阅读说明：本技术 被加工物的加工方法 (The processing method of machined object ) 是由 台井晓治 古川良 水口雅则 小野隆之 于 2019-05-20 设计创作，主要内容包括：提供被加工物的加工方法,不会大幅降低生产率而能够适当地调整切削刀具的高度。被加工物的加工方法包含如下的工序：基准设定工序,设定切削单元的作为基准的高度；目标设定工序,设定切削单元的作为目标的高度以便切削刀具切入至划片带的规定的深度；第1切削工序,在将切削单元定位于作为目标的高度的状态下使切削单元和卡盘工作台相对地移动,从而对被加工物进行切削加工；校正值获取工序,根据通过切削刀具而形成在划片带的接触痕的长度而获取校正值；以及第2切削工序,在将切削单元定位于通过校正值对作为目标的高度进行了校正的高度的状态下使切削单元和卡盘工作台相对地移动,从而对被加工物进行切削加工。(The processing method of machined object is provided, productivity will not be greatly reduced and the height of cutting tool can be suitably adjusted.The processing method of machined object includes following process: benchmark sets process, sets the height as benchmark of cutting unit；Goal-setting process sets the height as target of cutting unit so that cutting tool is cut into the defined depth of dicing tape；1st cutting process moves cutting unit and chuck table relatively in the state that cutting unit to be positioned to the height as target, to carry out machining to machined object；Corrected value obtains process, obtains corrected value according to the length for the contact trace for being formed in dicing tape by cutting tool；And the 2nd cutting process, move cutting unit and chuck table relatively, to carry out machining to machined object.)

1. a kind of processing method of machined object carries out cutting to the machined object for being pasted with dicing tape using cutting apparatus and adds Work, the dicing tape are pasted on the opening of cricoid frame,

The cutting apparatus includes:

Chuck table keeps machined object；

Cutting unit is equipped with the cutting tool that the machined object kept to the chuck table carries out machining； And

Setting unit sets the height as benchmark of the cutting unit according to the height of the front end of the periphery of the cutting tool Degree,

The processing method of the machined object is characterized in that, includes following process:

Benchmark sets process, sets the conduct of the cutting unit benchmark according to the height of the front end of the periphery of the cutting tool Height；

Goal-setting process sets the height as target of the cutting unit so that the cutting tool is cut into the dicing tape Defined depth；

1st cutting process makes the cutting unit and is somebody's turn to do in the state that the cutting unit to be positioned to the height as the target Chuck table relatively moves, to carry out machining to the machined object；

Corrected value obtain process, with the 1st cutting process simultaneously or after the 1st cutting process, according to pass through the bite Have and the length of contact trace that is formed in the dicing tape and obtain corrected value, conduct of the corrected value for the cutting unit should The correction of the height of target；And

2nd cutting process corrects the height as the target by the corrected value being positioned at the cutting unit Height in the state of, make the cutting unit and the chuck table relatively move, to cut the machined object Processing.

2. the processing method of machined object according to claim 1, which is characterized in that

In the 1st cutting process, exposing of the cutting unit between the machined object and the frame is made to have the dicing tape The 1st region in drop to after the height as the target, make the cutting unit and the chuck table relatively move, with So that the cutting tool is moved to the exposing for being located at the side opposite with the 1st region relative to the machined object and has the dicing tape The 2nd region, to carry out machining to the machined object and form in the dicing tape contact trace.

3. the processing method of machined object according to claim 1, which is characterized in that

The processing method of the machined object also includes following contact trace formation process: after the 1st cutting process and at this Before corrected value obtains process, exposing of the cutting unit between the machined object and the frame is made to have the region of the dicing tape In drop to the height as the target, to form the contact trace in the dicing tape.

4. according to claim 1 to the processing method of machined object described in any one in 3, which is characterized in that

It is obtained in process in the corrected value, according to by the length of the contact trace and the calculated contact trace of the outer diameter of the cutting tool Depth and obtain the corrected value.

Technical field

The present invention relates to the processing methods of machined object, carry out cutting to the machined object for the plate for being pasted with dicing tape and add Work.

