阅读说明：本技术 一种半导体晶圆硅片自旋转式高效抛光设备 (Self-rotating efficient polishing equipment for semiconductor wafer silicon wafer ) 是由 周勤 于 2021-07-05 设计创作，主要内容包括：本发明属于硅片生产制备技术领域,具体的说是一种半导体晶圆硅片自旋转式高效抛光设备,包括外壳、转盘、放料部件、电机、主动轮、从动轮、一号齿轮、二号齿轮、安装架、支架、限位轮和打磨部件；本发明中通过电机转动带动转盘转动,进而使得转盘带动上部的晶圆硅片和放料部件移动,随后在两个限位轮的支撑和摩擦力的作用下,进而使得晶圆硅片能够旋转,在抛光的过程中,晶圆硅片能够自转,进而在增加了晶圆硅片上各点在抛光过程中相对打磨部件移动的距离,进而提高了打磨的效率；同时由于晶圆硅片的自转,在转盘转动一周后,晶圆硅片上各点相对打磨部件的位置改变,进而防止出现晶圆硅片局部打磨不到的情况,进而提高了抛光的均匀性。(The invention belongs to the technical field of silicon wafer production and preparation, and particularly relates to a self-rotating efficient polishing device for a semiconductor wafer silicon wafer, which comprises a shell, a turntable, a discharging component, a motor, a driving wheel, a driven wheel, a first gear, a second gear, a mounting rack, a support, a limiting wheel and a polishing component, wherein the turntable is arranged on the shell; according to the polishing device, the motor rotates to drive the turntable to rotate, so that the turntable drives the upper wafer silicon wafer and the material placing component to move, then the wafer silicon wafer can rotate under the action of the support and friction force of the two limiting wheels, the wafer silicon wafer can rotate in the polishing process, the moving distance of each point on the wafer silicon wafer relative to the polishing component in the polishing process is increased, and the polishing efficiency is improved; meanwhile, due to the rotation of the wafer silicon wafer, after the turntable rotates for a circle, the positions of all points on the wafer silicon wafer relative to the polishing part are changed, so that the situation that the local part of the wafer silicon wafer cannot be polished is prevented, and the polishing uniformity is improved.)

1. A semiconductor wafer silicon wafer self-rotating type efficient polishing equipment is characterized in that: the automatic feeding device comprises a shell (1), a turntable (2), a feeding component (3), a motor (40), a driving wheel (41), a driven wheel (42), a first gear (43), a second gear (44), a mounting rack (5), a support (6), a limiting wheel (7) and a polishing component (8); the upper part of the shell (1) is provided with the turntable (2); the rotary table (2) is rotationally connected with the shell (1) through a bearing; the upper part of the turntable (2) is provided with the grinding component (8); the polishing component (8) is used for polishing the wafer silicon slice; the mounting racks (5) are uniformly arranged on the upper part of the shell (1) at intervals along the circumferential direction; the mounting rack (5) is fixedly connected with the shell (1); the limiting wheels (7) are symmetrically arranged on the mounting rack (5); the limiting wheel (7) is rotatably connected with the mounting rack (5); the first gear (43) is arranged at the lower part of the turntable (2); the first gear (43) is fixedly connected with one end of the turntable (2); the bracket (6) is arranged in the shell (1); the bracket (6) is fixedly connected with the shell (1); the second gear (44) is rotationally connected with one end of a rotating shaft on the bracket (6); the first gear (43) is meshed with the second gear (44); the driven wheel (42) is arranged at the other end of the rotating shaft on the bracket (6); the driven wheel (42) is rotationally connected with a rotating shaft on the bracket (6); the motor (40) is arranged outside the shell (1); the motor (40) is fixedly connected with the shell (1); the output end of the motor (40) is provided with the driving wheel (41); the driving wheel (41) is fixedly connected with an output shaft of the motor (40); the driving wheel (41) and the driven wheel (42) are in transmission through a belt; the material placing component (3) is arranged at the upper part of the polishing component (8); the material placing component (3) is used for clamping the wafer silicon chip.

2. The self-rotating efficient polishing device for the silicon wafer of the semiconductor wafer as claimed in claim 1, wherein: the discharging component (3) comprises a charging barrel (31), an upper cover (32), a screw (33), a pressing plate (34) and a hook (35); the upper cover (32) is arranged at the upper part of the charging barrel (31); one side of the upper cover (32) is hinged with the charging barrel (31); the upper part of the upper cover (32) is provided with a threaded hole; the threaded hole is internally provided with the screw (33); the screw rod (33) is in threaded connection with the upper cover (32); one end of the screw (33) close to the charging barrel (31) is provided with the pressing plate (34); the pressure plate (34) is fixedly connected with the screw rod (33); the hook (35) is arranged on one side, away from the joint, of the charging barrel (31); the hook (35) is rotationally connected with the charging barrel (31) through a pin shaft; a torsion spring is arranged at the joint of the hook (35) and the charging barrel (31); a hanging rod is arranged at one end, close to the hook (35), of the upper cover (32); the hanging rod is fixedly connected with the upper cover (32).

