阅读说明：本技术 一种cof基板高强度凸块的制造方法 (A kind of manufacturing method of COF substrate high intensity convex block ) 是由 戚爱康 王健 计晓东 孟庆园 孙彬 沈洪 李晓华 于 2019-08-23 设计创作，主要内容包括：本发明涉及一种COF基板高强度凸块的制造方法,属于COF基板技术领域。依次进行第一次光刻胶工序,第一蚀刻工序,湿法全蚀刻,第二光刻胶工序,第二蚀刻工序,压合工序,第三光刻胶工序,第三蚀刻工序,电镀铜工序,第四光刻胶工序,电镀镍金工序；与通过传统的电镀处理所形成的凸块相比,凸块的高度偏差会减小。即使是同样的电镀处理,在采用无电解电镀的情况下,比使用有电解电镀时,凸块高度偏差变小,电解电镀因电流集中等原因,镀层的增长速度容易发生波动,而无电解电镀的情况下,不会发生这种现象,整体上镀层会均匀地增长。与传统的电镀处理形成的凸块相比,能够降低凸块的高度偏差,提高生产效率。(The present invention relates to a kind of manufacturing methods of COF substrate high intensity convex block, belong to COF matrix technique field.First time photoetching glue process, the first etching work procedure are successively carried out, wet process total eclipse is carved, the second photoetching glue process, the second etching work procedure, pressing working procedure, third photoetching glue process, and copper process, the 4th photoetching glue process, nickel-gold electroplating sequence is electroplated in third etching work procedure；Compared with being formed by convex block by traditional electroplating processes, the height tolerance of convex block can reduce.Even same electroplating processes, using electroless plating, when than having used electrolysis to be electroplated, bump height deviation becomes smaller, because of reasons such as current convergences, the growth rate of coating is easy to happen fluctuation for electrolysis plating, and in the case where electroless plating, this phenomenon will not occur, coating can equably increase on the whole.Compared with the convex block that traditional electroplating processes are formed, the height tolerance of convex block can reduce, improve production efficiency.)

1. a kind of manufacturing method of COF substrate high intensity convex block characterized by comprising

First time photoetching glue process, the resist coating (21) on the copper foil (11) of insulating substrate (1), using film egative film to coating The insulating substrate (1) of photoresist (21) is exposed, and development retains the photoetching agent pattern (22) of needs；

First etching work procedure carries out wet process total eclipse to insulating substrate (1) with the photoetching agent pattern (22) of reservation as resist layer It carves, obtains the first lug boss of convex block (31), spend membrane solvent and remove photoetching agent pattern (22) on the first lug boss (31), obtain To the first lug boss of convex block (31) of complete naked leakage；

Second photoetching glue process, on the insulating substrate (1) of the first lug boss of convex block (31) obtained after the first etching work procedure, pressure One layer of dry film I (23) is exposed the insulating substrate (1) after being coated with dry film I (23) using film egative film, and development will be required Dry film pattern I (24) retain；

It is complete to carry out wet process to insulating substrate (1) with the dry film pattern I (24) remained as resist layer for second etching work procedure Etching, obtains the second lug boss of convex block (32), then spends membrane solvent removal dry film pattern I (24) and obtains the convex block of complete naked leakage First lug boss (31) and the second lug boss of convex block (32)；

Pressing working procedure obtains the insulation of the first lug boss of convex block (31) and the second lug boss of convex block (32) after the second etching work procedure In substrate (1) back copper foil (12), laminating layer insulating layer (13) forms new substrate (1-1)；

Third photoetching glue process, it is convex in the first lug boss of convex block (31) and convex block second of the substrate (1-1) that pressing working procedure obtains It rises on portion (32), presses one layer of dry film II (25), be exposed using substrate (1-1) of the film egative film to coating dry film II (25), Development retains the dry film pattern II (26) of needs；

Third etching work procedure carries out wet process total eclipse to substrate (1-1) with the dry film pattern II (26) remained as resist layer It carves, obtains convex block third protrusion portion (33)；