Background technique

When to being processed using semiconductor wafer or package substrate as the machined object of the plate of representative, for example, using The cutting apparatus of cricoid cutting tool is installed on main shaft.It on one side rotates main shaft and cutting tool is made to cut machined object, Move main shaft and cutting tool relatively with machined object, so as to along the direction of the relative movement to be processed Object carries out machining.

But when carrying out machining to machined object using cutting apparatus as described above, the abrasion of cutting tool It constantly promotes, diameter slowly becomes smaller.When the cutting tool to be become smaller using diameter by abrasion always, cutting tool relative to The incision of machined object shoals, and suitably can not carry out machining to machined object.

Therefore, following method is practical: being carried out in position of the arbitrary opportunity to the front end (lower end) of cutting tool Detection, controls incision of the cutting tool for machined object (for example, referring to patent document on the basis of the position of the front end 1).In the method, so that cutting tool is entered the sensor for being set to the optical profile type of cutting apparatus, interdicted and passed by cutting tool Optical path in sensor and the position of the front end of cutting tool is detected.

Patent document 1: Japanese Unexamined Patent Publication 2001-298001 bulletin

In recent years, with the miniaturization etc. of the chip cut out from machined object, the processing for being set in the machined object is predetermined The quantity of line (spacing track) also increases.Therefore, it is easy to produce following situation: machining is being carried out to a machined object Halfway, larger abrasion occurs for cutting tool, it is necessary to confirm the position of front end and adjust the height of cutting tool.

When generating such situation, stopping the machining of machined object and detecting using above-mentioned sensor to cut After the position of the front end of cutting knife tool, adjusts the height of cutting tool and start again at machining.But in this case, Cutting tool must be made relatively to move between machined object and sensor, therefore productivity is easily reduced.

Summary of the invention

The present invention is completed in view of the problem, and its purpose is to provide the processing method of machined object, Bu Hui great Width reduces productivity and can suitably adjust the height of cutting tool.

According to one method of the present invention, the processing method of machined object is provided, using cutting apparatus to being pasted with scribing The machined object of band carries out machining, which is pasted on the opening of cricoid frame, which includes: chuck work Make platform, machined object is kept；Cutting unit, be equipped with the machined object that the chuck table is kept into The cutting tool of row machining；And setting unit, this is set according to the height of the front end of the periphery of the cutting tool The height as benchmark of cutting unit, the processing method of the machined object include following process: benchmark sets process, according to The height of the front end of the periphery of the cutting tool and the height as the benchmark for setting the cutting unit；Goal-setting process, The height as target of the cutting unit is set so that the cutting tool is cut into the defined depth of the dicing tape；1st cuts Process is cut, makes the cutting unit and the chuck table in the state that cutting unit to be positioned to the height as the target It relatively moves, to carry out machining to the machined object；Corrected value obtain process, with the 1st cutting process simultaneously or After the 1st cutting process, obtained according to the length for the contact trace being formed in the dicing tape by the cutting tool Corrected value, correction of the corrected value for the height as the target of the cutting unit；And the 2nd cutting process, should Cutting unit is positioned in the state of the height corrected by the corrected value to the height as the target, makes the cutting Unit and the chuck table relatively move, to carry out machining to the machined object.

In one embodiment of the present invention, be also possible in the 1st cutting process, make the cutting unit in the quilt Exposing between machining object and the frame, which has in the 1st region of the dicing tape, to be dropped to after the height as the target, this is made Cutting unit and the chuck table relatively move so that the cutting tool be moved to relative to the machined object be located at The exposing of the opposite side in 1st region has the 2nd region of the dicing tape, thus to the machined object carry out machining and The contact trace is formed in the dicing tape.

In addition, the processing method for being also possible to the machined object also includes following connects in one embodiment of the present invention It touches trace formation process: after the 1st cutting process and before the corrected value obtains process, adding the cutting unit at this Exposing between work object and the frame, which has in the region of the dicing tape, drops to the height as the target, thus in the dicing tape Upper formation contact trace.

In addition, being also possible to obtain in process in the corrected value, according to by the contact in one embodiment of the present invention The length of trace and the outer diameter of the cutting tool it is calculated contact trace depth and obtain the corrected value.

In the processing method of the machined object of one embodiment of the present invention, scribing is formed according to by cutting tool The length of the contact trace taken and obtain corrected value, corrected value for cutting unit the height as target correction, then Cutting unit is positioned to the height corrected by the corrected value, machining is carried out to machined object.

