Pipeline flowing in arithmetic unit

文档序号:1776057 发布日期:2019-12-03 浏览:17次 中文

阅读说明:本技术 运算装置中的管路配置 (Pipeline flowing in arithmetic unit ) 是由 陈朝荣 黄玉年 徐荣辉 于 2018-08-29 设计创作,主要内容包括:本发明公开一种运算装置中的管路配置,其用于服务器的管路系统,所述服务器包含相对于进入空气的遮蔽配置(shadow arrangement)中的多个元件配置。所述管路系统包含多个管路,所述管路用以将空气引导至所述遮蔽配置中的后侧元件,而所述遮蔽配置中的前侧元件很少或不加热所述空气。(The present invention discloses the pipeline flowing in a kind of arithmetic unit, is used for the pipe-line system of server, and the server includes relative to the multiple element configuration in the masking configuration (shadow arrangement) for entering air.The pipe-line system includes multiple pipelines, and air to be guided the posterior elements into the masking configuration by the pipeline, and the front element covered in configuration is seldom or does not heat the air.)

1. the pipeline flowing in a kind of arithmetic unit, which is characterized in that have in relative to the masking configuration for entering air Multiple first heating elements and multiple second heatiing elements, those first heating elements be positioned adjacent to those first fever member In the arithmetic unit of part, which includes:

One or more first pipelines, for guide a part this enter air flow through the latter in those first heating elements with And the former in those second heatiing elements;And

One or more second pipelines, this for guiding another part enter air and flow through the latter in those second heatiing elements And be not passed through those first heating elements and those second heatiing elements this former.

2. pipeline flowing as described in claim 1, wherein one or more those first pipelines and one or more those second pipes Road shares an at least common wall.

3. pipeline flowing as described in claim 1, wherein one or more those first pipelines include multiple pipelines, wherein those The first part of pipeline around those second heatiing elements this former.

4. pipeline flowing as claimed in claim 3,

Wherein the second part of those pipelines includes by the former and those first heating elements of those second heatiing elements The former one or more separated walls,

Wherein the second part of those pipelines includes in the second part of an at least exhaust outlet to guide those pipelines The latter of air towards those second heatiing elements.

5. pipeline flowing as claimed in claim 4, wherein one or more those second pipelines be located at those pipelines this first Between part and the second part of those pipelines.

6. the pipeline flowing in a kind of arithmetic unit, which is characterized in that have in relative to the masking configuration for entering air Multiple first heating elements and multiple second heatiing elements, those first heating elements be positioned adjacent to those first fever member In the arithmetic unit of part, which includes:

First pipeline, this for guiding a part enter air flow through the latter in those first heating elements and those the The former in two heater elements;

Second pipeline, this for guiding another part enter air and flow through the latter in those second heatiing elements and do not flow Through those first heating elements and those second heatiing elements this former;And

Third pipeline, this for guiding another part enter air and flow through the latter in those first heating elements and not Flow through the former and those second heatiing elements of those first heating elements.

7. pipeline flowing as claimed in claim 6, wherein first pipeline and second pipeline share an at least common wall.

8. pipeline flowing as claimed in claim 6, wherein second pipeline and the third pipeline share an at least common wall.

9. pipeline flowing as claimed in claim 6,

Wherein first pipeline include by those second heatiing elements this former with those first heating elements the former divide this One or more walls opened,

Wherein first pipeline includes an at least exhaust outlet to guide the air in first pipeline towards those the second fevers The latter of element.

10. pipeline flowing as claimed in claim 6, wherein second pipeline be located at first pipeline and the third pipeline it Between.

Technical field

Improved for improving cooling System and method for, and more particularly to a kind of using pipeline the present invention relates to a kind of The System and method for of the cooling of downstream components.

Background technique

It include the electronics dress in the shell of server to make electronic device in server maintain operational temperature specification It is cooled that heat caused by setting needs server.In general, these servers are flowed through by fan or forced air Other devices of server are cooled down.