3. The self-rotating efficient polishing device for the silicon wafer of the semiconductor wafer as claimed in claim 2, wherein: the grinding component (8) comprises grinding cloth (82) and a pressing ring (81); a polishing cloth (82) is laid on the upper part of the turntable (2); the outer side of the rotary table (2) is provided with threads; the pressing ring (81) is arranged on the outer side of the rotary disc (2); the pressing ring (81) is in threaded connection with the rotary disc (2).

4. The self-rotating efficient polishing device for the silicon wafer of the semiconductor wafer as claimed in claim 3, wherein: the upper part of the pressing ring (81) is uniformly provided with bulges (83) at intervals; the bulge (83) is of an arc-shaped structure; the projection (83) is obliquely arranged.

5. The self-rotating efficient polishing device for the silicon wafer of the semiconductor wafer as claimed in claim 4, wherein: the middle part of the rotary table (2) is arranged in a hollow way; a fixed nut (9) is arranged in the middle of the turntable (2); two ends of the fixing nut (9) are fixedly connected with the turntable (2) through connecting plates; the upper part of the polishing cloth (82) is provided with a pressing ball (10); a conical rod is arranged on the pressing ball (10); the conical rod is fixedly connected with the pressing ball (10); the taper rod is provided with threads.

6. The self-rotating efficient polishing device for the silicon wafer of the semiconductor wafer as claimed in claim 5, wherein: the lower part of the rotary table (2) is provided with a circulating pump (11); the circulating pump (11) is fixedly connected with the rotary disc (2); a circulating cavity (12) is formed in the turntable (2); the circulation cavity (12) is in a vortex shape; a cooling pipe (13) is arranged at the lower part of the rotary table (2); one end of the cooling pipe (13) is fixedly connected with the rotary table (2); the cooling pipe (13) is communicated with the inside of the circulating cavity (12); the other end of the cooling pipe (13) is communicated with the circulating pump (11); the other port of the circulating pump (11) is communicated with the circulating cavity (12); cooling liquid is arranged in the circulating cavity (12) and the cooling pipe (13); a cooling cylinder (14) is arranged in the shell (1); the cooling cylinder (14) is filled with cooling liquid; the cooling pipe (13) is located inside the cooling cylinder (14).

7. The self-rotating efficient polishing device for the silicon wafer of the semiconductor wafer as claimed in claim 6, wherein: a thrust bearing (15) is arranged at the lower part of the turntable (2); one side of the thrust bearing (15) is abutted against the shell (1); the other side of the thrust bearing (15) is abutted against the turntable (2); the thrust bearing (15) is close to the edge of the turntable (2).

Technical Field

The invention belongs to the technical field of silicon wafer production and preparation, and particularly relates to self-rotating efficient polishing equipment for a semiconductor wafer silicon wafer.

Background

Polishing is a final processing procedure of a silicon wafer, and the polished surface is required to have lattice integrity, high flatness and cleanness; the surface free of the process-altered layer can be obtained using a mechanochemical polishing process. In order to improve the polishing efficiency, two times of polishing are carried out; in the first polishing, by means of the mechanical action of abrasive particles and polishing cloth, a hydration film on the surface of a silicon wafer is damaged for efficient polishing; therefore, it is necessary to form a thin hydrated film by using abrasive grains having a large particle size and a polishing cloth having a good air permeability, in order to obtain the thickness, flatness, etc. of the silicon wafer. The removal amount in the first polishing was about 1.5 μm, and the polishing solution used in the first polishing was prepared by adding an alkaline additive such as NaOH or KOH to SiO2 suspension so that the pH of the polishing solution became 11. The polishing cloth for primary polishing is a non-woven cloth made of diffuse polyurethane; the polishing cloth for secondary polishing is made of foamed polyurethane artificial leather. The secondary polishing is finish polishing, which is performed by continuously removing the hydrated film without damage. The polishing solution added with alkali or ammonia is used for the secondary polishing, and the pH value is 9. The processing amount of the secondary polishing is generally below 1 μm; the silicon wafer polishing device has two types of single-side polishing and double-side polishing. Double-sided polishing can improve polishing efficiency and machining precision.

In the existing polishing equipment for the wafer silicon wafer, the mutual friction between a rotating polishing head and a static wafer silicon wafer is realized mainly through the relative sliding between the rotating polishing head and the static wafer silicon wafer, so that the surface polishing effect of the wafer silicon wafer is achieved, but because the wafer silicon wafer is in a static state and the center position of the polishing head is kept unchanged, the distance between each point on the wafer silicon wafer and the center of the polishing head is kept unchanged in the polishing process, so that the sliding path of the wafer and each point on the polishing head is reduced, and the polishing efficiency is further reduced; meanwhile, as the wafer silicon chip is kept still, the contact tracks of all points on the wafer silicon chip and the polishing head are always superposed during polishing, so that the surface flatness of the wafer silicon wafer is completely consistent with the surface of the polishing head (namely, when the surface of the polishing head has small protrusions and contacts with the wafer silicon wafer, the small protrusions return to the initial contact positions with the wafer silicon wafer after rotating for one circle, so that the paths of the small protrusions sliding on the wafer silicon wafer are overlapped each other when rotating for one circle, and scratches appear on the paths), thereby reducing the polishing uniformity, in the scheme, the wafer silicon wafer autorotates under the action of friction force when the rotating disc rotates through the arranged limiting wheel and the rotating disc, and then increased the path of relative slip between wafer silicon chip and the part of polishing, and then solved the problem that the efficiency of polishing is low because wafer silicon chip motionless and then cause among the traditional polishing process.

