Functional layer alloy material for laser manufacturing and remanufacturing of hot top crystallizer copper plate and preparation method thereof

文档序号:1794182 发布日期:2021-11-05 浏览:10次 中文

阅读说明:本技术 一种激光制造与再制造热顶结晶器铜板的功能层合金材料及其制备方法 (Functional layer alloy material for laser manufacturing and remanufacturing of hot top crystallizer copper plate and preparation method thereof ) 是由 倪春雷 陈海涛 董思远 于 2021-08-18 设计创作,主要内容包括:本发明属于激光熔覆和金属复合板材料领域,具体涉及一种激光制造与再制造热顶结晶器铜板的功能层合金材料及其制备方法。一种激光制造与再制造热顶结晶器铜板的功能层合金材料,由以下质量百分数的组分组成:C:0.01%~0.08%,Cr:18.0%~22.0%,Mo:3.3%~8.0%,Nb:3.0%~5.0%,Al:0.01%~0.4%,Ti:0.4%~1.0%,Mn:0.2%~0.5%,Co:0.01%~1.0%,P:0.01%~0.08%,Ta:0.01~0.5%,Ni余量。本发明提供一种激光制造与再制造热顶结晶器铜板的功能层合金材料,并用激光熔覆的方法将低导热系数镍基功能层合金材料制备在铜板的弯月面处,从而达到降低弯月面处的导热能力,实现热顶结晶器的目的,解决连铸裂纹的问题。(The invention belongs to the field of laser cladding and metal composite board materials, and particularly relates to a functional layer alloy material for laser manufacturing and remanufacturing a hot top crystallizer copper plate and a preparation method thereof. A functional layer alloy material for laser manufacturing and remanufacturing of a hot top crystallizer copper plate comprises the following components in percentage by mass: c: 0.01% -0.08%, Cr: 18.0% -22.0%, Mo: 3.3% -8.0%, Nb: 3.0% -5.0%, Al: 0.01% -0.4%, Ti: 0.4% -1.0%, Mn: 0.2% -0.5%, Co: 0.01% -1.0%, P: 0.01% -0.08%, Ta: 0.01-0.5% and the balance of Ni. The invention provides a functional layer alloy material for laser manufacturing and remanufacturing a hot-top crystallizer copper plate, and a low-thermal conductivity nickel-based functional layer alloy material is prepared at a meniscus of the copper plate by using a laser cladding method, so that the heat conductivity at the meniscus is reduced, the purpose of realizing a hot-top crystallizer is achieved, and the problem of continuous casting cracks is solved.)

1. A functional layer alloy material for laser manufacturing and remanufacturing a hot top crystallizer copper plate is characterized by comprising the following components in percentage by mass: c: 0.01% -0.08%, Cr: 18.0% -22.0%, Mo: 3.3% -8.0%, Nb: 3.0% -5.0%, Al: 0.01% -0.4%, Ti: 0.4% -1.0%, Mn: 0.2% -0.5%, Co: 0.01% -1.0%, P: 0.01% -0.08%, Ta: 0.01-0.5% and the balance of Ni.

2. A method for preparing a functional layer alloy material for laser manufacturing and remanufacturing a hot top crystallizer copper plate is characterized by comprising the following steps:

step 1, processing a copper plate into a groove to be clad with a chamfer angle of 15-45 degrees and a depth of 1.0-10.0mm within a range of 50-400mm from an upper opening of the copper plate;

step 2, preparing functional layer powder: according to the formula C: 0.01% -0.08%, Cr: 18.0% -22.0%, Mo: 3.3% -8.0%, Nb: 3.0% -5.0%, Al: 0.01% -0.4%, Ti: 0.4% -1.0%, Mn: 0.2% -0.5%, Co: 0.01% -1.0%, P: 0.01% -0.08%, Ta: 0.01-0.5 percent of Ni, and functional layer powder is prepared according to the mass fraction of the balance of Ni, and the functional layer powder is used for priming cladding with the cladding thickness of 0.3-0.8mm, including chamfering;

step 3, selecting an optical fiber output laser to carry out powder laying or powder feeding multilayer scanning cladding, wherein the thickness of single-layer cladding is controlled to be 0.7-2.0mm till the thickness is 0.5-1.2mm higher than that of the copper plate base material;

and 4, cladding and processing according to a drawing to obtain a finished product.

