unit, or range unless otherwise expressly indicated. The coupling elements may be directly connected to each other or have elements interposed therebetween electrically, mechanically, or physically. The scope of the systems and methods described herein is thus indicated by the appended claims, rather than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.