阅读说明：本技术 适用不同尺寸功率元件的功率转换器 (It is applicable in the power converter of different size power components ) 是由 施奕安 于 2018-05-17 设计创作，主要内容包括：一种适用不同尺寸功率元件的功率转换器,包括一基座、一散热器、一电路板以及一功率元件。基座具有一隔板以及一开口,隔板具有一第一阶梯面及一第二阶梯面,其中第一阶梯面及第二阶梯面位于不同的水平高度。散热器组装于基座上,并抵靠于隔板的第一阶梯面及第二阶梯面中的其中之一。电路板组装于基座上。功率元件设置于电路板上,并通过开口与散热器接触。(A kind of power converter being applicable in different size power components, including a pedestal, a radiator, a circuit board and a power component.Pedestal has a partition and an opening, and partition has one first cascaded surface and one second cascaded surface, wherein the first cascaded surface and the second cascaded surface are located at different level heights.Assembling radiator one of is resisted against in the first cascaded surface and the second cascaded surface of partition on pedestal.Circuit board is assembled on pedestal.Power component is set on circuit board, and is contacted by being open with radiator.)

1. a kind of power converter for being applicable in different size power components characterized by comprising

There is a partition and an opening, the partition to have one first cascaded surface and one second cascaded surface for one pedestal, the pedestal, In first cascaded surface and second cascaded surface be located at different level heights；

One radiator is assembled on the pedestal, and be resisted against in first cascaded surface and second cascaded surface of the partition its One of；

One circuit board is assembled on the pedestal；And

One power component is set on the circuit board, and is contacted by the opening with the radiator.

2. power converter according to claim 1, which is characterized in that the radiator according to the size of the power component and Determine first cascaded surface or second cascaded surface for being resisted against the partition.

3. power converter according to claim 1, which is characterized in that when the power component has a first size, The radiator is resisted against first cascaded surface of the partition, when the power component have second size when, the radiator against In second cascaded surface of the partition, wherein the first size is different from second size.

4. power converter according to claim 1, which is characterized in that the size of the power component includes a first thickness Or a second thickness, the first thickness are different from the second thickness, wherein first cascaded surface has one relative to the circuit board First height, first height correspond to the first thickness, and wherein second cascaded surface has one second relative to the circuit board Highly, which corresponds to the second thickness, which is different from second height.

5. power converter according to claim 1, which is characterized in that first cascaded surface has relative to the circuit board One first height, second cascaded surface have one second height relative to the circuit board, wherein first height be different from this Two height.

6. power converter according to claim 1, which is characterized in that multiple fixing elements are further included, for dissipating this Hot device is fixed on the partition.

7. power converter according to claim 1, which is characterized in that when the power component has a first size, The circuit board is assembled on a fixed position of the pedestal, when the power component has second size, circuit board assembling In on the fixation position of the pedestal, wherein the first size is different from second size.

8. power converter according to claim 1, which is characterized in that the partition further includes multiple protecting walls, and surrounding should Around opening, and in the gap between the circuit board and the partition.

Technical field

The present invention relates to a kind of power converters, and in particular to a kind of power conversion for being applicable in different size power components Device.

Background technique

Various power converters are widely used for various electronic products, such as power supply unit, computer, UPS are not powered off System, exchange turn DC frequency-changing device etc., and power converter provides stable constant voltage or constant current, and major function is will to input The power supply pattern at end is converted into power supply pattern required for the load of output end.General power converter includes power component (example Such as power transistor, power diode) and radiator (such as radiator and fan etc.).It is various due to having in the market The power component of different sizes or output power, meanwhile, in order to cooperate the power component of different sizes or output power, also correspond to Have the radiator and fan of different sizes or radiating efficiency, to avoid cause power converter overheat and stop actuation, failure or It damages.

In power converter, be by power component and assembling radiator on the base, and the structure design of pedestal only may be used Power component and its corresponding radiator suitable for a specific dimensions.In other words, in order to power component and radiator are consolidated It is scheduled in pedestal, once the corresponding pedestal knot of the size design will be directed to after the size of decision power component and radiator Structure and its mold.To change the size of power component and radiator, it is bound to develop new mold to produce new pedestal, because And die cost is caused to increase.