Copper process is electroplated, it is convex in the first lug boss of convex block (31), convex block second by the method for electro-coppering on substrate (1-1) The outer surface copper facing of portion (32) and convex block third protrusion portion (33) is played, so that the first lug boss of convex block (31), the second protrusion of convex block Portion (32) and convex block third protrusion portion (33) are plated layers of copper (51) covering, are integrally formed；

4th photoetching glue process, in the first lug boss of convex block (31), the second lug boss of convex block for being plated layers of copper (51) covering (32) laminating layer dry film III (27) and on the substrate (1-1) in convex block third protrusion portion (33), using film egative film to being coated with Substrate (1-1) after dry film III (27) is exposed, and development will need dry film pattern III (28) and opening (41) to remain；

Dry film pattern III (28) is used as mask and carries out electroless plating nickel gold, covers electricity with nickel film (52) by nickel-gold electroplating sequence The surface of copper plate (51) then spends membrane solvent and removes dry film pattern III (28), obtains the convex block (3) of complete naked leakage.

2. a kind of manufacturing method of COF substrate high intensity convex block according to claim 1, it is characterised in that: described is exhausted Edge substrate (1) is made of insulating substrate (10), copper foil (11) and back copper foil (12) with electrical insulating property, insulating substrate (1) Using double-side copper-applying.

3. a kind of manufacturing method of COF substrate high intensity convex block according to claim 2, it is characterised in that: the copper Foil (11) is with a thickness of 8um-16um, and insulating substrate (10) is polyimides, with a thickness of the flexible insulation substrate of 15-125um.

4. a kind of manufacturing method of COF substrate high intensity convex block according to claim 1, it is characterised in that: described In photoetching glue process, photoresist (21) is using any one of positivity or negativity, to the copper foil of insulating substrate (1) before coating (11) microetch is carried out.

5. a kind of manufacturing method of COF substrate high intensity convex block according to claim 1, it is characterised in that: described In two photoetching glue process, third photoetching glue process and the 4th photoetching glue process, press mold is carried out by vacuum press molding machine.

6. a kind of manufacturing method of COF substrate high intensity convex block according to claim 1, it is characterised in that: described In two etching work procedures, when carrying out wet process total eclipse quarter to insulating substrate (1), contain sodium permanganate using the liquid medicine for etching non-polyimides Or the medical fluid of potassium permanganate vertically sprays sodium permanganate or Gao Meng to the convex block on insulating substrate (1) by using spray mode Sour potassium etches medical fluid, reaches and is fully etched polyimides.

7. a kind of manufacturing method of COF substrate high intensity convex block according to claim 1, it is characterised in that: the pressure It closes in process, the material of insulating layer (13) is polyimides, and thickness is in 15-125um.

8. a kind of manufacturing method of COF substrate high intensity convex block according to claim 1, it is characterised in that: the electricity In plating nickel gold process, component of the thickness of nickel film (52) in 2-10 μm of nickel film (52), nickel 87-98%, phosphorus 2-13%.

9. a kind of manufacturing method of COF substrate high intensity convex block according to claim 1, it is characterised in that: the electricity In plating nickel gold process, heat treatment is carried out after plating and be heat-treated within 1 hour using 300 ~ 500 DEG C, improves nickel film (52) Hardness.

Technical field

The present invention relates to a kind of manufacturing methods of COF substrate high intensity convex block, belong to COF matrix technique field.

Background technique

With the continuous development of science and technology, electronic product increasingly can to miniaturization, intelligence, high-performance and height Develop by property direction.For package substrate by FPC as COF transition, the PTCH value of COF substrate is smaller and smaller, for the pin in encapsulation Increasingly, intensive and accurate, and integrated antenna package not only directly affects the property of integrated circuit, electronic module or even complete machine Can, but also restrict miniaturization, low cost and the reliability of entire electronic system.It gradually contracts in IC wafer size Small, in the case that integrated level is continuously improved, electronics industry proposes increasingly higher demands to integrated antenna package technology.In order to Realize the connection between internal components and external devices, convex block is generally formed in the external terminal or active around semiconductor chip On the external terminal formed in the presumptive area array in area.Bump material is generally solder such as gold (Au), sn-ag alloy (Sn-Ag) Or similar metal material composition.The key property index of golden convex block is exactly hardness, flatness and microminiaturization.

