A kind of radiator structure of electronic device

文档序号:1745262 发布日期:2019-11-26 浏览:6次 中文

阅读说明:本技术 一种电子装置的散热结构 (A kind of radiator structure of electronic device ) 是由 章毛连 周小杰 何恩节 张永锋 于 2019-07-24 设计创作,主要内容包括:本发明公开了一种电子装置的散热结构,包括电子装置外壳,电子装置外壳上设置有散热开口,所述散热开口上设置有散热机构,所述散热机构包括上铝板和下铝板,所述上铝板和下铝板两端通过连接板固接;所述上铝板和下铝板之间设置有若干铜导管,所述上铝板和下铝板上皆固设有由若干散热铝条组成的散热组件,散热组件上安装有多个金属导热片,所述金属导热片通过金属导热绳与吸盘连接,所述金属导热绳伸入吸盘内的一端与散热头连接,所述散热头由若干金属丝组成。本发明将散热机构通过金属导热绳与电子装置零部件连接,将发热零部件热量直接导出,体积小巧,散热效率高,避免了由于电子装置体积较小,外设散热装置进行散热较为困难的问题。(The invention discloses a kind of radiator structures of electronic device, including electronic device housing, it is provided with radiating opening on electronic device housing, is provided with cooling mechanism on the radiating opening, the cooling mechanism includes upper aluminium sheet and lower aluminum sheet, and the upper aluminium sheet and lower aluminum sheet both ends are affixed by connecting plate;Several copper conductor tubes are provided between the upper aluminium sheet and lower aluminum sheet, the radiating subassembly being made of several heat dissipation aluminum strips is all installed on the upper aluminium sheet and lower aluminum sheet, multiple metal conducting strips are installed on radiating subassembly, the metal conducting strip is connect by metal heat-conducting rope with sucker, one end that the metal heat-conducting rope protrudes into sucker is connect with heat dissipation head, the heat dissipation head by several groups of metal filaments at.Cooling mechanism connect by metal heat-conducting rope with electronic device components by the present invention, heat-generating component heat is directly exported, compact, and radiating efficiency height is avoided due to electronic device small volume, and peripheral hardware radiator is radiated the problem of more difficulty.)

1. a kind of radiator structure of electronic device, including electronic device housing (1), it is characterised in that:

It is provided with radiating opening on the electronic device housing (1), cooling mechanism, the heat dissipation are provided on the radiating opening Mechanism includes upper aluminium sheet (6) and lower aluminum sheet (5), and the upper aluminium sheet (6) and lower aluminum sheet (5) both ends are affixed by connecting plate (9), institute It states radiating opening two sides to be provided with limiting plate (17), the limiting plate (17) is installed on electronic device housing (1), described It is threaded in limiting plate (17) for pushing against connecting plate (9) screw rod (16) that cooling mechanism is fixed;

Be provided with several copper conductor tubes (4) between the upper aluminium sheet (6) and lower aluminum sheet (5), copper conductor tube (4) both ends respectively with it is upper Aluminium sheet (6) and lower aluminum sheet (5) are affixed, are all installed on the upper aluminium sheet (6) and lower aluminum sheet (5) and radiate what aluminum strips formed by several Radiating subassembly (3) is equipped with multiple metal conducting strips (10) on the radiating subassembly (3), and the metal conducting strip (10) passes through Metal heat-conducting rope (11) is connect with sucker (13), and the metal heat-conducting rope (11) protrudes into one end and heat dissipation head in sucker (13) (12) connect, the heat dissipation head (12) by several groups of metal filaments at.

2. a kind of radiator structure of electronic device according to claim 1, it is characterised in that: the metal conducting strip (10) For aluminum.

3. a kind of radiator structure of electronic device according to claim 1, it is characterised in that: on the outside of the upper aluminium sheet (6) It is covered with insulation net (2), the insulation net (2) is detachably connected with electronic device housing (1).

4. a kind of radiator structure of electronic device according to claim 3, it is characterised in that: insulation net (2) two sides It is installed with rubber base plate (15), the rubber base plate (15) is connect by standing screw (14) with electronic device housing (1).

5. a kind of radiator structure of electronic device according to claim 1, it is characterised in that: the electronic device housing It (1) is isolation material.

6. a kind of radiator structure of electronic device according to claim 1, it is characterised in that: the metal conducting strip (10) Quantity be ten.