Summary of the invention

The purpose of the present invention is to provide a kind of power converters for being applicable in different size power components, to reach pedestal The purpose for sharing and reducing number of molds.

According to an aspect of the invention, it is proposed that a kind of power converter for being applicable in different size power components, including a base Seat, a radiator, a circuit board and a power component.There is pedestal a partition and an opening, partition to have one first rank Tread and one second cascaded surface, wherein the first cascaded surface and the second cascaded surface are located at different level heights.Assembling radiator in One of on pedestal, and be resisted against in the first cascaded surface and the second cascaded surface of partition.Circuit board is assembled on pedestal.Function Rate element is set on circuit board, and is contacted by being open with radiator.

Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.

Detailed description of the invention

Figure 1A and Figure 1B is painted the power conversion for being applicable in different size power components according to one embodiment of the invention respectively The decomposition diagram that device is watched from depression angle and upward view angle；

Fig. 1 C is painted pedestal along the schematic cross-sectional view of line C-C；

Fig. 2A is painted the schematic diagram that first size power component is assembled in pedestal；

Fig. 2 B is painted schematic diagram of the first size assembling radiator in pedestal；

Fig. 2 C is painted the first size assembling radiator in Fig. 2 B after pedestal along the schematic cross-sectional view of line A-A；

Fig. 2 D is painted Fig. 2 B along the schematic cross-sectional view of line C-C；

Fig. 3 A is painted the schematic diagram that the second size power component is assembled in pedestal；

Fig. 3 B is painted the schematic diagram that the second sized heat sink is assembled in pedestal；

The second sized heat sink that Fig. 3 C is painted in Fig. 2 B is assembled in the schematic cross-sectional view after pedestal along line B-B；

Fig. 3 D is painted Fig. 3 B along the schematic cross-sectional view of line C-C；

The second sized heat sink that Fig. 4 is painted in Fig. 3 B is assembled in the schematic cross-sectional view after pedestal along line D-D.

Wherein, appended drawing reference

100: power converter

110: upper cover

120: circuit board

130: first size power component

130 ': the second size power component

131: lower surface

140: pedestal

141: partition

142: bottom plate

143: cascaded surface

1431: the first cascaded surfaces

1432: the second cascaded surfaces

144: opening

146: active heat removal element

148: protecting wall

150,150 ': radiator

151: upper surface

152: the first fixing elements

153: the second fixing elements

154: safety buffer zone

H1: the first height

H2: the second height

T1: first thickness

T2: second thickness

Specific embodiment

Embodiment set forth below is described in detail, and embodiment as example only to illustrate, not to limit this hair The bright range to be protected.It is to indicate that identical/similar element explains with identical/similar symbol below.

Figure 1A and Figure 1B is please referred to, according to the power converter 100 of one embodiment of the invention, for example including a upper cover 110, a circuit board 120, a power component 130, a pedestal 140, a bottom plate 142 and a radiator 150.Wherein, power member Part 130 is set on circuit board 120.Upper cover 110, circuit board 120, bottom plate 142 and radiator 150 are respectively assembled in pedestal 140 On.In addition, it is only an example that upper cover 110 and circuit board 120, which are covered on pedestal 140, it is not intended to limit the invention.

In embodiments of the present invention, pedestal 140 has a partition 141, and partition 141 has an opening 144 and multiple ranks Tread 143.Wherein radiator 150 is resisted against one of cascaded surface in multiple cascaded surfaces 143 of partition 141, and power member Part 130 is contacted by opening 144 with radiator 150.In addition, in embodiments of the present invention, no matter the size of power component 130 is What, circuit board 120 is all on the fixed position for being assembled in pedestal 140.