As a result, when being worn cutting tool, even if not utilizing setting unit to the front end of the periphery of cutting tool Height detected, can also suitably adjust the height of cutting unit.That is, when adjusting the height of cutting tool, unlike In the past make like that cutting tool relative movement distance increase, therefore productivity will not be greatly reduced and can be suitably Adjust the height of cutting tool.

Detailed description of the invention

Fig. 1 is the perspective view for showing the structural example of machined object etc..

Fig. 2 is the perspective view for showing the structural example of cutting apparatus.

Fig. 3 is by perspective view obtained by cutting unit and the amplification of tool position detection unit.

(A) of Fig. 4 and (B) of Fig. 4 are the side elevation in partial section for showing the case where carrying out machining to machined object.

(A) of Fig. 5 is the top view of machined object after showing machining etc., and (B) of Fig. 5 is the depth for showing contact trace The concept map of degree.

(A) of Fig. 6 is the side elevation in partial section for showing the case where carrying out machining to machined object, and (B) of Fig. 6 is The top view of machined object after showing machining etc..

Fig. 7 is the top view for showing dicing tape for foring using other processes and contacting trace etc..

Label declaration

11: machined object；11a: front；11b: the back side；11c, 11d: notch (cutting opening)；13: processing preset lines (interval Road)；15: device；21: dicing tape；21a: the 1 face；21b, 21c: contact trace；23: frame；23a: opening；2: cutting apparatus；4: Base station；4a, 4b, 4c: opening；6: box elevator；8: box；10:X axis mobile mechanism (processing feed mechanism)；10a: workbench cover； 12: corrugated cover；14: chuck table (keeps workbench)；14a: retaining surface；14b: attraction road；16: fixture；18: cutting is single Member；20: supporting structure；22: cutting unit mobile mechanism (index feed mechanism, incision feed mechanism)；24:Y axis rail；26:Y Axis movable plate；28:Y axis ball-screw；30:Z axis rail；32:Z axis movable plate；34:Z axis ball-screw；36:Z axis pulse electric Machine；38: main shaft housing；40: main shaft；42: cutting tool；44: camera (shooting unit)；46: (the setting of tool position detection unit Unit)；48: cleaning unit；50: control unit (setting unit)；54: detector；54a: supporting part；54b: test section；54c: Cutter entrance；56: illumination region；58: acceptance part；60: air provides nozzle；62: liquid provides nozzle；64: connecting piece；66: Cover.

Specific embodiment

It is illustrated referring to embodiment of the attached drawing to one embodiment of the present invention.Fig. 1 is to show to utilize present embodiment Machined object processing method carry out machining the equal structural example of machined object 11 perspective view.As shown in Figure 1, by adding Work object 11 is, for example, the discoid chip formed using semiconductor materials such as silicon (Si).

The positive side 11a of the machined object 11 is marked off multiple by cross one another a plurality of processing preset lines (spacing track) 13 Zonule is formed with the devices 15 such as IC (Integrated Circuit: integrated circuit) in each zonule.Diameter ratio is added The 1st face side 21a of the big dicing tape 21 of work object 11 is pasted on the back side side 11b of machined object 11.

In addition, the outer peripheral portion of the 1st face side 21a of dicing tape 21 is pasted on the ring with generally circular opening 23a On the frame 23 of shape.That is, being pasted with drawing for the opening 23a for being pasted on cricoid frame 23 in the back side side 11b of machined object 11 Piece band 21, machined object 11 are supported on frame 23 by the dicing tape 21.

In addition, in the present embodiment, using the discoid chip formed by semiconductor materials such as silicon as machined object 11, but for material, shape, structure, size of machined object 11 etc., there is no limit.Such as it also can be used and partly led by other Substrate that the materials such as body, ceramics, resin, metal are formed etc. is used as machined object 11.Type, number similarly, for device 15 Also there is no limit for amount, shape, structure, size, configuration etc..Device 15 can not also be formed on machined object 11.

In addition, in the present embodiment, dicing tape 21 is pasted with to the back side side 11b in machined object 11 and from front The example that the side 11a carries out machining to machined object 11 is illustrated, but dicing tape 21 can also be pasted on machined object The 11 positive side 11a.In this case, machining is carried out to machined object 11 from the back side side 11b.