Disclosure of Invention

In order to make up the defects of the prior art, the invention provides a self-rotating type high-efficiency polishing device for a semiconductor wafer silicon wafer. The polishing device is mainly used for solving the problem of low polishing efficiency caused by the fact that a wafer is still in the traditional polishing process.

The technical scheme adopted by the invention for solving the technical problems is as follows: a self-rotating efficient polishing device for semiconductor wafer silicon wafers comprises a shell, a rotary table, a material placing component, a motor, a driving wheel, a driven wheel, a first gear, a second gear, a mounting rack, a support, a limiting wheel and a polishing component, wherein the rotary table is arranged on the shell; the upper part of the shell is provided with the rotary disc; the turntable is rotationally connected with the shell through a bearing; the upper part of the rotary table is provided with the grinding component; the polishing component is used for polishing the wafer silicon slice; the mounting racks are uniformly arranged at intervals along the circumferential direction on the upper part of the shell; the mounting rack is fixedly connected with the shell; the limiting wheels are symmetrically arranged on the mounting rack; the limiting wheel is rotatably connected with the mounting rack; the first gear is arranged at the lower part of the turntable; the first gear is fixedly connected with one end of the turntable; the bracket is arranged inside the shell; the bracket is fixedly connected with the shell; the second gear is rotationally connected with one end of a rotating shaft on the bracket; the first gear is meshed with the second gear; the driven wheel is arranged at the other end of the rotating shaft on the bracket; the driven wheel is rotationally connected with the rotating shaft on the bracket; the motor is arranged outside the shell; the motor is fixedly connected with the shell; the output end of the motor is provided with the driving wheel; the driving wheel is fixedly connected with the output shaft of the motor; the driving wheel and the driven wheel are in transmission through a belt; the upper part of the polishing component is provided with the discharging component; the discharging component is used for clamping the wafer silicon chip.

During working, in the existing polishing equipment for the wafer silicon wafer, the rotating polishing head and the static wafer silicon wafer slide relatively to each other, so that mutual friction between the rotating polishing head and the static wafer silicon wafer is realized, and further the surface polishing effect of the wafer silicon wafer is achieved; meanwhile, as the wafer silicon wafer is kept static, the contact tracks of all points on the wafer silicon wafer and the polishing head are always overlapped during polishing, so that the surface flatness of the wafer silicon wafer is completely consistent with the surface of the polishing head (namely when a small bulge appears on the surface of the polishing head and is in contact with the wafer silicon wafer, after the polishing head rotates for one circle, the small bulge returns to the initial contact position with the wafer silicon wafer, the path which the small bulge slides on the wafer silicon wafer for each circle of rotation is overlapped, and scratches appear on the path), and the polishing uniformity is reduced; therefore, in the scheme, before polishing, the wafer silicon wafer is prevented from being placed on the placing mechanism, the wafer silicon wafer is pressed on the polishing component through the placing mechanism, then the driving wheel is driven to rotate through the rotation of the arranged motor, the driven wheel is driven to rotate, the second gear is driven to rotate, the first gear is driven to rotate, the turntable is driven to rotate and the polishing component rotates, the turntable drives the wafer silicon wafer and the placing component on the upper portion to move, after the wafer silicon wafer and the placing component move for a certain distance, the placing component is contacted with the limiting wheels, relative sliding occurs between the wafer silicon wafer and the polishing component due to the limitation of the limiting wheels, the polishing component generates sliding friction force on the wafer silicon wafer, and meanwhile, under the supporting action of the two limiting wheels, the intersection point of the acting forces of the two limiting wheels passes through the central point (namely, point O in figure 8) of the wafer silicon wafer, meanwhile, because the center of the wafer silicon wafer is not overlapped with the center of the turntable, the friction force acting on each point on the wafer silicon wafer is distributed on the arc line of each concentric circle taking the center of the turntable as the center of the circle, wherein the friction force distributed on the point on the arc (the arc is taken as a dividing arc) taking the center of the turntable as the center of the circle and the distance from the point O to the center of the turntable as the radius passes through the center of the wafer silicon wafer, the wafer silicon wafer cannot rotate around the point O by changing the friction force, the wafer silicon wafer can rotate anticlockwise by the friction force of each point on the area on one side of the dividing arc (namely the area B in figure 8), the wafer silicon wafer can rotate clockwise by the friction force generated by each point on the area on the other side of the dividing arc (namely the area A in figure 8), and because the area B is larger than the area A, the points generating the friction force in the area B are more than the area A, and then make the resultant force (fb in fig. 8) of the frictional force of B area greater than the resultant force (fa in fig. 8) of the frictional force of A area, and then make the silicon wafer can anticlockwise rotate, and then make in the course of polishing, the silicon wafer can autorotation, and then the distance that each point on the silicon wafer moves relative to the part of polishing in the course of polishing has increased, and then has improved the efficiency of polishing, meanwhile because the autorotation of the silicon wafer, and then make the carousel rotate a week, the relative position of each point on the silicon wafer relative to the part of polishing changes, and then prevent to cause the situation that the silicon wafer can't be ground locally because of the unevenness of the part of polishing, and then improved the homogeneity of polishing.

