阅读说明：本技术 冷却装置及服务器装置 (Cooling device and server unit ) 是由 陈朝荣 黄玉年 陈庆育 方尔凯 于 2019-01-31 设计创作，主要内容包括：本发明公开一种冷却装置及服务器装置,其中该冷却装置用以冷却电子元件,并包含吸热基部以及散热体。吸热基部配置以接触位于服务器装置内的电子元件,而散热体连接吸热基部。散热体包含散热静态特征以及至少一散热动态特征。散热动态特征配置以相对散热静态特征改变位置,以增加散热体的冷却表面积。利用枢轴装置以及柔性金属导管连接散热动态特征与散热静态特征,并进行两者间的热能传递。此冷却装置依循目前的组装过程,且不会影响其他的装置组装方法。产品内具有越多的空间,则能处理越多的热能。(The present invention discloses a kind of cooling device and server unit, and wherein the cooling device is to cooling electronic component, and includes heat absorption base portion and radiator.The configuration of heat absorption base portion is to contact the electronic component being located in server unit, and radiator connects heat absorption base portion.Radiator includes heat dissipation static nature and at least one heat dissipation behavioral characteristics.Behavioral characteristics configuration radiate with opposite heat dissipation static nature change position, to increase the cooling surface product of radiator.Using pivot device and flexible metal conduit connection heat dissipation behavioral characteristics and heat dissipation static nature, and carry out thermal energy transmitting between the two.This cooling device follows current assembling process, and will not influence other apparatus assembling methods.There is more spaces in product, then can handle more thermal energy.)

1. a kind of cooling device, to cooling electronic component, which is characterized in that the cooling device includes:

Absorb heat base portion, and configuration is to contact the electronic component being located in server unit；And

Radiator connects the heat absorption base portion, and wherein the radiator includes heat dissipation static nature and the first heat dissipation behavioral characteristics,

Wherein the first heat dissipation behavioral characteristics configuration changes position with the opposite heat dissipation static nature, to increase the cold of the radiator But surface area.

2. cooling device as described in claim 1, wherein the heat dissipation static nature and the first heat dissipation behavioral characteristics include Material of high thermal conductivity, the material of high thermal conductivity are selected from a group as composed by aluminium, copper, alloy and composite material.

3. cooling device as described in claim 1, wherein the first heat dissipation behavioral characteristics configuration is via the first pivot device It is rotated around the heat dissipation static nature, which connects the first heat dissipation behavioral characteristics and the heat dissipation static nature, And the first heat dissipation behavioral characteristics are transferred to for thermal energy.

4. cooling device as described in claim 1, further includes the second heat dissipation behavioral characteristics, configuration is quiet with the opposite heat dissipation State feature changes position, to increase the cooling surface product of the radiator.

5. cooling device as claimed in claim 4, wherein the second heat dissipation behavioral characteristics configuration with via thermal siphon group around Heat dissipation static nature rotation, the thermal siphon group connect the second heat dissipation behavioral characteristics and the heat dissipation static nature.

6. cooling device as claimed in claim 5, wherein the thermal siphon group includes heat pipe, and heat pipe circulation is first-class Body.

7. cooling device as claimed in claim 4, the wherein first heat dissipation behavioral characteristics and the second heat dissipation behavioral characteristics With rectangular shape.

8. cooling device as claimed in claim 4, wherein the first heat dissipation behavioral characteristics include interlock feature, second heat dissipation Behavioral characteristics include corresponding another interlock feature, and another interlock feature configuration is to receive being somebody's turn to do for the first heat dissipation behavioral characteristics Interlock feature.

9. a kind of server unit, which is characterized in that there is entrance side, outlet side, the first side wall and second sidewall, wherein should The first side wall and the second sidewall extend to the outlet side by the entrance side, which includes:

Blower module, to introduce an air-flow by the entrance side, which blows to the outlet side for configuration；

Chipset；And

Cooling component includes:

Absorb heat base portion, configures to contact the chipset；And

Radiator connects the heat absorption base portion, and wherein the radiator includes heat dissipation static nature and at least one heat dissipation behavioral characteristics,

Wherein at least one heat dissipation behavioral characteristics configuration changes position with the opposite heat dissipation static nature, to increase the radiator One cooling surface product.

Technical field

The cooling device that the present invention relates to a kind of to distribute the thermal energy issued from each electronic unit in server unit.

