阅读说明：本技术 具有pmi泡沫夹层结构电子模块的导热能力提升方法 (Capacity of heat transmission method for improving with PMI foamed sandwich structure electronic module ) 是由 王东 方伟 胡家渝 卢健钊 曾俊杰 李继 刘攀 彭磊 于 2019-07-27 设计创作，主要内容包括：发明公开一种具有PMI泡沫夹层结构电子模块的导热能力提升方法,旨在提供一种能够快速耗散电子元器件产生热量的导热方法。本发明通过下述技术方案予以实现：在由上导热面板(1)、下蒙皮面板(4)或下导热面板(6)与夹层PMI泡沫芯材(2)构成的电子模块中,将夹层PMI泡沫芯材(2)四周通过封边条(3)进行封边处理,并在夹层PMI泡沫芯材(2)上制出形成电子模块内部元器件的散热通道的散热槽,然后在散热槽的散热通道中嵌入导热介质(5),导热介质(5)通过散热通道将电子模块内部元器件产生的热量快速地导向模块框架交联点的四周或两侧帽子型、直筋型的肋条。(A kind of a kind of capacity of heat transmission method for improving with PMI foamed sandwich structure electronic module of disclosure of the invention, it is desirable to provide heat-conducting method for capableing of fast dissipation electronic component generation heat.The technical scheme is that: by upper thermally conductive panel (1), lower skin panel (4) or under in the electronic module that constitutes of thermally conductive panel (6) and interlayer PMI foam core material (2), interlayer PMI foam core material (2) surrounding is subjected to edge sealing processing by edge band (3), and the radiating groove to form the heat dissipation channel of electronic module internal component is produced on interlayer PMI foam core material (2), then heat-conducting medium (5) are embedded in the heat dissipation channel of radiating groove, the heat that heat-conducting medium (5) is generated electronic module internal component by the heat dissipation channel rapidly surrounding of oriented module frame crosslinking points or two sides cap type, the rib of straight muscle type.)

1. a kind of capacity of heat transmission method for improving with PMI foamed sandwich structure electronic module, there is following technical characteristic: by Upper thermally conductive panel (1), lower skin panel (4) or under the electronic module that constitutes of thermally conductive panel (6) and interlayer PMI foam core material (2) In, interlayer PMI foam core material (2) surrounding is subjected to edge sealing processing by edge band (3), and on interlayer PMI foam core material (2) The radiating groove to form the heat dissipation channel of electronic module internal component is produced, is then embedded in the heat dissipation channel of radiating groove thermally conductive Medium (5), the heat that heat-conducting medium (5) is generated electronic module internal component by heat dissipation channel rapidly oriented module frame The surrounding of frame crosslinking points or the rib of two sides cap type, straight muscle type.

2. having the capacity of heat transmission method for improving of PMI foamed sandwich structure electronic module as described in claim 1, feature exists In: upper thermally conductive panel (1), under thermally conductive panel (6) be integrally machined molding respectively or be decomposed into the combination knot of frame and skin panel Structure.

3. having the capacity of heat transmission method for improving of PMI foamed sandwich structure electronic module as described in claim 1, feature exists In: radiating groove is that heat-conducting medium (5) provide installation space.

4. having the capacity of heat transmission method for improving of PMI foamed sandwich structure electronic module as described in claim 1, feature exists In: the heat-conducting medium (5) is heat pipe, pyrolytic graphite and other highly heat-conductive materials.

5. having the capacity of heat transmission method for improving of PMI foamed sandwich structure electronic module as described in claim 1, feature exists In: the radiating groove is arranged on foam core material (2) plate body by linear array, the L-shaped groove that symmetrical middle part is spaced apart every road both sides, And the arch abutment of each L-shaped groove connects on the frame of the plate body.

6. having the capacity of heat transmission method for improving of PMI foamed sandwich structure electronic module as described in claim 1, feature exists In: the heat-conducting medium (5) by welding, bonding form and upper thermally conductive panel (1) or under thermally conductive panel (6) connect.

7. having the capacity of heat transmission method for improving of PMI foamed sandwich structure electronic module as described in claim 1, feature exists In: the make-up that upper thermally conductive panel (1) inside surrounding is formed with corresponding interlayer PMI foam core material (2) surrounding edge band (3) frame is convex Platform.