Preferably, the discharging component comprises a charging barrel, an upper cover, a screw, a pressing plate and a hook; the upper cover is arranged at the upper part of the charging barrel; one side of the upper cover is hinged with the charging barrel; the upper part of the upper cover is provided with a threaded hole; the threaded hole is internally provided with the screw; the screw rod is in threaded connection with the upper cover; the pressing plate is arranged at one end, close to the charging barrel, of the screw; the pressing plate is fixedly connected with the screw; the hook is arranged on one side of the charging barrel, which is far away from the joint; the hook is rotationally connected with the charging barrel through a pin shaft; a torsion spring is arranged at the joint of the hook and the charging barrel; a hanging rod is arranged at one end of the upper cover close to the hook; the hanging rod is fixedly connected with the upper cover.

During working, the wafer silicon wafer is fragile in material, so that the wafer silicon wafer is easily damaged during clamping, and meanwhile, the force exerted on the wafer silicon wafer is kept uniform during polishing, so that in the scheme, during clamping of the wafer silicon wafer, a user manually dials away the hook and the hanging rod, then the upper part of the charging barrel is opened by rotating the upper cover, then the charging barrel is placed on the upper part of the polishing part, then the wafer silicon wafer is placed in the charging barrel, then the upper cover is rotated, the hanging rod is close to the hook along with closing of the upper cover, the hook is deflected, the hanging rod moves downwards along with the continuation of the hanging rod, the hanging rod is separated from the outer side of the hook, then the hook is restored to the initial position under the action of the elastic force of the torsion spring, the hanging rod is positioned on the inner side of the hook, further the locking of the upper cover is realized, and then the screw rod is rotated, the pressing plate moves downwards, so that the pressing plate presses the wafer silicon chip, the contact area between the pressing plate and the wafer silicon chip is large due to the large area of the pressing plate, the acting force of the pressing plate on the wafer silicon chip is uniform, and the wafer silicon chip is prevented from being damaged when the wafer silicon chip is pressed tightly; meanwhile, when the silicon wafer pressing device is used, the tightness of the pressing plate pressing on the wafer silicon wafer can be adjusted by rotating the screw rod; and then the pressure on the wafer silicon chip is adjusted, so that the friction between the wafer silicon chip and the grinding part is adjusted, the polishing effect of different degrees is realized, and the application range of the polishing equipment is enlarged.

Preferably, the grinding part comprises a grinding cloth and a pressing ring; polishing cloth is laid on the upper portion of the rotary table; the outer side of the rotary table is provided with threads; the pressing ring is arranged on the outer side of the rotary table; the pressing ring is in threaded connection with the rotary table.

During working, because the required surface polishing quality of wafer silicon wafers required by different production processes is different, in the conventional common method, polishing equipment of different types is usually adopted for polishing, and meanwhile, because the polishing head needs to be replaced after the polishing equipment is used for a period of time, because the connection mode of the polishing head of the conventional polishing equipment is complex, the replacement of the polishing head is more complex; therefore, in the scheme, the pressing ring is arranged, so that a circle of polishing cloth tiled on the turntable is pressed, the polishing cloth can be flatly laid on the turntable, when different polishing effects are required to be obtained, the pressing ring is rotated to be away from the polishing cloth, the polishing cloth is loosened, the polishing cloth can be taken down, the polishing cloth with different requirements can be replaced, and the purposes of different polishing qualities are achieved; because in the process of replacing the polishing cloth, an operator only needs to rotate the pressing ring to realize the pressing and releasing of the polishing cloth, the polishing cloth is further replaced simply and conveniently, different polishing effects are further obtained simply, and the application range of the polishing equipment is further enlarged.

Preferably, the upper part of the pressing ring is uniformly provided with bulges at intervals; the bulge is of an arc-shaped structure; the protrusions are arranged obliquely.

When the polishing device works, the motor and the gear are in transmission in the polishing device, so that the polishing device inevitably has vibration, and further the pressing ring is easy to loosen, so that the polishing cloth is loosened, wrinkles appear on the polishing cloth, and the polishing quality is poor; therefore, in the scheme, the bulge is arranged on one side, close to the polishing cloth, of the pressing ring, so that when the pressing ring is tightly pressed on the polishing cloth, due to the flexible characteristic of the polishing cloth, the bulge is extruded inside the polishing cloth, the contact area between the polishing cloth and the pressing ring is increased, the resistance borne by the pressing ring when the pressing ring is loosened is increased, the effect of preventing the pressing ring from loosening is achieved, the problem of poor polishing quality caused by loosening of the polishing cloth in the use process of polishing equipment is solved, and the polishing quality of the polishing equipment is ensured; simultaneously because protruding one-tenth spiral slope sets up, and then at the in-process that the clamping ring was screwed up, under bellied drive, and then make polishing cloth gather together towards the centre, and then make polishing cloth tightened, and then make polishing cloth can be more smooth lay on the carousel, and then improved polishing effect.

