阅读说明：本技术 用于提高医疗器械的散热能力的设备和方法 (For improving the device and method of the heat-sinking capability of medical instrument ) 是由 范安琪 T·胡 于 2018-05-08 设计创作，主要内容包括：用于改善散热能力的方法和设备。一种设备包含细长构件、外壳和热泵装置。所述细长构件具有远端和近端。所述外壳被联接到所述细长构件的所述近端。所述热泵装置被联接在所述细长构件与所述外壳之间。所述热泵装置被配置为在所述细长构件与所述外壳之间转移热能。(Method and apparatus for improving heat-sinking capability.A kind of equipment includes slender member, shell and heat pump assembly.The slender member has proximally and distally.The shell is coupled to the proximal end of the slender member.The heat pump assembly is connected between the slender member and the shell.The heat pump assembly is configured as shifting thermal energy between the slender member and the shell.)

1. a kind of equipment, it includes:

Slender member has proximally and distally；

Shell is coupled to the proximal end of the slender member；And

Heat pump assembly is connected between the slender member and the shell, and the heat pump assembly is configured as described Thermal energy is shifted between slender member and the shell.

2. equipment according to claim 1, wherein the heat pump assembly includes:

First side is coupled to the proximal end of the slender member；And

Second side is coupled to the shell.

3. equipment according to claim 2, wherein heat pump assembly control is in first side of the heat pump assembly First temperature of the slender member at place, so that first temperature is lower than the ambient temperature of the shell surrounding.

4. equipment according to claim 2, wherein the described second side of heat pump assembly control in the heat pump assembly The second temperature of the shell at place, so that the second temperature is higher than the Maximum Contact temperature of the distal end of the slender member Degree.

5. equipment according to claim 2, wherein the heat pump assembly is dissipated by the shell by the heat pump assembly The waste heat of generation.

6. equipment according to claim 2, wherein the heat pump assembly is configured as turning thermal energy from the slender member The shell is moved on to, so that the proximal end temperature of the proximal end of the slender member is less than the skin temperature of the shell.

7. equipment according to claim 1, wherein the heat pump assembly includes thermoelectric (al) cooler.

8. equipment according to claim 1, wherein the distal end of the slender member includes the heat for generating the thermal energy Generation device.

9. equipment according to claim 8, wherein the heat generator is light source.

10. a kind of equipment, it includes:

Slender member has proximally and distally；

Shell is coupled to the proximal end of the slender member；And

Heat pump assembly, is coupled at least one of the slender member and the shell, and the heat pump assembly is configured To change the first heat-sinking capability of the slender member, and change the second heat-sinking capability of the shell.

11. equipment according to claim 11, wherein the heat pump assembly includes:

First side is coupled to the proximal end of the slender member；And

Second side is coupled to the shell.

12. equipment according to claim 11, wherein heat pump assembly control is described the first of the heat pump assembly First temperature of the slender member at side, so that first temperature is lower than the ambient temperature of the shell surrounding.

13. equipment according to claim 11, wherein heat pump assembly control is described the second of the heat pump assembly The second temperature of the shell at side, so that the second temperature is higher than the Maximum Contact of the distal end of the slender member Temperature.

14. equipment according to claim 10, wherein the heat pump assembly makes the first temperature of the slender member by base It is maintained at a below the first value of the ambient temperature of the shell surrounding in sheet, and makes the second temperature of the shell by substantially Maintain the second value of the Maximum Contact temperature of the distal end higher than the slender member.

15. equipment according to claim 10, wherein when the rate that the waste heat generated by the heat pump assembly is generated is small When difference between second heat-sinking capability and first heat-sinking capability, the heat pump assembly provides disappearing for the waste heat It dissipates.

16. equipment according to claim 10, wherein the heat pump assembly heat is transferred to from the slender member it is described Shell, so that the proximal end temperature of the proximal end of the slender member is less than the skin temperature of the shell.

17. equipment according to claim 10, wherein the heat pump assembly includes thermoelectric (al) cooler.

