阅读说明：本技术 防撞击的软硬结合板及其制作方法 (Anti-collision soft-hard combined board and manufacturing method thereof ) 是由 朱光远 肖璐 纪成光 林宇超 于 2021-07-27 设计创作，主要内容包括：本发明涉及PCB技术领域,公开了一种防撞击的软硬结合板及其制作方法。软硬结合板,至少包括：依次叠板压合的软板、第一粘结片和第一硬板；软板包括软性区和软硬结合区；第一硬板和第一粘结片均在指定位置断开形成沿宽度方向分离的两部分,指定位置位于软性区的正投影区域内；第一粘结片与软性区通过隔离层分隔开,且在软性区呈弯折状态时隔离层能够与软性区分离。本发明实施例中,由于第一硬板在软性区的正投影区域内断开,并且在软性区的正投影区域内的硬板部分通过隔离层与软性区分离,因此软硬结合板不仅能实现单向弯折,而且硬板能够对软性区形成遮挡,避免软性区完全裸露于外,防止外部异物进入以撞击软性区,有效保证了良好性能。(The invention relates to the technical field of PCBs (printed circuit boards), and discloses an anti-collision rigid-flex board and a manufacturing method thereof. The rigid-flex board at least comprises: the soft board, the first bonding sheet and the first hard board are sequentially laminated and pressed; the soft board comprises a soft area and a soft and hard combination area; the first hard board and the first bonding sheet are both disconnected at designated positions to form two parts separated along the width direction, and the designated positions are located in the orthographic projection area of the soft area; the first bonding sheet is separated from the soft area through the isolation layer, and the isolation layer can be separated from the soft area when the soft area is in a bending state. In the embodiment of the invention, the first hard board is disconnected in the orthographic projection area of the soft area, and the hard board part in the orthographic projection area of the soft area is separated from the soft area through the isolating layer, so that the rigid-flexible combined board can realize unidirectional bending, the hard board can shield the soft area, the soft area is prevented from being completely exposed outside, external foreign matters are prevented from entering to impact the soft area, and good performance is effectively ensured.)

1. An impact-resistant rigid-flex board, comprising at least: the soft board, the first bonding sheet and the first hard board are sequentially laminated and pressed; the soft board comprises a soft area and a soft and hard combination area;

the first hard board and the first bonding sheet are both disconnected at a designated position to form two parts separated along the width direction, and the designated position is located in the orthographic projection area of the soft area;

the first bonding sheet and the flexible area are separated through an isolation layer, and the isolation layer can be separated from the flexible area when the flexible area is in a bending state.

2. The impact-resistant rigid-flex board according to claim 1, wherein the isolation layer is a single-sided tape, and the adhesive surface of the single-sided tape is attached to the first adhesive sheet.

3. The impact-resistant rigid-flexible printed circuit board as claimed in claim 1, wherein the isolation layer is a double-sided tape, the adhesive surface of the double-sided tape with a relatively high viscosity is attached to the first adhesive sheet, and the adhesive surface of the double-sided tape with a relatively low viscosity is attached to the flexible region when the flexible region is in the non-bent state and is separated from the flexible region when the flexible region is in the bent state.

4. The impact-resistant rigid-flex board according to claim 1, wherein the designated position is located right above an interface position of the flexible region and the rigid-flex region.

5. The impact-resistant rigid-flexible printed circuit board as claimed in claim 1, wherein a second adhesive sheet and a second rigid board are laminated in sequence between the first rigid board and the first adhesive sheet, and the second rigid board and the second adhesive sheet are separated at the designated position to form two parts.

6. The impact-resistant rigid-flex board according to claim 1, further comprising at least one windowed third hard board laminated to a side of the soft board facing away from the first hard board by a windowed third adhesive sheet; the windowing areas of the third hard board and the third bonding sheet are consistent with the positions of the soft area, and the size of the windowing area is consistent with that of the soft area.