In the processing method of the machined object of present embodiment, carried out first for utilizing cutting apparatus to above-mentioned quilt The preparation of the progress machining of machining object 11.Fig. 2 is shown used in the processing method of the machined object of present embodiment Cutting apparatus 2 structural example perspective view.In addition, a part of constituent element is shown with functional block in Fig. 2.Such as Fig. 2 institute Show, cutting apparatus 2 has the base station 4 supported to each component.

It is formed with opening 4a in the corner in the front of base station 4, elevating mechanism is provided in opening 4a and (does not scheme Show) the box elevator 6 that is gone up and down.Box 8 is placed on the upper surface of box elevator 6, which is used for by dicing tape 21 And the machined object 11 for being supported on the state of frame 23 is stored.In addition, for ease of description, only showing box 8 in Fig. 2 Profile.

The longer opening in X-direction (front-rear direction, processing direction of feed) is formed in the side of box elevator 6 4b.X-axis mobile mechanism (processing feed mechanism) 10 and covering X-axis mobile mechanism 10 in opening 4b configured with ball screw type Top corrugated cover 12.X-axis mobile mechanism 10 has X-axis moving table (not shown), and the X-axis moving table is made to exist It is moved in X-direction.In addition, the top of the X-axis moving table is covered by workbench cover 10a.

(work is kept configured with chuck table in a manner of exposing from workbench cover 10a in X-axis moving table Platform) 14, chuck table (the keeping workbench) 14 is for keeping machined object 11 across dicing tape 21.Chuck work Make the connection (not shown) of the rotary driving sources such as platform 14 and motor, around the rotary shaft substantially parallel with Z-direction (vertical direction) Rotation.In addition, chuck table 14 is moved together with X-axis moving table in the X-axis direction by above-mentioned X-axis mobile mechanism 10 Dynamic (processing feeding).

A part of the upper surface of chuck table 14 is the retaining surface 14a for being kept to machined object 11.It protects It holds face 14a to be formed substantially in parallel relative to X-direction and Y direction (left and right directions, index feed direction), via being formed in The inside of chuck table 14 attraction road 14b (referring to Fig. 4 (A)) etc. and with attract source (not shown) connect.In addition, in card There are four fixture 16, which is used for the ring-type from four sides to bearing machined object 11 for setting around disk workbench 14 Frame 23 be fixed.

It is configured in the top of opening 4b for transporting above-mentioned machined object 11 (frame 23) to chuck table 14 Deng transport unit (not shown).What the machined object 11 that transport unit is transported for example exposed according to the positive side 11a to top Mode is placed on the retaining surface 14a of chuck table 14.That is, in the present embodiment, making the back for being pasted on machined object 11 The dicing tape 21 of the face side 11b is contacted with the retaining surface 14 of chuck table 14.

It is configured with the supporting structure 20 of cantilever beam-like in the side of opening 4b, which is used to be processed cutting The cutting unit 18 of object 11 is supported.Being provided on the front surface top of supporting structure 20 makes cutting unit 18 in Y direction With the cutting unit mobile mechanism (index feed mechanism, incision feed mechanism) 22 moved in Z-direction.

Cutting unit mobile mechanism 22 has a pair of of Y-axis guide rail 24, they are configured in the front surface of supporting structure 20, with Y direction is substantially parallel.The Y for being constituted cutting unit mobile mechanism 22 is installed in a manner of it can slide in Y-axis guide rail 24 Axis movable plate 26.

The back side (back-surface side) of Y-axis moving plate 26 is provided with nut portions (not shown), is screwed togather in the nut portions There is the Y-axis ball-screw 28 substantially parallel with Y-axis guide rail 24.Y-axis pulse electricity is linked in an end of Y-axis ball-screw 28 Motivation (not shown).If rotating Y-axis ball-screw 28 using Y-axis pulse motor, Y-axis moving plate 26 is along Y-axis guide rail 24 move in the Y-axis direction.

A pair of of the Z axis guide rail 30 substantially parallel with Z-direction is provided on the front (front surface) of Y-axis moving plate 26. Z axis movable plate 32 is installed in a manner of it can slide in Z axis guide rail 30.