In some traditional servers, controlled using circuit design (ducting design) to the different members of cooling The flowing of air needed for part.In a kind of typical server design, central processing unit (Central Processing Unit, CPUs) it can be put with memory element with covering the pipeline flowing of configuration (shadow arrangement) and separation It sets in the server.That is, relative to the air-flow for flowing through server, central processing unit (CPUs) be arranged in series so that One in upstream and another is in downstream.Similarly, relative to the air-flow for flowing through server, memory element can also be arranged in series with So that one in upstream and another is in downstream.Furthermore, it is possible to provide pipeline flowing enters air only so as to leader cooling Only pass through central processing unit (CPUs) by memory element and by the air that enters for guiding second part cooling.

Enter air since upstream element has preheated, such design can lead to the problem of two.Firstly, cooling air Efficiency reduce.That is, relatively warm air is compared with can not cool down downstream components.Secondly, having used extra electric power.Also It is to say, because cooling efficiency reduces, it is often necessary to the reduction for accelerating cooling fan to increase air-flow to overcome cooling efficiency.

Accordingly, it is desirable to provide cooling system in servo-system and other arithmetic units, with improve downstream it is cooling without It needs to use more energy significantly.

Summary of the invention

The present invention proposes a kind of pipe-line system for arithmetic unit, and the arithmetic unit includes relative to entrance air Multiple element configuration in masking configuration.The pipe-line system includes multiple pipelines, and the pipeline is guiding air to institute The posterior elements in masking configuration are stated, and the front element in the masking configuration is seldom or does not heat the air.

In one configuration, providing a kind of arithmetic unit has in relative to multiple in the masking configuration for entering air First heating element and multiple second heatiing elements.The first heating element is positioned adjacent to the institute of the first heating element It states in arithmetic unit.In this configuration, pipeline flowing includes to flow through first heating element into air for leader In the latter and the former the first pipeline in second heatiing element.Pipeline flowing also include for guide another part into Enter air to flow through the latter in second heatiing element and be not passed through the former the of first heating element and second heatiing element Two pipelines.

In an alternative embodiment, the arithmetic unit alternatively include the first pipeline, the second pipeline with Third pipeline.First pipeline can be used for the latter and the second fever of leader flowed through in first heating element into air The former in element.Second pipeline can be used for guiding another part into air flow through the latter in second heatiing element and It is not passed through the former of first heating element and second heatiing element.Third pipeline can be used for guiding the entrance air stream of another part Through the latter in first heating element and it is not passed through the former and second heatiing element of first heating element.

To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is attached appended by cooperation Figure is described in detail below.

Detailed description of the invention

Fig. 1 is the side view cutaway drawing of the server comprising pipeline flowing of the prior art;

Fig. 2 is the side view cutaway drawing of the server comprising pipeline flowing of the invention;

Fig. 3 is perspective view, the partial sectional view of the server comprising pipeline flowing of the invention.

Symbol description

10,30,31,32: pipeline

12: entering air

14,16: memory

18: server

19: front side

20: cooling air

22: rear side

24: motherboard

25: pipeline flowing

26,26 ', 27,28,28 ': arrow

33: exhaust outlet

34,36,37: wall

35: single shell

38: opening portion

40,42: central processing unit (CPU)

Specific embodiment

With reference to the accompanying drawings to describe the present invention, wherein indicating similar or phase using being identically numbered in all the drawings Same element.Attached drawing is not necessarily drawn to scale and is only to illustrate the present invention.It is retouched referring to the exemplary application for explanation State several aspects of the invention.It should be understood that listing many details, relationship and mode to provide for of the invention Comprehensive understanding.It, can be in none or multiple details however, the ordinary skill of related fields will recognize immediately Or get off to realize the present invention using the case where other methods.In other cases, be not shown specifically well known structure or operation with Avoid confusion the present invention.The sequence of behavior or event the present invention is not limited to shown in, some behaviors may in a different order and/ Or occur simultaneously with other behaviors or event.In addition, and the not all behavior shown or event require side according to the present invention Method is implemented.

As shown in Fig. 1 (prior art), pipeline flowing may include conventional tube 10, receives and enters air (incoming Air) 12 and guide air to flow through server 18 the preceding memory 14 of front side 19 and the rear side of server 18 or downside 22 after Memory 16.Especially, pipeline 10 leads into air 12 first and flows through memory 14.Pipeline 10 collection flow through memory 14 with The air of the other parts of pipeline 10, to provide cooling air (cooling air) 20 to background storage 16.Pipeline 10 also makes Into the steering of air 12 far from any central processing unit (CPUs) in server 18, to avoid these central processing unit (CPUs) it is heated into air 12.The air that enters that adjacent pipeline (not shown) can be used to carry out leader flows through neighbouring deposit The central processing unit (CPUs) of reservoir 14 and memory 16.

