阅读说明：本技术 一种研磨装置和研磨方法 (Grinding device and grinding method ) 是由 廖世容 刘朝辉 于 2019-09-18 设计创作，主要内容包括：本发明提供一种研磨装置,包括研磨机构、定位机构、真空泵、夹持机构、陶瓷盘、真空罩,陶瓷盘上开设有若干通孔,陶瓷盘上设有若干定位柱,真空罩上部开孔,孔内安装密封圈,密封圈中插入有连接管,连接管上设有调节阀。相应地,本发明还提供一种所述研磨装置的研磨方法。本发明可以提高研磨的磷化铟晶圆片的均匀性,同时可以加快研磨后从陶瓷盘上取下磷化铟晶圆片的速度。(The invention provides a grinding device which comprises a grinding mechanism, a positioning mechanism, a vacuum pump, a clamping mechanism, a ceramic disc and a vacuum cover, wherein a plurality of through holes are formed in the ceramic disc, a plurality of positioning columns are arranged on the ceramic disc, a hole is formed in the upper part of the vacuum cover, a sealing ring is arranged in the hole, a connecting pipe is inserted into the sealing ring, and an adjusting valve is arranged on the connecting pipe. Correspondingly, the invention further provides a grinding method of the grinding device. The invention can improve the uniformity of the grinded indium phosphide wafer and can accelerate the speed of taking down the indium phosphide wafer from the ceramic disc after grinding.)

1. A grinding apparatus characterized by: the ceramic disc grinding device comprises a grinding mechanism, a positioning mechanism, a vacuum pump, a clamping mechanism, a ceramic disc and a vacuum cover, wherein a plurality of through holes are formed in the ceramic disc, a plurality of positioning columns are arranged on the ceramic disc, a hole is formed in the upper portion of the vacuum cover, a sealing ring is installed in the hole, a connecting pipe is inserted into the sealing ring, an adjusting valve is arranged on the connecting pipe, a vacuumizing pipe joint is arranged on the upper portion of the connecting pipe, a circle of sealing ring is arranged on the lower portion of the vacuum cover, a vacuumizing pipe is connected onto the vacuum pump, the other end of the vacuumizing pipe can be inserted into the vacuumizing pipe joint, the clamping mechanism comprises a supporting table and a clamping piece, a notch for accommodating the ceramic disc is formed in the supporting table, the clamping piece is arranged on; the grinding mechanism comprises a frame and a liquid supply tank, a groove is formed in the middle of the upper portion of the frame, a driving motor is arranged in the frame, the driving motor is connected with a rotating shaft in a driving mode, the upper portion of the rotating shaft is connected with a grinding disc, a plurality of flow guide grooves are formed in the surface of the grinding disc, the bottom of the groove is arranged in an upward inclined mode from outside to inside, supporting columns are connected to the positions, located on the left side and the right side of the groove, of the upper portion of the frame, supporting blocks are arranged on the upper portion of the supporting columns, an arc-shaped plate is connected to one side, away from the supporting columns, of the supporting blocks, two adjusting holes are formed in the arc-shaped plate, positioning wheels are installed in the adjusting holes, a liquid supply pump is arranged at the position, located on the rear side of the groove, a liquid suction, the junction of control tube and feed pipe is provided with the flow valve, feed tank upper portion is provided with agitator motor, agitator motor's output is connected with the (mixing) shaft, the (mixing) shaft periphery is equipped with a plurality of stirring leaves.

2. A grinding apparatus as defined in claim 1, wherein: the diameter of the through holes is 1mm, and the distance between every two adjacent through holes is 10 mm.

3. A grinding apparatus as defined in claim 1, wherein: the clamping piece comprises a clamping piece and an adjusting screw rod, the adjusting screw rod is connected to the supporting table in a threaded mode, a supporting seat is arranged on the outer side of the clamping piece, and the adjusting screw rod is connected with the supporting seat in a rotating mode.

4. A grinding apparatus as defined in claim 1, wherein: the adjusting pipe is a universal bamboo joint pipe.

5. A grinding apparatus as defined in claim 3 or 4, wherein: the supporting structure is characterized in that the supporting block is provided with a mounting hole, an adjusting groove and a bolt hole, the mounting hole is located on one side, close to the outside, of the supporting block, the adjusting groove is perpendicular to the mounting hole, one end of the adjusting groove penetrates through the mounting hole, the other end of the adjusting groove is connected with the outer side face of the supporting block, the bolt hole is perpendicular to the adjusting groove and located on the outer side of the mounting hole, the upper end of the supporting column is inserted into the mounting hole, and a bolt is screwed into the.

