阅读说明：本技术 一种导热结构及其制备方法和应用 (A kind of conductive structure and its preparation method and application ) 是由 刘明炜 施宏君 于 2019-08-28 设计创作，主要内容包括：本发明涉及导热结构技术领域,尤其涉及一种导热结构及其制备方法和应用。本发明提供的一种导热结构,包括基底、银浆电路层、石墨烯电路层和透明保护层。本发明所述的导热结构可以任意弯折,所述银浆电路层能够保证在所述导热结构弯折后的导电和导热性,使所述导热结构具有很好的传输功能和稳定性。(The present invention relates to conductive structure technical fields more particularly to a kind of conductive structure and its preparation method and application.A kind of conductive structure provided by the invention, including substrate, silver paste circuit layer, graphene circuit layer and transparent protective layer.Conductive structure of the present invention can arbitrarily be bent, and silver paste circuit layer can guarantee the conduction and thermal conductivity after the conductive structure is bent, and the conductive structure is made to have good transfer function and stability.)

1. a kind of conductive structure, which is characterized in that including substrate, silver paste circuit layer, graphene circuit layer and transparent protective layer.

2. conductive structure as described in claim 1, which is characterized in that in parts by weight, the preparation of silver paste circuit layer, Including following raw material:

3. conductive structure as claimed in claim 1 or 2, which is characterized in that silver paste circuit layer with a thickness of 4~20 μm.

4. conductive structure as described in claim 1, which is characterized in that the graphene circuit layer prepares raw material, according to weight Number meter, including following raw material:

5. the conductive structure as described in claim 1 or 4, which is characterized in that the graphene circuit layer with a thickness of 2~15 μm.

6. conductive structure as described in claim 1, which is characterized in that the material of the transparent protective layer is dielectric ink；

The transparent protective layer with a thickness of 1~8 μm.

7. conductive structure as described in claim 1, which is characterized in that the material of the substrate is plastics；

The plastics are TPU, PET, PVC, PC, OPP, AS, PS, PMMA, PP or ABS；

The substrate with a thickness of 0.05~0.38mm.

8. the preparation method of any one of claim 1~7 conductive structure, which comprises the following steps:

Surface is sequentially prepared silver paste circuit layer, graphene heat-conducting layer and transparent protective layer on the substrate, obtains conductive structure.

9. preparation method as claimed in claim 8, which is characterized in that the preparation silver paste circuit layer, graphene heat-conducting layer and The method of transparent protective layer is printing.

10. application of any one of claim 1~7 conductive structure in massage machine.

Technical field

The present invention relates to conductive structure technical fields more particularly to a kind of conductive structure and its preparation method and application.

Background technique

Graphene has caused the wide of scientist since 2004 by the report such as professor Geim of Univ Manchester UK General concern and great interest.Single-layer graphene exists with two dimensional crystal structure, and thickness only has 0.1334nm, it is that one kind does not have There is the semiconductor of energy gap, there is 100 times of carrier mobility higher than silicon, there is micron order free path and big phase at room temperature Dry length.Therefore, graphene is the ideal material of nanometric circuit.

Meanwhile people's lives condition is become better and better, but miscellaneous chronic disease is also more and more, present many people It gos out by bus, multiplies stair upstairs, be easy to cause blood circulation abnormal.And there may be improve blood circulation to ask just for massage Topic.But conductive structure in current massage machine is at high cost, using trouble and cannot arbitrarily bend.

Summary of the invention

The purpose of the present invention is to provide it is a kind of it is at low cost, structure is simple and the conductive structure and its system that can arbitrarily bend Preparation Method and application.

In order to achieve the above-mentioned object of the invention, the present invention the following technical schemes are provided:

The present invention provides a kind of conductive structure, including substrate, silver paste circuit layer, graphene circuit layer and transparency protected Layer.

Preferably, in parts by weight, the preparation of silver paste circuit layer, including following raw material:

Preferably, silver paste circuit layer with a thickness of 4~20 μm.

Preferably, the graphene circuit layer prepares raw material, in parts by weight, including following raw material:

Preferably, the graphene circuit layer with a thickness of 2~15 μm.

Preferably, the material of the transparent protective layer is dielectric ink；The transparent protective layer with a thickness of 1~8 μm.

Preferably, the material of the substrate is plastics；

The plastics are TPU, PET, PVC, PC, OPP, AS, PS, PMMA, PP or ABS；

The substrate with a thickness of 0.05~0.38mm.

The present invention also provides the preparation methods of conductive structure described in above-mentioned technical proposal, comprising the following steps:

Surface is sequentially prepared silver paste circuit layer, graphene heat-conducting layer and transparent protective layer on the substrate, obtains thermally conductive Structure.

Preferably, the method for the preparation silver paste circuit layer, graphene heat-conducting layer and transparent protective layer is printing.

The present invention also provides application of the conductive structure described in above-mentioned technical proposal in massage machine.

The present invention provides a kind of conductive structure, including substrate, silver paste circuit layer, graphene circuit layer and transparency protected Layer.Conductive structure of the present invention can arbitrarily be bent, and silver paste circuit can guarantee after the conductive structure is bent Conduction and thermal conductivity, have good transfer function and stability, record according to the embodiment, thermally conductive knot of the present invention The resistance of structure is 3~20 ohm, and after positive and negative bending 3 times, resistance only increases by 10% and (passes through positive recurvation hereinafter, product is qualified After folding 3 times, resistance incrementss are below 10%).

Specific embodiment

The present invention provides a kind of conductive structure, including substrate, silver paste circuit layer, graphene circuit layer and transparency protected Layer.