7. A method for manufacturing the impact-resistant rigid-flex board according to any one of claims 1 to 6, wherein the manufacturing method comprises the following steps:

providing at least the soft board, the first bonding sheet, the first hard board and the isolation layer to be processed;

sequentially laminating and pressing the plates to enable the first hard plate, the first bonding sheet and the soft plate to be sequentially arranged, and the isolation layer is located between the first bonding sheet and the soft area of the soft plate;

processing the appointed positions of the first hard board, the first bonding sheet and the isolation layer, wherein the appointed positions are positioned in an orthographic projection area of the flexible area, so that the first hard board, the first bonding sheet and the isolation layer are all disconnected at the appointed positions to form two parts separated along the width direction.

8. The method for manufacturing the impact-resistant rigid-flex board as recited in claim 7, wherein the isolation layer is a single-sided tape; the in-order lamination pressfitting includes:

adhering the adhesive surface of the single-sided adhesive tape to the surface of the first adhesive sheet in advance;

removing an invalid area of the single-sided tape, and reserving an effective area of the single-sided tape, wherein the position of the effective area is the same as that of the flexible area, the effective area is smaller than the single side of the flexible area by a first value along the width direction, the effective area is larger than the single side of the flexible area by a second value along the length direction, and the second value is larger than the first value;

and sequentially laminating and pressing the first hard board, the first bonding sheet bonded with the single-sided adhesive tape and the soft board.

9. The method for manufacturing the impact-resistant rigid-flex board according to claim 7, wherein the isolation layer is a double-sided adhesive tape; the in-order lamination pressfitting includes:

adhering the adhesive surface with higher viscosity of the double-sided adhesive tape to the surface of the first adhesive sheet facing the soft board in advance; or, an adhesive surface of the double-sided adhesive tape with a low viscosity is bonded to the surface of the flexible board facing the first adhesive sheet in advance;

removing an invalid area of the double-sided tape, and reserving an effective area of the double-sided tape, wherein the position of the effective area is the same as that of the flexible area, the effective area is smaller than the flexible area by a first value along the width direction, the effective area is larger than the flexible area by a second value along the length direction, and the second value is larger than the first value;

and sequentially laminating and pressing the first hard board, the first bonding sheet and the soft board.

10. The method for manufacturing the impact-resistant rigid-flex board according to claim 7, wherein the processing at the designated positions of the first hard board, the first bonding sheet and the isolation layer comprises:

before laminating and pressing the laminated boards, pre-cutting the specified position by taking the board surface of the first hard board facing the soft area as a drilling surface, wherein the pre-cutting depth is smaller than the thickness of the first hard board;

after the laminated plate is pressed, taking the plate surface of the first hard plate, which is back to the soft area, as a drilling surface, and firstly performing mechanical depth control milling at the specified position, wherein the depth of the mechanical depth control milling is larger than the thickness of the first hard plate and smaller than the sum of the thickness of the first hard plate and the thickness of the first bonding sheet; and then carrying out laser control deep milling at the designated position until the soft region is exposed.

Technical Field

The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to an anti-collision rigid-flex Board and a manufacturing method thereof.

Background

The rigid-flex Board is formed by combining a Flexible Circuit Board and a rigid Circuit Board through processes such as pressing and the like, and the Circuit Board simultaneously has the characteristics of a Flexible Printed Circuit (FPC) and a Printed Circuit Board (PCB); the soft and hard combined plate has a certain rigid area and a certain flexible area, and the flexible area can be bent, so that the soft and hard combined plate has great advantages in the aspects of saving the internal space of a product, reducing the volume of a finished product, improving the performance of the product and the like.

However, the structure of the existing rigid-flex board is shown in fig. 1, and the manufacturing method thereof is generally: the method comprises the steps of firstly routing off the part, corresponding to the soft area 11 of the soft board 1, of the hard board, windowing the bonding sheet, then pressing the soft board 1, the bonding sheet and the hard board, and then manufacturing an outer-layer circuit on a semi-finished product obtained through pressing.