Background technique

By the Fast Growth of data storage and the communication of high bandwidth that the extension of internet is driven, increase to data center The demand of interior intensive interconnection system.Data center is usually made of plurality of rows of rack server, and server needs and data center In other servers carry out high bandwidth communication, and the communication of high bandwidth can by shielded cable or gradually popular active optical cable come Reach.Active optical cable may achieve longer transmission range and higher transmitting bandwidth, usually has and is bound to cable at least one The light engine in transceiver on end.Light engine converts electrical signals to optical signal (transmission [Tx] function), and light is believed Number be converted to electric signal (receiving [Rx] function).Electronic machineframe can have hundreds if not thousands of interconnection elements, each interconnection member Part generates the thermal energy that must be removed from electronic machineframe.This thermal energy, which can not be removed, will lead to the interconnection member of other component in electronic machineframe The accelerated ageing of part and/or ahead of time failure, therefore, it is necessary to provide cooling system in high speed communication device, facilitate high fever Energy removes and the dense pack of interconnection element.

Summary of the invention

Multiple embodiments of the invention are about a kind of cooling device to cooling electronic component.Cooling device includes to inhale Hot radical portion and radiator.The configuration of heat absorption base portion is to contact the electronic component being located in server unit, and radiator connection is inhaled Hot radical portion.Radiator includes heat dissipation static nature and the first heat dissipation behavioral characteristics.First heat dissipation behavioral characteristics configuration is with opposite The static nature that radiates changes position, to increase the cooling surface product of radiator.

In certain embodiments of the present invention, heat dissipation static nature and the first heat dissipation behavioral characteristics include high heat transfer Rate material, material of high thermal conductivity are selected from a group as composed by aluminium, copper, alloy and composite material.

In certain embodiments of the present invention, first heat dissipation behavioral characteristics configuration with via the first pivot device around heat dissipation Static nature rotation.The first heat dissipation behavioral characteristics of first pivot device connection and heat dissipation static nature, and transmitted for thermal energy. In certain embodiments of the present invention, the first heat dissipation behavioral characteristics are generated around the rotation of heat dissipation static nature between the first heat dissipation Interlock fit feature between behavioral characteristics and heat dissipation static nature.

Cooling device can further include the second heat dissipation behavioral characteristics, and configuration changes position with opposite heat dissipation static nature To increase the cooling surface product of radiator.In certain embodiments of the present invention, second heat dissipation behavioral characteristics configuration with via Second pivot device is around heat dissipation static nature rotation.The second heat dissipation behavioral characteristics of second pivot device connection and heat dissipation are static special Sign, and transmitted for thermal energy.

In certain embodiments of the present invention, second heat dissipation behavioral characteristics around heat dissipation static nature rotation generate between Interlock fit feature between second heat dissipation behavioral characteristics and the static nature that radiates.In certain embodiments of the present invention, Second heat dissipation behavioral characteristics configuration is with via thermal siphon group, around heat dissipation static nature rotation, thermal siphon group connects the second heat dissipation Behavioral characteristics and heat dissipation static nature.In certain embodiments of the present invention, thermal siphon group includes the heat of circulation of fluid Conduit.

In certain embodiments of the present invention, the first heat dissipation behavioral characteristics and the second heat dissipation behavioral characteristics have rectangle External form.It should be understood that heat dissipation behavioral characteristics can have different shapes based on the product being contained in device.

In certain embodiments of the present invention, the first heat dissipation behavioral characteristics include an interlock feature, the second heat dissipation dynamic Feature includes corresponding another interlock feature, is configured to receive the interlock feature of the first heat dissipation behavioral characteristics.

In certain embodiments of the present invention, first heat dissipation behavioral characteristics configuration with via the second thermal siphon group around dissipate Hot static nature rotation.The first heat dissipation behavioral characteristics of second thermal siphon group connection and heat dissipation static nature.Of the invention In some embodiments, the second thermal siphon group includes the heat pipe of circulation of fluid.