Existing technology is all after by the layer covering with photoresist of the wiring on insulating substrate, by the photoresist layer Implement exposure, development treatment, forms the photoetching agent pattern for being formed on predetermined position and there is opening portion in convex block.At this point, photoetching The opening of glue has part copper to expose.Then, on the copper face exposed in above-mentioned opening portion, by electrolysis plating by metallic copper into Row deposition, forms copper bump.Then, the photoetching agent pattern that electrolysis plating uses is removed from insulating substrate.

Route and lug surface on insulating substrate are covered with the electronickelling gold of protection.Through electrolysis plating in wiring Form convex block.In the case that the height of block is got higher, it can lead to the problem of following.In electrolysis plating, the growth rate of convex block goes out Local difference is showed.Therefore, the bump height obtained after electroplating gold is easy to produce error.Especially, as the height of convex block is got over Height, because the growth rate difference of plating causes the difference in height of the convex block caused also can be bigger.To improve the height of convex block, just have to Increase the weight of plating metal.Therefore, the electroplating processes time will grow longer, and production efficiency can also decline.

Summary of the invention

Place, the present invention provide a kind of manufacture of COF substrate high intensity convex block in order to overcome the above-mentioned deficiencies of the prior art Method guarantees bump height planarizing, the deviation of the height of convex block is reduced, to improve production efficiency；Convex block can be improved Hardness can also make the diameter microminiaturization of convex block, and providing one kind can inhibit convex block de- during and after manufacturing circuit board It falls and keeps the intensity of convex block and increase the technology of the height of convex block.

The present invention is achieved through the following technical solutions: a kind of manufacturing method of COF substrate high intensity convex block, feature It is, comprising:

First time photoetching glue process, the resist coating on the copper foil of insulating substrate, using film egative film to being coated with photoresist Insulating substrate is exposed, and development retains the photoetching agent pattern of needs；

First etching work procedure carries out wet process total eclipse quarter to insulating substrate, obtains convex with the photoetching agent pattern of reservation as resist layer The first lug boss of block spends membrane solvent and removes photoetching agent pattern on the first lug boss, obtains the convex block first of complete naked leakage Lug boss；

Second photoetching glue process, on the insulating substrate of the first lug boss of convex block obtained after the first etching work procedure, press one layer it is dry Film I is exposed the insulating substrate after being coated with dry film I using film egative film, and development retains required dry film pattern I；

Second etching work procedure carries out wet process total eclipse quarter to insulating substrate, obtains with the dry film pattern I remained as resist layer To the second lug boss of convex block, then spends membrane solvent removal dry film pattern I and obtain the first lug boss of convex block of complete naked leakage and convex The second lug boss of block；

Pressing working procedure obtains the insulating substrate back side of the second lug boss of the first lug boss of convex block and convex block after the second etching work procedure On copper foil, laminating layer insulating layer forms new substrate；

Third photoetching glue process, on the second lug boss of the first lug boss of convex block and convex block for the substrate that pressing working procedure obtains, pressure One layer of dry film II is exposed using substrate of the film egative film to coating dry film II, and development retains the dry film pattern II of needs；

Third etching work procedure carries out wet process total eclipse quarter to substrate, obtains convex with the dry film pattern II remained as resist layer Block third protrusion portion；

Copper process is electroplated, by the method for electro-coppering on substrate, in the first lug boss of convex block, the second lug boss of convex block and convex block The outer surface copper facing in third protrusion portion, so that the first lug boss of convex block, the second lug boss of convex block and convex block third protrusion portion are electric Copper plate covering, is integrally formed；

4th photoetching glue process, in the first lug boss of convex block, the second lug boss of convex block and the convex block third for being plated layers of copper covering Laminating layer dry film III on the substrate of lug boss is exposed the substrate after being coated with dry film III using film egative film, development Dry film pattern III and opening will be needed to remain；

Dry film pattern III is used as mask and carries out electroless plating nickel gold by nickel-gold electroplating sequence, with nickel film covering copper electroplating layer Surface then spends membrane solvent and removes dry film pattern III, obtains the convex block of complete naked leakage.