In the rigid-flexible printed circuit board with the structure, since the flexible region 11 of the flexible printed circuit board 1 is completely exposed to the external environment, the flexible region 11 may be damaged or even broken due to external impact when the product is assembled.

Disclosure of Invention

The invention aims to provide an anti-collision rigid-flex board and a manufacturing method thereof, and solves the problem that the prior art is easy to damage or even break due to collision caused by complete exposure.

In order to achieve the purpose, the invention adopts the following technical scheme:

an impact-resistant rigid-flex board comprising at least: the soft board, the first bonding sheet and the first hard board are sequentially laminated and pressed; the soft board comprises a soft area and a soft and hard combination area;

the first hard board and the first bonding sheet are both disconnected at a designated position to form two parts separated along the width direction, and the designated position is located in the orthographic projection area of the soft area;

the first bonding sheet and the flexible area are separated through an isolation layer, and the isolation layer can be separated from the flexible area when the flexible area is in a bending state.

Optionally, the isolation layer is a single-sided adhesive tape, and an adhesive surface of the single-sided adhesive tape is attached to the first bonding sheet.

Optionally, the isolation layer is double-sided tape, the great viscose of double-sided tape's viscosity with the laminating of first bonding sheet, the less viscose of double-sided tape's viscosity is in when the softness district is the non-bending state with the laminating of softness district, when the softness district is the bending state with the separation of softness district.

Optionally, the designated position is located right above a boundary position of the soft region and the soft-hard combining region.

Optionally, a second bonding sheet and a second hard board are sequentially laminated and pressed between the first hard board and the first bonding sheet, and the second hard board and the second bonding sheet are separated at the designated position to form two parts.

Optionally, the flexible printed circuit board further comprises at least one windowed third hard board, and the third hard board is laminated on the side of the flexible board, which faces away from the first hard board, through a windowed third bonding sheet; the windowing areas of the third hard board and the third bonding sheet are consistent with the positions of the soft area, and the size of the windowing area is consistent with that of the soft area.

A manufacturing method of the impact-resistant rigid-flexible printed circuit board comprises the following steps:

providing at least the soft board, the first bonding sheet, the first hard board and the isolation layer to be processed;

sequentially laminating and pressing the plates to enable the first hard plate, the first bonding sheet and the soft plate to be sequentially arranged, and the isolation layer is located between the first bonding sheet and the soft area of the soft plate;

processing the appointed positions of the first hard board, the first bonding sheet and the isolation layer, wherein the appointed positions are positioned in an orthographic projection area of the flexible area, so that the first hard board, the first bonding sheet and the isolation layer are all disconnected at the appointed positions to form two parts separated along the width direction.

Optionally, the isolation layer is a single-sided adhesive tape; the in-order lamination pressfitting includes:

adhering the adhesive surface of the single-sided adhesive tape to the surface of the first adhesive sheet in advance;

removing an invalid area of the single-sided tape, and reserving an effective area of the single-sided tape, wherein the position of the effective area is the same as that of the flexible area, the effective area is smaller than the single side of the flexible area by a first value along the width direction, the effective area is larger than the single side of the flexible area by a second value along the length direction, and the second value is larger than the first value;

and sequentially laminating and pressing the first hard board, the first bonding sheet bonded with the single-sided adhesive tape and the soft board.

Optionally, the isolation layer is a double-sided adhesive tape; the in-order lamination pressfitting includes:

adhering the adhesive surface with higher viscosity of the double-sided adhesive tape to the surface of the first adhesive sheet facing the soft board in advance; or, an adhesive surface of the double-sided adhesive tape with a low viscosity is bonded to the surface of the flexible board facing the first adhesive sheet in advance;

removing an invalid area of the double-sided tape, and reserving an effective area of the double-sided tape, wherein the position of the effective area is the same as that of the flexible area, the effective area is smaller than the flexible area by a first value along the width direction, the effective area is larger than the flexible area by a second value along the length direction, and the second value is larger than the first value;

and sequentially laminating and pressing the first hard board, the first bonding sheet and the soft board.