Multiple embodiments of the invention are about a kind of server unit, with entrance side, outlet side, the first side wall And second sidewall.The first side wall and second sidewall extend to outlet side by entrance side.Server unit includes blower module And chipset.Blower module is configured to introduce air-flow by entrance side, and air-flow blows to outlet side.Chipset configuration is to receive cooling Device.Cooling device includes configuration with the heat absorption base portion of contact chip group and the radiator of connection heat absorption base portion.Radiator packet The static nature containing heat dissipation, the first heat dissipation behavioral characteristics and the second heat dissipation behavioral characteristics.First heat dissipation behavioral characteristics and second The configuration of heat dissipation behavioral characteristics is to rotate around heat dissipation static nature to increase the surface area of radiator.

Other features and advantages of the invention will illustrate in following description, partially can from narration, it is evident that or Person can be by practicing principle disclosed herein come acquistion.By the element that is particularly pointed out in appended claims with combine, can manage Solve simultaneously acquistion features and advantages of the invention.Above-mentioned and other feature of the invention is become by described below with appended claims It must be fully apparent from, or can be by practicing principle set forth herein come acquistion.

Detailed description of the invention

In order to describe the disclosure above content and its advantage and feature in easily understandable manner, below by way of referring to appended The specific embodiment shown in attached drawing is presented the more specific description of above-mentioned principle.Attached drawing is only described of the invention exemplary Aspect, therefore it is not construed as limitation of the scope of the invention.More specific by using the following drawings, detailed narration and explanation The principle of the present invention.

Fig. 1 is the perspective view of the existing radiator to cooled wafer group；

Fig. 2A is the schematic diagram that one or more embodiments of the invention are painted the cooling device being in close state；

Fig. 2 B is the schematic diagram that one or more embodiments of the invention are painted cooling device in the open state；

Fig. 3 A is the schematic diagram that one or more embodiments of the invention are painted the cooling device being in close state；

Fig. 3 B is the schematic diagram that one or more embodiments of the invention are painted cooling device in the open state；

Fig. 3 C is that one or more embodiments of the invention are painted the exemplary hot rainbow for being implemented in cooling device shown in Fig. 3 B The schematic diagram of suction pipe connector；

Fig. 4 A is that one or more embodiments of the invention are painted the cooling device being in close state, with different shape Schematic diagram；

Fig. 4 B is that one or more embodiments of the invention are painted cooling device in the open state, with different shape Schematic diagram；

Fig. 5 A is that one or more embodiments of the invention show the schematic diagram for being installed with the server unit of cooling device；

Fig. 5 B is server unit shown in one or more embodiment display diagrams 5A of the invention, and wherein cooling device is in The schematic diagram of open state.

Symbol description

10: radiator

12: radiating fin

14: mounting characteristic

16: heat absorption base portion

18: heat dissipation characteristics

20: through-hole

22: screw

24: mounting hole

210,310,410: cooling device

216,316,416: heat absorption base portion

218,318,418: radiator

220,320,420: heat dissipation static nature

221,321,421: the first heat dissipation behavioral characteristics

222,322,422: the second heat dissipation behavioral characteristics

223,423: the first pivot device

224,424: the second pivot device

323: the first thermal siphon groups

324: the second thermal siphon groups

500: server unit

A: chipset

C: printed circuit board

F: blower module

T1, T2: top surface

Specific embodiment

The present invention is described below with reference to attached drawing, wherein specifying similar or waiting using identical numeral mark in attached drawing Same element.The drawings are not drawn to scale, and only provides to illustrate the invention.Referring to explanation sample application to retouch State several aspects of the invention.It should be understood that many details, relationship and method set forth below are to provide to of the invention Comprehensive understanding.However, will be readily seen that can be in the case where one or more details by related fields tool ordinary skill person Or implement the present invention otherwise.In other embodiments, existing structure or operation it is not shown specifically to avoid fuzzy sheet Invention.The present invention not by acting or the sequence of Event Description is limited because some movements may occur in a different order and/or Occur simultaneously with other movements or event.In addition, not all of the illustrated actions or event all need method according to the present invention real It applies.

In high-effect calculating industry, typical calculation server device can include one or more of high performance chips group, lift For example, calculation server may include central processing unit (CPU) or graphics processor (GPU).Said chip group can produce thermal energy And/or with the interconnection element for generating thermal energy.As it was noted above, can not remove thermal energy will lead to chipset itself or calculates clothes The accelerated ageing of the interconnection element of other component and/or failure ahead of time in business device.In typical calculation server, radiator can It is directly connected in the top of high-effect chipset, to attempt to mitigate previously discussed heat problem.

