阅读说明：本技术 一种柔性电路板用无卤银浆料及其制备方法 (A kind of flexible circuit board Halogen silver paste and preparation method thereof ) 是由 何伟雄 肖海明 于 2019-08-07 设计创作，主要内容包括：本发明提供了一种柔性线路板用无卤银浆料,由以下重量份比的组分组成：金属银粉54-60份、无卤聚酯树脂6-7.5份、无卤聚氨酯树脂2-3份、分散剂0.5-1.0份、底材润湿剂0.5-1.0份、增稠剂0.5-1.5份、附着力促进剂0.5-1.2份、溶剂27-33份。目前国内大部分柔性电路板用无卤银浆料所存在的主要问题有：卤素含量超标,不符合无卤的环保要求,本发明相对于现有技术,采用无卤原材料,完全满足世界对环境保护的要求,制得完全不含有卤素的导电银浆料产品,降低污染。(The present invention provides a kind of flexible circuit board Halogen silver pastes, are grouped as by the group of following weight part ratio: 54-60 parts of silver powder, 6-7.5 parts of Halogen polyester resin, 2-3 parts of Halogen polyurethane resin, 0.5-1.0 parts of dispersing agent, 0.5-1.0 parts of ground wetting agent, 0.5-1.5 parts of thickener, 0.5-1.2 parts of adhesion promoter, 27-33 parts of solvent.Main problem present in most domestic flexible circuit board Halogen silver paste has at present: content of halogen is exceeded; the environmental requirement of Halogen is not met; the present invention is compared with the existing technology; using Halogen raw material; fully meet requirement of the world to environmental protection; the conductive silver paste product for being entirely free of halogen is made, reduces pollution.)

1. a kind of flexible circuit board Halogen silver paste, which is characterized in that the Halogen silver paste by following weight part ratio group Be grouped as: 54-60 parts of silver powder, 6-7.5 parts of Halogen polyester resin, without 2-3 parts of polyurethane resin, 0.5-1.0 parts of dispersing agent, 0.5-1.0 parts of ground wetting agent, 0.5-1.5 parts of thickener, 0.5-1.2 parts of adhesion promoter, 27-33 parts of solvent.

2. Halogen silver paste according to claim 1, which is characterized in that the silver powder is flake silver powder, the gold The grain diameter for belonging to silver powder is 2-6 μm, tap density 2.8-4.0g/ml.

3. Halogen silver paste according to claim 1, which is characterized in that the Halogen polyurethane resin is the poly- ammonia of thermoplastics type Ester resin.

4. Halogen silver paste according to claim 1, which is characterized in that the Halogen polyester resin is thermoplastics type's polyester tree Rouge.

5. Halogen silver paste according to claim 1, which is characterized in that the dispersing agent is ink dispersing agent.

6. Halogen silver paste according to claim 1, which is characterized in that the ground wetting agent is polyether-modified acrylic acid Ester.

7. Halogen silver paste according to claim 1, which is characterized in that the thickener is polyurea modified resin solution.

8. Halogen silver paste according to claim 1, which is characterized in that the adhesion promoter is modified polyester resin Rouge.

9. Halogen silver paste according to claim 1, which is characterized in that the solvent is selected from propylene glycol diacetate, second One of glycol diacetate, propylene glycol dipropionate are a variety of.

10. a kind of preparation method of the flexible circuit board Halogen silver paste as described in claim 1-9 is any, which is characterized in that The preparation method comprises the following steps:

Step 1: taking Halogen polyester resin, Halogen polyurethane resin and solvent mixing, and stir to being transparent, use 300- 400 mesh screen cloth filtering and impurity removings, obtain carrier；

Step 2: taking silver powder, carrier, adhesion promoter, dispersing agent, thickener, ground wetting agent resulting in step 1 In carrier, and high speed dispersion, obtain uniform slurry；

Step 3: step 2 gained slurry is ground, until silver paste fineness reach 7 μm hereinafter, silver paste viscosity in 15-200Pa Flexible circuit board Halogen silver paste is made in S.

Technical field

The present invention relates to electrocondution slurry fields, more particularly, to a kind of flexible circuit board Halogen silver paste and its preparation side Method.

