阅读说明：本技术 一种已固化环氧树脂玻璃纤维废渣粉尘井盖及其制备方法 (Cured epoxy resin glass fiber waste residue and dust manhole cover and preparation method thereof ) 是由 徐立三 王金木 于 2019-08-09 设计创作，主要内容包括：本发明公开了一种已固化环氧树脂玻璃纤维废渣粉尘井盖及其制备方法,井盖包括钢筋网,钢筋网的下部固定连接有底板,钢筋网的上部固定连接有上板,上板与底板相互穿过钢筋网的孔洞固定相连；所述上板与底板采用已固化环氧树脂玻璃纤维废渣粉尘混合粘合剂制成。采用已固化环氧树脂玻璃纤维废渣粉尘混合粘合剂制做井盖,不但解决了电子垃圾基板的回收处理,还降低了井盖的生产成本,便于降低城市下水道建设成本,且降低了井盖的质量,提高了井盖的运输性能。(The invention discloses a cured epoxy resin glass fiber waste residue dust well lid and a preparation method thereof, wherein the well lid comprises a steel bar mesh, the lower part of the steel bar mesh is fixedly connected with a bottom plate, the upper part of the steel bar mesh is fixedly connected with an upper plate, and the upper plate and the bottom plate are mutually and fixedly connected through holes of the steel bar mesh; the upper plate and the bottom plate are made of a cured epoxy resin glass fiber waste residue and dust mixed adhesive. The well lid is made of the cured epoxy resin, the glass fiber, the waste residue and the dust mixed adhesive, so that the recovery treatment of the electronic garbage substrate is solved, the production cost of the well lid is reduced, the construction cost of urban sewers is reduced conveniently, the quality of the well lid is reduced, and the transportation performance of the well lid is improved.)

1. The utility model provides a solidification epoxy glass fiber waste residue dust well lid which characterized in that: the well lid (1) comprises a reinforcing mesh (2), the lower part of the reinforcing mesh (2) is fixedly connected with a bottom plate (3), the upper part of the reinforcing mesh (2) is fixedly connected with an upper plate (6), and the upper plate (6) and the bottom plate (3) are fixedly connected with each other by penetrating through holes of the reinforcing mesh (2); the upper plate (6) and the bottom plate (3) are made of a cured epoxy resin glass fiber waste residue and dust mixed adhesive.

2. The cured epoxy resin fiberglass waste residue dust manhole cover of claim 1, wherein: the upper surface of upper plate (6) sets up concavo-convex non-slip raised (5), non-slip raised (5) comprise vertically and horizontally staggered's protruding rectangular.

3. The cured epoxy resin fiberglass waste residue dust manhole cover of claim 2, wherein: a plurality of through holes (4) are formed in the well lid (1), and the through holes (4) are used for discharging rainwater or are used for installation and movement.

4. The cured epoxy resin fiberglass waste residue dust manhole cover of claim 3, wherein: well lid (1) upper surface is provided with the hydrophobic layer, and the hydrophobic layer can improve the self-cleaning ability of well lid, improves its life.

5. The cured epoxy resin fiberglass slag dust manhole cover of any one of claims 1-4, wherein: the cured epoxy resin glass fiber waste residue dust is formed by crushing waste circuit boards.

6. The method for preparing the cured epoxy resin glass fiber waste residue dust well lid as claimed in claim 5, wherein the method comprises the following steps:

1. crushing a circuit board substrate and leftover materials into powder to form cured epoxy resin glass fiber waste residue dust;

2. putting the cured epoxy resin glass fiber waste residue dust into a stirrer, adding a high molecular adhesive, and uniformly stirring to form a mixture of the cured epoxy resin glass fiber waste residue dust and the high molecular adhesive;

3. adding a mixture of the cured epoxy resin glass fiber waste residue dust and the polymer adhesive into a dryer for drying;

4. putting the reinforcing mesh (2) into a mold for manufacturing the well lid (1), and pouring the reinforcing mesh generated in the step (2) into the mold;

5. and (4) carrying out hot pressing on the mould, then demoulding, cooling and forming.

7. The method for preparing the cured epoxy resin glass fiber waste residue dust well lid as claimed in claim 6, wherein the method comprises the following steps: in the step 2, the mixing ratio of the cured epoxy resin glass fiber waste residue dust to the polymer adhesive is 3: 1.

8. The method for preparing the cured epoxy resin glass fiber waste residue dust well lid as claimed in claim 6, wherein the method comprises the following steps: in the step 3, the drying temperature of the cured epoxy resin glass fiber waste residue dust and the polymer adhesive is 80-90 ℃.

9. The method for preparing the cured epoxy resin glass fiber waste residue dust well lid as claimed in claim 6, wherein the method comprises the following steps: in the step 5, the mould is hot-pressed for 15 minutes, and the pressure is 4410 MPa; then heating the die to 160-250 ℃, wherein the heating speed is higher than 5 ℃/min, then raising the pressure to 1260MPa, and keeping for 20 minutes; then demoulding is carried out; and cooling with wind for 25 minutes to form.

10. The method for preparing the cured epoxy resin glass fiber waste residue dust well lid according to any one of claims 6 to 9, wherein the method for preparing the polymer adhesive in the step 2 comprises the following steps:

1. adding phenol, caustic soda, polyvinyl alcohol, a flame retardant, a fire retardant and a stabilizer into a reaction kettle;

2. heating the reaction kettle, and carrying out polymerization reaction on phenol, caustic soda, polyvinyl alcohol, a flame retardant, a fire retardant and a stabilizer to form the high-molecular adhesive.

Technical Field

The invention relates to a well cover, in particular to a cured epoxy resin glass fiber waste residue dust well cover and a preparation method thereof.