Fig. 1 is the perspective view of the existing radiator 10 to cooled wafer group A.Chipset A can be installed in printed circuit board C On.Existing radiator 10 includes heat absorption base portion 16 and heat dissipation characteristics 18.The base portion 16 that absorbs heat includes two peaces positioned at corner Feature 14 is filled, heat absorption base portion 16 is installed to contact the chipset A being installed on printed circuit board C.Citing comes It says, mounting characteristic 14 includes configuration to receive the through-hole 20 of screw 22, and printed circuit board C may include configuration with fixed screw 22 Mounting hole 24.As shown in Figure 1, two mounting holes 24 are formed near chipset A.Heat dissipation characteristics 18 can from heat absorption base portion 16 to Upper extension, the thermal energy that base portion 16 absorbs that will absorb heat are transferred to air.Heat dissipation characteristics 18 include radiating fin 12.

In some embodiments, printed circuit board C can have multiple chipset A.Printed circuit board C can be located at server In device (being not illustrated in Fig. 1).Therefore, server unit may include multiple chipset A and subsidiary radiator 10.In typical case Server unit in, blower module is installed near radiator 10 so that fan guiding air-flow pass through radiator 10.Air is most It is the inlet air flow path flowed between one or more radiating fins 12 well.Radiator 10 is traditionally by aluminium, copper, heat conducting pipe or steaming Air cavity is made.Radiator 10 can have specific dimensions corresponding with the size of chipset A.Radiator is commonly designed so as to surround The largest surface area that the cooling media (e.g. air-flow) of radiator is in contact with it.Air velocity, the material of selection, protrusion Design and surface treatment are to influence the factor of radiator performance.The surface area of radiator 10 is limited to the surface of radiating fin 12 Product.

With the increase in demand of high-power die group, the demand to high efficiency heat radiation gas also increases.As it was noted above, when pair When the demand of efficiency is promoted, the heat that the chipset in server unit generates increases therewith.Excessively high temperature may cause ahead of time Failure and efficiency are bad.Therefore, various embodiments disclosed herein provide, and there is the new radiator of large surface area to set Meter, but still keep the high-effect chipset of compact package.Specifically, teachings of this disclosure one kind includes heat absorption base portion and connection The cooling body of the radiator of heat absorption base portion, wherein heat absorption base portion configuration is to contact high-power die group.Radiator includes heat dissipation Static nature, the first heat dissipation behavioral characteristics and the second heat dissipation behavioral characteristics.First heat dissipation behavioral characteristics and the second heat dissipation are dynamic State feature configuration is to rotate around heat dissipation static nature to increase the surface area of radiator.

One or more embodiments are painted cooling device 210 to Fig. 2A according to the present invention, may include heat absorption base portion 216 and Radiator 218.For example, cooling device 210 can be made of aluminium, copper, alloy, composite material, heat conducting pipe or steam cavity, can also It is realized using other Heat Conduction Materials.The shape of radiator 218 is changeable to generate bigger surface area, to increase air flow path And promote the efficiency of cooling device 210.

Please referring briefly to Fig. 5 A.Cooling device 210 is configured with the top surface of contact chip group A.Chipset A, which may be disposed at, to be located at Printed circuit board C in server unit 500.The thermal energy absorbed by chipset A can be sent to radiator by the base portion 216 that absorbs heat 218.Blower module F can be installed near cooling device 210, so that fan guiding air-flow passes through radiator 218.

Referring back to Fig. 2A.Radiator 218 includes that heat dissipation static nature 220, first radiates behavioral characteristics 221 and the Two heat dissipation behavioral characteristics 222.First heat dissipation behavioral characteristics 221 can connect heat dissipation static nature via the first pivot device 223 220, likewise, the second heat dissipation behavioral characteristics 222 can connect heat dissipation static nature 220 via the second pivot device 224.Although cold But device 210 includes the first pivot device 223 and the second pivot device 224 dynamically to rotate the first heat dissipation behavioral characteristics 221 With the second heat dissipation behavioral characteristics 222, cooling device 210 also may include other mechanical features.Other illustrative embodiments It is discussed in detail referring to Fig. 3 A to Fig. 3 C.

Fig. 2A shows that the cooling device 210 being in close state, top surface T1 are limited to be stacked in heat dissipation static nature 220 The size of first heat dissipation behavioral characteristics 221 of top and the second heat dissipation behavioral characteristics 222.In other words, the top surface of cooling device 210 T1 area is equal to square of the width of heat dissipation static nature 220.

