阅读说明：本技术 用于纳米尺寸材料的配体 (Ligands for nanosized materials ) 是由 I·利伯曼 M·汉布格尔 C·马图舍克 T·埃贝勒 B·布克哈特 S·迈尔 于 2020-03-02 设计创作，主要内容包括：本发明涉及一种适用于结合到半导体纳米颗粒表面的配体的化合物,所述化合物包括锚定基团、连接基团和有机官能团；半导体纳米颗粒具有连接到最外部颗粒表面的所述配体；组合物、制剂和用于制备所述半导体纳米颗粒的方法；以及电子器件。(The present invention relates to a compound suitable for binding to a ligand on the surface of a semiconductor nanoparticle, said compound comprising an anchoring group, a linking group and an organic functional group; the semiconductor nanoparticles having the ligands attached to the outermost particle surface; compositions, formulations, and methods for making the semiconductor nanoparticles; and an electronic device.)