7. a kind of radiator structure of electronic device according to claim 3, it is characterised in that: insulation net (3) mesh Diameter be one millimeter.

8. a kind of radiator structure of electronic device according to claim 1, it is characterised in that: the upper aluminium sheet (6) and under Aluminium sheet (5) length is identical as radiating opening length.

Technical field

The present invention relates to field of electronic devices more particularly to a kind of radiator structures of electronic device.

Background technique

Electronic equipment refers to be made of electronic components such as integrated circuit, transistor, electron tubes, application electric technology (packet Include) equipment that plays a role of software, including electronic computer and the robot, numerical control or the program-controlled system that are controlled by electronic computer System etc..

Miniaturization is one of the developing direction of contemporary electronic device, and while minimize, the heat dissipation problem of electronic device It becomes increasingly conspicuous, due to electronic device small volume, peripheral hardware radiator is radiated more difficult, needs to design a kind of for small The radiator structure of type electronic device.

Summary of the invention

The purpose of the present invention is to provide a kind of radiator structures of electronic device, to solve the above technical problems.

The present invention using following technical scheme in order to solve the above technical problems, realized:

A kind of radiator structure of electronic device, including electronic device housing,

It is provided with radiating opening on the electronic device housing, cooling mechanism is provided on the radiating opening, it is described to dissipate Heat engine structure includes upper aluminium sheet and lower aluminum sheet, and the upper aluminium sheet and lower aluminum sheet both ends are affixed by connecting plate, the radiating opening two Side is provided with limiting plate, and the limiting plate is installed on electronic device housing, is threadedly coupled in the limiting plate useful In the screw rod that abutting connecting plate is fixed by cooling mechanism;

Be provided with several copper conductor tubes between the upper aluminium sheet and lower aluminum sheet, the copper conductor tube both ends respectively with upper aluminium sheet and under Aluminium sheet is affixed, and the radiating subassembly being made of several heat dissipation aluminum strips, the heat dissipation group are all installed on the upper aluminium sheet and lower aluminum sheet Multiple metal conducting strips are installed, the metal conducting strip is connect by metal heat-conducting rope with sucker, the metal heat-conducting on part Restrict one end for protruding into sucker is connect with heat dissipation head, the heat dissipation head by several groups of metal filaments at.

Preferably, the metal conducting strip is aluminum.

Preferably, the upper aluminium sheet outside mask is equipped with insulation net, and the insulation net is detachably connected with electronic device housing.

Preferably, insulation net two sides are installed with rubber base plate, and the rubber base plate is filled by standing screw and electronics Set cage connection.

Preferably, the electronic device housing is isolation material.

Preferably, the quantity of the metal conducting strip is ten.

Preferably, the diameter of the insulation net meshe is one millimeter.

Preferably, the upper aluminium sheet and lower aluminum sheet length are identical as radiating opening length.

The beneficial effects of the present invention are:

1, cooling mechanism is connect by metal heat-conducting rope with electronic device components by the present invention, by heat-generating component heat It directly exports, compact, radiating efficiency is high, avoids due to electronic device small volume, peripheral hardware radiator radiates More difficult problem.

2, on metal heat-conducting rope be arranged sucker can in order to which metal heat-conducting rope is connect with electronic device heat-generating component, by Groups of metal filaments at heat dissipation head can expand the contact area of heat dissipation head and heat-generating component.

3, insulation net can play protective action, prevent cooling mechanism electrification from user being caused accidentally to touch.

Detailed description of the invention

Fig. 1 is the structural diagram of the present invention;

Fig. 2 is the portion the A enlarged diagram of Fig. 1 of the present invention;

Fig. 3 is the portion the B enlarged diagram of Fig. 1 of the present invention;

Appended drawing reference: 1- electronic device housing;2- insulation net;3- radiating subassembly;4- copper conductor tube;5- lower aluminum sheet;The upper aluminium of 6- Plate;8- rubber base plate;9- connecting plate;10- metal conducting strip;11- metal heat-conducting rope;12- heat dissipation head;13- sucker;14- is fixed Screw rod;16- screw rod;17- limiting plate.

Specific embodiment

In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below Specific embodiments and the drawings are closed, the present invention is further explained, and however, the following embodiments are merely preferred embodiments of the present invention, not All.Based on the implementation example in the implementation mode, those skilled in the art are obtained without making creative work Other embodiments belong to protection scope of the present invention.

Specific embodiments of the present invention are described with reference to the accompanying drawing.

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