When being in close state, bottom surface contact heat dissipation 220 portion top surface of static nature of the first heat dissipation behavioral characteristics 221. In this way, it is any by chipset (being not illustrated in Fig. 2A) generate thermal energy must pass through heat absorption base portion 216 enter radiate it is quiet State feature 220 is further transferred to the first heat dissipation behavioral characteristics 221 through mating surface.In addition, when being in close state, the Bottom surface contact heat dissipation 220 portion top surface of static nature of two heat dissipation behavioral characteristics 222.In this way, which any (do not shown by chipset In Fig. 2A) generate thermal energy can pass through heat absorption base portion 216 enter heat dissipation static nature 220, further through cooperating Face is transferred to the second heat dissipation behavioral characteristics 222.Although radiator 218 provides the surface area of cube, the first heat dissipation behavioral characteristics 221 and second heat dissipation behavioral characteristics 222 be movable to release position.At release position, 210 surface area of cooling device increase with Improve its cooling efficiency.

In some embodiments, mating surface can be between heat dissipation static nature 220 and the first heat dissipation behavioral characteristics 221 Two planes.In alternative embodiments, mating surface can be between heat dissipation static nature 220 and the first heat dissipation behavioral characteristics 221 Two interlocking surfaces.Likewise, mating surface can be two between heat dissipation static nature 220 and the second heat dissipation behavioral characteristics 222 Plane.In alternative embodiments, mating surface can be between heat dissipation static nature 220 and the second heat dissipation behavioral characteristics 222 Two interlocking surfaces.Interlocking surface increases the surface area between two co-operating members, improves the efficiency of cooling device 210.Mutually Latching surface may include interlockable teeth.

Mating surface also may include the material different from heat dissipation static nature 220 and the first heat dissipation behavioral characteristics 221.Some In embodiment, mating surface may include material identical with heat dissipation static nature 220 and the first heat dissipation behavioral characteristics 221.Together Sample, mating surface also may include the material different from heat dissipation static nature 220 and the second heat dissipation behavioral characteristics 222.In some realities It applies in mode, mating surface may include material identical with heat dissipation static nature 220 and the second heat dissipation behavioral characteristics 222.

One or more embodiments are painted cooling device 210 in the open state to Fig. 2 B according to the present invention.In some realities It applies in mode, cooling device 210 can be manually configured as open state.In alternative embodiments, cooling device 210 can be automatic It is configured to open state.For example, cooling device 210 can be equipped with temperature sensor, can detect environment temperature or chipset Temperature whether be more than reservation threshold.Once being more than threshold temperature, cooling device 210 be may be actuated as open state.In addition, cooling Device 210 can via Wide Area Network (wide area network, WAN) or Local Area Network (local area network, LAN it) is connected to manager's (not shown), manager can activate cooling device 210 when determining that chipset is more than threshold temperature.This Invention also may include other embodiments manually or automatically.

When in the open state, the side surface of the first heat dissipation behavioral characteristics 221 rotates inward and contacts heat dissipation static nature 220 component side surfaces.In this way, which any thermal energy generated by chipset (being not illustrated in Fig. 2 B) must pass through heat absorption base portion 216 enter heat dissipation static nature 220, are further transferred to the first heat dissipation behavioral characteristics 221 through mating surface.Likewise, place When open state, side surface contact heat dissipation 220 component side surface of static nature of the second heat dissipation behavioral characteristics 222.Such one Come, any thermal energy generated by chipset (being not illustrated in Fig. 2 B) must pass through heat absorption base portion 216 and enter heat dissipation static nature 220, further the second heat dissipation behavioral characteristics 222 are transferred to through mating surface.In addition, the top surface area of radiator 218 passes through First heat dissipation behavioral characteristics 221 rotate outward with the second heat dissipation behavioral characteristics 222 and are increased.