The insulating substrate is made of insulating substrate, copper foil and back copper foil with electrical insulating property, and insulating substrate is adopted Use double-side copper-applying.

Preferably, the copper thickness is 8um-16um, and insulating substrate is polyimides, with a thickness of 15-125um's Flexible insulation substrate.

Preferably, in the first time photoetching glue process, photoresist is using any one of positivity or negativity, before coating Microetch is carried out to the copper foil of insulating substrate.

Preferably, in the second photoetching glue process, third photoetching glue process and the 4th photoetching glue process, pass through vacuum Molding press carries out press mold.

Preferably, it in second etching work procedure, when carrying out wet process total eclipse quarter to insulating substrate, uses and etches non-polyamides Medical fluid of the liquid medicine of imines containing sodium permanganate or potassium permanganate, it is vertical to the convex block on insulating substrate by using spray mode It sprays sodium permanganate or potassium permanganate etches medical fluid, reach and be fully etched polyimides.

Preferably, in the pressing working procedure, the material of insulating layer is polyimides, and thickness is in 15-125um.

Preferably, in the nickel-gold electroplating sequence, in the component of 2-10 μm of nickel film, nickel is for the thickness of nickel film 87-98%, phosphorus 2-13%.

Preferably, in the nickel-gold electroplating sequence, it is small using 300 ~ 500 DEG C of progress 1 that heat treatment is carried out after plating When be heat-treated, improve nickel film hardness.

The beneficial effects of the present invention are: the height of convex block is inclined compared with being formed by convex block by traditional electroplating processes Difference can reduce.It is convex when than having used electrolysis to be electroplated using electroless plating even same electroplating processes Block height tolerance becomes smaller, and electrolysis plating is because of reasons such as current convergences, and the growth rate of coating is easy to happen fluctuation, and electroless electricity In the case where plating, this phenomenon will not occur, coating can equably increase on the whole.The convex block formed with traditional electroplating processes It compares, can reduce the height tolerance of convex block, improve production efficiency.

Detailed description of the invention

Below according to drawings and examples, the present invention is further described.

Fig. 1 is insulating substrate schematic diagram of the present invention；

Fig. 2 is first time photoetching glue process schematic diagram of the invention；

Fig. 3 is the first etching work procedure schematic diagram of the invention；

Fig. 4 is the second photoetching glue process schematic diagram of the invention；

Fig. 5 is the second etching work procedure schematic diagram of the invention；

Fig. 6 is pressing working procedure schematic diagram of the present invention；

Fig. 7 is third photoetching glue process schematic diagram of the present invention；

Fig. 8 is third etching work procedure schematic diagram of the present invention；

Fig. 9 is present invention plating copper process schematic diagram；

Figure 10 is the 4th photoetching glue process schematic diagram of the invention；

Figure 11 is nickel-gold electroplating sequence schematic diagram of the present invention；

Figure 12 is convex block partial enlargement diagram of the present invention.

In figure: 1, insulating substrate, 1-1, substrate, 10, insulating substrate, 11, copper foil, 12, back copper foil, 13, insulating layer, 21, photoresist, 22, photoetching agent pattern, 23, dry film I, 24, dry film pattern I, 25, dry film II, 26, dry film pattern II, 27, Dry film III, 28, dry film pattern III, 3, convex block, 31, the first lug boss of convex block, 32, the second lug boss of convex block, 33, convex block third Lug boss, 41, opening, 51, copper electroplating layer, 52, nickel film.

Specific embodiment

Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other Embodiment shall fall within the protection scope of the present invention.