3. The method for preparing the functional layer alloy material for laser manufacturing and remanufacturing the copper plate of the hot-top crystallizer according to claim 2, wherein the cladding process in the step 3 is as follows: laser power density 300W/mm2~450W/mm2The scanning speed: 800-1500 mm/min, lap joint rate: 50%, protective atmosphere: argon gas, and the oxygen content of the molten pool and the radius of the molten pool within 300mm is controlled to be less than 500ppm in the cladding process.

Technical Field

The invention belongs to the field of laser cladding and metal composite board materials, and particularly relates to a functional layer alloy material for laser manufacturing and remanufacturing a hot top crystallizer copper plate and a preparation method thereof.

Background

The slab continuous casting crystallizer is the core of slab production equipment, has the function of molten steel purification, and has direct relation with defects on the surface of a casting blank. The peritectic steel and high-carbon steel plate blanks produced by continuous casting are easy to crack in the continuous casting process, and the reason is closely related to the crystallizer.

On one hand, the crack is caused by that the shrinkage amount is large due to solidification shrinkage of the plate blank in the solidification and peritectic reaction process and linear shrinkage in the phase change transformation process, so that an air gap is formed between the blank shell and the copper plate too early, the blank shell grows unevenly and shrinks unevenly, and the crack is caused by stress concentration formed at a weak position; on the other hand, the ingot is largely dependent on the uniformity of the primary shell at the meniscus, which is determined by the heat flux density and the uniformity of the heat transfer at the meniscus. The heat flux density is large, the primary blank shell grows too fast, the vibration mark depth can be increased, meanwhile, the blank shell shrinks in advance, and the thickness unevenness of the blank shell is increased. The local part generates a dent, the structure is coarsened, and obvious crack sensitivity is generated.

But the cooling intensity of the crystallizer at the meniscus position can be reduced to lighten the thermal stress of the primary blank shell, weaken the unevenness of primary cooling, improve the growth uniformity of the blank shell and reduce the occurrence of cracks. However, at present, in order to reduce the heat conduction at the meniscus of the copper plate, there are limited methods, such as adding a heat-insulating device or changing the structure of the water tank of the copper plate, adding a low-heat-conductivity alloy layer on the back of the copper plate, as in the patent with application numbers CN200620030695.9 and CN200620030694.4, and increasing the thickness of the coating on the surface of the copper plate, as in the patent with application number CN 201510655708.5.

Disclosure of Invention

In view of the problems in the prior art, the invention aims to provide a functional layer alloy material for laser manufacturing and remanufacturing a hot-top crystallizer copper plate, and a low-thermal-conductivity nickel-based functional layer alloy material is prepared at a meniscus of the copper plate by using a laser cladding method, so that the heat conductivity at the meniscus is reduced, the purpose of realizing a hot-top crystallizer is achieved, and the problem of continuous casting cracks is solved. The functional layer alloy material used in the invention is nickel-based alloy.

In order to achieve the purpose, the invention adopts the following technical scheme.

A functional layer alloy material for laser manufacturing and remanufacturing a hot top crystallizer copper plate comprises the following components in percentage by mass: c: 0.01% -0.08%, Cr: 18.0% -22.0%, Mo: 3.3% -8.0%, Nb: 3.0% -5.0%, Al: 0.01% -0.4%, Ti: 0.4% -1.0%, Mn: 0.2% -0.5%, Co: 0.01% -1.0%, P: 0.01% -0.08%, Ta: 0.01-0.5% and the balance of Ni.

A method for preparing a functional layer alloy material for laser manufacturing and remanufacturing a hot top crystallizer copper plate comprises the following steps:

step 1, processing a copper plate into a groove to be clad with a chamfer angle of 15-45 degrees and a depth of 1.0-10.0mm within a range of 50-400mm from an upper opening of the copper plate.

Step 2, preparing functional layer powder: according to the formula C: 0.01% -0.08%, Cr: 18.0% -22.0%, Mo: 3.3% -8.0%, Nb: 3.0% -5.0%, Al: 0.01% -0.4%, Ti: 0.4% -1.0%, Mn: 0.2% -0.5%, Co: 0.01% -1.0%, P: 0.01% -0.08%, Ta: 0.01-0.5 percent of Ni, and functional layer powder is prepared according to the mass fraction of the balance of Ni, and the functional layer powder is used for priming cladding with the cladding thickness of 0.3-0.8mm, including chamfering.