6. A grinding apparatus as defined in claim 5, wherein: and a recovery pipe is connected between the bottom of the groove and the liquid supply tank.

7. A grinding method using the grinding apparatus according to any one of claims 1 to 6, characterized by comprising:

step 1, placing a ceramic disc at a gap of a support table, adjusting a clamping piece to clamp and fix the ceramic disc, smearing a layer of wax on the position of the ceramic disc corresponding to a wafer, standing for 30-60 seconds after waxing, and then attaching the indium phosphide wafer to the wax-coated position on the ceramic disc;

step 2, inserting a vacuumizing pipe into a vacuumizing pipe joint, attaching a vacuum cover to the back of the ceramic disc, starting the vacuum pump, vacuumizing the vacuum cover so as to adsorb the indium phosphide wafer on the ceramic disc, closing the regulating valve, and pulling the vacuumizing pipe out of the vacuumizing pipe joint;

step 3, placing the ceramic block of the positioning mechanism on a grinding disc downwards, adjusting the position of a positioning wheel to enable the positioning wheel to be attached to the periphery of the positioning ring, taking the ceramic disc off the clamping mechanism, and placing the side, attached with the indium phosphide wafer, of the ceramic disc downwards into the positioning mechanism;

step 4, starting a grinding mechanism, driving a grinding disc to rotate by a driving motor, driving a stirring blade to stir the grinding liquid in the liquid supply tank by a stirring motor, providing the grinding liquid by a liquid supply pump through a liquid supply pipe and an adjusting pipe after the grinding liquid in the liquid supply tank is extracted by the liquid supply pump, grinding the surface of the indium phosphide wafer by the rotating grinding disc, and stopping when the thickness of the indium phosphide wafer is qualified;

step 5, closing the grinding mechanism, taking out the ceramic disc from the positioning mechanism, fixing the side, on which the indium phosphide wafer is adsorbed, of the ceramic disc upwards by using a clamping mechanism, opening the regulating valve, taking down the vacuum cover, and taking down the indium phosphide wafer from the ceramic disc;

and 6, washing and drying the ground indium phosphide wafer by using pure water, and detecting the ground surface.

8. A grinding method according to claim 7, wherein: the rotating speed of the grinding disc is 10r/min, the flow rate of the grinding fluid is 25ml/min, and the grinding fluid is calcined alumina powder and pure water in a volume ratio of 1: 20, and mixing the components in a ratio of 20.

Technical Field

The invention relates to the technical field of indium phosphide wafer production, in particular to a grinding device and a grinding method.

Background

The indium phosphide has the advantages of high electron mobility, good radiation resistance, large forbidden band width and the like, and has key advantages in two application fields of the photon field and the radio frequency field. In optical communications, indium phosphide provides high performance in a number of functions, including emission, detection, modulation, and mixing. The indium phosphide wafer needs to be ground in the production process, and the indium phosphide wafer is usually attached to a wax-coated ceramic disc and firmly adsorbed by pressurization, so that the indium phosphide wafer can be taken off from the ceramic disc after grinding for a long time.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a grinding device and a grinding method.

In order to achieve the purpose, the invention provides the following technical scheme to realize the purpose:

a grinding device comprises a grinding mechanism, a positioning mechanism, a vacuum pump, a clamping mechanism, a ceramic disc and a vacuum cover, wherein the ceramic disc is provided with a plurality of through holes, the ceramic disc is provided with a plurality of positioning columns, the upper part of the vacuum cover is provided with an opening, a sealing ring is arranged in the hole, a connecting pipe is inserted in the sealing ring, the connecting pipe is provided with a regulating valve, the upper part of the connecting pipe is provided with a vacuumizing pipe joint, the lower part of the vacuum cover is provided with a circle of sealing ring, the vacuum pump is connected with a vacuumizing pipe, the other end of the vacuumizing pipe can be inserted into the vacuumizing pipe joint, the clamping mechanism comprises a supporting table and a clamping piece, the supporting table is provided with a notch for accommodating the,

the grinding mechanism comprises a frame and a liquid supply tank, a groove is formed in the middle of the upper portion of the frame, a driving motor is arranged in the frame, the output end of the driving motor is in driving connection with a rotating shaft, a grinding disc is connected to the upper portion of the rotating shaft, a plurality of flow guide grooves are formed in the surface of the grinding disc, the bottom of the groove is arranged in an upward inclined mode from outside to inside, supporting columns are connected to the positions, located on the left side and the right side of the groove, of the upper portion of the frame, supporting blocks are arranged on the upper portion of the supporting columns, an arc-shaped plate is connected to one side, away from the supporting columns, of each supporting block, two adjusting holes are formed in each arc-shaped plate, positioning wheels are installed in the adjusting holes, a liquid supply pump is arranged on the rear side of the groove in the frame, a liquid suction pipe is connected between, the output end of the stirring motor is connected with a stirring shaft, and the periphery of the stirring shaft is provided with a plurality of stirring blades.