The back side (back-surface side) of Z axis movable plate 32 is provided with nut portions (not shown), is screwed togather in the nut portions There is the Z axis ball-screw 34 parallel with Z axis guide rail 30.Z axis pulse motor is linked in an end of Z axis ball-screw 34 36.If rotating Z axis ball-screw 34 using Z axis pulse motor 36, Z axis movable plate 32 is along Z axis guide rail 30 in Z axis side It moves up.

The main shaft housing 38 for constituting the tubular of cutting unit 18 is fixed in the lower part of Z axis movable plate 32.In main shaft housing The main shaft 40 as rotary shaft is accommodated in 38 (referring to Fig. 3).Reveal from the one end of main shaft housing 38 one end of main shaft 40 Outside is arrived out, and the cutting tool 42 for carrying out machining to machined object 11 is installed in an end of the main shaft 40. The rotary driving sources such as motor (not shown) is linked in the another side of main shaft 40.

The position adjacent with cutting unit 18 is provided with machined object 11 for being kept to chuck table 14 etc. The camera (shooting unit) 44 shot.If moving Y-axis moving plate 26 in the Y-axis direction using cutting unit mobile mechanism 22 Dynamic, then cutting unit 18 and camera 44 move (index feed) in the Y-axis direction.In addition, if utilizing cutting unit mobile mechanism 22 move Z axis movable plate 32 in the Z-axis direction, then cutting unit 18 and camera 44 move (incision feeding) in the Z-axis direction.

Opening 4b top and in the position lower than cutting unit 18, configured with tool position detection unit, (setting is single Member) 46, which is used for the Z axis side to the blade tip (front end of periphery) of cutting tool 42 To position (height) detected.In addition, being formed with opening in the position of the side opposite with the 4a that is open relative to opening 4b 4c.Configured with the cleaning unit 48 for being cleaned to the machined object 11 etc. after machining in opening 4c.

In X-axis mobile mechanism 10, cutting unit 18, cutting unit mobile mechanism 22, camera 44, tool position detection unit Control unit (setting unit) 50 is connected in each components such as 46.Control unit 50 is for example according to the processing of machined object 11 Condition etc. and each component of cutting apparatus 2 is controlled.

Fig. 3 is perspective view obtained by amplifying cutting unit 18 and tool position detection unit 46.In addition, being saved in Fig. 3 A part of structural element of cutting unit 18 is omited.As shown in figure 3, tool position detection unit 46, which has, is located at cutting unit 18 Lower section detector 54.Detector 54 for example comprising: supporting part 54a consists of substantially rectangular parallelepiped；And test section 54b is set to the top of the rear end side (side of X-direction) of supporting part 54a.

It is formed with cutter entrance 54c in the upper end of test section 54b, cutter entrance 54c is according to cutting tool Made of 42 modes being able to enter are cut off.Cutter entrance 54c has a pair of inside face faced in the Y-axis direction, The illumination region 56 and acceptance part 58 for constituting the sensor of optical profile type are each configured on a pair of inside face.That is, illumination region 56 Cutter entrance 54c is clipped with acceptance part 58 and is faced.

On the upper surface positioned at the supporting part 54a of the front side (other side of X-direction) of test section 54b, it is provided with Two air for providing air to illumination region 56 and acceptance part 58 provide nozzle 60.In addition, providing nozzle 60 in air Two liquid that front is provided with for providing the liquid such as water to illumination region 56 and acceptance part 58 provide nozzle 62.Such as passing through After the liquid for providing the offer of nozzle 62 from liquid cleans illumination region 56 and acceptance part 58, by providing nozzle from air Illumination region 56 and acceptance part 58 is dried in 60 air provided.

The cover 66 of rectangular-shape is installed on the rear end face of detector 54 by the connecting piece 64 by formation such as hinges. The inside of the cover 66 is hollow.Thus, for example pivoting about cover 66 with connecting piece 64, so as to will test portion 54b, air provide nozzle 60, liquid provides the inside that nozzle 62 etc. is accommodated in cover 66.

On the other hand, it is examined using position of the tool position detection unit 46 to the front end of the periphery of cutting tool 42 When survey, by the rotation of cover 66 to position shown in Fig. 3, test section 54b, air is set to provide nozzle 60, liquid provides the dew such as nozzle 62 Out.The position of the front end of its periphery is detected thereby, it is possible to make cutting tool 42 enter to cutter entrance 54c.