Preferably, the middle part of the rotating disc is arranged in a hollow way; a fixed nut is arranged in the middle of the rotary table; two ends of the fixing nut are fixedly connected with the rotary table through a connecting plate; the upper part of the polishing cloth is provided with a pressing ball; a conical rod is arranged on the pressing ball; the conical rod is fixedly connected with the pressing ball; the taper rod is provided with threads.

When the polishing cloth is in work, the polishing cloth is flexible, and the area of the rotary table is large, so that after the polishing cloth is used for a long time, the elasticity of the polishing cloth is reduced, the middle part of the polishing cloth is loosened, wrinkles of the polishing cloth can be caused, and the polishing quality is poor; therefore, in the scheme, the pressing balls are arranged in the middle of the turntable, so that the polishing cloth is tightened in the middle through the pressing balls, the polishing cloth is kept in a tightened and flat state, and the polishing quality is ensured; the pressing ball is spherical, so that the pressing ball is in uniform contact with the polishing cloth in the downward movement process of the pressing ball, the force of the pressing ball on the polishing cloth is more uniform, and the polishing cloth can be tightened more uniformly; the flatness of the polishing cloth is further ensured, and the polishing quality is further ensured; simultaneously after using a period, when the polishing cloth appears lax, compress tightly the ball through rotating, and then make and compress tightly the ball and move down, and then make the middle part of polishing cloth move down, make the polishing cloth be the state of tightening once more, and then can remain the level and smooth of polishing cloth throughout, and then guarantee the polishing quality of different periods.

Preferably, the lower part of the rotating disc is provided with a circulating pump; the circulating pump is fixedly connected with the rotary disc; a circulating cavity is formed in the turntable; the circulating cavity is in a vortex shape; a cooling pipe is arranged at the lower part of the rotary table; one end of the cooling pipe is fixedly connected with the turntable; the cooling pipe is communicated with the interior of the circulating cavity; the other end of the cooling pipe is communicated with the circulating pump; the other port of the circulating pump is communicated with the circulating cavity; cooling liquid is arranged in the circulating cavity and the cooling pipe; a cooling cylinder is arranged inside the shell; the cooling cylinder is filled with cooling liquid; the cooling tube is located inside the cooling cylinder.

When the polishing machine works, a large amount of heat is generated in the polishing process, and if the heat is not dissipated for a long time, the damage to the wafer silicon chip and the polishing cloth can be caused, so that the polishing quality is poor, therefore, in the scheme, the circulating cavity is arranged in the turntable, so that the cooling liquid in the turntable flows under the action of the circulating pump, the heat generated by polishing is driven to the outside of the turntable through the flowing cooling liquid, the dissipation of the heat is accelerated, the over-high temperature of the wafer silicon chip is prevented, and the wafer silicon chip is prevented from being damaged due to the over-high temperature; meanwhile, the cooling pipe is arranged to be spiral, so that the contact area between the cooling pipe and the external cooling liquid is increased, the heat generated by polishing is quickened to be dissipated, and the wafer silicon chip is further guaranteed not to be thermally damaged.

Preferably, a thrust bearing is arranged at the lower part of the rotating disc; one side of the thrust bearing is abutted against the shell; the other side of the thrust bearing is abutted against the turntable; the thrust bearing is near the edge of the turntable.

In operation, because the area of carousel is great, and the blowing part weight of placing on carousel upper portion is also great, and the blowing part is kept away from the carousel center and is placed, and then at the pivoted in-process, be difficult to guarantee can keep balance between a plurality of blowing parts that upper portion was placed, and then can lead to the carousel unstability, and then cause the incline of carousel, therefore in this scheme, be provided with thrust bearing through the edge at the carousel, and then can play the effect of supporting the carousel in vertical direction, and then prevent that the incline from appearing in the vertical direction of carousel, and then increased the stability of carousel, and then guaranteed the stability and the regularity of the part of polishing, and then guaranteed polishing effect.

The invention has the following beneficial effects:

1. before polishing, the wafer silicon slice is prevented from being arranged on the discharging mechanism, the wafer silicon slice is tightly pressed on the polishing component through the discharging mechanism, then the driving wheel is driven to rotate through the rotation of the arranged motor, the driven wheel is driven to rotate, the second gear is driven to rotate, the first gear is driven to rotate, the turntable is driven to rotate and the polishing component rotates, the wafer silicon slice and the discharging component on the upper portion are driven to move through the turntable, after the wafer silicon slice and the discharging component move for a certain distance, the discharging component is contacted with the limiting wheels, relative sliding occurs between the wafer silicon slice and the polishing component due to the limitation of the limiting wheels, the polishing component generates sliding friction force on the wafer silicon slice, and meanwhile, under the supporting action of the two limiting wheels, the intersection point of the acting forces of the two limiting wheels passes through the central point (namely, point O in figure 8) of the wafer silicon slice, meanwhile, because the center of the wafer silicon wafer is not overlapped with the center of the turntable, the friction force acting on each point on the wafer silicon wafer is distributed on the arc line of each concentric circle taking the center of the turntable as the center of the circle, wherein the friction force distributed on the point on the arc (the arc is taken as a dividing arc) taking the center of the turntable as the center of the circle and the distance from the point O to the center of the turntable as the radius passes through the center of the wafer silicon wafer, the wafer silicon wafer cannot rotate around the point O by changing the friction force, the wafer silicon wafer can rotate anticlockwise by the friction force of each point on the area on one side of the dividing arc (namely the area B in figure 8), the wafer silicon wafer can rotate clockwise by the friction force generated by each point on the area on the other side of the dividing arc (namely the area A in figure 8), and because the area B is larger than the area A, the points generating the friction force in the area B are more than the area A, and then make the resultant force (fb in fig. 8) of the frictional force of B area greater than the resultant force (fa in fig. 8) of the frictional force of A area, and then make the silicon wafer can anticlockwise rotate, and then make in the course of polishing, the silicon wafer can autorotation, and then the distance that each point on the silicon wafer moves relative to the part of polishing in the course of polishing has increased, and then has improved the efficiency of polishing, meanwhile because the autorotation of the silicon wafer, and then make the carousel rotate a week, the relative position of each point on the silicon wafer relative to the part of polishing changes, and then prevent to cause the situation that the silicon wafer can't be ground locally because of the unevenness of the part of polishing, and then improved the homogeneity of polishing.

2. In the invention, because the wafer silicon wafer is fragile in material, the wafer silicon wafer is easy to damage during clamping, and meanwhile, the force exerted on the wafer silicon wafer is kept uniform during polishing, in the scheme, when the wafer silicon wafer is clamped, a user manually dials away the hook and the hanging rod, then the upper part of the charging barrel is opened by rotating the upper cover, then the charging barrel is placed at the upper part of the polishing component, then the wafer silicon wafer is placed in the charging barrel, then the upper cover is rotated, the hanging rod is close to the hook along with the closing of the upper cover, so that the hook deflects, the hanging rod moves downwards along with the continuation of the hanging rod, the hanging rod is separated from the outer side of the hook, the hook is restored to the initial position under the action of the elasticity of the torsion spring, the hanging rod is positioned at the inner side of the hook, the locking of the upper cover is realized, and then the screw rod is rotated, the pressing plate moves downwards, so that the pressing plate presses the wafer silicon chip, the contact area between the pressing plate and the wafer silicon chip is large due to the large area of the pressing plate, the acting force of the pressing plate on the wafer silicon chip is uniform, and the wafer silicon chip is prevented from being damaged when the wafer silicon chip is pressed tightly; meanwhile, when the silicon wafer pressing device is used, the tightness of the pressing plate pressing on the wafer silicon wafer can be adjusted by rotating the screw rod; and then the pressure on the wafer silicon chip is adjusted, so that the friction between the wafer silicon chip and the grinding part is adjusted, the polishing effect of different degrees is realized, and the application range of the polishing equipment is enlarged.

3. In the invention, because the required surface polishing quality of the wafer silicon wafers required by different production processes is different, in the conventional common method, polishing equipment with different models is usually adopted for polishing, and meanwhile, because the polishing heads of the polishing equipment need to be replaced after being used for a period of time, the polishing heads of the conventional polishing equipment are complicated in connection mode, so that the replacement of the polishing heads is more complicated; therefore, in the scheme, the pressing ring is arranged, so that a circle of polishing cloth tiled on the turntable is pressed, the polishing cloth can be flatly laid on the turntable, when different polishing effects are required to be obtained, the pressing ring is rotated to be away from the polishing cloth, the polishing cloth is loosened, the polishing cloth can be taken down, the polishing cloth with different requirements can be replaced, and the purposes of different polishing qualities are achieved; because in the process of replacing the polishing cloth, an operator only needs to rotate the pressing ring to realize the pressing and releasing of the polishing cloth, the polishing cloth is further replaced simply and conveniently, different polishing effects are further obtained simply, and the application range of the polishing equipment is further enlarged.

4. In the invention, because the polishing equipment is provided with the motor and the gear transmission, the polishing equipment inevitably has vibration, and the pressing ring is easy to loosen, so that the polishing cloth is loosened, and the polishing cloth is wrinkled, and the polishing quality is poor; therefore, in the scheme, the bulge is arranged on one side, close to the polishing cloth, of the pressing ring, so that when the pressing ring is tightly pressed on the polishing cloth, due to the flexible characteristic of the polishing cloth, the bulge is extruded inside the polishing cloth, the contact area between the polishing cloth and the pressing ring is increased, the resistance borne by the pressing ring when the pressing ring is loosened is increased, the effect of preventing the pressing ring from loosening is achieved, the problem of poor polishing quality caused by loosening of the polishing cloth in the use process of polishing equipment is solved, and the polishing quality of the polishing equipment is ensured; simultaneously because protruding one-tenth spiral slope sets up, and then at the in-process that the clamping ring was screwed up, under bellied drive, and then make polishing cloth gather together towards the centre, and then make polishing cloth tightened, and then make polishing cloth can be more smooth lay on the carousel, and then improved polishing effect.