Background

Along with the continuous development of electronic technology, the speed of upgrading of circuit boards is accelerated, and electronic waste is increasing gradually, and electronic waste discarded object is various, roughly can divide into two types: one type is waste electronic products which contain simpler materials and have less harm to the environment, such as household appliances like refrigerators, washing machines, air conditioners and the like, medical and scientific research appliances and the like, and the disassembly and treatment of the products are relatively simple; the other is waste electronic products which contain more complex materials and have larger harm to the environment, such as lead in computer and television display tubes, arsenic, mercury and other harmful substances contained in computer elements, arsenic, cadmium, lead and other various toxic substances with persistent reduction and bioaccumulation in raw materials of mobile phones, and the like.

The substrate of the circuit board is formed by curing glass fiber and resin, has high strength, is not easy to degrade and decompose, and has the problems of troublesome disposal and high garbage disposal cost.

Disclosure of Invention

The invention aims to: aiming at the existing problems, the cured epoxy resin glass fiber waste residue dust well lid and the preparation method thereof are provided, the problem of electronic waste substrate treatment is solved, the problem of high well lid production cost is solved, and the problem of heavy well lid is solved.

The technical scheme adopted by the invention is as follows:

a well lid of solidified epoxy resin glass fiber waste residue dust comprises a steel bar mesh, wherein the lower part of the steel bar mesh is fixedly connected with a bottom plate, the upper part of the steel bar mesh is fixedly connected with an upper plate, and the upper plate and the bottom plate are fixedly connected through holes of the steel bar mesh; the upper plate and the bottom plate are made of a cured epoxy resin glass fiber waste residue and dust mixed adhesive.

The well lid is made of the cured epoxy resin, the glass fiber, the waste residue and the dust mixed adhesive, so that the recovery treatment of the electronic garbage substrate is solved, the production cost of the well lid is reduced, the construction cost of urban sewers is reduced conveniently, the quality of the well lid is reduced, and the transportation performance of the well lid is improved.

Furthermore, the upper surface of upper plate sets up the concavo-convex non-slip raised, the non-slip raised comprises vertically and horizontally staggered protruding rectangular. The friction of the well lid can be improved, and the well lid is prevented from slipping when a pedestrian or a bicycle rides the well lid.

Furthermore, a plurality of through holes are formed in the well cover and used for draining rainwater or being installed and moved. The through holes are arranged, so that rainwater can be conveniently discharged, and meanwhile, the through holes are arranged, so that the well cover can be conveniently installed and moved.

Further, the well lid upper surface is provided with the hydrophobic layer, and the hydrophobic layer can improve the self-cleaning ability of well lid, improves its life.

Furthermore, the cured epoxy resin glass fiber waste residue dust is formed by crushing waste circuit boards.

A preparation method of a cured epoxy resin glass fiber waste residue dust well lid comprises the following steps:

1. crushing a circuit board substrate and leftover materials into powder to form cured epoxy resin glass fiber waste residue dust;

2. putting the cured epoxy resin glass fiber waste residue dust into a stirrer, adding a high molecular adhesive, and uniformly stirring to form a mixture of the cured epoxy resin glass fiber waste residue dust and the high molecular adhesive;

3. adding a mixture of the cured epoxy resin glass fiber waste residue dust and the polymer adhesive into a dryer for drying;

4. putting the reinforcing mesh into a mold for manufacturing the well lid, and pouring the reinforcing mesh generated in the step 2 into the mold;

5. and (4) carrying out hot pressing on the mould, then demoulding, cooling and forming.

Preferably, in the step 2, the mixing ratio of the cured epoxy resin glass fiber waste dust to the polymer binder is 3: 1.

Preferably, in the step 3, the drying temperature of the cured epoxy resin glass fiber waste dust and the polymer binder is 80 ℃ to 90 ℃.

Preferably, in the step 5, the mold is hot-pressed for 15 minutes at a pressure of 4410 MPa; then heating the die to 160-250 ℃, wherein the heating speed is higher than 5 ℃/min, then raising the pressure to 1260MPa, and keeping for 20 minutes; then demoulding is carried out; and cooling with wind for 25 minutes to form.

The waste slag dust of the cured epoxy resin glass fiber, namely the waste slag dust of the leftover materials of the electronic circuit board, needs to be crushed into a dust shape.

Preferably, the method for preparing the polymer adhesive in step 2 comprises the following steps:

1. adding phenol, caustic soda, polyvinyl alcohol, a flame retardant, a fire retardant and a stabilizer into a reaction kettle;

2. heating the reaction kettle, and carrying out polymerization reaction on phenol, caustic soda, polyvinyl alcohol, a flame retardant, a fire retardant and a stabilizer to form the high-molecular adhesive.

In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:

1. the well lid is manufactured by adopting the waste circuit board substrate and the leftover materials, so that the problem of electronic waste substrate treatment is solved, the electronic waste can be recycled, and the waste circuit board is prevented from polluting the environment;

2. the well lid is manufactured by adopting the waste circuit board substrate and the leftover materials, so that the production cost of the well lid is reduced, and the quality of the well lid is reduced;

3. by integrating the advantages of the cured epoxy resin glass fiber waste residue dust, the reticular reinforcing mesh and the polymer adhesive refined by the reaction kettle, the composite material has the advantages of high strength, wear resistance, acid resistance, alkali resistance, water resistance, long service life, high flame retardance and strong comprehensive mechanical property,

mainly reduces the waste generated in the production process and has strong environmental protection.

Drawings

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a schematic cross-sectional structure of the present invention.

FIG. 3 is a flow chart of a preparation method of the present invention.

Wherein: 1 is the well lid, 2 is the reinforcing bar net, 3 is the bottom plate, 4 is the through-hole, 5 is the non-skid stud, 6 is the upper plate.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings.

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.