阅读说明：本技术 荧光粉涂布系统及方法 (fluorescent powder coating system and method ) 是由 黄涛 魏勇强 于 2018-05-28 设计创作，主要内容包括：本发明提供了一种荧光粉涂布系统及方法,其中,在该荧光粉涂布系统中包括：用于放置晶圆的载台；用于固定荧光胶载具的机械臂,机械臂与载台固定连接,置于载台上方；用于控制荧光胶涂布的点胶机,点胶机与荧光胶载具电连接；用于控制载台/机械臂按照预设路径运动的控制器,控制器分别与载台/机械臂及点胶机电连接。其采用控制器控制荧光胶载具定量出胶,代替现有技术中的人工手动打胶,使每次打胶都在设定范围内,节省荧光粉成本,避免荧光胶的浪费和人力的浪费。(The invention provides a fluorescent powder coating system and a method, wherein the fluorescent powder coating system comprises: a stage for placing a wafer; the mechanical arm is used for fixing the fluorescent glue carrier, is fixedly connected with the carrying platform and is arranged above the carrying platform; the glue dispenser is used for controlling the coating of the fluorescent glue and is electrically connected with the fluorescent glue carrier; and the controller is used for controlling the carrying platform/mechanical arm to move according to a preset path and is respectively and electrically connected with the carrying platform/mechanical arm and the dispenser. It adopts the ration of controller control fluorescence glue carrier to go out to glue, replaces artifical manual among the prior art to beat to glue, makes to beat at every turn and glues all in setting for the within range, saves the phosphor powder cost, avoids the waste of fluorescence glue and the waste of manpower.)

1. A phosphor coating system, comprising:

a stage for placing a wafer;

The mechanical arm is used for fixing the fluorescent glue carrier, is fixedly connected with the carrying platform and is arranged above the carrying platform;

The dispenser is used for controlling the coating of the fluorescent glue and is electrically connected with the fluorescent glue carrier;

and the controller is used for controlling the carrying platform/mechanical arm to move according to a preset path and is respectively and electrically connected with the carrying platform/mechanical arm and the dispenser.

2. a phosphor coating method applied to the phosphor coating system according to claim 1, the phosphor coating method comprising:

placing the wafer on a carrier;

Placing the fluorescent glue carrier in a mechanical arm;

setting a moving path of the carrier moving wafer or the mechanical arm moving fluorescent glue carrier and the glue dispensing amount of the fluorescent glue carrier through a controller;

And starting the dispenser and the controller, and moving the wafer by the carrying platform or moving the fluorescent glue carrier by the mechanical arm to finish the coating of the fluorescent powder.

Technical Field

The invention relates to the technical field of semiconductors, in particular to a fluorescent powder coating system and a fluorescent powder coating method.

background

The light emitting diode has been applied to more and more occasions by virtue of its advantages of high luminous efficiency, low energy consumption, no pollution and the like, and has a tendency to replace the traditional light source. The light emitting diode emits light by exciting a light emitting chip thereof with current. Since a single led chip often cannot generate a desired color (especially white for daily lighting), a phosphor is usually coated on the led chip, and the color of the led chip is adjusted by the wavelength conversion function of the phosphor.

At present, the phosphor coating method generally includes manually controlling a glue-applying syringe to apply phosphor, and manually moving a glue-applying head to perform a circular motion several times within a half radius range above a wafer, so as to spread the phosphor on a surface of a predetermined position of the wafer. However, the manual control may cause the amount of the phosphor powder applied each time to be unstable, which results in the waste of the phosphor powder, and the glue application range on the wafer surface is also inconsistent, which results in the rework due to the fact that the phosphor powder may not completely cover the wafer surface in the subsequent spin coating process (as shown in fig. 1).

disclosure of Invention

in order to overcome the defects, the invention provides a fluorescent powder coating system and a fluorescent powder coating method, which effectively solve the technical problem that waste is easily caused by fluorescent powder coating in the prior art.

A phosphor coating system, comprising:

A stage for placing a wafer;

the mechanical arm is used for fixing the fluorescent glue carrier, is fixedly connected with the carrying platform and is arranged above the carrying platform;

The glue dispenser is used for controlling the coating of the fluorescent glue and is electrically connected with the fluorescent glue carrier;

And the controller is used for controlling the carrying platform/mechanical arm to move according to a preset path and is respectively and electrically connected with the carrying platform/mechanical arm and the dispenser.