Background technique

In recent years, with the rapid development of electronics industry, flexible printed circuit board demand is increasing sharply, and conductive silver Slurry also gets more and more people's extensive concerning as the critical functionality material for preparing such electronic component, development and application.By Environmental protection is increasingly paid attention in people, the requirement to environmental protection is higher and higher, in the use of production product, for depositing There are in pollution environment and to human body the product and material of harm of causing a disease, all disables or limit the use of measure in carrying out gradually.

2007, European Union proposed the ROHS instruction of electronic product, REACH instruction was had also been proposed within 2008, continuous Increasing to dangerous class and pollution class product and raw material disabling or limitation use.Then, as flexible circuit board silver The requirement of slurry is exactly to limit to use to contain halogen product.

In order to meet growing non-halogen requirement, the non-halogen of existing product is put the one of global slurry industry A actual-statement.Flexible circuit road plate is necessary for low temperature (100 DEG C~200 DEG C) conductive silver paste with Halogen silver paste, and should have It is good to flexible circuit board adhesive force, the advantages that electric conductivity is excellent, impressionability, bending resistance, and there is certain scratch resistance Property and hardness without the harmful substances such as lead, halogen meet the requirement such as environmental protection.

And main problem present in most domestic flexible circuit board Halogen silver paste has at present: content of halogen is super Mark, does not meet the environmental requirement of Halogen；To meet excellent electric conductivity, silver powder content is between 65%~75%, silver powder content It is higher, lead to that silver paste is at high cost, bending is poor.

Summary of the invention

The present invention be overcome the problems of the above-mentioned prior art and provide one kind be halogen-free, environmental protection, silver powder content it is low Flexible circuit board Halogen silver paste and preparation method thereof.

The present invention provides a kind of flexible circuit board Halogen silver pastes, are grouped as by the group of following weight part ratio: metal 54-60 parts of silver powder, 6-7.5 parts of Halogen polyester resin, 2-3 parts of Halogen polyurethane resin, 0.5-1.0 parts of dispersing agent, ground wetting 0.5-1.0 parts of agent, 0.5-1.5 parts of thickener, 0.5-1.2 parts of adhesion promoter, 27-33 parts of solvent.

Further, the silver powder is flake silver powder, and the grain diameter of the silver powder is 2-6 μm, vibration density Degree is 2.8-4.0g/ml.

Further, the Halogen polyurethane resin is thermal plastic polyurethane resin.

Further, the Halogen polyester resin is thermoplastics type's polyester resin.

Further, the dispersing agent is ink dispersing agent.

Further, the ground wetting agent is polyether-modified acrylate.

Further, the thickener is polyurea modified resin solution.

Further, the adhesion promoter is modified polyester resin.

Further, the solvent is in propylene glycol diacetate, ethylene diacetate, propylene glycol dipropionate It is one or more.

Invention additionally discloses a kind of preparation methods of above-mentioned flexible circuit board Halogen silver paste, comprising the following steps:

Step 1: taking polyester resin, polyurethane resin and solvent mixing, and stir to being transparent, use 300-400 mesh Screen cloth filtering and impurity removing, obtains carrier；

Step 2: taking silver powder, carrier, adhesion promoter, dispersing agent, thickener, ground wetting agent in step 1 institute In the carrier obtained, and high speed dispersion, obtain uniform slurry；

Step 3: step 2 gained slurry is ground, until silver paste fineness reach 7 μm hereinafter, silver paste viscosity in 15- Flexible circuit board Halogen silver paste is made in 200PaS.

The present invention compared with the existing technology, using Halogen raw material, fully meets requirement of the world to environmental protection, is made It is entirely free of the conductive silver paste product of halogen.Meanwhile formula collocation of the invention remains to while reducing silver powder content Reach same excellent electric conductivity, the conductive silver paste product for being entirely free of halogen is made, and there is preferable adhesive force, resistance to Bending.

Specific embodiment

It in order to enable those skilled in the art to better understand the solution of the present invention, below will be to the skill in the embodiment of the present invention Art scheme is clearly and completely described, it is clear that and the described embodiment is only a part of the embodiment of the present invention, without It is whole embodiments.