When being used together when the memory element with lower-wattage, pipeline 10 allows access into air 12 and keeps enough cold to mention For effective cooling of memory 14 and memory 16.However, since new high-speed memory technology has higher power demand, The each of memory 14 and memory 16 consumes more high heat in which can dramatically.Memory power is up to 18 watts (Watt, W). This causes memory temperature to reach more than 85 degree Celsius (memory specifications).So into pipeline 10 enter air 12 can be Before flowing through memory 14 and reaching memory 16, it is preheated significantly.The preheating into air 12 in pipeline 10 causes Any cooling air 20 for reaching memory 16, which has, enters the higher temperature of air 12 compared with the cooling for entering pipeline 10.This Therefore preheating reduces the cooling efficiency for reaching the cooling air 20 of memory 16 into air 12.Then, this is reduced Therefore cooling efficiency may cause the temperature of memory 16 to be more than operations specifications, and may further result in the mistake of memory 16 Effect even goes back early failure than expected.

In view of the limitation for traditional cooling line configuration of new memory technology, the present invention considers new pipeline and sets Meter is illustrated in Fig. 2 and Fig. 3.Fig. 2 is painted the lateral sectional view of the server according to the present invention comprising pipeline flowing. Fig. 3 is painted perspective view, the partial sectional view of the server according to the present invention comprising pipeline flowing.

Although specification is directed to the realization of certain types of arithmetic unit (i.e. server), this is merely for convenience of solving It releases.So the present invention is suitable for inclusion in any operation device of heat emitting electronics, wherein heat emitting electronics are relative to air-flow And it is set in masking configuration.Therefore, the present invention considers the element that such arithmetic unit may include any kenel, such as center Processing unit (CPU), graphics processor (graphics processing unit, GPU), memory and similar electronics fill It sets.

As shown in Figure 2 and Figure 3, the pipeline flowing 25 of server 18 includes pipeline 32, pipeline 31 and pipeline 30.Respectively such as arrow Person indicated by first 26,27 and 28, pipeline 32, pipeline 31 and pipeline 30 divide will enter air 12 for three parts.Configure these Pipeline is to provide the cooling of the different piece of server 18.

With reference first to pipeline 30, this pipeline is mainly to provide the cooling of the rear CPU in server 18.Especially, such as Fig. 3 In arrow 28 ' shown in, the part as shown in arrow 28 is directed to flow across pipeline 30 and is then drawn first into air 12 It is directed at rear CPU 42.The inner surface of pipeline 30 not only provides the necessary guidance of air-flow, but also promotes to flow through the part of pipeline 30 Into 12 smooth flow of air.That is, the entrance air of this part follows not first, by preceding CPU 40, (its position is in figure Indicated in 3 with dotted line) path.So, because not by preceding CPU 40, suffering from into air 12 for this part is less Preheating or be not preheated.Correspondingly, it as shown in arrow 28 ', then guides to the part of rear CPU 42 and enters air 12 Colder air is provided for CPU 42 after cooling.

Referring next to pipeline 32, the mainly cooling to memory 14 before providing of this pipeline.In addition, this pipeline is also to mention It is cooling for the part of rear CPU 42.As shown in Figure 2 and Figure 3, as shown in arrow 26, the air 12 that enters of part is guided to flow first By the road 32.For cooling preceding memory 14, pipeline 32 is to guide the air 12 that enters of this part to flow through preceding memory 14.It Afterwards, as shown in the arrow 26 ' in Fig. 3, the air 12 that enters of this part is directed to rear CPU 42 also by exhaust outlet 33.Pipe The inner surface on road 32 can be configured to that the part for flowing through pipeline 32 is promoted to enter 12 smooth flow of air.

Although the air being discharged through exhaust outlet 33 can be heated by memory 14, heated by memory 14 The amount for the air that CPU 40 is heated before the amount of air is usually less than.So the air being discharged through exhaust outlet 33 can still have foot Enough abilities cool down hotter element, for example, after CPU 42.Then, as shown in arrow 26 ', part that exhaust outlet 33 is discharged Into air 12 for CPU 42 after cooling.

