阅读说明：本技术 一种泥状双组份高导热系数界面填隙材料及其制备方法 (A kind of pureed two-component high thermal conductivity coefficient interface sealant and preparation method thereof ) 是由 费伟康 于 2019-07-17 设计创作，主要内容包括：本发明一种泥状双组份高导热系数界面填隙材料,由A组分和B组分组成,且A组份与B组份按1:1的重量比进行混合,A组分包括如下组分及其重量百分比含量：乙烯基硅油3-5%、催化剂0.01-0.05%、偶联剂0.2-0.8%、导热填料余量；B组分包括如下组分及其重量百分比含量：乙烯基硅油3-5%、含氢硅油0.2-0.7%、抑制剂0.01-0.05%、偶联剂0.2-0.8%、导热填料余量。本发明所述双组分泥状导热界面填隙材料,具有较高的导热系数,既可满足敏感器件的高导热需求,还可以大大吸收在安装时所产生的瞬间应力,达到保护器件的作用,并且还能够减少人工需求,并有效地提高生产效率和材料使用率。(A kind of pureed two-component high thermal conductivity coefficient interface of the invention sealant, it is made of component A and B component, and component A is mixed with B component by the weight ratio of 1:1, component A includes following component and its weight percent content: vinyl silicone oil 3-5%, catalyst 0.01-0.05%, coupling agent 0.2-0.8%, heat filling surplus；B component includes following component and its weight percent content: vinyl silicone oil 3-5%, containing hydrogen silicone oil 0.2-0.7%, inhibitor 0.01-0.05%, coupling agent 0.2-0.8%, heat filling surplus.Bi-component pureed thermally-conductive interface sealant of the present invention; thermal coefficient with higher; both the high thermal conductivity demand of Sensitive Apparatus can have been met; generated moment stress during installation can also be absorbed significantly; have the function that protect device; and artificial demand can also be reduced, and effectively improves production efficiency and materials'use rate.)

1. a kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that be made of component A and B component, and A group Part is mixed with B component by the weight ratio of 1:1,

The component A includes following component and its weight percent content: vinyl silicone oil 3-5%, catalyst 0.01-0.05%, Coupling agent 0.2-0.8%, heat filling surplus；

The B component includes following component and its weight percent content: vinyl silicone oil 3-5%, containing hydrogen silicone oil 0.2-0.7%, Inhibitor 0.01-0.05%, coupling agent 0.2-0.8%, heat filling surplus.

2. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that the second Alkenyl silicone oil is vinyl-terminated silicone fluid, and viscosity 50-100mPas, contents of ethylene is 1-2 mol%.

3. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that described to contain Hydrogen silicone oil is Methyl Hydrogen Polysiloxane Fluid, viscosity 10-50mm²/ s, hydrogen content >=1.5%.

4. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that described to urge Agent is platinum catalyst, platinum content 20000-30000ppm.

5. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that the idol Connection agent is one of silane coupling agent, titanate coupling agent, aluminate coupling agent or more than one mixture.

6. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that described to lead Hot filler is one of aluminium oxide, zinc oxide, boron nitride, aluminium nitride, silica or more than one mixture.

7. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that described to lead The size distribution of hot filler are as follows: 0.1-1um particle size distribution powder weight ratio accounts for 15%-20%；5-15um particle size distribution Powder weight ratio accounts for 20%-25%；50-90um particle size distribution powder weight ratio accounts for 10%-15%, 90-120um size distribution model It encloses powder weight ratio and accounts for 45%-50%.

8. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that component A Preparation the following steps are included:

1) coupling agent is made into the dilution of 1%-4% concentration, being sprayed at heat filling, granularity that granularity is 5-15um respectively is The heat filling and granularity of 50-90um is the heat filling surface of 90-120um, and constantly stirs to heat filling, makes it uniformly Coupling agent dilution, and the drying and processing in 100-120 DEG C of baking oven are touched, pretreatment heat filling is obtained；

2) successively vinyl silicone oil, catalyst, coupling agent are added into double kneaders, are sufficiently stirred, mix three Uniformly, mixed solution is obtained；

3) it is added into mixed solution made from step 2 pretreated in the heat filling and step 1 that granularity is 0.1-1um Heat filling carries out being sufficiently stirred 30-50 minutes under vacuum conditions, and component A is made.

9. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that B component Preparation the following steps are included:

1) coupling agent is made into the dilution of 1%-4% concentration, being sprayed at heat filling, granularity that granularity is 5-15um respectively is The heat filling and granularity of 50-90um is the heat filling surface of 90-120um, and constantly stirs to heat filling, makes it uniformly Coupling agent dilution, and the drying and processing in 100-120 DEG C of baking oven are touched, pretreatment heat filling is obtained；

2) successively vinyl silicone oil, containing hydrogen silicone oil, inhibitor, coupling agent are added into double kneaders, are sufficiently stirred, mixed Close uniform mixed solution；

3) it is added into mixed solution made from step 2 pretreated in the heat filling and step 1) that granularity is 0.1-1um Heat filling carries out being sufficiently stirred 30-50 minutes under vacuum conditions, and B component is made.

Technical field

The invention belongs to Heat Conduction Material technical fields, and in particular to a kind of pureed two-component high thermal conductivity coefficient interface calking material Material and preparation method thereof.