18. equipment according to claim 10, wherein the distal end of the slender member includes generating the thermal energy Heat generator.

19. equipment according to claim 8, wherein the heat generator is light emitting device.

20. a kind of equipment, it includes:

Slender member has proximally and distally；

Shell is located at the near proximal ends of the slender member；And

Multiple heat pump assemblies, each of the multiple heat pump assembly be located at along in the slender member the distal end with Corresponding position in multiple positions of the hot path formed between the shell, wherein the multiple heat pump assembly heat of transfer Can, to change the first heat-sinking capability of the slender member, and change the second heat-sinking capability of the shell.

21. equipment according to claim 20, wherein internal difference in temperature is collectively formed in the multiple heat pump assembly, and wherein The internal difference in temperature is greater than the total system temperature difference.

22. equipment according to claim 21, wherein the distal end of the total system temperature difference by the slender member The ambient temperature of the environment of Maximum Contact temperature and the shell surrounding defines.

23. a kind of method, it includes:

Thermal energy is generated in the far-end of slender member；And

It is thermally coupled in heat pump assembly between the slender member and shell by activating, in the slender member and described outer The thermal energy is shifted between shell.

24. according to the method for claim 23, wherein shifting the thermal energy and including:

The first temperature in the slender member of the first side position of the heat pump assembly is controlled, so that first temperature is lower than The ambient temperature of the shell surrounding.

25. according to the method for claim 24, being further included wherein shifting the heat:

The second temperature of the shell at second side of the heat pump assembly is controlled, so that the second temperature is higher than described The Maximum Contact temperature of the distal end of slender member.

26. according to the method for claim 23, wherein between the first side of the heat pump and second side of the heat pump Internal difference in temperature is greater than the total temperature difference between the Maximum Contact temperature of the distal end and the ambient temperature of the shell surrounding.

27. according to the method for claim 23, wherein the heat pump assembly is activated to generate waste heat, and the wherein waste heat It is dissipated by the shell.

28. according to the method for claim 23, wherein activating the heat pump assembly includes activation thermoelectric (al) cooler.

29. according to the method for claim 23, wherein the far-end in the slender member generates the thermal energy packet Include activation light source.

Technical field

This disclosure relates to medical instrument, and more particularly to the medical instrument for generating heat.More specifically, this disclosure relates to In the system and method for improving the heat-sinking capability along medical instrument (such as endoscope).

Background technique

Minimally invasive imaging instrument can be used to be difficult to the vision inspection in space reach or compact in the anatomical structure of patient It looks into.Endoscope be may include with can be inserted into patient's body distal tip axis minimally invasive imaging instrument example.Outside Shell may be connected to the other end of axis.Shell, which may include, for example allows human operator to observe and/or be recorded in the remote of axis The various optical components and electronic component of captured image at the tip of side.Endoscope can provide photograph for the anatomic region checked It is bright.

It may be desirable to nearby improving imaging instrument by distal tip that some optics and electronic component are located in axis Picture quality and power efficiency.In the case where existing system, this improvement has been limited to connect maintenance distal tip dissection The needs of temperature are touched, the distal tip dissection Contact Temperature is lower than the Maximum Contact temperature being usually arranged by safety standard.Most Big Contact Temperature can be such as distal tip and safely can directly contact in inner body parts or patient tissue or entrance Maximum temperature in the selected range of portion's body part or patient tissue.Accordingly, it may be desirable to for maintaining distal tip Equal to or less than the improved system and method for the temperature of Maximum Contact temperature.

Summary of the invention

The embodiment of the present invention is summarised by following appended claims.

In an exemplary embodiments, a kind of equipment includes slender member, shell and heat pump assembly.The slender member With proximally and distally.The shell is coupled/couples the proximal end that (coupled) arrives the slender member.The heat pump Device is connected between the slender member and the shell.The heat pump assembly is configured as in the slender member and institute It states and shifts thermal energy between shell.