8. having the capacity of heat transmission method for improving of PMI foamed sandwich structure electronic module as described in claim 1, feature exists In: after interlayer PMI foam core material (2) is encapsulated by the make-up boss on upper thermally conductive panel (1) inner side frame side, it is connected by screw to With glue film be bonded underlying lower skin panel (4) or under thermally conductive panel (6), and solidification is integrated together.

9. having the capacity of heat transmission method for improving of PMI foamed sandwich structure electronic module as described in claim 1, feature exists In: upper thermally conductive panel (1) is fixed with L shape heat-conducting medium (5) by its lower surface, is located under interlayer PMI foam core material (2) plate body Thermally conductive panel (6) is fixed with L shape heat-conducting medium (5), unilateral symmetrical L shape heat-conducting medium (5) point by its upper surface under side It is not embedded in symmetrically in the radiating groove of L shape splicing.

10. as described in claim 1 with the capacity of heat transmission method for improving of PMI foamed sandwich structure electronic module, feature Be: unilateral L shape heat-conducting medium (5) is bonded or welded on upper thermally conductive panel (1), the L of another unilateral symmetrical above-mentioned unilateral side Shape heat-conducting medium (5) is bonded or welded under on thermally conductive panel (6)；Then by interlayer PMI foam core material (2) plate of machine-shaping Body and its edge band (3) bonding are sub-assembly, sub-assembly and upper thermally conductive panel (1), under thermally conductive panel (6) be connected by screw to and Curing molding together after glue film bonding.

Technical field

The invention belongs to Aeronautics and Astronautics electronic module heat dissipation design fields, and in particular to PMI foamed sandwich structure The method for improving of the electronic module frame capacity of heat transmission.

Background technique

The capacity of heat transmission of electronic module is an important indicator, and the electronic component on electronic module can generate at work A large amount of heat.If the electronic module with PMI foamed sandwich structure generates a large amount of heat, these heats cannot dissipate in time Out, it will cause component overheat to burn, so that whole equipment be made to fail or break down.The simple sandwich of electronic module by Panel, core material and glue three parts composition.By transmitting load between glue in front two components.The work that sandwich can reach Be by allow lightweight, there is certain thickness core material to bear shear stress, while the bearing panel relatively tough and tensile, thin by two It separates.In advanced field of compound material, the core material of most common sandwich is Polymethacrylimide (PMI).PMI foam It is the specific strength being currently known and the highest foamed material of specific stiffness, it has high temperature resistant, thermoplasticity and full closed pore and respectively to same The excellent performances such as property.PMI foamed sandwich structure integrally has very high specific strength, biggish specific stiffness, while also having excellent Different heat-insulated and wave transparent function is realizing that structural member is light-weighted simultaneously, can also guarantee mechanical property well, be applied to In electronic module frame.

According to measurement result, in room temperature within the scope of 100 DEG C, the big PMI foam thermal conductivity of density is higher, with density Approximately linear increases PMI foam thermal conductivity as the temperature increases.Solid phase, gas since PMI foam pores are relatively large in diameter, in material Mutually and radiant heat transfer increases with temperature and is increased, and increases and line so as to cause the efficient thermal conductivity of PMI foamed material with temperature Property increase.Also due to pore-size is larger, gaseous heat transfer and radiant heat transfer are unrelated with density, therefore effective thermal conductivity of material Rate is directly proportional to its solid concentration, becomes larger so as to cause PMI foam efficient thermal conductivity with the increase of density.Due to PMI foam Closed-cell foam material, in all traditional antivacuum heat insulators, thermal conductivity be it is minimum, only by electronic module frame Thin panel carry out it is thermally conductive, effect is poor.In sandwich, cellular sandwich has the advantages that prominent, also there is corresponding disadvantage, This thin-wall construction may result in cellular surface, especially in the biggish situation of honeycomb hole, it may occur that part loses Stablize, to generate destruction.In actual engineering design, PMI foamed sandwich structure uses reinforced structure, and reinforced structure can mention The critical load of high structural member.But on the basis of reinforced structure increases the rigidity of structure, also considerably increase integrally-built matter Amount.In order to coordinate the relationship of load and architecture quality, needs to optimize reinforced structure, reach whole quality of loads ratio Optimal, need to optimize generally has following items: the shape of structure, the thickness of covering, the type of reinforcement and mode (cap type, Straight muscle type etc.), the angle of laying, these should be determined according to the load condition in detailed process, can be according to practical feelings Condition determines best technique.In the structure of reinforcement, it generally will appear transversal reinforcement and longitudinal reinforcement, the two needed to combine.Add The buckling of muscle structure is divided into complete buckling and local buckling, can continue to carry when there is the local buckling of covering, work as appearance When complete buckling, structural member starts to fail.In addition, layer shell structure will generate big deformation under larger external force, can make to tie Structure is deformed into GEOMETRICALLY NONLINEAR, and structure is likely to unstable phenomenon occur.Theory of mechanics is known that sandwich structure is general There are following several failure modes, can conclude and be expressed as the following:

