阅读说明：本技术 一种防水传感器封装、传感器及电子设备 (Waterproof sensor encapsulation, sensor and electronic equipment ) 是由 徐香菊 端木鲁玉 巩向辉 付博 于 2019-09-29 设计创作，主要内容包括：本发明公开了一种防水传感器封装、传感器以及电子设备,包括第一壳体和第二壳体,所述第一壳体与第二壳体之间设置有防水膜,所述防水膜与第一壳体和第二壳体之间胶接固定,所述第二壳体和所述防水膜围成的空腔内设置有传感器单体,所述防水膜与第一壳体胶接面的胶宽不小于0.5mm,所述防水膜与第一壳体胶接面积占所述防水膜膜面积的占比不小于30%,所述防水膜与第二壳体的上端面胶接,并且胶接面积不低于第二壳体上端面面积的30%,所述第二壳体和所述防水膜围成的空腔内至少设置有一种MEMS传感器芯片,实现多个传感器的组合防水,同时满足声学要求。(The invention discloses a waterproof sensor package, a sensor and electronic equipment, which comprises a first shell and a second shell, wherein a waterproof membrane is arranged between the first shell and the second shell, the waterproof membrane is fixedly connected with the first shell and the second shell in an adhesive manner, a sensor monomer is arranged in a cavity defined by the second shell and the waterproof membrane, the adhesive width of the adhesive surface of the waterproof membrane and the first shell is not less than 0.5mm, the adhesive area of the waterproof membrane and the first shell accounts for not less than 30% of the area of the waterproof membrane, the upper end surface of the waterproof membrane and the second shell is in adhesive connection, the adhesive area is not less than 30% of the area of the upper end surface of the second shell, and at least one MEMS sensor chip is arranged in the cavity defined by the second shell and the waterproof membrane, so that the combination waterproof of a plurality of sensors is realized, and the acoustic requirements are met.)

1. The waterproof sensor package is characterized by comprising a first shell and a second shell, wherein a waterproof membrane is arranged between the first shell and the second shell, the waterproof membrane is fixedly connected with the first shell and the second shell in a splicing manner, a sensor monomer is arranged in a cavity surrounded by the second shell and the waterproof membrane, the glue width of the glue surface of the waterproof membrane and the first shell is not less than 0.5mm, and the glue area of the waterproof membrane and the first shell accounts for not less than 30% of the area of the waterproof membrane.

2. The waterproof sensor package according to claim 1, wherein the waterproof film is bonded to the upper end surface of the second casing in an area of not less than 30% of the area of the upper end surface of the second casing.

3. The waterproof sensor package of claim 1, wherein said second housing and said waterproof membrane enclose a cavity having at least one MEMS sensor chip disposed therein.

4. the waterproof sensor package of claim 1, wherein said first housing defines a through hole, said first housing through hole having a diameter not less than 0.15 mm.

5. The waterproof sensor package of claim 1, wherein the first housing has a through hole, and wherein the waterproof membrane and the first housing have an adhesive layer therebetween, wherein an outer side of the adhesive layer is aligned with an outer side of the first housing, and an inner side of the adhesive layer does not exceed an inner circumferential surface of the through hole of the housing.

6. the waterproof sensor package according to claim 1, wherein the first housing includes a fixing portion parallel to the waterproof film and a protrusion extending upward along an inner side of the fixing portion and perpendicular to the waterproof film, and a rounded corner is provided at a connection portion of the fixing portion and the protrusion, the connection portion being close to the waterproof film.

7. The waterproof sensor package of claim 1, wherein said waterproof membrane is an EPTFE membrane or a CELLULOSE membrane.

8. The waterproof sensor package of any one of claims 1-7, wherein the first housing is made of metal, plastic, or ceramic, and the second housing is made of PCB or ceramic.

9. A sensor comprising a water-resistant sensor package according to any one of claims 1 to 8.

10. An electronic device comprising the waterproof sensor package according to any one of claims 1 to 8.

Technical Field

The invention relates to the technical field of sensors, in particular to a waterproof sensor package, a sensor and electronic equipment.