In conjunction with shown in Fig. 1 to Figure 12, a kind of manufacturing method of COF substrate high intensity convex block characterized by comprising

First time photoetching glue process, the resist coating 21 on the copper foil 11 of insulating substrate 1, using film egative film to being coated with photoetching The insulating substrate 1 of glue 21 is exposed, and development retains the photoetching agent pattern 22 of needs；

First etching work procedure carries out wet process total eclipse quarter to insulating substrate 1, obtains with the photoetching agent pattern 22 of reservation as resist layer To the first lug boss of convex block 31, spends membrane solvent and remove photoetching agent pattern 22 on the first lug boss 31, obtain complete naked leakage The first lug boss of convex block 31；

Second photoetching glue process on the insulating substrate 1 of the first lug boss of convex block 31 obtained after the first etching work procedure, presses one layer Dry film I 23 is exposed the insulating substrate 1 after being coated with dry film I 23 using film egative film, develops required dry film pattern I 24 retain；

Second etching work procedure carries out wet process total eclipse quarter to insulating substrate 1 with the dry film pattern I 24 remained as resist layer, The second lug boss of convex block 32 is obtained, membrane solvent removal dry film pattern I 24 is then spent and obtains the first protrusion of convex block of complete naked leakage Portion 31 and the second lug boss of convex block 32；

Pressing working procedure obtains the insulating substrate of the first lug boss of convex block 31 and the second lug boss of convex block 32 after the second etching work procedure In 1 back copper foil 12, laminating layer insulating layer 13 forms new substrate 1-1；

Third photoetching glue process, in the second lug boss of the first lug boss of convex block 31 and convex block for the substrate 1-1 that pressing working procedure obtains On 32, one layer of dry film II 25 is pressed, is exposed, is developed needs using substrate 1-1 of the film egative film to coating dry film II 25 Dry film pattern II 26 retains；

Third etching work procedure carries out wet process total eclipse quarter to substrate 1-1 with the dry film pattern II 26 remained as resist layer, Obtain convex block third protrusion portion 33；

Copper process is electroplated, by the method for electro-coppering on substrate 1-1, in the first lug boss of convex block 31, the second lug boss of convex block 32 and convex block third protrusion portion 33 outer surface copper facing so that the first lug boss of convex block 31, the second lug boss of convex block 32 and convex block Third protrusion portion 33 is plated the covering of layers of copper 51, is integrally formed；

4th photoetching glue process, in the first lug boss of convex block 31, the second lug boss of convex block 32 and convex for being plated the covering of layers of copper 51 Laminating layer dry film III 27 on the substrate 1-1 in block third protrusion portion 33, using film egative film to the base after being coated with dry film III 27 Plate 1-1 is exposed, and development will need dry film pattern III 28 and opening 41 to remain；

Dry film pattern III 28 is used as mask and carries out electroless plating nickel gold, covers electro-coppering with nickel film 52 by nickel-gold electroplating sequence The surface of layer 51, then spends membrane solvent and removes dry film pattern III 28, obtains the convex block 3 of complete naked leakage.

The insulating substrate 1 is made of insulating substrate 10, copper foil 11 and back copper foil 12 with electrical insulating property, insulation Substrate 1 uses double-side copper-applying.

Preferably, the copper foil 11 is with a thickness of 8um-16um, and insulating substrate 10 is polyimides, with a thickness of 15- The flexible insulation substrate of 125um.

Preferably, in the first time photoetching glue process, photoresist 21 uses any one of positivity or negativity, coating The preceding copper foil 11 to insulating substrate 1 carries out microetch.

Preferably, in the second photoetching glue process, third photoetching glue process and the 4th photoetching glue process, pass through vacuum Molding press carries out press mold.

Preferably, non-poly- using etching when carrying out wet process total eclipse quarter to insulating substrate 1 in second etching work procedure Medical fluid of the imido liquid medicine containing sodium permanganate or potassium permanganate hangs down to the convex block on insulating substrate 1 by using spray mode Direct-injection penetrates sodium permanganate or potassium permanganate etching medical fluid, reaches and is fully etched polyimides.

Preferably, in the pressing working procedure, the material of insulating layer 13 is polyimides, and thickness is in 15-125um.

Preferably, in the nickel-gold electroplating sequence, component of the thickness of nickel film 52 in 2-10 μm of nickel film 52, nickel For 87-98%, phosphorus 2-13%.

Preferably, in the nickel-gold electroplating sequence, it is small using 300 ~ 500 DEG C of progress 1 that heat treatment is carried out after plating When be heat-treated, improve nickel film 52 hardness.