Optionally, the processing at the designated positions of the first hard board, the first bonding sheet and the isolation layer includes:

before laminating and pressing the laminated boards, pre-cutting the specified position by taking the board surface of the first hard board facing the soft area as a drilling surface, wherein the pre-cutting depth is smaller than the thickness of the first hard board;

after the laminated plate is pressed, taking the plate surface of the first hard plate, which is back to the soft area, as a drilling surface, and firstly performing mechanical depth control milling at the specified position, wherein the depth of the mechanical depth control milling is larger than the thickness of the first hard plate and smaller than the sum of the thickness of the first hard plate and the thickness of the first bonding sheet; and then carrying out laser control deep milling at the designated position until the soft region is exposed.

Compared with the prior art, the invention has the beneficial effects that:

in the embodiment of the invention, the first hard board is disconnected in the orthographic projection area of the soft area, and the hard board part in the orthographic projection area of the soft area is separated from the soft area through the isolating layer, so that the rigid-flexible printed circuit board of the embodiment can realize unidirectional bending from the soft board to the direction departing from the first hard board, and the hard board part on one side can shield the soft area, thereby avoiding the soft area from being completely exposed, preventing external foreign matters from entering to impact the soft area, and effectively ensuring the good performance of the rigid-flexible printed circuit board.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a side view of a conventional rigid-flex board.

Fig. 2 is a side view of a first rigid-flex board according to an embodiment of the present invention.

Fig. 3 is a side view of a second rigid-flex board according to an embodiment of the present invention.

Fig. 4 is a side view of a third rigid-flex board according to an embodiment of the invention.

Fig. 5 is a side view of a fourth rigid-flex board according to an embodiment of the invention.

Fig. 6 is a flowchart of a method for manufacturing a rigid-flex circuit board according to an embodiment of the present invention.

Fig. 7 is a schematic view of a manufacturing process of the rigid-flex board according to an embodiment of the present invention.

Fig. 8 is a flowchart of a lamination pressing method when the isolation layer is a single-sided tape according to an embodiment of the present invention.

Fig. 9 is a flowchart of a lamination pressing method when the isolation layer is a double-sided tape according to an embodiment of the present invention.

Fig. 10 is a schematic diagram illustrating a comparison between a flexible region and an isolation layer according to an embodiment of the invention.

Illustration of the drawings:

the flexible printed circuit board comprises a flexible printed circuit board 1, a first hard printed circuit board 2, a first bonding sheet 3, a designated position 4, an isolation layer 5, a second hard printed circuit board 6, a second bonding sheet 7, a third hard printed circuit board 8, a third bonding sheet 9, a flexible area 11 and a flexible and rigid combination area 12.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to solve the problem that the soft region 11 of the conventional rigid-flex board is easily subjected to external impact due to complete exposure, the embodiment of the invention provides the impact-resistant rigid-flex board, wherein part of the soft region 11 can be shielded by the first hard board 2, so that the risk that the soft region 11 is subjected to external impact in the assembling and applying process is reduced.

Example one

Referring to fig. 2 and 3, the rigid-flex board according to the embodiment of the present invention includes: the soft board 1, the first bonding sheet 3 and the first hard board 2 are sequentially laminated and pressed.

The soft board 1 comprises a soft area 11 and a soft and hard combining area 12, the soft and hard combining area 12 is an area where the soft board 1 is bonded with other core boards through the first bonding sheet 3, and the soft and hard combining area 12 has certain rigidity due to bonding with the hard board and cannot be bent; the flexible region 11 is a region which is not bonded to another core board, remains flexible, and can be bent. In this embodiment, the soft region 11 is located in the middle region of the soft board 1.

The first hard sheet 2 and the first adhesive sheet 3 are each broken at a prescribed position 4 to form two parts separated in the width direction, the prescribed position 4 being located within the orthographic projection area of the flexible region 11. Meanwhile, the first bonding sheet 3 is separated from the flexible region 11 by the isolation layer 5, and the isolation layer 5 can be separated from the flexible region 11 when the flexible region 11 is in a bent state.