Preferably, the diameter of the through-holes is 1mm, and the distance between adjacent through-holes is 10 mm.

Preferably, the clamping piece comprises a clamping piece and an adjusting screw rod, the adjusting screw rod is connected to the supporting table in a threaded mode, a supporting seat is arranged on the outer side of the clamping piece, and the adjusting screw rod is connected with the supporting seat in a rotating mode.

Preferably, the adjusting pipe is a universal bamboo joint pipe.

Preferably, the supporting block is provided with a mounting hole, an adjusting groove and a bolt hole, the mounting hole is located on one side, close to the outside, of the supporting block, the adjusting groove is perpendicular to the mounting hole, one end of the adjusting groove penetrates through the mounting hole, the other end of the adjusting groove is connected with the outer side face of the supporting block, the bolt hole is perpendicular to the adjusting groove and located on the outer side of the mounting hole, the upper end of the supporting column is inserted into the mounting hole, and a bolt is screwed into the bolt.

Preferably, a recovery pipe is connected between the bottom of the groove and the liquid supply tank.

Correspondingly, the invention also provides a grinding method using the grinding device, which comprises the following steps:

placing the ceramic disc at the notch of the support table, adjusting the clamping piece to clamp and fix the ceramic disc, coating a layer of wax on the position of the ceramic disc corresponding to the attached wafer, standing for 30-60 seconds after wax coating, and then attaching the indium phosphide wafer to the wax coated position on the ceramic disc;

inserting a vacuumizing pipe into a vacuumizing pipe joint, attaching a vacuum cover to the back of the ceramic disc, starting a vacuum pump, vacuumizing the vacuum cover so as to adsorb the indium phosphide wafer on the ceramic disc, closing the regulating valve, and pulling the vacuumizing pipe out of the vacuumizing pipe joint;

the ceramic block of the positioning mechanism is placed on the grinding disc downwards, the position of the positioning wheel is adjusted to be attached to the periphery of the positioning ring, the ceramic disc is taken down from the clamping mechanism, and the side, attached with the indium phosphide wafer, of the ceramic disc is placed into the positioning mechanism downwards;

starting a grinding mechanism, driving a grinding disc to rotate by a driving motor, driving a stirring blade to stir the grinding liquid in a liquid supply tank by a stirring motor, providing the grinding liquid by a liquid supply pump through a liquid supply pipe and an adjusting pipe after the grinding liquid in the liquid supply tank is extracted by the liquid supply pump, grinding the surface of the indium phosphide wafer by the rotating grinding disc, and stopping the grinding until the thickness of the indium phosphide wafer is qualified;

closing the grinding mechanism, taking out the ceramic disc from the positioning mechanism, fixing the side, on which the indium phosphide wafer is adsorbed, of the ceramic disc upwards by using a clamping mechanism, opening the regulating valve, taking down the vacuum cover, and taking down the indium phosphide wafer from the ceramic disc;

and washing the ground indium phosphide wafer by using pure water, drying the wafer by spin-drying, and detecting the ground surface.

Preferably, the rotation speed of the grinding disc is 10r/min, the flow rate of the grinding fluid is 25ml/min, and the grinding fluid is calcined alumina powder and pure water in a volume ratio of 1: 20, and mixing the components in a ratio of 20.

Compared with the prior art, the invention has the beneficial effects that: the hole is formed on the ceramic disc, the indium phosphide wafer on the ceramic disc can be directly sucked by the vacuum cover, and the process of pressure adsorption is omitted; in the grinding process, the pressure can be discharged through the holes on the ceramic disc, so that the problem that the uniformity is influenced by different pressures at different positions of the indium phosphide wafer in the grinding process due to uneven wax coating is avoided; when the material is taken, the indium phosphide wafer can be taken down from the ceramic disc only by opening the regulating valve on the vacuum cover, and the indium phosphide wafer does not need to be pushed slowly on the ceramic disc to be fed.