In the processing method of the machined object of present embodiment, first according to the periphery of above-mentioned cutting tool 42 before The height at end sets height (the altitude datum H as benchmark of cutting unit 18 in cutting apparatus 2₀) (benchmark sets work Sequence).Specifically, the cutting tool of rotation 42 to be positioned to the top of the detector 54 of tool position detection unit 46 first. Then, as shown in figure 3, declining cutting unit 18 in the state of from 56 radiating light of illumination region, make the cutting tool 42 of rotation Enter to cutter entrance 54c (between illumination region 56 and acceptance part 58).

The light radiated as a result, from illumination region 56 to acceptance part 58 is cut cutter 42 and partly blocks, acceptance part 58 by Light quantity slowly reduces.Light income (voltage value etc. that is equivalent to light income) and cutting unit 18 of the control unit 50 to acceptance part 58 Height monitored, such as using the light income of acceptance part 58 be reduced to as defined in threshold value when cutting unit 18 height as Altitude datum H₀And it is stored in the storage unit in control unit 50.

In the present embodiment, the front end of the periphery of cutting tool 42 is contacted with the retaining surface 14a of chuck table 14 When the height of cutting unit 18 be set as altitude datum H₀.That is, the threshold value etc. to the light income of acceptance part 58 is adjusted, with Just altitude datum H is set₀.But altitude datum H₀It may not necessarily front end according to the periphery of cutting tool 42 and chucking work The mode of the retaining surface 14a contact of platform 14 is set.

In addition, in the present embodiment, to using above-mentioned tool position detection unit 46 to set in a non-contact manner Altitude datum H₀Example be illustrated, but altitude datum H₀Setting method there is no limit.Such as it also can use in chuck Potential difference is formed between workbench 14 and cutting tool 42 and is contacted them and is confirmed the method for conducting to set altitude datum H₀。

Setting altitude datum H₀Later, according to the machined object 11 that can be suitably kept chuck table 14 The mode of cutting sets height (the object height H as target of cutting unit 18 in cutting apparatus 2₁) (goal-setting work Sequence).More specifically, it is held in chuck table 14 together with machined object 11 according to cutting tool 42 can be made to be cut into The mode of defined depth of dicing tape 21 set object height H₁。

Such as in dicing tape 21 with a thickness of T₀And wish that cutting tool 42 is cut into apart from the 1st face of the dicing tape 21 The depth of 21a is D₀Position in the case where (that is, the distance between lowest point of the 1st face 21a and cutting tool 42 is D₀Feelings Under condition), object height H₁For H₀+T₀-D₀。

Control unit 50 is by obtained object height H₁The storage unit being stored in control unit 50.In addition, in target Height H₁Calculating used in depth D₀Preferably 5 μm~35 μm, be typically 10 μm or so.But depth D₀Value can It is arbitrarily adjusted in the range of can suitably cut off machined object 11.

Setting altitude datum H₀With object height H₁Later, machining (the 1st skiver is carried out to machined object 11 Sequence).(A) of Fig. 4 and (B) of Fig. 4 show the side elevation in partial section for the case where carrying out machining to machined object 11.Specifically For, contact the dicing tape 21 of the back side side 11b for being pasted on machined object 11 with the retaining surface 14a of chuck table 14 And act on the negative pressure in attraction source.Then, frame 23 is fixed using fixture 16.Machined object 11 is in the positive side 11a as a result, It is kept in the state of exposing upwards.

Then, such as chuck table 14 is made to rotate and make the processing preset lines 13 of object and the X-direction of cutting apparatus 2 Alignment.In addition, chuck table 14 and cutting unit 18 is made relatively to move and make the aligned in position of cutting tool 42 in object Processing preset lines 13 extended line top.

Also, as shown in (A) of Fig. 4, cutting unit 18 is set to drop to target height while rotating cutting tool 42 Spend H₁.It is cut as a result, exposing of the cutting tool 42 between machined object 11 and frame 23 has in the 1st region of dicing tape 21 Enter to dicing tape 21.

Then, chuck table 14 is moved in the X-axis direction.Specifically, as shown in (A) of Fig. 4 and (B) of Fig. 4, Move chuck table 14 in the X-axis direction, so that cutting tool 42 is relatively moved to relative to machined object 11 2nd region of the opposite side in 1 region Yu Yu.