It should be noted that the width direction and the length direction of the present embodiment are located in the same plane perpendicular to the lamination direction, and the width direction and the length direction are perpendicular to each other. Wherein, the width direction refers to: in the structure shown in fig. 2, the soft region 11 is used as a boundary, and the soft-hard combining region 12 on one side points to the soft-hard combining region 12 on the other side; therefore, the width of the soft region 11 in the width direction determines the bending radius.

In this embodiment, the designated position 4 where the separation occurs is not particularly limited, and may be located at a boundary position of the orthographic projection area, where the boundary position is a boundary position of the soft area 11 and the soft and hard combining area 12, as shown in fig. 2, at this time, a part of the first hard board 2 covers directly above the soft area 11; the designated location 4 where the separation occurs may also be located in the middle of the orthographic projection area, as shown in fig. 3, where the two parts of the first rigid plate 2 separated from each other are overlaid directly above the flexible zone 11.

Because one part or two parts of the first hard board 2 cover right above the soft area 11, and the first bonding sheet 3 bonded on the inner layer of the first hard board 2 can be separated from the soft area 11 through the isolation layer 5 when the soft area 11 is in a bending state, and the soft area 11 can not be limited by the first hard board 2 when being bent in a direction departing from the first hard board 2, the soft and hard combination area 12 not only can realize normal unidirectional bending in the soft area 11, but also can cover a part of hard board right above the soft area 11, so that the soft area 11 is prevented from being completely exposed outside, external foreign matters can be effectively prevented from entering from one side where the first hard board 2 is located to impact the soft area 11, and the good performance of the soft and hard combination board is effectively ensured. Meanwhile, the isolation layer 5 separating the first bonding sheet 3 from the flexible area 11 can effectively reduce the pollution of resin on the bonding sheet to the flexible area 11, and ensure the product quality.

The isolation layer 5 may be any film layer that can be separated from the flexible region 11, in a possible embodiment, the isolation layer 5 may be a single-sided tape, an adhesive surface of the single-sided tape is attached to the first adhesive sheet 3, and a non-adhesive surface of the single-sided tape faces the flexible region 11, because the single-sided tape is not attached to the flexible region 11, when the flexible region 11 is bent, the single-sided tape can be kept attached to the first adhesive sheet 3 and separated from the flexible region 11, and the bending of the flexible region 11 is not limited.

In another possible embodiment, the isolation layer 5 may be a double-sided tape, the two sides of which have different viscosities, and the adhesive surface of the double-sided tape with the higher viscosity is attached to the first adhesive sheet 3, and the adhesive surface of the double-sided tape with the lower viscosity is attached to the flexible region 11. When the flexible region 11 is bent in a direction away from the first hard plate 2, acting force in the same direction as the bending direction is generated on the double-sided adhesive tape; meanwhile, the hard plate part above the soft region 11 keeps a flat state due to strong rigidity, and generates the same acting force opposite to the bending direction on the double-sided adhesive tape; when the double-sided tape is subjected to the same magnitude of forces and opposite directions, the double-sided tape is separated from the soft region 11 on the side with the lower viscosity due to the difference in viscosity between the two surfaces of the double-sided tape, and the degree of bending of the soft region 11 is not affected.

In the rigid-flex board shown in fig. 2 and 3, only the first rigid board 2 and the flexible board 1 are shown, but in practical application, the second adhesive sheet 7 and the second rigid board 6 can also be laminated and laminated alternately between the first rigid board 2 and the flexible board 1, and the second rigid board 6 and the second adhesive sheet 7 are separated at the designated position 4 to form two parts, as shown in fig. 4. At this time, the first hard board 2 and the second hard board 6 are both partially located right above the soft region 11, and they are combined with each other to realize a better anti-collision function.