Drawings

FIG. 1 is a schematic view of the grinding mechanism of the present invention;

FIG. 2 is a schematic view of the vacuum pump, the clamping mechanism, the ceramic plate, and the vacuum cover of the present invention;

FIG. 3 is a schematic view of the clamping mechanism and the ceramic plate of the present invention;

FIG. 4 is a schematic view of the positioning mechanism, the ceramic plate and the vacuum cover of the present invention;

FIG. 5 is a bottom view of FIG. 4;

FIG. 6 is a cross-sectional view of FIG. 4;

FIG. 7 is a schematic view of a liquid supply tank in the grinding mechanism according to the present invention;

FIG. 8 is a cross-sectional view of a frame of the grinding mechanism of the present invention;

FIG. 9 is a schematic view of a support block in the grinding mechanism of the present invention.

Reference numerals: 1. a grinding mechanism; 11. a frame; 12. a liquid supply tank; 13. a groove; 14. a drive motor; 15. a rotating shaft; 16. a grinding disk; 17. a support pillar; 18. a support block; 19. an arc-shaped plate; 110. an adjustment hole; 111. positioning wheels; 112. a liquid supply pump; 113. a liquid pumping pipe; 114. a liquid supply tube; 115. an adjusting tube; 116. a flow valve; 117. a stirring motor; 118. a stirring shaft; 119. stirring blades;

2. a positioning mechanism; 21. a positioning ring; 22. a ceramic block;

3. a vacuum pump; 31. vacuumizing a tube;

4. a clamping mechanism; 41. a support table; 42. a clamping piece; 43. adjusting the screw rod; 44. a supporting seat;

5. a ceramic pan; 51. a through hole; 52. a positioning column;

6. a vacuum hood; 61. a seal ring; 62. a connecting pipe; 63. adjusting a valve; 64. a vacuum pipe joint; 65. a seal ring;

7. an indium phosphide wafer.

Detailed Description

Embodiments of the present invention are described in detail below with reference to fig. 1-9.

As an aspect of the present invention, a polishing apparatus is provided, including a polishing mechanism 1, a positioning mechanism 2, a vacuum pump 3, a clamping mechanism 4, a ceramic disc 5, and a vacuum cover 6, wherein the ceramic disc 5 is provided with a plurality of through holes 51, the ceramic disc 5 is provided with a plurality of positioning pillars 52, the downward polishing cannot be continued until the top ends of the positioning pillars 52 are polished, the downward polishing apparatus is used for controlling the polishing amount of an indium phosphide wafer, the diameter of each through hole 51 is 1mm, the distance between adjacent through holes 51 is 10mm, the through holes 51 are arranged according to the size of the indium phosphide wafer 7, and the indium phosphide wafer 7 covers all the through holes 51 when attached to the ceramic disc. The through holes 51 are arranged so that part of the pressure applied to the indium phosphide wafer in the grinding process can be discharged from the through holes, and the uniformity in grinding is improved.

The trompil in 6 upper portions of vacuum hood, downthehole installation sealing washer 61, connecting pipe 62 has been inserted in the sealing washer 61, be equipped with governing valve 63 on the connecting pipe 62, connecting pipe 62 upper portion sets up evacuation pipe joint 64, 6 lower parts of vacuum hood are equipped with round sealing ring 65, be connected with evacuation pipe 31 on the vacuum pump 3, the evacuation pipe 31 other end can insert in evacuation pipe joint 64, evacuation pump 31 is through evacuation pipe 31 with the interior evacuation of vacuum hood 6 to the vacuum, close governing valve 63, make keep vacuum in the vacuum hood 6 and can extract evacuation pipe 31 from evacuation pipe joint 64.

The through hole 51 of the ceramic disc 5 is matched with the vacuum cover 6, so that the material can be quickly adsorbed and discharged, and the grinding speed is increased.

Fixture 4 includes brace table 41, holder, sets up the breach that holds ceramic dish 5 on the brace table 41, and the holder is used for fixing ceramic dish 5 on brace table 41 to carry out the paster and get the operation of piece. As a specific embodiment of the present invention, the clamping member includes a clamping piece 42 and an adjusting screw 43, the adjusting screw 43 is screwed on the supporting platform 41, a supporting base 44 is disposed outside the clamping piece 42, the adjusting screw 43 is rotatably connected to the supporting base 44, the clamping piece 42 is attached to the periphery of the ceramic disc 5, and the clamping piece 42 is moved by rotating the adjusting screw 43, so that the front and rear clamping pieces 42 clamp and fix the ceramic disc 5.