A fluorescent powder coating method is applied to the fluorescent powder coating system and comprises the following steps:

placing the wafer on a carrier;

Placing the fluorescent glue carrier in a mechanical arm;

Setting a moving path of the carrier moving wafer of the carrying platform or the mechanical arm moving fluorescent glue carrier and the glue dispensing amount of the fluorescent glue carrier through a controller;

And starting the dispenser and the controller, and moving the wafer by the carrying platform or moving the fluorescent glue carrier by the mechanical arm to finish the coating of the fluorescent powder.

According to the fluorescent powder coating system and method provided by the invention, the controller is adopted to control the fluorescent glue carrier to quantitatively discharge glue, so that manual glue spraying in the prior art is replaced, the glue spraying is in a set range every time, the fluorescent powder cost is saved, and the waste of fluorescent glue and the waste of manpower are avoided; in addition, a table type mechanical arm is adopted to replace manual moving of the glue outlet head, so that the glue outlet head in the fluorescent glue carrier moves on the surface of the wafer according to a programmed path, and the fluorescent powder can be ensured to completely cover the surface of the wafer in a subsequent spin coating process. In practical application, the fluorescent powder coating method is applied to a silicon vertical structure LED chip wafer level fluorescent powder coating process and a sapphire laser lift-off LED chip wafer level fluorescent powder coating process, the fluorescent powder consumption can be saved by more than 20%, and the process rework rate is reduced from the previous 5% to zero rework.

drawings

FIG. 1 is a schematic view of a wafer surface after a spin coater rotates after fluorescent glue is manually dispensed;

FIG. 2 is a schematic structural diagram of a phosphor coating system according to the present invention;

FIG. 3 is a schematic diagram of the lateral movement path of the control stage or the robot of the present invention;

Fig. 4 is a schematic diagram of a circular motion path of the control stage or the robot arm according to the present invention.

reference numerals:

1-a carrying platform, 2-a mechanical arm, 3-a dispenser and 4-a controller.

Detailed Description

in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.

as shown in fig. 2, which is a schematic structural diagram of the phosphor coating system provided by the present invention, it can be seen from the figure that the phosphor coating system includes: a stage 1 for placing a wafer; the mechanical arm 2 is used for fixing a fluorescent glue carrier (such as a needle cylinder and the like), is fixedly connected with the carrying platform and is arranged above the carrying platform; the dispenser 3 is used for controlling the coating of the fluorescent glue and is electrically connected with the fluorescent glue carrier; and the controller 4 is used for controlling the carrying platform/mechanical arm to move according to a preset path, and the controller is respectively and electrically connected with the carrying platform/mechanical arm and the dispensing machine.

in the working process, firstly, the fluorescent powder coating system is set up, and the dispenser, the controller, the carrying platform and the mechanical arm are connected; and then, placing the wafer to be coated with the fluorescent glue on the carrying platform, guiding the prepared fluorescent glue into the fluorescent glue carrier, and fixing the fluorescent glue carrier in the mechanical arm. Then setting parameters such as a moving path of the carrier moving wafer or the mechanical arm moving fluorescent glue carrier, the glue dispensing amount of the fluorescent glue carrier and the like through a controller; and starting the dispenser and the controller, so that the fluorescent glue is coated on the surface of the wafer according to a preset moving path in a mode that the wafer is moved by the carrying platform or the fluorescent glue carrier is moved by the mechanical arm, after the coating of the fluorescent powder is finished, the dispenser is controlled to stop dispensing, the whole foot pad process is intelligently controlled, manual coating is not needed, and the condition of uneven dispensing is avoided.

specifically, the stage or the robot arm can move along the X-axis and the Y-axis under the control of the controller, so that the moving paths of the stage or the robot arm can be preset according to actual situations, as shown in fig. 3 and 4, schematic diagrams of two moving paths are shown, where the stage or the robot arm is controlled to move laterally as shown in fig. 3, and the stage or the robot arm is controlled to make circular motion as shown in fig. 4.

it should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.