In another exemplary embodiments, a kind of equipment includes slender member, shell and heat pump assembly.The slender member With proximally and distally.The shell is coupled to the proximal end of the slender member.The heat pump assembly is coupled to institute State at least one of slender member and the shell.What the heat pump assembly was configured as changing the slender member first dissipates Thermal energy power, and change the second heat-sinking capability of the shell.

In another exemplary embodiments, a kind of equipment includes slender member, shell and multiple heat pump assemblies.It is described elongated Component has proximally and distally.The shell is located at the near proximal ends of the slender member.In the multiple heat pump assembly Each be located at along the hot path formed between the distal end and the shell of the slender member multiple positions In corresponding position.The multiple heat pump assembly shifts thermal energy, to change the first heat-sinking capability of the slender member, and Change the second heat-sinking capability of the shell.

In another exemplary embodiments, provide a method.Thermal energy is generated in the far-end of slender member.By swashing The heat pump assembly living being thermally coupled between the slender member and shell, is shifted between the slender member and the shell The thermal energy, the shell are coupled to the proximal end of the slender member.

It should be understood that foregoing general description and following specific embodiment are inherently exemplary and explanatory , and understanding of this disclosure is intended to provide without limiting the scope of the present disclosure.In this regard, according to following specific embodiment party Other aspects, features and advantages of formula, the disclosure will be apparent to those skilled in the art.

Detailed description of the invention

When read in conjunction with the accompanying drawings, according to the following specific implementation, all aspects of this disclosure are best understood.It needs , it is emphasized that various features are not drawn on scale according to industrial standard convention.In fact, for clear discussion, Ke Yiren Meaning increases or decreases the size of various features.In addition, the disclosure can repeat reference numerals and/or letter in the various examples. The repetition is for purposes of simplicity and clarity, and itself to be not offered as the various embodiments discussed and/or construct it Between relationship.

Fig. 1 is the diagram according to the imaging system of exemplary embodiments；

Fig. 2 is the diagram according to the schematic diagram of the imaging system of exemplary embodiments；

Fig. 3 is the diagram according to the method for improving heat-sinking capability of exemplary embodiments；

Fig. 4 is the diagram according to the method for improving heat-sinking capability of exemplary embodiments；And

Fig. 5 is the song according to the tip and shell heat-sinking capability of exemplary embodiments compared with slender member and skin temperature Line chart.

Specific embodiment

In the following description, it elaborates to describe the detail according to some embodiments of the present disclosure.Elaborate many tools Body details is in order to provide a thorough understanding of embodiments.It is apparent, however, to one skilled in the art, that can not have Some embodiments are practiced in the case where there are some or all of these details.Specific embodiment disclosed herein is explanation Property and not restrictive.Other elements may be implemented in those skilled in the art, although not specifically describing here, In the scope of the present disclosure and spirit.In addition, in order to avoid unnecessary repetition, one for showing and describing in conjunction with one embodiment Or more feature can be incorporated into other embodiments, unless being in addition particularly described or if one or more features make Embodiment is obtained not work.In some cases, it is not described in detail well known method, program, component and circuit, so as not to it is unnecessary Ground obscures the various aspects of embodiment.

Exemplary embodiments are recognized and consider to may expect have for dissipating by medical instrument (such as endoscope) Far-end component operation generate heat device and method.Heat can be from being distally transferred to outside the body of patient The shell in portion.Then heat can be scattered in the ambient enviroment of shell surrounding.Exemplary embodiments recognize that various factors can limit The heat-sinking capability of the far-end of endoscope processed.These factors may include the Maximum Contact temperature of such as, but not limited to distal tip Degree, ambient enviroment ambient temperature and distally located tip and shell between electrically and mechanically part thermal resistance.Therefore, scheme The property shown embodiment is provided for improving setting for tip heat-sinking capability and shell heat-sinking capability under the background of these limiting factors Standby and method.