The positioning mechanism 2 comprises a positioning ring 21, a plurality of ceramic blocks 22 are arranged at the lower part of the positioning ring 21, and the ceramic blocks 22 are arranged at equal intervals.

The grinding mechanism 1 comprises a frame 11 and a liquid supply tank 12, a groove 13 is formed in the middle of the upper portion of the frame 11, a driving motor 14 is arranged inside the frame 11, the output end of the driving motor 14 is connected with a rotating shaft 15 in a driving mode, a grinding disc 16 is connected to the upper portion of the rotating shaft 15, a plurality of flow guide grooves are formed in the surface of the grinding disc 16, supporting columns 17 are connected to the positions, located on the left side and the right side of the groove 13, of the upper portion of the frame 11, supporting blocks 18 are arranged on the upper portion of the supporting columns 17, an arc-shaped plate 19 is connected to one side, far away from the supporting columns 17, of the supporting blocks 18, two adjusting holes 110 are formed in the arc-shaped plate 19, positioning wheels 111 are installed in the adjusting holes 110, the positioning mechanisms are clamped and rotated by the two positioning wheels 111, the positioning mechanisms and the ceramic discs, one side of liquid feed pump 112, which is far away from liquid suction pipe 113, is connected with two liquid feed pipes 114, the front end of liquid feed pipe 114 is connected with adjusting pipe 115, the junction of adjusting pipe 115 and liquid feed pipe 114 is provided with flow valve 116, liquid feed tank 12 upper portion is provided with agitator motor 117, agitator motor 117's output is connected with (mixing) shaft 118, the (mixing) shaft 118 periphery is equipped with a plurality of stirring leaves 119.

The bottom of the groove 13 is inclined upwards from outside to inside and can be used for collecting grinding fluid, a recovery pipe is connected between the bottom of the groove 13 and the fluid supply tank 12, a valve is arranged on the recovery pipe, the grinding fluid collected in the groove 13 returns to the fluid supply tank 12 through the recovery pipe, the collected grinding fluid is recycled, and waste of the grinding fluid is reduced.

The adjustment tube 115 is a universal bamboo joint tube with a spray head and can be fixed in different positions as required.

As another aspect of the present invention, there is provided a polishing method using the above polishing apparatus, the polishing method comprising:

placing the ceramic disc 5 at the notch of the support table 41, adjusting the clamping piece to clamp and fix the ceramic disc 5, smearing a layer of wax on the position of the ceramic disc 5 corresponding to the indium phosphide wafer 7, standing for 30-60 seconds after waxing, and then attaching the indium phosphide wafer 7 to the wax-coated position on the ceramic disc 5;

inserting the vacuumizing pipe 31 into a vacuumizing pipe joint 64, attaching the vacuum cover 6 to the back of the ceramic disc 5, starting the vacuum pump 3, vacuumizing the vacuum cover 6 to vacuum so as to adsorb the indium phosphide wafer 7 on the ceramic disc 5, closing the regulating valve 63, and pulling the vacuumizing pipe 31 out of the vacuumizing pipe joint 64;

the ceramic block 22 of the positioning mechanism 2 is placed on the grinding disc downwards, the position of the positioning wheel 111 is adjusted to be attached to the periphery of the positioning ring 21, the ceramic disc 5 is taken down from the clamping mechanism 4, and the surface attached with the indium phosphide wafer 7 is placed into the positioning mechanism 2 downwards;

the grinding mechanism 1 is started, the driving motor 14 drives the grinding disc 16 to rotate, the rotating speed of the grinding disc 16 is 10r/min, the stirring motor 117 drives the stirring blade 119 to rotate to stir the grinding fluid in the fluid supply tank 12, the fluid supply pump 112 provides the grinding fluid through the fluid supply pipe 114 and the adjusting pipe 115 after extracting the grinding fluid in the fluid supply tank 12, the flow of the grinding fluid is 25ml/min, and the grinding fluid is calcined alumina powder and pure water in a volume ratio of 1: 20, and the rotating grinding disc 16 is used for grinding the surface of the indium phosphide wafer 7 until the thickness of the indium phosphide wafer 7 is qualified;

closing the grinding mechanism 1, taking out the ceramic disc 5 from the positioning mechanism 2, fixing the side, on which the indium phosphide wafer 7 is adsorbed, of the ceramic disc 5 upwards by using the clamping mechanism 4, opening the regulating valve 63, then taking down the vacuum cover 6, and directly taking down the indium phosphide wafer 7 from the ceramic disc 5;

the ground indium phosphide wafer 7 was rinsed with pure water, spun-dried, and the ground surface was examined.

The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.