As shown in figure 3, opening portion 38 of its at least part for showing pipeline 30 with CPU 40 forward, and pipeline 32 It not comprising such opening portion (in addition to exhaust outlet 33), that is, include wall 37.In pipeline 32, wall 37 is designed to holding part Memory 14 is directed to flow across without being heated by CPU 40 into air 12.However, the present invention considers in some structures, pipe Road 32 can also have opening portion or even seem that pipeline 30 in Fig. 3 fully opens like that.Similarly, pipeline 30 can be optionally It is designed to similar to pipeline 32.That is, it is colder in order to maintain to flow through the entrance air of the part of pipeline 30, it also can provide wall 36 (being indicated with dotted line) separate the inside of pipeline 30 and CPU 40.

Other than pipeline 30 and pipeline 32, as shown in Figure 2 and Figure 3, pipeline flowing 25 also may include be located at pipeline 30 with Pipeline 31 between pipeline 32.This pipeline is to provide the cooling of background storage 16.As depicted in Fig. 2 and Fig. 3, such as arrow Shown in 27, configuration pipeline 31 makes the air 12 that enters of part be directed to background storage 16, without being stored by 14 or appointing One CPU 40 or CPU 42 are preheated.Therefore, the air 12 that enters for reaching the part of memory 16 keeps cooling, deposits to provide Effective cooling of reservoir 16.Such as pipeline 30 and pipeline 32, the inner surface of pipeline 31 can be configured to smoothly guide air.

Although Fig. 2 and Fig. 3 show the specific configuration and size of pipeline 30, pipeline 31 and pipeline 32, the present invention considers The other configurations of these pipelines can also use without restriction.Therefore, the configuration of pipeline can be each based on what is be cooled with size The size of kind of element, the configuration in server 18, the available space in server 18 and various elements cooling requirement and Change.For example, although pipeline 30, pipeline 31 and pipeline 32 are shown to include common wall in Fig. 2 and Fig. 3, In other embodiments, these pipelines may include different walls.In other examples, although pipeline 30, pipeline 31 and pipeline 32 It is illustrated as providing substantial parallel and adjacent to each other air path in Fig. 2 and Fig. 3, but in other embodiments, this A little pipelines do not need adjacent to each other or parallel to each other.

In some embodiments, pipeline 30, pipeline 31 and pipeline 32 can be by the motherboards 24 that configured in server 18 On single shell 35 and define, support memory 14, memory 16 and CPU 42.However, the present invention considers pipeline 30, pipe Road 31 any number of element can be used to define with pipeline 32.

The material of the construction of pipeline described in this specification can be low thermal conductivity material, to minimize between shared Wall (such as separate the wall 34 of pipeline 30 and pipeline 31 and separate the shared wall 37 of pipeline 31 and pipeline 32) between appoint What heat transfer.Suitable material for pipeline includes polymer and ceramics.However, in other implementations, can be used With the 0.55 watt/any materials of (meter Du) (W/ (mK)) or lower pyroconductivity under 25 degree Celsius.

It should be noted that for the ease of discussing, the presentation for one or more elements being shown in each figure may be simplified.Cause This, it should be understood that shown certain elements may include the extention for not individually being painted or being indicated or element.Citing For, the region for being denoted as CPU 40 and CPU 42 may include actual treatment unit, but also may include or be incorporated to other features, Such as heat radiating fin structure.So the present invention considers those skilled in the art and arrives cognition, the pipeline described in the present specification is matched The arithmetic unit for setting implementation may include more or fewer elements that are more depicted than in each figure or being indicated.

Term as used herein is only for for the purpose of describing particular embodiments and is not intended to limit the present invention.As herein It is used, singular " one " (a, an) and "the" (the) are intended to also include multiple forms, unless clearly referring to otherwise herein Show.Furthermore whether the term "comprising" used in detailed description and/or invention claim (including, Includes, having, has, with or its deformation) range, such term be intended to comprising be similar to term The mode of " comprising ".

Unless otherwise defined, otherwise all terms (including technology and scientific term) used herein have and institute of the present invention The identical meaning that the ordinary skill in category field is understood.It should further be appreciated that such as being defined in common dictionary Those of term, should be interpreted as having with its consistent meaning in the contexts of the association area, and will not be interpreted The meaning of idealization or over formalization, unless being clearly defined.

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