In addition, as shown in fig. 5, the rigid-flex board of this embodiment may further include at least one windowed third hard board 8, where the third hard board 8 is pressed on a side of the flexible board 1 away from the first hard board 2 by a windowed third bonding sheet 9. In order to ensure that the rigid-flexible combined board can realize unidirectional bending in the flexible area 11, the third rigid board 8 and the third bonding sheet 9 need to be windowed, the position of the windowing area is consistent with that of the flexible area 11, and the size of the windowing area is consistent with that of the flexible area 11. In the figure 5, the soft board 1 is located in the inner layer, and one side of the soft area 11 of the soft board 1 is shielded and protected by the local hard board, and the other side is completely exposed, so that the unidirectional bending can be ensured, and the single-side anti-collision protection can be realized.

In order to obtain the rigid-flex board, an embodiment of the present invention further provides a method for manufacturing a rigid-flex board, as shown in fig. 6 and 7, including the steps of:

step 101, providing a soft board 1, a first bonding sheet 3, a first hard board 2 and an isolation layer 5, wherein the soft board 1 comprises a soft area 11 and a soft and hard combination area 12.

And 102, sequentially laminating and pressing the plates to enable the first hard plate 2, the first bonding sheet 3 and the soft plate 1 to be sequentially arranged, and the isolation layer 5 to be positioned between the first bonding sheet 3 and the soft area 11 of the soft plate 1.

Step 103, processing the designated positions 4 of the first hard board 2, the first adhesive sheet 3 and the isolation layer 5, wherein the designated positions 4 are located in the orthographic projection area of the flexible area 11, so that the first hard board 2, the first adhesive sheet 3 and the isolation layer 5 form two separated parts at the designated positions 4.

In one possible embodiment, the isolation layer 5 is a single-sided tape, as shown in fig. 8, and the method of laminating the stacked sheets in sequence in step 102 is as follows:

step 201, adhering the adhesive surface of the single-sided tape to the surface of the first adhesive sheet 3 in advance.

In this step, a single-sided tape having a size equal to that of the first adhesive sheet 3 may be obtained by cutting, and the single-sided tape is attached to the surface of the first adhesive sheet 3, and the first adhesive sheet 3 is used as a carrier, which not only facilitates the graphic fabrication of the single-sided tape, but also facilitates the subsequent lamination and lamination operation.

Step 202, removing the invalid region of the single-sided tape, and keeping the valid region of the single-sided tape, where the position of the valid region is the same as the position of the flexible region 11, and the valid region is smaller than the single side of the flexible region 11 by a first value along the width direction, and larger than the single side of the flexible region 11 by a second value along the length direction, and the second value is larger than the first value.

To prevent the single-sided tape from entering the unit and to control the opening of the lid after milling, exemplary dimensions of the effective area of the single-sided tape are as follows, as shown in fig. 10: the width L1 of the single-sided tape is L +1.8 × 2mm, and the length D1 of the single-sided tape is D-0.2 × 2mm, where L is the width of the flexible region 11 and D is the length of the flexible region 11.

Specifically, the single-sided adhesive tape can be cut off along the boundary line between the effective area and the ineffective area by laser cutting, and then the ineffective area of the single-sided adhesive tape is torn off.

And 203, sequentially laminating and pressing the first hard board 2, the first bonding sheet 3 bonded with the single-sided adhesive tape and the soft board 1.

In another possible embodiment, the isolation layer 5 is a double-sided tape, as shown in fig. 9, and the method of laminating the boards in sequence in step 102 is as follows:

step 301, adhering an adhesive surface with high viscosity of the double-sided adhesive tape to the surface of the first adhesive sheet 3 facing the flexible printed circuit board 1 in advance; or, an adhesive surface of the double-sided adhesive tape having a low viscosity is previously bonded to the surface of the flexible board 1 facing the first adhesive sheet 3;

step 302, removing the invalid region of the single-sided tape, and retaining the valid region of the single-sided tape, where the position of the valid region is the same as the position of the flexible region 11, and the valid region is smaller than the single side of the flexible region 11 by a first value along the width direction, and larger than the single side of the flexible region 11 by a second value along the length direction, and the second value is larger than the first value.