Background

As a detection device, the sensor is commonly used in a mobile phone, a notebook computer, a tablet computer and a wearable device. MEMS sensors, i.e., Micro Electro Mechanical Systems (MEMS), are developed in the field of advanced research with multidisciplinary intersections based on microelectronics, and compared with conventional sensors, MEMS sensors have the characteristics of small size, light weight, low cost, low power consumption, high reliability, suitability for mass production, easiness in integration and realization of intelligence, and thus are widely used in the electronic field.

disclosure of Invention

The invention aims to solve the problems in the prior art and provides a waterproof sensor package, a sensor and electronic equipment, which realize the waterproof combination of a plurality of sensors and meet the acoustic requirements.

The technical scheme of the invention is as follows:

The utility model provides a waterproof sensor encapsulation, includes first casing and second casing, be provided with the water proof membrane between first casing and the second casing, it is fixed to splice between water proof membrane and first casing and the second casing, the second casing with be provided with the sensor monomer in the cavity that the water proof membrane encloses, the glue width of water proof membrane and first casing glue face is not less than 0.5mm, the water proof membrane splices the area with first casing and accounts for the percentage of not less than 30% of water proof membrane area.

As a preferable technical scheme, the waterproof membrane is glued with the upper end face of the second shell, and the gluing area is not less than 30% of the area of the upper end face of the second shell.

As a preferable technical solution, at least one MEMS sensor chip is disposed in a cavity enclosed by the second housing and the waterproof membrane, and the MEMS sensor chip may be a MEMS microphone.

As a preferable technical solution, the first housing is provided with a through hole, and the diameter of the through hole of the first housing is not less than 0.15 mm.

As a preferred technical scheme, the first shell is provided with a through hole, a glue joint layer is arranged between the waterproof membrane and the first shell, the outer side of the glue joint layer is aligned with the outer side face of the first shell, and the inner side of the glue joint layer does not exceed the inner circular face of the through hole of the shell.

As a preferred technical scheme, the first shell comprises a fixing portion parallel to the waterproof membrane and a protruding portion extending upwards along the inner side of the fixing portion and perpendicular to the waterproof membrane, and a rounded corner is arranged on one side, close to the waterproof membrane, of a connecting portion of the fixing portion and the protruding portion.

As a preferable technical scheme, the waterproof membrane is made of an EPTFE membrane or a CELLULOSE membrane.

As a preferred technical solution, the first housing is made of metal, plastic or ceramic, and the second housing is made of PCB or ceramic.

A sensor comprising the waterproof sensor package described above.

An electronic device comprising the waterproof sensor package described above.

According to the waterproof sensor package, the sensor and the electronic equipment, 2 or more than 2 MEMS sensors with small volume are combined and arranged in the shell with one side opened, the waterproof membrane meeting the waterproof grade requirement is used for sealing and packaging, and then the other shell with the through hole is used for compressing and fixing, so that the waterproof integrated sensor which aims at the small and inconvenient package of the MEMS sensors with the same volume is formed, the sensor components are jointly waterproof through the waterproof membrane, meanwhile, the size of the through hole on the first shell meets the acoustic requirement, the effective vibration area of the waterproof membrane is ensured while the gluing area is met, and the requirement on the acoustic condition during the sensor package is met.

Drawings

FIG. 1 is a sectional view showing the internal structure of the present invention;

FIG. 2 is a top view of the first housing of the present invention;

FIG. 3 is a cross-sectional view of one embodiment of the waterproof membrane of the present invention adhesively bonded thereto;

FIG. 4 is a cross-sectional view of another embodiment of a waterproof membrane of the present invention adhesively bonded;

Wherein, 1 first casing, 2 waterproof membrane, 3 second casings, 4 sensor module A, 5 sensor module B, 6 go up the glue film, 7 glue films down, 8 through-holes, 9 fixed part, 10 bellying, 11 fillets.

Detailed Description

In order to make the technical means, technical features, objects and technical effects of the present invention easily understandable, the present invention is further described below with reference to the specific drawings.