Exemplary embodiments described below are provided for improving along medical imaging modalities (such as endoscope) each The method and apparatus of heat-sinking capability at kind area-of-interest.In an exemplary embodiments, a kind of equipment includes elongated structure Part, shell and heat pump assembly.The slender member has proximally and distally.The shell is coupled to the institute of the slender member State proximal end.The heat pump assembly is connected between the slender member and the shell.The heat pump assembly is configured as Thermal energy is shifted between the slender member and the shell.This transfer of thermal energy may include the heat radiation energy of distal end and shell Power.Specifically, it can permit the heat from distal end using heat pump assembly to dissipate by shell, without changing ambient temperature And the undesirable amount of weight or volume of endoscope is not needed to increase.

Further, improve distally can permit the hot component of generation and is used at tip with the heat-sinking capability at shell Near or, and the temperature of far-end is no more than Maximum Contact temperature.For example, one or more illuminace components, one or more A electronic component or combinations thereof can be repositioned at or near the tip of the far-end of endoscope, to improve endoscope Picture quality, power efficiency and robustness.Specifically, it can help to simplify optical device towards these mobile components of tip, by This reduces the total weight of endoscope.

With reference to Fig. 1 of attached drawing, the imaging system 100 according to exemplary embodiments is depicted.Imaging system 100 can be energy Enough be used to visually and medicine check the instruments of various inner body parts and chamber inside the anatomical structure of patient.Example Such as, imaging system 100 can take the form for being used to the endoscope of the view of the interior section of anatomical structure of patient.

In an exemplary embodiments, imaging system 100 includes slender member 102, shell 106 and heat pump assembly 108. Depending on embodiment, slender member 102 can be rigid, is flexible, hinged, partially flexible or combinations thereof.Into one Step ground, slender member 102 can be made of metal, plastics, the combination of the two or certain other suitable material.Scheme as one The property shown example, slender member 102 can take the form of the axis with one or more inner passages.Slender member 102 can To have the thermal resistance for being selected as helping improve heat dissipation.

During the medical procedure for being used to visualize internal patient anatomy in imaging system 100, slender member 102 A part can be inserted in inside the anatomical structure of patient, and another part of slender member 102 can be maintained at patient Anatomical structure outside.Such as, but not limited to, the first part 110 of slender member 102 can be located in the anatomical structure of patient Portion, and second part 112 can be located at outside the anatomical structure of patient.

Slender member 102 has distal end 114 and proximal end 116.The distal tip 104 of axis is located at distal end 114.Scheme at one In the property shown embodiment, tip 104 can be the integral part of slender member 102.In other exemplary embodiments, tip 104 can be coupled to the unitary part of slender member 102.

Shell 106 is located near the proximal end 116 of slender member 102.In the exemplary embodiments, shell 106 can be through It is connected to the proximal end 116 of slender member 102 indirectly by heat pump assembly 108.Shell 106 may include any amount of difference Component.Such as, but not limited to, shell 106, which may include, allows human operator observation to catch at the distal end of imaging system 100 114 One or more optical elements of the image obtained.These optical components may include such as, but not limited to one or more anti- Penetrate mirror, one or more lens, other one or more optical components or combinations thereof.Depending on embodiment, shell 106 It may include additional component.

Further, shell 106 can be made of the one or more of materials for being selected as improving heat dissipation.Scheme at one In the property shown embodiment, shell 106 is made of aluminium.

Imaging system 100 further includes the component 117 at distal end 114.Component 117, which can produce, causes distal end 114 The increased thermal energy of temperature.In some exemplary embodiments, component 117 takes light emitting diode (LED) or another type of production The powered light source of heat energy or the form of light source.In other exemplary embodiments, component 117, which can be, generates thermal energy Energization electronic component, such as sensor or signal projector.In the alternate embodiment that thermal energy generating component 117 is omitted, Cooling system described herein can be utilized to dissipation body heat or otherwise cooling distal end 114.

