阅读说明：本技术 一种光固化性热固化性树脂组合物及其固化物 (A kind of light solidifying/heat solidifying resin composition and its solidfied material ) 是由 彭维恩 于 2019-08-06 设计创作，主要内容包括：本发明公开了一种光固化性热固化性树脂组合物及其固化物,组合物包括以下重量份的物质：含羧基树脂70～100份,光聚合引发剂2～10份,感光性单体10～80份,热固化性树脂20～100份,填料40～85份。本发明树脂组合物其形成的涂层厚度均匀,具有很好的耐焊耐热性、显影性、机械强度以及耐冷热冲击等特性。(The invention discloses a kind of light solidifying/heat solidifying resin composition and its solidfied materials, composition includes the substance of following parts by weight: containing 70~100 parts of carboxy resin, 2~10 parts of Photoepolymerizationinitiater initiater, 10~80 parts of photo-sensitive monomer, 20~100 parts of heat-curing resin, 40~85 parts of filler.The uniform coating thickness of its formation of invention resin composition has the characteristics such as good resistance to weldering heat resistance, developability, mechanical strength and cold-resistant thermal shock.)

1. a kind of light solidifying/heat solidifying resin composition, which is characterized in that the substance including following parts by weight: tree containing carboxyl 70~100 parts of rouge, 2~10 parts of Photoepolymerizationinitiater initiater, 10~80 parts of photo-sensitive monomer, 20~100 parts of heat-curing resin, filler 40~85 parts.

2. a kind of light solidifying/heat solidifying resin composition according to claim 1, which is characterized in that including following heavy It measures the substance of part: containing 100 parts of carboxy resin, 8 parts of Photoepolymerizationinitiater initiater, 60 parts of photo-sensitive monomer, 80 parts of Thermocurable ingredient, fill out 70 parts of material.

3. a kind of light solidifying/heat solidifying resin composition according to claim 1 or 2, which is characterized in that described group Closing object further includes 15~30 parts of organic solvent.

4. a kind of light solidifying/heat solidifying resin composition according to claim 3, which is characterized in that the composition In contain 20 parts of organic solvent.

5. a kind of light solidifying/heat solidifying resin composition according to claim 3, which is characterized in that contain carboxy resin Mixture for bisphenol type containing carboxy resin and phenolic varnish type containing carboxy resin, the bisphenol type are clear containing carboxy resin and phenolic aldehyde Mass ratio of the paint shaped containing carboxy resin is 1:2.

6. a kind of light solidifying/heat solidifying resin composition according to claim 3, which is characterized in that the photopolymerization Initiator selects oxime ester system Photoepolymerizationinitiater initiater, alpha-aminoacetophenone system Photoepolymerizationinitiater initiater, the acyl group oxidation with oxime ester base In phosphine system Photoepolymerizationinitiater initiater any one or it is a variety of.

7. a kind of light solidifying/heat solidifying resin composition according to claim 3, which is characterized in that the photonasty Monomer select compound in molecule with 2 or more ethylenically unsaturated groups or to polyalcohol addition alpha, beta-unsaturated carboxylic acid and Obtained compound.

8. a kind of light solidifying/heat solidifying resin composition according to claim 3, which is characterized in that the heat cure Property resin select amino resins, maleimide compound, benzoxazine resin, carbodiimide resin, cyclic carbonate compound, Any one in multi-functional epoxy compound, episulfide resin.

9. a kind of light solidifying/heat solidifying resin composition according to claim 3, which is characterized in that the filler choosing With any one in barium sulfate, spherical silicon dioxide, talcum.

10. a kind of solidfied material of light solidifying/heat solidifying resin composition, which is characterized in that the solidfied material is by claim Light solidifying/heat solidifying resin composition described in 1 or 2 is obtained by photocuring and heat cure.

Technical field

The present invention relates to ink coating technical field more particularly to a kind of light solidifying/heat solidifying resin composition and its Solidfied material.

Background technique

It is in recent years, a large amount of in printed circuit board manufacture since electronic product is light, thin, thin and durable reliability requirement Use photocuring heat-curing composition resin.Photocuring heat-curing composition resin can pass through silk-screen printing, roller coating, electrostatic The modes such as painting, aerial spraying are coated on circuit board substrate, are then dried under conditions of 70-80 DEG C of well-ventilated, through contacting Or non-contacting selective ray irradiation.Then irradiated portion is cleaned up with dilute alkaline aqueous solution, the diluted alkaline that can be used The aqueous solution of aqueous solution commonly sodium carbonate, sodium hydroxide, potassium hydroxide, tetramethylphosphonihydroxide hydroxide base amine etc., irradiation portion code insurance stay On substrate.The composition for being retained in substrate is heating and curing 30 minutes to 120 minutes at a temperature of 120 DEG C to 180 DEG C, last shape At the insulation heat-resisting protective soldermask coatings on wiring board.