Machining is carried out to machined object 11 along the processing preset lines 13 of object as a result,.In addition, in the 2nd region In, also in the same manner as the 1st region, dicing tape 21 is exposed.In the present embodiment, chuck table 14 is moved in the X-axis direction Dynamic distance (distance for moving cutting tool 42 relatively) is set as x₀。

(A) of Fig. 5 is the equal top view of the machined object 11 after showing machining.The result of above-mentioned machining It is to be formed with (to cut the notch for the form that machined object 11 is cut off along the processing preset lines 13 of object on machined object 11 Opening) 11c.In the present embodiment, make cutting tool 42 follow the 1st region on one side be cut into dicing tape 21 while relatively to move To the 2nd region.Therefore, it as shown in (A) of Fig. 5, is formed with and connects also by with the contact of cutting tool 42 in dicing tape 21 Touch trace 21b.

Such as machining is carried out to machined object 11 in the processing preset lines 13 along object, and in dicing tape 21 After foring contact trace 21b, obtains and be used for above-mentioned object height H₁Correction corrected value (corrected value acquisition process).At this In embodiment, according to the depth of the calculated contact trace 21b of the outer diameter (diameter) of length and cutting tool 42 by contact trace 21b It spends and obtains corrected value.

In addition, here for ease of description, being cut machined object 11 along a processing preset lines 13 The example that corrected value is obtained after processing is illustrated, but can also along a plurality of processing preset lines 13 to machined object 11 It has carried out obtaining corrected value after machining.The quantity of the processing preset lines 13 of machining is carried out before obtaining corrected value (that is, utilize the 1st cutting process carry out machining processing preset lines quantity) etc. according to the shape of the abrasion of cutting tool 42 Condition etc. is adjusted.

(B) of Fig. 5 is concept map, is shown in the case where cutting cutting tool 42 in situ (that is, not making cutting tool 42 In the case where relatively moving in the X-axis direction) it is formed by the depth D of contact trace.According to geometry shown in (B) of Fig. 5 The diameter of cutting tool 42 is set as d by relationship, and the length (length in X-direction) of the contact trace is set as L₀, with formula (1) Indicate the depth D that contact trace is formed by the case where cutting cutting tool 42 in situ.

[formula 1]

(1)

As described above, in the present embodiment, will make that cutting tool 42 relatively moves in order to form contact trace 21b away from From being set as x₀.Therefore, when by contact trace 21b length (length in X-direction) be set as L₁When, L₀=L₁-x₀.That is, using Contact the length L of trace 21b₁The depth D of contact trace 21b is indicated with formula (2)₁(≈D)。

[formula 2]

(2)

As a result, when obtaining corrected value, the length L of contact trace 21b is obtained first₁.In the present embodiment, camera is utilized 44 couples of contact trace 21b are shot and form image, and according to the contact trace 21b taken in the image, control unit 50 is calculated Length L out₁.In addition, shooting and the length L of contact trace 21b₁Obtain can be with the machining of above-mentioned machined object 11 simultaneously It carries out capablely.In this case, a part that corrected value obtains process carries out simultaneously with the 1st cutting process.

The distance x of the relative movement of the diameter d and cutting tool 42 of cutting tool 42₀It is known.It calculates and connects as a result, Touch the length L of trace 21b₁, so that the depth D of contact trace 21b can be calculated according to above-mentioned formula (2)₁.It is cut caused by abrasion etc. Depth D of the reduction of the diameter d of cutting knife tool 42 to contact trace 21b₁It has little effect, therefore can ignore.

Control unit 50 is in the depth D for calculating contact trace 21b₁Later, according to depth D₁And obtain corrected value.At this In embodiment, object height H will calculated₁The depth D of Shi Suoyong₀With the depth D of contact trace 21b₁Difference (D₀-D₁) it is used as school Positive value.The storage unit that control unit 50 obtains corrected value and is stored in control unit 50.

After obtaining corrected value, cutting unit 18 is positioned at, object height H is corrected by the corrected value₁Height It spends and machining (the 2nd cutting process) is carried out to machined object 11.(A) of Fig. 6 is to show to cut machined object 11 The side elevation in partial section of the case where processing, (B) of Fig. 6 are the equal top views of the machined object 11 after showing machining.