Please referring briefly to Fig. 5 B.Cooling device 210 can be configured to open state in server unit 500.Cooling device 210 it is in the open state when top surface T1 of top surface T2 (as shown in Figure 2 B) area when being in close state for it (such as Fig. 2A institute Show) twice of area.Specifically, the top surface T2 area of cooling device 210 is equal to square of the width of heat dissipation static nature 220 In addition the area of the first heat dissipation behavioral characteristics 221 and the second heat dissipation 222 top surface of behavioral characteristics.It can by the thermal energy that chipset A absorbs By absorbing heat, base portion 216 is sent to radiator 218, then is transferred to the first heat dissipation behavioral characteristics 221 and the second heat dissipation dynamic outward Feature 222.Blower module F can be installed near cooling device 210, so that fan guiding air-flow passes through the top of cooling device 210 Face T2.The surface area of increase improves the radiating efficiency of cooling device 210 because blower module F guiding air-flow have it is bigger Space surface can contact cooling device 210.

One or more embodiments are painted the cooling device 310 being in close state to Fig. 3 A according to the present invention, may include Absorb heat base portion 316 and radiator 318.For example, cooling device 310 can by aluminium, copper, alloy, composite material, heat conducting pipe or Steam cavity is made.In some embodiments, cooling device 310 can be made of a variety of materials.For example, cooling device 310 It may include the thermal siphon for connecting the component of radiator 318, discuss in more detail to this referring to Fig. 3 A and Fig. 3 B.It is cold But device 310 can also be realized with other Heat Conduction Materials.Cooling device 210 shown in similar Fig. 2A and Fig. 2 B, radiator 318 it is outer Type is changeable to increase surface area, to increase air flow path and improve the efficiency of cooling device 310.

Radiator 318 may include that heat dissipation static nature 320, first heat dissipation behavioral characteristics 321 and the second heat dissipation dynamic are special Sign 322.The top surface T1 for the cooling device 310 being in close state is limited to be stacked in the first of 320 top of heat dissipation static nature The size of heat dissipation behavioral characteristics 321 and the second heat dissipation behavioral characteristics 322.In other words, the top surface T1 area of cooling device 310 is equal to Square of the width of heat dissipation static nature 320.When being in close state, the bottom surface of the first heat dissipation behavioral characteristics 321 contacts heat dissipation 320 portion top surface of static nature.In this way, which any thermal energy generated by chipset (being not illustrated in Fig. 3 A) must pass through suction Hot radical portion 316 enters heat dissipation static nature 320, is further transferred to the first heat dissipation behavioral characteristics 321.In addition, in closing When state, bottom surface contact heat dissipation 320 portion top surface of static nature of the second heat dissipation behavioral characteristics 322.In this way, any by core The thermal energy that piece group (being not illustrated in Fig. 3 A) generates can pass through heat absorption base portion 316 and enter heat dissipation static nature 320, further It is transferred to the second heat dissipation behavioral characteristics 322.Although radiator 318 provides the surface area of cube, cooling device 310, which can be changed, is Open state.When in the open state, 310 surface area of cooling device increases to improve its cooling efficiency.

One or more embodiments are painted cooling device 310 in the open state to Fig. 3 B according to the present invention.First heat dissipation Behavioral characteristics 321 can be connected to heat dissipation static nature 320 by the first thermal siphon group 323.First thermal siphon group 323 can be Mechanical features with heat exchanger and pivot function.For example, the first thermal siphon group 323 can be in the first heat dissipation dynamic Circulation of fluid between feature 321 and heat dissipation static nature 320, the first expansion when fluid reaches specific temperature of thermal siphon group 323 , cause the first heat dissipation behavioral characteristics 321 to rotate around heat dissipation static nature 320.First thermal siphon group 323 can be heat conducting pipe, It does not need mechanical pump can circulation of fluid.Instead, the first thermal siphon group 323 can be made of single Heat Conduction Material, Similar to radiator 318.In some embodiments, the first thermal siphon group 323 can be by motor activated.

Similarly, the second heat dissipation behavioral characteristics 322 can be connected to heat dissipation static nature by the second thermal siphon group 324 320.Second thermal siphon group 324 can be the mechanical features with heat exchanger and pivot function.For example, the second hot rainbow Suction pipe group 324 can in second heat dissipation behavioral characteristics 322 and heat dissipation static nature 320 between circulation of fluid, the second thermal siphon group 324 expansions when fluid reaches specific temperature cause the second heat dissipation behavioral characteristics 322 to rotate around heat dissipation static nature 320.Second Thermal siphon group 324 can be heat conducting pipe, and not needing mechanical pump can circulation of fluid.Instead, the second thermal siphon group 324 can be made of single Heat Conduction Material, be similar to radiator 318.Please referring briefly to Fig. 3 C.Second thermal siphon group 324 can be straight It is tapped into succession into the second heat dissipation behavioral characteristics 322.Second thermal siphon group 324 can be by being same as the second heat dissipation behavioral characteristics 322, dissipating The material of hot static nature 320 or both is made.In some embodiments, the second thermal siphon group 324 can be caused by motor It is dynamic.First thermal siphon group 323 can be made of with the second thermal siphon group 324 flexible metal conduit.