In the present invention, if without specified otherwise, all raw material components are commercial product well known to those skilled in the art.

In the present invention, the conductive structure includes substrate, and the material of the substrate is preferably plastics；The plastics are preferred For TPU, PET, PVC, PC, OPP, AS, PS, PMMA, PP or ABS；The thickness of the substrate is preferably 0.05~0.38mm, more excellent It is selected as 0.1~0.188mm, most preferably 0.12~0.15mm.

In the present invention, the conductive structure further includes silver paste circuit layer, and silver paste circuit layer prepares raw material, according to Parts by weight meter, preferably includes following raw material: 20~55 parts of silver powder, 40~60 parts of resin, 1~5 part of carbon dust and isophorone 1~ 5 parts.The dosage of the silver powder is more preferably 30~50 parts；The partial size of the silver powder is preferably 0.3~0.6 μm, more preferably 0.4 ~0.5 μm；The dosage of the resin is more preferably 45~55 parts, most preferably 48~52 parts；The resin is preferably resin 5013 (Shanghai Jin Tang plastic cement Science and Technology Ltd.s)；The dosage of the carbon dust is more preferably 2~4 parts, most preferably 2.5~3.5 Part；The partial size of the carbon dust is preferably 0.3~0.4 μm, and more preferably 0.35 μm；The dosage of the isophorone is preferably 2~4 Part, most preferably 2.5~3.5 parts.In the present invention, the thickness of silver paste circuit layer is preferably 4~20 μm, more preferably 10 ~19 μm, most preferably 15~18 μm.

In the present invention, the conductive structure further includes graphene circuit layer, in parts by weight, silver paste circuit The preparation of layer, including following raw material:: 1~50 part of graphite powder, 1~3 part of curing agent, 60~87 parts of resin, open 2~10 parts of grease. The dosage of the graphite powder is more preferably 5~30 parts, most preferably 20~25 parts；The partial size of the graphite powder is preferably 0.25~ 0.35 μm, more preferably 0.3 μm；The dosage of the curing agent is preferably 1.5~2.5 parts, and more preferably 1.8~2.2 parts；This hair The bright type to the curing agent does not have any special restriction, using any curing agent well known to those skilled in the art ；The dosage of the resin is preferably 65~80 parts, and more preferably 70~75 parts；The resin be preferably resin 5013 (on Hai Jintang plastic cement Science and Technology Ltd.)；The dosage for opening grease is preferably 4~8 parts, and more preferably 5~6 parts.In the present invention In, the thickness of the graphene circuit layer is preferably 2~15 μm, and more preferably 2~5 μm.

In the present invention, the conductive structure further includes transparent protective layer, and the material of the transparent protective layer is dielectric oil Ink；The dielectric ink is preferably solvent type dielectric ink；The present invention is not any to the source of the solvent type dielectric ink Special restriction, using commercial product well known to those skilled in the art；In a specific embodiment of the present invention, can have Body is selected as DI-7001；The thickness of the transparent protective layer is preferably 1~8 μm, and more preferably 3~4 μm.

The present invention also provides the preparation methods of conductive structure described in above-mentioned technical proposal, comprising the following steps:

Surface is sequentially prepared silver paste circuit layer, graphene heat-conducting layer and transparent protective layer on the substrate, obtains thermally conductive Structure.

In the present invention, before preparing silver paste circuit layer, graphene heat-conducting layer and transparent protective layer, preferably to the substrate into Row cleaning, the present invention does not have any special restriction to the condition of the cleaning, using process well known to those skilled in the art It is cleaned.

In the present invention, the process of the preparation silver paste circuit preferably includes following steps:

Silver powder, resin, carbon dust and isophorone are mixed, silver paste is obtained；

Silver paste is printed on upper surface of substrate, obtains silver paste circuit layer.

The present invention mixes the no any special restriction of mixing using process well known to those skilled in the art Conjunction.

In the present invention, the mode of the printing is preferably silk-screen printing；The present invention does not have the process of the silk-screen printing There is any special restriction, is printed using process well known to those skilled in the art.

It is described be completed for printing after, the present invention is preferably dried the silver paste circuit layer obtained after printing, and the present invention is to institute Dry no any special restriction is stated, is dried using process well known to those skilled in the art.

In the present invention, the process for preparing graphene circuit layer preferably includes following steps:

By graphite powder, curing agent, resin and oil mixing with water is opened, obtains graphene slurry；

The graphene slurry is printed on to the upper surface of silver paste circuit layer, obtains graphene circuit layer.

The present invention mixes the no any special restriction of mixing using process well known to those skilled in the art Conjunction.

In the present invention, the mode of the printing is preferably silk-screen printing；The present invention does not have the process of the silk-screen printing There is any special restriction, is printed using process well known to those skilled in the art.

It is described be completed for printing after, preferably the graphene circuit layer obtained after printing is dried, the present invention is to described dry It is dry without any special restriction, be dried using process well known to those skilled in the art.

In the present invention, the process for preparing transparent protective layer preferably includes following steps:

Transparency protected oil is printed on to the upper surface of the graphene circuit layer, obtains transparent protective layer.

In the present invention, the printing is preferably silk-screen printing；The present invention is not any to the process of the silk-screen printing Special restriction is printed using process well known to those skilled in the art.

It is described be completed for printing after, preferably the transparent protective layer obtained after printing is dried, the present invention is to the drying There is no any special restriction, is dried using process well known to those skilled in the art.

The present invention also provides application of the conductive structure described in above-mentioned technical proposal in massage machine.

A kind of conductive structure provided by the invention and its preparation method and application is carried out below with reference to embodiment detailed Illustrate, but they cannot be interpreted as limiting the scope of the present invention.