Figure 1A and Fig. 1 C is please referred to, by taking two cascaded surfaces as an example, partition 141 has the first cascaded surface 1431 and second-order Tread 1432, wherein the first cascaded surface and the second cascaded surface are located at different level heights.Radiator 150 is according to power component Size and determine the first cascaded surface 1431 for being resisted against partition 141 or the second cascaded surface 1432.

A and Fig. 2 B referring to figure 2. is 150 groups of first size power component 130 and its corresponding first size radiator The schematic diagram of the pedestal 140 of power converter 100 loaded on the embodiment of the present invention.When power component 130 has a first size When, radiator 150 is resisted against the first cascaded surface 1431 of partition 141, as shown by the dotted lines in fig. 2.D referring to figure 2. is Fig. 2 B along line C-C schematic cross-sectional view.When power component 130 has first size, radiator 150 is resisted against partition 141 The first cascaded surface 1431.

C referring to figure 2. is assembled in cuing open along line A-A after pedestal 140 for the first size radiator 150 in Fig. 2 B Depending on schematic diagram.Radiator 150 is arranged between partition 141 and bottom plate 142, and the upper surface 151 of radiator 150 can be by multiple First fixing element 152 (such as screw) is fixed on the first cascaded surface 1431 of partition 141, so that radiator 150 is fixed on base On seat 140, and the upper surface 151 of radiator 150 is resisted against the first cascaded surface 1431 of partition 141.

In one embodiment, the upper surface 151 of radiator 150 can be by heat-conducting glue and first size power component 130 Lower surface 131 directly contacts, to absorb the waste heat of the generation of first size power component 130.First size power component 130 passes through Opening 144 is directly attached on radiator 150, and heat transfer can be made to have best and shortest effective heat dissipation path.In addition, bottom plate 142 can contact with 150 bottom of radiator, to increase heat dissipation area.Radiator 150 is, for example, radiating fin, in order to increase heat dissipation Efficiency, more settable active heat removal element 146 (B referring to fig. 2) in pedestal 140, such as fan pass through the air-flow that fan generates The torrid zone that radiating fin absorbs can be walked, it is cooling to achieve the effect that.

C referring to figure 2., in this embodiment, first size power component 130 have a first thickness T1, and partition 141 The first cascaded surface 1431 be located at a first level height, wherein the first cascaded surface 1431 of partition 141 is relative to circuit board 120 With the first height H1.Wherein, the first height H1 is equivalent to first thickness T1.

A and Fig. 3 B referring to figure 3. is the second size power component 130 ' and its corresponding second sized heat sink 150 ' It is assembled in the schematic diagram of the pedestal 140 of the power converter 100 of the embodiment of the present invention.When power component 130 ' has one second ruler When very little, radiator 150 ' is resisted against the second cascaded surface 1432 of partition 141, as shown in the dotted line in Fig. 3 A, wherein first size Different from the second size, that is to say, that there is power component 130 ' a second thickness T2, second thickness T2 to be different from power component 130 first thickness T1.D referring to figure 3. is schematic cross-sectional view of Fig. 3 B along line C-C.When power component 130 ' has the When two sizes, radiator 150 ' is resisted against the second cascaded surface 1432 of partition 141.

C referring to figure 3. is assembled in cuing open along line B-B after pedestal 140 for the second sized heat sink 150 ' in Fig. 3 B Depending on schematic diagram.Radiator 150 ' is arranged between partition 141 and bottom plate 142, and the upper surface 151 of radiator 150 ' can be by more A second fixing element 153 (such as screw) is fixed on the second cascaded surface 1432 of partition 141, so that radiator 150 ' is fixed on On pedestal 140, and the upper surface 151 of radiator 150 ' is resisted against the second cascaded surface 1432 of partition 141.