(1) panel of sandwich is destroyed: this is because the fiber panel intensity of sandwich structure does not reach and core material The intensity to match, causes fiber panel to be destroyed in advance, bears drawing, compression without playing the role of；

(2) abnormal collapsing has occurred in the part of core material: this and above with the destruction of panel just on the contrary, being due to core material Intensity it is too low, the shear stress not being able to bear in setting value collapses before not reaching load；

(3) buckling occurs for overall structure: this is the synthesis for having both above situation, illustrates that sandwich structure has integrally lost resistance The ability of load needs to redesign.The better panel of intensity and core material are needed, when buckling occurs for overall structure, structural member It can destroy, be destructive；

(4) core material lateral shear destroys: such case be because core material shear strength is inadequate or entire sandwich plate thickness low LCL and Cause.In above destroy, PMI foamed sandwich structure plate has a surfacing, no unsticking, bulge phenomenon, mechanical property without Directionality.Purpose using reinforced structure is the Buckling Critical Load in order to improve entire thin-wall case, even more in order to enable thin The efficiency of wall shell structure improves as much as possible.

Summary of the invention

The present invention is directed to the poor shortcoming of the electronic module heat dissipation effect with PMI foamed sandwich structure, provides one Kind is for the capacity of heat transmission method for improving with PMI foamed sandwich structure electronic module.It is provided for electronic module internal component More good passage of heat realizes the fast dissipation that heat is generated when component work.

In order to realize above-mentioned purpose of the invention, the present invention provides a kind of with PMI foamed sandwich structure electronic module Capacity of heat transmission method for improving has following technical characteristic: by upper thermally conductive panel 1, lower skin panel 4 or under thermally conductive panel 6 with In the electronic module that interlayer PMI foam core material 2 is constituted, 2 surrounding of interlayer PMI foam core material is carried out at edge sealing by edge band 3 Reason, and the radiating groove to form the heat dissipation channel of electronic module internal component is produced on interlayer PMI foam core material 2, then exist Heat-conducting medium 5 is embedded in the heat dissipation channel of radiating groove, heat-conducting medium 5 is generated electronic module internal component by heat dissipation channel The heat rapidly surrounding of oriented module frame crosslinking points or two sides cap type, straight muscle type rib.

Preferably, upper thermally conductive panel 1, under thermally conductive panel 6 can be integrally machined molding respectively, can also be decomposed into frame with The composite structure of skin panel.

The present invention has the following beneficial effects: compared with the prior art

The present invention produces radiating groove on interlayer PMI foam core material 2, forms the heat dissipation channel of electronic module internal component, In Heat-conducting medium 5 is embedded in the heat dissipation channel of radiating groove, using being embedded in interlayer PMI foam core material 2 and the thermally conductive panel 1 of electronic module Between heat-conducting medium in heat dissipation channel, the heat of fast dissipation electronic module internal component, interlayer PMI foam core material 2 Decomposition temperature can reach 260 DEG C or more, and the thermal environment requirement of electronic module is fully achieved.

Standardization, Seriation Design may be implemented in electronic module heat-conducting plate of the present invention, is conducive to the system type of electronic module, can To effectively reduce design difficulty, shorten the lead time.

Detailed description of the invention

Fig. 1 is the decomposition of the typical thermal structure of first embodiment of the invention unilateral side printed board assembly electronic module frame Schematic diagram.

Fig. 2 is the decomposition of the typical thermal structure of second embodiment of the invention bilateral printed board assembly electronic module frame Schematic diagram.