Distally 114 and therefore tip 104 has for when the directly contact inner body parts or patient tissue of distal end 114 It or when entering in the selected range of inner body parts or patient tissue is considered as safe Maximum Contact temperature (T_C).One In a illustrative example, which can be between about 2 millimeters and about 10 millimeter.Distally 114 Maximum Contact temperature Degree can be adjusted by safety standard.As an illustrative example, Maximum Contact temperature be can be at about 40 degrees Celsius With the value between 45 degrees Celsius.In other illustrative examples, Maximum Contact temperature can be at about 40 degrees Celsius and big Value between about 50 degrees Celsius.Therefore, it may be desirable to which the temperature of control distal end 114 is connect with ensuring that distal end 114 is not up to higher than maximum Touch the temperature of temperature.

In this embodiment, the temperature of distal end 114 can by the thermal energy that generates component 117 along main hot path from point It dissipates and enters the ambient enviroment 118 of 106 surrounding of shell to control in end 104.As an illustrative example, heat can be from distal end Tip 104 at 114 is transferred along slender member 102, then spreads to shell 106, and is finally dissipated from shell 106 Into ambient enviroment 118.

Ambient enviroment 118 can have ambient temperature (T_A).In some cases, ambient temperature can be variable.Example Such as, but not limited to, ambient enviroment 118 can be the operating room in hospital or clinic.In some cases, operating room can be tieed up It holds in the temperature being selected as between about 18 degrees Celsius and 23 degrees Celsius.Depending on the type of ambient enviroment 118, surrounding temperature Degree can be maintained at the value between about 18 degrees Celsius and about 28 degrees Celsius.

Main hot path has by the Maximum Contact temperature (T of distal end 114_C) and ambient enviroment 118 ambient temperature (T_A) define The total system temperature difference (Δ T_O).For example, when Maximum Contact temperature between about 40 degrees Celsius and 45 degrees Celsius and around it is warm When degree is between about 23 degrees Celsius and 26 degrees Celsius, the total system temperature difference can be between about 16 degrees Celsius and 20 degrees Celsius.

Heat pump assembly 108 accelerates heat along the transfer of main hot path.In this embodiment, heat pump assembly 108 is positioned in Between slender member 102 and shell 106.More specifically, heat pump assembly 108 can be coupled in the side of heat pump assembly 108 The proximal end 116 of slender member 102, and the distal side 107 of shell 106 is coupled in the opposite side of heat pump assembly 108.With this side Formula, slender member 102 can be connected to shell 106 by heat pump assembly 108 indirectly.

Heat pump assembly 108 is used to improve the heat-sinking capability of slender member 102 and the heat-sinking capability of shell 106.Specifically, The heat-sinking capability of slender member 102 and the heat-sinking capability of shell 106 can be improved in heat pump assembly 108, to accelerate along the road Zhu Re Total heat dissipation of diameter, and accelerate the removal of heat from distal end 114.The heat-sinking capability of slender member can also be referred to as tip heat radiation energy Power, distal end heat-sinking capability or slender member heat-sinking capability.The heat-sinking capability of shell can also be referred to as shell heat-sinking capability.

Fig. 2 is the schematic diagram of imaging system 100.In the exemplary embodiments, heat pump assembly 108 takes thermoelectric (al) cooler Form.But in other exemplary embodiments, it can be used and thermal energy (that is, heat) is transferred to its of cooling fin from heat source The device of his type.

As depicted, heat pump assembly 108 has axis side 200 and shell side 202.In the exemplary embodiments, axis side 200 are thermally coupled to slender member 102, and shell side 202 is thermally coupled to shell 106.Heat pump assembly 108 allows elongated structure Temperature (the T of the proximal end 116 of part 102₁) it is controlled in the level lower than the ambient temperature of ambient enviroment 118.Further, heat pump Device 108 allows the temperature (T in the distal side 107 of shell 106₂) it is controlled in the level higher than the Maximum Contact temperature of distal end 114.