Background technique

With the continuous complication of integrated circuit, the packing density of electronic integrated board increases, and the fever under unit area is close Degree increases, and Functional Unit device miniaturization, more sensitive to mount stress, and easily stress is excessive leads to component damage or can Decline by property, therefore conventional thermal conductive silica gel piece (heat-conducting pad) has been unable to satisfy now or even following growth requirement, and tradition Cooling requirements are not achieved in thermally conductive gel thermal coefficient.Meanwhile with the raising of processing cost, using labor-intensive as primary operational The heat-conducting pad of mode has been unable to meet current cost needs, and cost of labor pressure increases.

Summary of the invention

Aiming at the problems existing in the prior art, what the present invention designed is designed to provide a kind of quick applied to mount stress The pureed two-component high thermal conductivity coefficient interface sealant of inductor component.Its thermal coefficient with higher, can both meet sensor The thermally conductive demand of part can also absorb generated moment stress during installation significantly, have the function that protect device, and also Artificial demand can be reduced, and effectively improves production efficiency and materials'use rate.

The present invention is realized by the following technical programs:

A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that it is made of component A and B component, And component A is mixed with B component by the weight ratio of 1:1,

The component A includes following component and its weight percent content: vinyl silicone oil 3-5%, catalyst 0.01-0.05%, Coupling agent 0.2-0.8%, heat filling surplus；

The B component includes following component and its weight percent content: vinyl silicone oil 3-5%, containing hydrogen silicone oil 0.2-0.7%, Inhibitor 0.01-0.05%, coupling agent 0.2-0.8%, heat filling surplus.

A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the vinyl silicone oil is Vinyl-terminated silicone fluid, viscosity 50-100mPas, contents of ethylene are 1-2 mol%.

A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the containing hydrogen silicone oil is first Base containing hydrogen silicone oil, viscosity 10-50mm²/ s, hydrogen content >=1.5%.

A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the catalyst is urged for platinum Agent, platinum content 20000-30000ppm.

A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the coupling agent is silane One of coupling agent, titanate coupling agent, aluminate coupling agent or more than one mixture.

A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the heat filling is oxygen Change one of aluminium, zinc oxide, boron nitride, aluminium nitride, silica or more than one mixture.

A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the grain of the heat filling Degree distribution are as follows: 0.1-1um particle size distribution powder weight ratio accounts for 15%-20%；5-15um particle size distribution powder weight ratio Account for 20%-25%；50-90um particle size distribution powder weight ratio accounts for 10%-15%, 90-120um particle size distribution powder weight Than accounting for 45%-50%.

A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the preparation of component A includes Following steps:

1) coupling agent is made into the dilution of 1%-4% concentration, being sprayed at heat filling, granularity that granularity is 5-15um respectively is The heat filling and granularity of 50-90um is the heat filling surface of 90-120um, and constantly stirs to heat filling, makes it uniformly Coupling agent dilution, and the drying and processing in 100-120 DEG C of baking oven are touched, pretreatment heat filling is obtained；

2) successively vinyl silicone oil, catalyst, coupling agent are added into double kneaders, are sufficiently stirred, mix three Uniformly, mixed solution is obtained；

3) it is added into mixed solution made from step 2 pretreated in the heat filling and step 1 that granularity is 0.1-1um Heat filling carries out being sufficiently stirred 30-50 minutes under vacuum conditions, and component A is made.

A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the preparation of B component includes Following steps:

1) coupling agent is made into the dilution of 1%-4% concentration, being sprayed at heat filling, granularity that granularity is 5-15um respectively is The heat filling and granularity of 50-90um is the heat filling surface of 90-120um, and constantly stirs to heat filling, makes it uniformly Coupling agent dilution, and the drying and processing in 100-120 DEG C of baking oven are touched, pretreatment heat filling is obtained；

2) successively vinyl silicone oil, containing hydrogen silicone oil, inhibitor, coupling agent are added into double kneaders, are sufficiently stirred, mixed Close uniform mixed solution；

3) it is added into mixed solution made from step 2 pretreated in the heat filling and step 1) that granularity is 0.1-1um Heat filling carries out being sufficiently stirred 30-50 minutes under vacuum conditions, and B component is made.

Bi-component pureed thermally-conductive interface sealant of the present invention, thermal coefficient with higher can both meet sensitivity The high thermal conductivity demand of device can also absorb generated moment stress during installation significantly, have the function that protect device, and And artificial demand can also be reduced, and effectively improve production efficiency and materials'use rate.It is used thermally conductive on the market at present All there is certain integrity problem in gel, but bi-component pureed thermally-conductive interface sealant of the present invention is installed in sizing Cheng Houke is solidified by specific temperature, guarantees its environmental reliability.

When the present invention pureed thermally-conductive interface sealant heat-conducting pad advantage is to install, material is to component Stress is smaller, the stress of extraneous moment generation can be absorbed by deformation, so that component is protected, to avoid component damage；This Invention is compared with heat-conducting cream advantage, and heat-conducting cream is suitable for " zero pair zero " contact gap of filling, can not fill biggish between component Gap or gap, and pureed thermally-conductive interface sealant of the present invention, because it has excellent wetability to device surface, and Inherent upright thixotropy is suitable for various specifications gap；The present invention is compared with one-component thermally conductive gel advantage, will not after use Sliding occurs and overflow problem occurs.

The full cross-linked collocation between coupling agent in the present invention between organic matter matrix, so that final products have Excellent unfailing performance, in 150 DEG C, in 1000 hours long-term aging tests, properties of product are unchanged, and do not occur it is dry and cracked, Become the fail results such as powder.

Specific embodiment

Below in conjunction with specific embodiment, the invention will be described in further detail.