Fig. 3 C and Fig. 2 C the difference is that: the second size power component 130 ' has second thickness T2, radiator 150 ' The second cascaded surface 1432 for being resisted against partition 141, and the second cascaded surface 1432 of partition 141 is located at one second level height, Wherein the second cascaded surface 1432 of partition 141 relative to circuit board 120 there is the second height H2, the second height H2 to be different from partition First height H1 of 141 the first cascaded surface 1431 relative to circuit board 120.Wherein, the second height H2 is equivalent to second thickness T2。

In above-mentioned two embodiment, first size power component 130 is, for example, the power component packed with Easy Pack, Its thickness T1 is, for example, 12mm, and the second size power component 130 ' is, for example, the power component packed with Econo Pack, Thickness T2 is, for example, 17mm (greater than the thickness T1 of first size power component 130).Since power component 130,130 ' is setting In circuit board 120, and circuit board 120 is assembled on pedestal 140.Since circuit board 120 is assembled in the fixation position of pedestal 140, Therefore when the power component 130,130 ' of different-thickness is assembled in pedestal 140 by circuit board 120, power component 130,130 ' Lower surface be located at differentiated levels, as shown in Fig. 2 C and Fig. 3 C.

In order to achieve the purpose that can common-base 140, the embodiment of the present invention propose differentiated levels multiple cascaded surfaces 1431,1432 power component 130,130 ' for respectively corresponding different-thickness, bear against radiator 150,150 ' can in correspondence Cascaded surface 1431,1432 on, make 144 directly contacting with radiator by opening for power component 130,130 ', to reach scattered Thermal effect.It is so not required to design different pedestals 140 for various sizes of power component 130,130 ' again, to reach pedestal 140 share the purpose with reduction number of molds.

Above-described embodiment is by taking two cascaded surfaces as an example, and so the invention is not limited thereto, can be according to the different rulers of power component It is very little, design the cascaded surface of corresponding number.For example, if power component has, there are four types of different sizes, in one embodiment, pedestal 140 can have there are four be located at differentiated levels cascaded surface.

Figure 1A and Fig. 4 is please referred to, after the second sized heat sink 150 ' that wherein Fig. 4 is painted in Fig. 3 B is assembled in pedestal 140 Along the schematic cross-sectional view of line D-D.In one embodiment, partition 141 was for example including multiple protecting walls 148, around opening 144 weeks It encloses, and protecting wall 148 is raised towards the direction of circuit board 120, so that circuit board 120 is assembled in 141 top of partition of pedestal 140 When, protecting wall 148 can be in the gap between circuit board 120 and partition 141.In one embodiment, general power converter In order to increase by an explosion rupture disk on power component by part breaking test, for preventing spark splash, however, such as explosion Shi Nengliang is too strong, and explosion rupture disk can keep out incessantly and rupture the function of losing protection.The pedestal 140 of the present embodiment is in addition to being open 144 surroundings be arranged protecting wall 148, to avoid spark splash, more can by be set to opening 144 around cascaded surface 143 will Amount is led off to a safety buffer zone 154 (referring to fig. 4, such as positioned at the upper surface of the first cascaded surface 1431 and radiator 150 ' Between 151), the energy generated by explosion is reduced, while the risk of explosion rupture disk rupture can be reduced.

In addition, electronic component and radiator 150,150 ' have relevant space length and creepage distance on circuit board 120 Safety standard, the pedestal 140 of the present embodiment in 144 surroundings that are open be arranged multiple cascaded surfaces 143 can make space length and climb electricity away from From increase (such as can be routed along the side wall of safety buffer zone 154 in Fig. 4), the cloth of circuit board 120 can be more effectively utilized Space of lines makes the volume-diminished of circuit board 120.

It is suitble to the power converter of different size power components disclosed by the above embodiment of the present invention, base can be not being changed It is applicable in the power component of different dimensional thickness in the case where seat size, meets the market demand and increases the market competitiveness.That is, Radiator is the size according to power component and determines the first cascaded surface for being resisted against partition or the second cascaded surface.In addition, this dress Set the power component that different dimensional thickness can be applicable in the case where not changing base size, not will increase base mold quantity, Manufacture difficulty and manufacturing cost will not increase assembling product degree of difficulty, and then reach pedestal and share and reduce number of molds Purpose.

Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention Shape all should fall within the scope of protection of the appended claims of the present invention.