For example, the operation that can use heat pump assembly 108 will be elongated when ambient temperature is arranged to about 25 degrees Celsius The temperature T of component₁Maintain about 20 degrees Celsius.Further, heat pump assembly 108 is by the temperature T in the distal side 107 of shell 106₂ Basic control is in the value higher than the Maximum Contact temperature of distal end 114.Such as, but not limited to, when Maximum Contact temperature is arranged to big At about 42 degrees Celsius, caused temperature T₂It can be about 50 degrees Celsius.By this method, temperature T₂With temperature T₁(temperature T₁It can Think about 30 degrees Celsius) between difference be greater than about 17 degrees Celsius of the total system temperature difference (T_C-T_A)。

Therefore, the proximal end 116 of slender member 102 can have the temperature of the ratio shell 106 controlled by heat pump assembly 108 Low temperature.Further, the axis side 200 of heat pump assembly 108 can have the temperature lower than the shell side 202 of heat pump assembly 108 Degree.It is relatively warm at shell side 202 that heat pump assembly 108 allows heat to be transferred to from the colder slender member 102 from axis side 200 Shell 106.Therefore, heat pump assembly 108 accelerates the heat transfer between slender member 102 and shell 106.

In an exemplary embodiments, for heat pump assembly 108 operation and the external power supply supplied generates waste heat.Heat pump Device 108 can also have the ability the waste heat that dissipated by shell 106.When the heat-sinking capability and slender member 102 of shell 106 When difference between heat-sinking capability is greater than the rate that waste heat is generated, shell 106 can have the ability to dissipate from 102 He of slender member The heat of both heat pump assemblies 108.In one example, the heat-sinking capability for the shell 106 realized using heat pump assembly can be big About 7 watts.The heat-sinking capability for the slender member 102 realized using heat pump assembly 108 can be about 3 watts.If by heat pump assembly 108 rates for generating waste heat are less than about 4 watts, then shell 106 can effectively dissipate from distal end 114 and heat pump assembly Both 108 heat.

Diagram in Fig. 1 and Fig. 2, which is not meant to imply that, carries out the mode that different exemplary embodiments can be carried out Physics or structure limitation.It can be used other than illustrated component or replace the other component of illustrated component.It is some Component can be optionally.

In some exemplary embodiments, can use along the main hot path of imaging system 100 includes that multiple heat pumps fill The heat pump system set.For example, multiple heat pump assemblies can be located at along at multiple positions of main hot path to accelerate each position Thus the heat energy transfer at place improves the heat-sinking capability of slender member 102 and the heat-sinking capability of shell 106.The multiple heat pump dress Multiple selected temperature difference can be formed at multiple positions along main hot path by setting.Jointly or individually, the multiple position In the multiple selected temperature difference of corresponding position can be greater than the total system temperature difference.Therefore, it increases in the multiple position Each of the thermal energy that shifts at position or heat.

Fig. 3 is the diagram for the method for improving heat-sinking capability described according to exemplary embodiments.It is illustrated in Fig. 3 Method 300 can be used to improve along medical instrument (such as tip 104 of the imaging system 100 described in figure before With the slender member 102 between shell 106) heat-sinking capability.Method 300 is illustrated as one group of operation or process 302 and 304. The process 302 and 304 of not all diagram can all execute in all embodiments of method 300.In addition, bright not in Fig. 3 One or more processes really illustrated can be included in process 302 and 304 before, later, between or as 302 and of process 304 a part.In some embodiments, one or more in process 302 and 304 can be optional, and therefore It can be omitted.

Method 300 can be started with process 302, and process 302 includes the far-end generation thermal energy in slender member.In process In 302, thermal energy can be generated by the energized components at or near operation distal end.Such as, but not limited to, heat can be by remote The operation of light source (such as light emitting diode) at or near end generates.In another example, heat can pass through far-end Or the operation of neighbouring electronic component generates.

At process 304, heat pump assembly is activated.Heat pump can be thermally coupled between slender member and shell.

At process 306, thermal energy is shifted between slender member and shell.Therefore, with omit heat pump assembly similar system System is compared, and the heat-sinking capability of slender member and the heat-sinking capability of shell can be improved in the use of heat pump.Therefore, with work as heat pump assembly It is compared when being omitted, heat pump assembly can permit uses more powerful component at or near distal tip.In a n-lustrative In embodiment, heat pump assembly can be thermoelectric (al) cooler.Depending on embodiment, thermal energy can be transferred to outer from slender member Shell is transferred to slender member from shell, or both.