Referring back to Fig. 3 B.When in the open state, the side surface of the first heat dissipation behavioral characteristics 321 rotates inward and connects Touching heat dissipation 320 component side surface of static nature.In this way, which any thermal energy generated by chipset (being not illustrated in Fig. 3 B) must pass It passs and heat dissipation static nature 320 is entered by heat absorption base portion 316, be further transferred to the first heat dissipation behavioral characteristics 321.Equally , when in the open state, side surface contact heat dissipation 320 component side surface of static nature of the second heat dissipation behavioral characteristics 322.Such as This one, any thermal energy generated by chipset (being not illustrated in Fig. 3 B) must pass through heat absorption base portion 316, and to enter heat dissipation static Feature 320 is further transferred to the second heat dissipation behavioral characteristics 322.In addition, the top surface area of radiator 318 is dissipated by first Hot behavioral characteristics 321 rotate outward with the second heat dissipation behavioral characteristics 322 and are increased.It should be understood that embodiments of the present invention can be only Include single heat dissipation behavioral characteristics or more than two heat dissipation behavioral characteristics.

In alternative embodiment, the first heat dissipation behavioral characteristics 321 can be quiet by radiating with the second heat dissipation behavioral characteristics 322 The vertical extension of state feature 320.In some embodiments, the first heat dissipation behavioral characteristics 321 and the second heat dissipation behavioral characteristics 322 Configuration is with mobile in multiple directions relative to heat dissipation static nature 320.It should be understood that first heat dissipation behavioral characteristics 321 with Second heat dissipation behavioral characteristics 322 can be rotated, slide or be prolonged by heat dissipation static nature 320 in the other direction or with other mechanism It stretches, to increase the surface area of cooling device 310.

Top surface T1 when top surface T2 area when cooling device 310 is in the open state is in close state for it is (as schemed Shown in 3A) twice of area.Specifically, the top surface T2 area of cooling device 310 is equal to the width of heat dissipation static nature 320 Square plus first heat dissipation behavioral characteristics 321 with second radiate 322 top surface of behavioral characteristics area.The surface area of increase improves The radiating efficiency of cooling device 310.Although cooling device 310 includes the first heat dissipation behavioral characteristics 321 and the second heat dissipation of rectangle Behavioral characteristics 322, cooling device 310 may include the heat dissipation behavioral characteristics of other geometries.

One or more embodiments are painted cooling device 410 to Fig. 4 A according to the present invention, may include heat absorption base portion 416 and Radiator 418.For example, cooling device 410 can be made of aluminium, copper, alloy, composite material, heat conducting pipe or steam cavity, can also Include other Heat Conduction Materials.The external form of radiator 418 is changeable to increase surface area, to increase air flow path and improve cooling The efficiency of device 410.

Radiator 418 may include that heat dissipation static nature 420, first heat dissipation behavioral characteristics 421 and the second heat dissipation dynamic are special Sign 422.First heat dissipation behavioral characteristics 421 can connect heat dissipation static nature 420 via the first pivot device 423, likewise, second The behavioral characteristics 422 that radiate can connect heat dissipation static nature 420 via the second pivot device 424.It is noted that the first heat dissipation is dynamic The surface area of state feature 421 is greater than the surface area of the second heat dissipation behavioral characteristics 422.First heat dissipation behavioral characteristics 421 have outside U-shaped Type is configured to fix the complementary external form of the second heat dissipation behavioral characteristics 422.Although the first heat dissipation behavioral characteristics 421 have square U Shape external form, also it is contemplated that other shapes, for example, the first heat dissipation behavioral characteristics 421 can have semicircle U-shaped external form, configure To fix the second heat dissipation behavioral characteristics 422 external form complementary with semicircle U-shaped.Under this arrangement, cooling device 410 is in unlatching Bigger surface area is provided when state for air flow contacts.The present invention also may include other geometric directions.