The fundamental component of photocuring thermosetting compositions, ink is made of photocuring and heat cure composition, for storage-stable, industry Composition is divided into dual-pack by boundary, and when in use, two components (host agent and curing agent) is mixed.But this mode is deposited The problem of be mixing after viscosity gradually rise the problem of, due to the variation of composition viscosity, composition is caused to pass through screen printing When the modes such as brush, roller coating, electrostatic spraying, aerial spraying are coated on circuit board substrate, lead to electrostatic spraying, roller coating, silk-screen, sky Composition solidify coating thickness in gas spraying process is uneven, reduces the performance of coating.

Summary of the invention

It is an object of the invention to: a kind of light solidifying/heat solidifying resin composition and its solidfied material are provided, formed Uniform coating thickness, there are the characteristics such as good resistance to weldering heat resistance, developability, mechanical strength and cold-resistant thermal shock.

The technical solution adopted by the invention is as follows:

To achieve the above object, the present invention provides a kind of light solidifying/heat solidifying resin composition, including following weight Part substance: contain 70~100 parts of carboxy resin, 2~10 parts of Photoepolymerizationinitiater initiater, 10~80 parts of photo-sensitive monomer, Thermocurable 20~100 parts of resin, 40~85 parts of filler.

Preferably, the substance including following parts by weight: contain 100 parts of carboxy resin, 8 parts of Photoepolymerizationinitiater initiater, photonasty list 60 parts of body, 80 parts of Thermocurable ingredient, 70 parts of filler.

Preferably, the composition further includes 15~30 parts of organic solvent.Be added organic solvent be in order to adjust viscosity with It is coated on substrate or film convenient for resin.

Preferably, 20 parts of organic solvent are contained in the composition.

Organic solvent be easy to select ethyl alcohol, propyl alcohol, ethylene glycol, petroleum ether, in naphtha any one or it is a variety of.

It preferably, is mixture of the bisphenol type containing carboxy resin and phenolic varnish type containing carboxy resin, institute containing carboxy resin Stating bisphenol type, the mass ratio containing carboxy resin is 1:2 containing carboxy resin and phenolic varnish type.

Preferably, the Photoepolymerizationinitiater initiater selects the oxime ester system Photoepolymerizationinitiater initiater with oxime ester base, alpha-amido benzene second In ketone system Photoepolymerizationinitiater initiater, acylphosphine oxide system Photoepolymerizationinitiater initiater any one or it is a variety of.

Preferably, the photo-sensitive monomer selects the compound or right in molecule with 2 or more ethylenically unsaturated groups Compound obtained from polyalcohol addition alpha, beta-unsaturated carboxylic acid.

There is the optional spent glycol of compound of 2 or more ethylenically unsaturated groups in molecule, methoxyl group tetraethylene glycol, gather The diacrylate esters of the glycol such as ethylene glycol, propylene glycol；Hexylene glycol, trimethylolpropane, pentaerythrite, dipentaerythritol, three The polynary propylene of the polyalcohols such as hydroxyethylisocyanurate or their ethylene oxide adduct or propylene oxide adduct etc. Esters of gallic acid.

Glycol diacrylate, diethyl two can be selected to compound obtained from polyalcohol addition alpha, beta-unsaturated carboxylic acid Alcohol diacrylate, tetraethylene glycol diacrylate, polyethyleneglycol diacrylate, propylene glycol diacrylate, polypropylene glycol Diacrylate, pentaerythritol triacrylate, Dipentaerythritol Pentaacrylate, dipentaerythritol hexaacrylate etc.

Preferably, the heat-curing resin selects amino resins, maleimide compound, benzoxazine resin, carbon Diimine resin, cyclic carbonate compound, multi-functional epoxy compound, any one in episulfide resin.

Preferably, the filler selects barium sulfate, spherical silicon dioxide, any one in talcum.Filler can be improved The physical strength of its film.

The present invention also provides a kind of solidfied material of light solidifying/heat solidifying resin composition, the solidfied material is by photocuring Property hot curing resin composition by photocuring and heat cure and obtain.

In conclusion by adopting the above-described technical solution, the beneficial effects of the present invention are:

Light solidifying/heat solidifying resin composition formula of the invention rationally, avoids and in the prior art directly consolidates light Change the problem larger with viscosity variety caused by the mixing of heat cure composition, so that the uniform coating thickness of its formation, tool There are the characteristics such as good resistance to weldering heat resistance, developability, mechanical strength and cold-resistant thermal shock.

Specific embodiment

The following is a clear and complete description of the technical scheme in the embodiments of the invention, it is clear that described embodiment Only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field Art personnel every other embodiment obtained without making creative work belongs to the model that the present invention protects It encloses.