5. In the invention, because the polishing cloth is flexible and the area of the turntable is large, after the polishing cloth is used for a long time, the elasticity of the polishing cloth is reduced, so that the middle part of the polishing cloth is loosened, wrinkles of the polishing cloth can be caused, and the polishing quality is poor; therefore, in the scheme, the pressing balls are arranged in the middle of the turntable, so that the polishing cloth is tightened in the middle through the pressing balls, the polishing cloth is kept in a tightened and flat state, and the polishing quality is ensured; the pressing ball is spherical, so that the pressing ball is in uniform contact with the polishing cloth in the downward movement process of the pressing ball, the force of the pressing ball on the polishing cloth is more uniform, and the polishing cloth can be tightened more uniformly; the flatness of the polishing cloth is further ensured, and the polishing quality is further ensured; simultaneously after using a period, when the polishing cloth appears lax, compress tightly the ball through rotating, and then make and compress tightly the ball and move down, and then make the middle part of polishing cloth move down, make the polishing cloth be the state of tightening once more, and then can remain the level and smooth of polishing cloth throughout, and then guarantee the polishing quality of different periods.

Drawings

The invention will be further explained with reference to the drawings.

FIG. 1 is a schematic view of a first overall construction of a polishing apparatus according to the present invention;

FIG. 2 is a schematic view of a second overall structure of the polishing apparatus of the present invention;

FIG. 3 is a schematic view of a first internal structure of the polishing apparatus of the present invention;

FIG. 4 is a schematic view of a second internal structure of the polishing apparatus of the present invention;

FIG. 5 is a schematic view showing an internal structure of a grinding member according to the present invention;

FIG. 6 is a schematic view showing the internal structure of a discharge member in the present invention;

FIG. 7 is a schematic view of the construction of the clamping ring according to the present invention;

FIG. 8 is a schematic view of the wafer during polishing process;

in the figure: the device comprises a shell 1, a rotary table 2, a discharging component 3, a motor 40, a driving wheel 41, a driven wheel 42, a first gear 43, a second gear 44, a mounting rack 5, a support 6, a limiting wheel 7, a polishing component 8, a charging barrel 31, an upper cover 32, a screw 33, a pressing plate 34, a hook 35, a pressing ring 81, polishing cloth 82, a protrusion 83, a fixing nut 9, a pressing ball 10, a circulating pump 11, a circulating cavity 12, a cooling pipe 13, a cooling barrel 14 and a thrust bearing 15.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

As shown in fig. 1 to 8, a semiconductor wafer self-rotation type high-efficiency polishing device comprises a housing 1, a turntable 2, a material placing component 3, a motor 40, a driving wheel 41, a driven wheel 42, a first gear 43, a second gear 44, a mounting rack 5, a support 6, a limiting wheel 7 and a polishing component 8; the upper part of the shell 1 is provided with the rotary disc 2; the rotary disc 2 is rotationally connected with the shell 1 through a bearing; the upper part of the turntable 2 is provided with the grinding component 8; the polishing component 8 is used for polishing a wafer silicon wafer; the mounting frames 5 are uniformly arranged at intervals along the circumferential direction on the upper part of the shell 1; the mounting rack 5 is fixedly connected with the shell 1; the limiting wheels 7 are symmetrically arranged on the mounting rack 5; the limiting wheel 7 is rotatably connected with the mounting rack 5; the first gear 43 is arranged at the lower part of the turntable 2; the first gear 43 is fixedly connected with one end of the turntable 2; the bracket 6 is arranged inside the shell 1; the bracket 6 is fixedly connected with the shell 1; the second gear 44 is rotatably connected with one end of a rotating shaft on the bracket 6; the first gear 43 and the second gear 44 are meshed; the driven wheel 42 is arranged at the other end of the rotating shaft on the bracket 6; the driven wheel 42 is rotationally connected with the rotating shaft on the bracket 6; the motor 40 is arranged outside the shell 1; the motor 40 is fixedly connected with the shell 1; the output end of the motor 40 is provided with the driving wheel 41; the driving wheel 41 is fixedly connected with an output shaft of the motor 40; the driving wheel 41 and the driven wheel 42 are in transmission through a belt; the material placing component 3 is arranged at the upper part of the polishing component 8; the discharging component 3 is used for clamping the wafer silicon wafer.