Step 303, laminating and pressing the first hard board 2, the first bonding sheet 3 and the soft board 1 in sequence.

Of course, in other embodiments, other carriers may be used to carry the isolation layer 5 and process the isolation layer 5 to form a pattern matching with the soft region 11, and during lamination, the isolation layer 5 is transferred between the first bonding sheet 3 and the soft region 11 of the flexible board 1, and then pressed.

In order to improve the depth control accuracy, the step 103 of processing the designated positions 4 of the first hard sheet 2, the first adhesive sheet 3 and the isolation layer 5 may include:

before laminating and pressing, pre-cutting is carried out at a specified position 4 by taking the surface of the first hard board 2 facing the soft area 11 as a drilling surface, wherein the pre-cutting depth is smaller than the thickness of the first hard board 2; by adopting the pre-cutting mode, on one hand, the precision of depth control milling can be improved, on the other hand, the subsequent depth control uncapping operation is facilitated, and the burr flash and other problems are reduced. If not precut, the burrs can affect the appearance and even scratch the soft zones 11 that are laminated to the inner layer of the first rigid sheet 2.

After laminating and pressing, taking the plate surface of the first hard plate 2, which faces away from the soft region 11, as a drilling surface, and performing mechanical depth control milling at a specified position 4, wherein the depth of the mechanical depth control milling is larger than the thickness of the first hard plate 2 and smaller than the sum of the thickness of the first hard plate 2 and the thickness of the first bonding sheet 3, and reserving the first bonding sheet 3 with smaller thickness; and carrying out laser control deep milling at the designated position 4 until the soft region 11 is exposed. The step combines the mechanical depth control milling and the laser depth control milling, not only utilizes the advantage of large processing depth of the mechanical depth control milling, but also utilizes the advantage of high processing precision of the laser depth control milling, and finally realizes the effects of large processing depth and high depth control precision.

In the above flow, the method of performing the lamination pressing operation first and then processing the designated location 4 is adopted, and in other embodiments, the method of performing the lamination pressing operation after processing the designated location 4 of the first hard board 2, the first adhesive sheet 3, and the like, respectively, may also be adopted, so as to achieve the object of the present invention.

When a second hard board 6 and a second bonding sheet 7 are further included between the first hard board 2 and the soft board 1 of the rigid-flexible printed circuit board, in the sequential lamination and pressing process of step 102, the second bonding sheets 7 and the second hard board 6 are sequentially and alternately stacked between the first hard board 2 and the soft board 1 for pressing; and in step 103, the designated positions 4 of the second hard sheet 6 and the second adhesive sheet 7 are simultaneously processed so that the second hard sheet 6 and the second adhesive sheet 7 are each formed into two separate parts at the designated positions 4. In this way, the second rigid board 6 can be bonded with the first rigid board 2 to combine with the shielding protection of the flexible region 11.

When the rigid-flex board further comprises a third rigid board 8 and a third bonding sheet 9, a manufacturing mode of firstly opening a window and then pressing can be adopted, and the method specifically comprises the following steps: before laminating, windowing the third hard board 8 and the third bonding sheet 9 respectively, wherein the windowing region is consistent with the soft region 11 in position, and the windowing region is consistent with the soft region 11 in size; in the sequential lamination pressing process of step 102, the windowed third bonding sheets 9 and the second hard boards 6 are sequentially and alternately laminated on the side of the soft board 1 away from the first hard board 2 for pressing.

Or, when the rigid-flex board still includes third hard board 8 and third bonding sheet 9, adopt the preparation mode of pressfitting earlier uncapping again, specifically include: before laminating and pressing, an isolation layer 5 is attached to the surface of the soft board 1 area, which is far away from the first hard board 2; in step 102, the third bonding sheets 9 and the third hard boards 8 are laminated alternately on the surface of the soft board 1 facing away from the first hard board 2; after pressing, the third hard board 8 and the third bonding sheet 9 are subjected to windowing, the windowing area and the size are consistent with those of the soft area 11, and then the isolation layer 5 is removed.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.