The step of specific machining, is identical as the 1st above-mentioned cutting process.Specifically, making chuck table first 14 and cutting unit 18 relatively move and by the aligned in position of cutting tool 42 the processing preset lines 13 of object extended line Top.In addition, in the court for the direction and the processing preset lines 13 of object for just having carried out the processing preset lines 13 of machining before In the case where difference, need that chuck table 14 is made to rotate and make the processing preset lines 13 of object and the X of cutting apparatus 2 in advance Axis direction alignment.

Then, as shown in (A) of Fig. 6, make as defined in cutting unit 18 drops to while rotating cutting tool 42 Height H₂.In the present embodiment, such as by object height H₁With corrected value (D₀-D₁) difference, that is, H₁-(D₀-D₁) as defined Height H₂.This means that it is lower to be positioned at the amount that shoals of incision by cutting unit 18 Position.

Then, chuck table 14 is moved in the X-axis direction.Added as a result, along 13 Duis of the processing preset lines of object Work object 11 carries out machining.(B) of Fig. 6 is the equal top view of the machined object 11 after showing machining.Above-mentioned cutting Processing as a result, the mode that machined object 11 is cut off in the formation of processing preset lines 13 on machined object 11 along object Notch (cutting opening) 11d.

Here, by according to corrected value acquired in above-mentioned step to object height H₁Be corrected, therefore even if In the case that cutting tool 42 is worn, the cutting tool 42 can be also set to be cut into height appropriate and to machined object 11 Carry out machining.In addition, being corrected value again later in the case where cutting tool 42 has occurred and wears etc. and obtaining process And it obtains corrected value and then carries out further cutting process.

As described above, being formed in the processing method of the machined object of present embodiment according to by cutting tool 42 Corrected value is obtained in the length of the contact trace 21b of dicing tape 21, which is used for the height as target of cutting unit 18 Then cutting unit 18 is positioned at the height corrected by the corrected value and carried out to machined object 11 by the correction of degree Machining.

As a result, when being worn cutting tool 42, even if not utilizing tool position detection unit (setting unit) 46 Height Deng the front end of the periphery to cutting tool 42 detects, and can also suitably adjust the height of cutting unit 18.That is, When adjusting the height of cutting tool 42, it is not necessary to as making the distance increase of the relative movement of cutting tool 42 just can in the past It realizes, therefore productivity will not be greatly reduced and the height of cutting tool 42 can be suitably adjusted.

In addition, the record that the present invention is not limited to the above embodiments, various modifications may be made and implements.Such as above-mentioned In embodiment, in the 1st cutting process for carrying out machining to machined object 11, notch is formed on machined object 11 11c and the formation contact trace 21b in dicing tape 21, but can also be connect after the 1st cutting process using other processes formation Touch trace (contact trace formation process).

Fig. 7 is to show to bow using what the dicing tape 21 that process different from the embodiment described above forms contact trace 21c waited View.In the case where forming such contact trace 21c, such as in the processing preset lines using the 1st cutting process along object After 13 pairs of machined objects 11 carry out machining, it is cut into cutting tool 42 more more outward than the 2nd region (that is, frame 23 Side) the 3rd region.

That is, increase cutting unit 18, into And move chuck table 14 in the X-axis direction.Specifically, move chuck table 14 in the X-axis direction, so that Cutting tool 42 is relatively moved to the top in the 3rd region.

Then, such as in the state that chuck table 14 is not mobile cutting unit 18 is made to drop to object height H₁.Its It is drawn as a result, exposing of the cutting tool 42 between machined object 11 and frame 23 has to be cut into the 3rd region of dicing tape 21 Piece band 21.

Contact trace 21c is formed in dicing tape 21 as a result,.In this way the step of is cut in situ and shape by making cutting tool 42 At contact trace 21c length (length in X-direction) L₂With the length L of the contact trace in above-mentioned formula (1)₀It is equal.As a result, Control unit 50 can calculate the depth D of contact trace 21c according to formula (1)₂(=D).

In addition to this, the structure of above embodiment, method etc., then can be with without departing from the range of the purpose of the present invention It is suitably changed and implemented.