Although Fig. 4 A shows that the cooling device 410 being in close state, Fig. 4 B are painted cooling device in the open state 410.When being in close state, the top surface T1 (as shown in Figure 4 A) of cooling device 410 is limited to be stacked in heat dissipation static nature 420 The size of first heat dissipation behavioral characteristics 421 of top and the second heat dissipation behavioral characteristics 422.In other words, the top surface of cooling device 410 T1 area is equal to square of the width of heat dissipation static nature 420.

When being in close state, bottom surface contact heat dissipation 420 portion top surface of static nature of the first heat dissipation behavioral characteristics 421. In this way, it is any by chipset (being not illustrated in Fig. 4 A) generate thermal energy must pass through heat absorption base portion 416 enter radiate it is quiet State feature 420 is further transferred to the first heat dissipation behavioral characteristics 421.In addition, when being in close state, the second heat dissipation dynamic Bottom surface contact heat dissipation 420 portion top surface of static nature of feature 422.In this way, which any (be not illustrated in Fig. 4 A) by chipset The thermal energy of generation can pass through heat absorption base portion 416 and enter heat dissipation static nature 420, further be transferred to the second heat dissipation dynamic Feature 422.Although radiator 418 provides the surface area of cube, the first heat dissipation behavioral characteristics 421 and the second heat dissipation behavioral characteristics 422 are movable to release position.At release position, 410 surface area of cooling device increases to improve its cooling efficiency.

One or more embodiments are painted cooling device 410 in the open state to Fig. 4 B according to the present invention.In unlatching When state, the side surface of the first heat dissipation behavioral characteristics 421 rotates inward and contacts heat dissipation 420 component side surface of static nature.Such as This one, any thermal energy generated by chipset (being not illustrated in Fig. 4 B) must pass through heat absorption base portion 416, and to enter heat dissipation static Feature 420 is further transferred to the first heat dissipation behavioral characteristics 421 through mating surface.Likewise, when in the open state, the Side surface contact heat dissipation 420 component side surface of static nature of two heat dissipation behavioral characteristics 422.In this way, any by chipset The thermal energy that (being not illustrated in Fig. 4 B) generates must pass through heat absorption base portion 416 and enter heat dissipation static nature 420, further pass through Mating surface is transferred to the second heat dissipation behavioral characteristics 422.In addition, the top surface area of radiator 418 passes through the first heat dissipation behavioral characteristics 421 rotate outward with the second heat dissipation behavioral characteristics 422 and are increased.

Top surface T1 when top surface T2 area when cooling device 410 is in the open state is in close state for it is (as schemed Shown in 4A) twice of area.Specifically, the top surface T2 area of cooling device 410 is equal to the width of heat dissipation static nature 420 Square plus first heat dissipation behavioral characteristics 421 with second radiate 422 top surface of behavioral characteristics area.Further, since the first heat dissipation Behavioral characteristics 421 have U-shaped external form, and the second heat dissipation behavioral characteristics 422 have the external form complementary with U-shaped, at cooling device 410 Biggish surface area is provided for air flow contacts along side when open state.The surface area of increase improves cooling device 410 Radiating efficiency.

It is bright for those skilled in the relevant art although having shown that and describing only certain exemplary embodiments of this invention It is aobvious to change and modify in the case where not departing from widely aspect of the invention.Therefore, the purpose of appended claims is to contain Lid falls into having altered in really spirit and scope of the invention and modifies.Already explained content and attached drawing is only used as explanation And it is non-limiting.When being observed at a proper angle based on the prior art, the actual scope of the present invention intention is defined by the claims.

Term as used herein is only to describe particular implementation, rather than intended limitation is of the invention.Unless context is another It explicitly points out outside, otherwise singular shape " one " used herein and "the" are also intended to encompass plural shape.In addition, in embodiment or When claim is using the terms such as " comprising ", " having " or its deformation, it is intended to express the meaning of similar "comprising".

Unless otherwise defined, otherwise all terms (including technology and scientific term) used herein have institute of the present invention Category field has the normally understood connotation of ordinary skill person.In addition, term defined in such as common dictionary is answered so that it has Have and it is interpreted in relevant art connotation consistent mode, and will not idealize or excessively formal meaning solution It releases, except being non-clearly so defined.