In figure: being led under thermally conductive panel, 2 interlayer PMI foam core materials, 3 edge bands, 4 lower skin panels, 5 heat-conducting mediums, 6 on 1 Hot panel.

Specific embodiment

Refering to fig. 1, Fig. 2.According to the present invention, by upper thermally conductive panel 1, lower skin panel 4 (thermally conductive panel 6 under or) and folder In the electronic module that layer PMI foam core material 2 is constituted, 2 surrounding of interlayer PMI foam core material is subjected to edge sealing processing using edge band 3, And radiating groove is produced on interlayer PMI foam core material 2, the heat dissipation channel of electronic module internal component is formed, in radiating groove Heat-conducting medium 5 is embedded in heat dissipation channel, heat-conducting medium 5 is fast by the heat that heat dissipation channel generates electronic module internal component Ground passes through the surrounding of thermally conductive oriented module frame crosslinking points or the rib of two sides cap type, straight muscle type.

By referring to the embodiment of following description, illustrates technical characteristic of the invention, will be apparent.

The upper thermally conductive panel 1, under thermally conductive panel 6 be made of the high material of light weight, thermal coefficient.

Radiating groove on PMI foam core material 2 is that heat-conducting medium 5 provides installation space.The heat-conducting medium 5 can be heat The forms such as pipe, pyrolytic graphite.The radiating groove can be linear array and be arranged on 2 plate body of foam core material, and symmetrical middle part is every road both sides The L-shaped groove being spaced apart, and the arch abutment of each L-shaped groove connects the frame of the plate body.

The heat-conducting medium 5 can by weld, be bonded etc. forms and upper thermally conductive panel 1 or under thermally conductive panel 6 connect.

In the embodiment shown in fig. 1, upper 1 inside surrounding of thermally conductive panel is formed with corresponding 2 surrounding edge sealing of interlayer PMI foam core material The make-up boss of 3 frame of item.Interlayer PMI foam core material 2 passes through the make-up boss encapsulation on above-mentioned thermally conductive 1 inner side frame side of panel Afterwards, it can be connected by screw to and be bonded underlying lower skin panel 4 with glue film, and solidification is integrated together.

In the embodiment depicted in figure 2, upper thermally conductive panel 1 by its lower surface be fixed with L-shaped heat-conducting medium 5, be located at folder Thermally conductive panel 6 is fixed with L-shaped heat-conducting medium 5 by its upper surface under below 2 plate body of layer PMI foam core material, unilateral symmetrical L shape heat-conducting medium 5 be respectively symmetrically embedded in L-shaped radiating groove.

In an alternate embodiment of the invention, with the unilateral printed board assembly electronic module capacity of heat transmission lift structure of PMI foam It manufactures by the following method:

Firstly, according to thermally conductive panel 1 in the requirement of practical electronic module product design and integrated machine-shaping；Secondly, will lead Thermal medium 5 is bonded or welded on upper thermally conductive panel 1；Again, skin panel 4, interlayer PMI foam core material 2, envelope under machine-shaping Edge strip 3；Finally, the sub-assembly, interlayer PMI foam core material 2, lower skin panel 4 of upper thermally conductive panel 1 and heat-conducting medium 5 are passed through Screw connection and glue film be bonded after with edge band 3 together curing molding.

In an alternate embodiment of the invention, with the bilateral printed board assembly electronic module capacity of heat transmission lift structure of PMI foam It manufactures by the following method:

According to thermally conductive panel 1 in the requirement of practical electronic module product design and integrated machine-shaping, under thermally conductive panel 6.It is single The L shape heat-conducting medium 5 of side is bonded or welded on upper thermally conductive panel 1, the L shape heat-conducting medium 5 of another unilateral symmetrical above-mentioned unilateral side It is bonded or welded under on thermally conductive panel 6；Then 2 plate body of interlayer PMI foam core material and its edge band 3 of machine-shaping are bonded For sub-assembly, sub-assembly and upper thermally conductive panel (1), under thermally conductive panel (6) be connected by screw to it is Nian Jie with glue film after solidify together Molding.

The above is present pre-ferred embodiments, it has to be noted that the present invention will be described for above-described embodiment, so And the present invention is not limited thereto, and those skilled in the art can be designed when being detached from scope of the appended claims Alternative embodiment.For those skilled in the art, without departing from the spirit and substance in the present invention, Various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.