In more detail, heat pump assembly can control the temperature of the slender member at the axis side of heat pump assembly.In some figures In the property shown embodiment, heat pump assembly can be controlled axis side temperature in the level lower than ambient temperature.Further, heat pump assembly It can control the temperature of the shell at the shell side of heat pump assembly.In some exemplary embodiments, heat pump assembly can be incited somebody to action The control of shell side temperature is in the value higher than the Maximum Contact temperature of distal end 114.

Fig. 4 is the diagram for the method for improving heat-sinking capability described according to exemplary embodiments.It is illustrated in Fig. 4 Method 400 can be used to improve the heat-sinking capability of imaging system (such as endoscope).Method 400 be illustrated as one group of operation or Process 402-410.The process 402-410 of not all diagram can be executed in all embodiments of method 400.In addition, not Before one or more processes clearly illustrated in Fig. 4 can be included in process 402-410, later, between or make For a part of process 402-410.In some embodiments, one or more in process 402-410 can be optional, And it therefore can be omitted.

This method can be started with process 402, and process 402 includes that the distal end of endoscope is inserted in patient anatomy Portion.At process 404, activation is located at the light source of the far-end of endoscope.Light source can be such as light emitting diode.Activation Light emitting diode may include for example supplying electric power to light emitting diode.In this example, in response to the activation of light emitting diode And heat is generated in the far-end of endoscope.

At process 406, the heat in the far-end generation of endoscope is conveyed along the axis of endoscope.At process 408, lead to Cross the shell that heat is transferred to endoscope by heat pump assembly from axis.Axis heat-sinking capability and shell dissipation energy can be improved in heat pump assembly Power.In process 408, shell is located at outside the anatomical structure of patient.

In process 408, axis side temperature is maintained at a below the ambient temperature of the ambient enviroment of shell surrounding by heat pump assembly Value.Further, the maximum that heat pump assembly can be used to maintain shell side temperature the distal end 114 higher than endoscope connects Touch the value of temperature.Therefore, heat pump assembly forms the total system temperature being greater than between distal end 114 and ambient enviroment between axis and shell Thus the temperature difference of difference improves the heat-sinking capability of axis and the heat-sinking capability of shell.In other exemplary embodiments, heat pump assembly The Maximum Contact temperature of the distal end 114 of endoscope but projecting temperature can be used to for shell side temperature to be maintained at a below Value.

At process 410, by heat from the ambient enviroment that shell is dissipated to shell surrounding.Such dissipate can also be with Referred to as heat is scattered in ambient enviroment.

Fig. 5 is the tip described according to exemplary embodiments and shell heat-sinking capability compared with slender member and skin temperature Curve graph 500.Curve graph 500 illustrates how to can be improved carefully using the heat pump assembly 108 of the imaging system 100 in Fig. 1 Long component 102 and therefore 114 heat-sinking capability of distal end and the shell heat-sinking capability of the shell 106 in Fig. 1.

Curve graph 500 includes temperature axis 502, tip heat-sinking capability axis 504 and shell heat-sinking capability axis 506.Temperature Spend axis 502 identification by degree Celsius as unit of temperature value.Tip heat-sinking capability axis 504 identification by watt as unit of distal end The heat radiation energy force value at the tip 104 at 114.Shell heat-sinking capability axis 506 identification by watt as unit of shell 106 heat radiation energy Force value.

Curve graph 500 further includes line 508, line 510, line 512, line 514 and line 516.In the illustrative example, First Line 508 indicate the heat dissipation of the slender member 102 of imaging system 100 when the thermal resistance that slender member 102 has about 6 degrees Celsius every watt Ability.Second line 510 indicates the elongated of when slender member 102 has about 10 degrees Celsius every watt of thermal resistance imaging system 100 The heat-sinking capability of component 102.Third line 512 indicates to be imaged when the thermal resistance that slender member 102 has about 15 degrees Celsius every watt The heat-sinking capability of the slender member 102 of system 100.

