阅读说明：本技术 适用于电路板的散热保护装置 (Heat radiation protection device suitable for circuit board ) 是由 眭书剑 于 2018-05-23 设计创作，主要内容包括：本发明公开了适用于电路板的散热保护装置,包括腔体本体,腔体本体的上表面设置有一个凹腔,所述腔体本体为一体化结构,腔体本体的左外侧面和右外侧面分别设置有一个第一凹槽,所述第一凹槽内设置有多片散热片；腔体本体的左外侧面和右外侧面还分别设置有多个第二凹槽,第二凹槽与第一凹槽不相交。本发明解决现有电路板由于电路排布密集,容易产生热量,传统电路板由于散热不及时容易导致电路板烧坏,造成财产损失的问题。(The invention discloses the heat radiation protection devices for being suitable for circuit board; including cavity body; the upper surface of cavity body is provided with a cavity; the cavity body is integrated; the left outside side of cavity body and right lateral surface are respectively arranged with first groove, are provided with multi-disc cooling fin in first groove；The left outside side of cavity body and right lateral surface are also respectively provided with multiple second grooves, and the second groove and the first groove are non-intersecting.The problem of present invention solves available circuit plate since circuit configuration is intensive, is easy to produce heat, and traditional circuit-board is easy to cause circuit board to burn out, caused any property loss not in time due to heat dissipation.)

1. being suitable for the heat radiation protection device of circuit board, including cavity body, the upper surface of cavity body are provided with a cavity (1), which is characterized in that the cavity (1) is rectangle cavity, and the cavity body is integrated, cavity body it is left outside Side and right lateral surface are respectively arranged with first groove (2), are provided with multi-disc cooling fin (3) in first groove (2)； The left outside side of cavity body and right lateral surface are also respectively provided with multiple second grooves (4), the second groove (4) and the first groove (2) non-intersecting, the lower surface of the cavity body is arc, and the lower surface of the cavity body is provided with multiple second grooves (4), the surface of first groove (2), cooling fin (3) and the second groove (4) is coated with heat radiation coating, the cavity body Leading flank is provided with the first circular hole (5), and the central axis of first circular hole (5) is in the leading flank of cavity body, the first circle Hole (5) is through-hole, and one end of the first circular hole (5) is located at the side of cavity (1).

2. the heat radiation protection device according to claim 3 suitable for circuit board, which is characterized in that first circular hole (5) radio frequency connector is provided in.

3. the heat radiation protection device according to claim 1 suitable for circuit board, which is characterized in that the cavity body Leading flank is additionally provided with square hole (6), and the central axis of the square hole (6) is in the leading flank of cavity body, square hole (6) For through-hole, and one end of square hole (6) is located at the side of cavity (1).

4. the heat radiation protection device according to claim 5 suitable for circuit board, which is characterized in that the square hole (6) Inside it is provided with micro- rectangular connector.

5. the heat radiation protection device according to claim 1 suitable for circuit board, which is characterized in that the cavity body Trailing flank is provided with the second circular hole (7), and the central axis of second circular hole (7) is in the trailing flank of cavity body, the second circle Hole (7) is through-hole, and one end of the second circular hole (7) is located at the side of cavity (1).

6. the heat radiation protection device according to claim 1 suitable for circuit board, which is characterized in that second circular hole (7) glass insulator is provided in.

Technical field

The present invention relates to a kind of cavity equipments, and in particular to the heat radiation protection device suitable for circuit board.

Background technique

Existing shell is mostly package assembly, is not only not easy to assemble, but also the stress of component seam crossing is bad, cannot be played Sealing, mechanical support and physical protection effect well；In addition, the bad, surface of the existing generally existing heat dissipation of metal-packaged shell The excessively high problem of temperature, and lasting high temperature can cause irreversible damage, available circuit plate to the electronic component encapsulated in it Since circuit configuration is intensive, it is easy to produce heat, traditional circuit-board is caused since heat dissipation is easy to cause circuit board to burn out not in time Property loss.