And 3, selecting an optical fiber output laser to carry out powder laying or powder feeding multilayer scanning cladding, wherein the thickness of single-layer cladding is controlled to be 0.7-2.0mm till the thickness is 0.5-1.2mm higher than that of the copper plate base material.

And 4, cladding and processing according to a drawing to obtain a finished product.

Further, the cladding process of the step 3 comprises the following steps: laser power density 300W/mm2~450W/mm2The scanning speed: 800-1500 mm/min, lap joint rate: 50%, protective atmosphere: argon gas, and the oxygen content of the molten pool and the radius of the molten pool within 300mm is controlled to be less than 500ppm in the cladding process.

Compared with the prior art, the invention has the following beneficial effects.

(1) The heat conductivity at the meniscus is adjusted by adjusting the cladding thickness, so that the requirement of actually adjusting the heat conductivity according to the field requirement is met, and the cladding layer combined by metallurgical bonding cannot be peeled off in the using process.

(2) The nickel-based alloy has higher alloying degree, higher thermal conductivity less than 15W/m DEG C for cladding, good laser cladding forming, and can realize multilayer cladding without generating cracks.

(3) The chamfer angle of the machined groove is 15-45 degrees, so that the root of the chamfer angle is changed into a fillet in the laser cladding process, stress concentration is avoided, and cracks are generated in the cladding and using processes.

(4) Because the Ta element with a proper proportion is added to improve the plasticity of the alloy solid solution and improve the thermal shock resistance of the alloy, the copper plate can not crack a cladding layer in the subsequent orthopedic and high-temperature use processes.

(5) The Ti element with a proper proportion is added into the alloy, the content of N and O in the protective atmosphere in the cladding process can be reduced by utilizing the Ti, the reaction pores in the cladding layer are reduced, and simultaneously the formed oxide can be used as a heterogeneous nucleating agent for mass point refining grains, so that the toughness of the cladding layer is improved, and the wear resistance of the cladding layer can also be improved. And the addition of Ti can make more Al be dissolved into the matrix in a solid way, thereby improving the corrosion resistance of the cladding layer.

(6) The addition of proper P can improve the high-temperature creep resistance of the alloy and improve the high-temperature mechanical property of the copper plate when in use.

(7) The surface temperature of the cast blank can be raised by at least 10 ℃.

Drawings

FIG. 1 is a schematic diagram of a hot top mold copper plate after laser manufacturing and remanufacturing. (1-copper plate matrix, 2-laser cladding priming coat, and 3-laser cladding functional layer).

Detailed Description

The following describes in detail specific embodiments of the present invention. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.

A functional layer alloy material for laser manufacturing and remanufacturing a hot top crystallizer copper plate comprises the following components in percentage by mass: c: 0.01% -0.08%, Cr: 18.0% -22.0%, Mo: 3.3% -8.0%, Nb: 3.0% -5.0%, Al: 0.01% -0.4%, Ti: 0.4% -1.0%, Mn: 0.2% -0.5%, Co: 0.01% -1.0%, P: 0.01% -0.08%, Ta: 0.01-0.5% and the balance of Ni.

A method for preparing a functional layer alloy material for laser manufacturing and remanufacturing a hot top crystallizer copper plate comprises the following steps:

step 1, processing the copper plate to form a chamfer with the depth of 1.0-10.0mm and the angle of 15-45 degrees within the range of 50-400mm from the upper opening of the copper plate

The groove to be clad.

Step 2, preparing functional layer powder: according to the formula C: 0.01% -0.08%, Cr: 18.0% -22.0%, Mo: 3.3% -8.0%,

nb: 3.0% -5.0%, Al: 0.01% -0.4%, Ti: 0.4% -1.0%, Mn: 0.2% -0.5%, Co: 0.01% -1.0%, P: 0.01% -0.08%, Ta: 0.01-0.5 percent of Ni, and functional layer powder is prepared according to the mass fraction of the balance of Ni, and the functional layer powder is used for priming cladding with the cladding thickness of 0.3-0.8mm, including chamfering.

And 3, selecting an optical fiber output laser to carry out powder laying or powder feeding multilayer scanning cladding, wherein the thickness of single-layer cladding is controlled to be 0.7-2.0mm till the thickness is 0.5-1.2mm higher than that of the copper plate base material.