Further, the first shell line 514 indicates the heat dissipation of the shell 106 of imaging system 100 when shell is made of aluminium Ability.Second housing line 516 indicates the heat-sinking capability of the shell 106 of imaging system 100 when shell is made of stainless steel.

In the exemplary embodiments, shell 106 can have about 120 millimeters length and about 30 watts every square metre Kelvin (W/m²K thermal transmittance).The ambient temperature of the ambient enviroment 118 of 106 surrounding of shell can be set to about 27 Degree Celsius.Further, distal end 114 and therefore the Maximum Contact temperature at tip 104 can be about 42 degrees Celsius.Therefore, The total system temperature difference can be the difference between Maximum Contact temperature and ambient temperature (ambient temperature is about 15 degrees Celsius).

Heat pump assembly 108 is used between slender member 102 and shell 106, the temperature of slender member 102 is in heat pump assembly It is separated at 108 with the temperature of shell 106.For example, heat pump assembly 108 can be used to that slender member 102 is kept to be in than surrounding The low temperature of temperature, and shell 106 is kept to be in the temperature higher than the Maximum Contact temperature of distal end 114.

As shown in the point 518 along line 510, when shell 106 is made of aluminum and slender member have it is about 6 Celsius When spending every watt of thermal resistance, heat pump assembly 108 can be used to axis side temperature maintaining about 25 degrees Celsius.Further, such as It is indicated by the point 520 along line 514, heat pump assembly 108 can be used to maintaining shell side temperature into about 50 degrees Celsius. Therefore, the temperature difference formed between slender member 102 and shell 106 can be about 25 degrees Celsius, be greater than the total system temperature difference.

By forming this biggish temperature difference between slender member 102 and shell 106, heat pump assembly can dissipate tip Thermal energy power is improved to about 3 watts, and shell dissipation capability is improved to about 7 watts.If heat pump assembly is than shell and point Hold the small rate of 4 watts of differences between heat-sinking capability to generate waste heat, heat pump assembly can have the ability not only to have dissipated the heat from tip but also Dissipate the waste heat from heat pump assembly.

As indicated by the intersection point 522 of First Line 510 and line 514, in the case where no heat pump assembly 108, elongated structure Part 102 and shell 106 will the joint between slender member 102 and shell 106 there is about 35 degrees Celsius of temperature.Into One step, in the case where no heat pump assembly 108, tip dissipation capability will be only about 1.33 watts, and shell dissipates Ability will be only about 2.37 watts.

Therefore, exemplary embodiments provide the side for improving the heat-sinking capability along medical instrument (such as endoscope) Method and equipment.Improving tip and shell heat-sinking capability allows the component for generating bigger heat to be used at or near endoscope. For example, the light emitting diode of higher power can be used in provide better illumination at the tip of endoscope, and it is no more than The Maximum Contact temperature at tip does not need to redesign shell or changes ambient temperature.

Further, thermoelectric (al) cooler, which is used, as heat pump assembly not will increase the undesirable weight or body of endoscope Product.In addition, may insure not generating additional undesirable acoustics or electricity during the operation of endoscope using thermoelectric (al) cooler Noise.

Although being described in the accompanying drawings and having shown certain exemplary embodiments of the invention, but it is to be understood that this A little embodiments are only to the illustrative and not limiting of broader invention.Furthermore, it is to be understood that the embodiment of the present invention be not limited to shown in and The specific structure and arrangement, because those of ordinary skill in the art are contemplated that various other modifications.

Further, in the detailed description of the embodiment of the present invention, numerous specific details are set forth in order to provide The comprehensive understanding of the disclosed embodiments.However, will be it will be apparent for a person skilled in the art that embodiment of the disclosure It can be without being practiced in the case where these details.In some cases, well known method, program and portion are not described in detail Part, in order to avoid unnecessarily obscure the various aspects of the embodiment of the present invention.