Summary of the invention

The present invention provide be suitable for circuit board heat radiation protection device, solve available circuit plate due to circuit configuration it is intensive, It is easy to produce heat, traditional circuit-board due to the problem of being easy to cause circuit board to burn out, cause any property loss of radiating not in time.

The present invention solves the above problems by the following technical programs:

Suitable for the heat radiation protection device of circuit board, including cavity body, the upper surface of cavity body be provided with one it is recessed Chamber, the cavity body are integrated, the left outside side of cavity body and right lateral surface be respectively arranged with one it is first recessed Slot is provided with multi-disc cooling fin in first groove；The left outside side of cavity body and right lateral surface are also respectively provided with more A second groove, the second groove and the first groove are non-intersecting, and the lower surface of the cavity body is provided with multiple second grooves, institute The surface for stating the first groove, cooling fin and the second groove is coated with heat radiation coating.Dissipating for body surface can be improved in heat radiation coating The thermal efficiency reduces object system temperature, can be according to the watt level of the microwave circuit of encapsulation and it is expected that can when using the present invention The heat that can be generated, selects different heat radiation coating: low form heat radiation coating (body surface temperature: 200 degree or less), middle warm type Heat radiation coating (body surface temperature: 200~600 degree or less) or high temperature modification heat radiation coating (body surface temperature: 600 degree with On), the leading flank of the cavity body is provided with the first circular hole, and the central axis of first circular hole is before cavity body Side, the first circular hole is through-hole, and one end of the first circular hole is located at the side of cavity, and the present invention passes through cavity body is integrated The disposable encapsulated moulding of microwave circuit may be implemented in molding, reduces production process, and the first groove of setting and the second groove can To increase the heat dissipation area of cavity body, accelerate radiating rate, the cooling fin being arranged in the second groove can not only increase cavity The heat dissipation area help of ontology is radiated, and can also be played a supporting role, be enhanced the structural strength of cavity body, increase and use the longevity Life, the lower surface of the cavity body are arc.Arc is set by the lower surface of cavity body, heat dissipation area can be increased, Help is radiated, and solves available circuit plate since circuit configuration is intensive, is easy to produce heat, traditional circuit-board is due to radiating not in time The problem of being easy to cause circuit board to burn out, causing any property loss.

Further, radio frequency connector is provided in first circular hole.First circular hole is used for will by radio frequency connector Corresponding pin is drawn.

Further, the leading flank of the cavity body is additionally provided with square hole, the central axis of the square hole in The leading flank of cavity body, square hole is through-hole, and one end of square hole is located at the side of cavity.

Further, micro- rectangular connector is provided in the square hole.Square hole is used for will by micro- rectangular connector Corresponding pin is drawn.

Further, the trailing flank of the cavity body is provided with the second circular hole, the central axis of second circular hole In the trailing flank of cavity body, the second circular hole is through-hole, and one end of the second circular hole is located at the side of cavity.

Further, glass insulator is provided in second circular hole.Glass insulator is used to support across the second circle The conducting wire in hole simultaneously makes its insulation, can be used for transmitting high frequency, low frequency signal.

Compared with prior art, the present invention having the following advantages and benefits: 1, solving available circuit plate due to electricity Road arrangement is intensive, is easy to produce heat, and traditional circuit-board causes property to damage since heat dissipation is easy to cause circuit board to burn out not in time The problem of mistake.

Detailed description of the invention

Attached drawing described herein is used to provide to further understand the embodiment of the present invention, constitutes one of the application Point, do not constitute the restriction to the embodiment of the present invention.In the accompanying drawings:

Fig. 1 is the structural diagram of the present invention.

Fig. 2 is the structural schematic diagram after Fig. 1 is inverted.

Label and corresponding parts title in attached drawing:

1-cavity, the 2-the first groove, 3-cooling fins, the 4-the second groove, the 5-the first circular hole, 6-square holes, 7-the Two circular holes.

Specific embodiment

To make the objectives, technical solutions, and advantages of the present invention clearer, below with reference to embodiment and attached drawing, to this Invention is described in further detail, and exemplary embodiment of the invention and its explanation for explaining only the invention, are not made For limitation of the invention.