And 4, cladding and processing according to a drawing to obtain a finished product.

Further, the cladding process comprises the following steps: laser power density 300W/mm2~450W/mm2The scanning speed: 800-1500 mm/min, lap joint rate: 50%, protective atmosphere: argon gas, and the oxygen content of the molten pool and the radius of the molten pool within 300mm is controlled to be less than 500ppm in the cladding process.

Example 1.

(1) Processing the copper plate into a groove to be clad with a chamfer angle of 45 degrees and a depth of 2.0mm within the range of 60-100mm from the upper opening of the copper plate.

(2) Firstly, nickel-based alloy is used for priming cladding, the cladding thickness is 0.5mm, and the nickel-based alloy comprises a chamfer angle.

(3) Selecting an optical fiber output laser to spread powder or send powder to scan and clad functional layer alloy powder, C: 0.08%, Cr: 22.0%, Mo: 8.0%, Nb: 5.0%, Al: 0.4%, Ti: 1.0%, Mn: 0.5%, Co: 1.0%, P: 0.08%, Ta: 0.5% and the balance of Ni. The thickness of single-layer cladding is controlled to be 1.1 mm. The cladding process comprises the following steps: laser power density 450W/mm2Scanning speed: 1200mm/min, lap joint rate: 50%, protective atmosphere: argon gas, and the oxygen content of the molten pool and the radius of the molten pool within 300mm is controlled to be less than 500ppm in the cladding process.

(4) And (4) cladding and processing according to a drawing to obtain a finished product.

Example 2.

(1) And processing the copper plate into a groove to be clad with a 3mm deep chamfer angle of 30 degrees within the range of 60-120mm from the upper opening of the copper plate.

(2) Firstly, nickel-based alloy is used for priming cladding, the cladding thickness is 0.6mm, and the nickel-based alloy comprises a chamfer angle.

(3) Selecting an optical fiber output laser to spread powder or send powder to scan and clad functional layer alloy powder, wherein the alloy comprises the following components in percentage by mass: c: 0.05%, Cr: 20.0%, Mo: 5.0%, Nb: 4.0%, Al: 0.2%, Ti: 0.6%, Mn: 0.3%, Co: 0.5%, P: 0.05%, Ta: 0.1% and the balance of Ni. The thickness of single-layer cladding is controlled to be 1.5 mm. The cladding process comprises the following steps: laser power density 450W/mm2The scanning speed: 1000mm/min, lap joint rate: 50%, protective atmosphere: argon gas, and the oxygen content of the molten pool and the radius of the molten pool within 300mm is controlled to be less than 300ppm in the cladding process.

(4) And (4) cladding and processing according to a drawing to obtain a finished product.

Example 3.

(1) And processing the copper plate into a groove to be clad with a chamfer angle of 15 degrees and a depth of 5mm within a range of 50-150mm from the upper opening of the copper plate.

(2) Firstly, nickel-based alloy is used for priming cladding, the cladding thickness is 0.8mm, and the nickel-based alloy comprises a chamfer angle.

(3) Selecting an optical fiber output laser to spread powder or send powder to scan and clad functional layer alloy powder, wherein the alloy comprises the following components in percentage by mass: c: 0.01%, Cr: 18.0%, Mo: 3.3%, Nb: 3.0%, Al: 0.1%, Ti: 0.4%, Mn: 0.2%, Co: 0.01%, P: 0.02%, Ta: 0.02% and the balance of Ni. The thickness of single-layer cladding is controlled to be 2.0 mm. The cladding process comprises the following steps: laser power density 450W/mm2The scanning speed: 800mm/min, lap joint rate: 50%, protective atmosphere: argon, and controlling the oxygen content of the molten pool and the radius of the molten pool within 300mm to be less than 100ppm in the cladding process.

(4) And (4) cladding and processing according to a drawing to obtain a finished product.

By adopting the alloy material, the bonding strength of the copper plate cladding layer and the copper plate substrate of the hot-top crystallizer prepared by the embodiment is more than 100Mpa, and the phenomenon of delamination of the cladding layer and the copper substrate can not occur in the online use process. The total steel passing amount of the lower line of the copper plate of the crystallizer can reach more than 10 ten thousand tons.

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