During working, in the existing polishing equipment for the wafer silicon wafer, the rotating polishing head and the static wafer silicon wafer slide relatively to each other, so that mutual friction between the rotating polishing head and the static wafer silicon wafer is realized, and further the surface polishing effect of the wafer silicon wafer is achieved; meanwhile, as the wafer silicon wafer is kept static, the contact tracks of all points on the wafer silicon wafer and the polishing head are always overlapped during polishing, so that the surface flatness of the wafer silicon wafer is completely consistent with the surface of the polishing head (namely when a small bulge appears on the surface of the polishing head and is in contact with the wafer silicon wafer, after the polishing head rotates for one circle, the small bulge returns to the initial contact position with the wafer silicon wafer, the path which the small bulge slides on the wafer silicon wafer for each circle of rotation is overlapped, and scratches appear on the path), and the polishing uniformity is reduced; therefore, in the scheme, before polishing, the wafer silicon wafer is prevented from being placed on the placing mechanism, the wafer silicon wafer is pressed on the polishing component 8 through the placing mechanism, then the driving wheel 41 is driven to rotate through the rotation of the arranged motor 40, the driven wheel 42 is driven to rotate, the second gear 44 is driven to rotate, the first gear 43 is driven to rotate, the turntable 2 is driven to rotate and the polishing component 8 is driven to rotate, the turntable 2 drives the upper wafer silicon wafer and the placing component 3 to move, after the wafer is moved for a certain distance, the placing component 3 is in contact with the limiting wheel 7, due to the limitation of the limiting wheel 7, relative sliding occurs between the wafer silicon wafer and the polishing component 8, the polishing component 8 generates sliding friction force on the wafer silicon wafer, and simultaneously under the supporting action of the two limiting wheels 7, the intersection point of the acting forces of the two limiting wheels 7 passes through the central point (i.e. point O in fig. 8) of the wafer, meanwhile, because the center of the wafer silicon wafer is not overlapped with the center of the turntable 2, the friction force acting on each point on the wafer silicon wafer is distributed on the arc line of each concentric circle taking the center of the turntable 2 as the center of the circle, wherein the friction force distributed on the point on the arc (taking the arc as the dividing arc) taking the center of the turntable 2 as the center of the circle and the distance from the point O to the center of the turntable 2 as the radius passes through the center of the wafer silicon wafer, the wafer silicon wafer cannot rotate around the point O by changing the friction force, the friction force of each point on the area on one side of the dividing arc (namely the area B in figure 8) can enable the wafer silicon wafer to rotate anticlockwise, the friction force generated by each point on the area on the other side of the dividing arc (namely the area A in figure 8) can enable the wafer silicon wafer to rotate clockwise, and because the area B is larger than the area A, the points generating the friction force in the area B are more than the area A, and then make the resultant force (fb in fig. 8) of the frictional force of B area greater than the resultant force (fa in fig. 8) of the frictional force of A area, and then make the silicon wafer can anticlockwise rotate, and then make in the course of polishing, the silicon wafer can autorotate, and then increased the distance that each point on the silicon wafer moves relative to the part 8 of polishing in the course of polishing, and then has improved the efficiency of polishing, meanwhile because the autorotate of the silicon wafer, and then make the carousel 2 rotate a week, the relative position of each point on the silicon wafer relative to the part 8 of polishing changes, and then prevent the situation that the silicon wafer can't be polished locally because of the unevenness of the part 8 of polishing from appearing, and then improved the homogeneity of polishing.

As shown in fig. 3 to 6, the discharging member 3 includes a cylinder 31, an upper cover 32, a screw 33, a pressing plate 34 and a hook 35; the upper cover 32 is arranged at the upper part of the charging barrel 31; one side of the upper cover 32 is hinged with the cartridge 31; the upper part of the upper cover 32 is provided with a threaded hole; the threaded hole is internally provided with the screw 33; the screw 33 is in threaded connection with the upper cover 32; the end of the screw 33 close to the barrel 31 is provided with the pressure plate 34; the pressure plate 34 is fixedly connected with the screw 33; the hook 35 is arranged on one side of the charging barrel 31 away from the joint; the hook 35 is rotationally connected with the charging barrel 31 through a pin shaft; a torsion spring is arranged at the joint of the hook 35 and the charging barrel 31; a hanging rod is arranged at one end of the upper cover 32 close to the hook 35; the hanging rod is fixedly connected with the upper cover 32.

During operation, the wafer silicon wafer is fragile in material, so that the wafer silicon wafer is easily damaged during clamping, and meanwhile, the force applied to the wafer silicon wafer is kept uniform during polishing, so that in the scheme, during clamping of the wafer silicon wafer, a user manually pulls the hook 35 and the hanging rod away, then rotates the upper cover 32 to open the upper part of the material cylinder 31, places the material cylinder 31 on the upper part of the polishing part 8, then places the wafer silicon wafer into the material inlet cylinder 31, then rotates the upper cover 32, closes the upper cover 32 to enable the hanging rod to approach the hook 35 along with the closing of the upper cover 32, further enables the hook 35 to deflect and further enables the hanging rod to move downwards along with the continuation of the hanging rod, further enables the hanging rod to be separated from the outer side of the hook 35, further enables the hook 35 to return to the initial position under the action of the elasticity of the torsion spring, further enables the hanging rod to be located on the inner side of the hook 35, and further realizes the locking of the upper cover 32, then, the screw 33 is rotated, so that the pressing plate 34 moves downwards, the pressing plate 34 is pressed to the wafer silicon wafer, the contact area between the pressing plate 34 and the wafer silicon wafer is large due to the large area of the pressing plate 34, the acting force of the pressing plate 34 on the wafer silicon wafer is uniform, and the wafer silicon wafer is prevented from being damaged when being pressed tightly; meanwhile, when the silicon wafer pressing device is used, the tightness of the pressing plate 34 pressed on the wafer silicon wafer can be adjusted by rotating the screw 33; and then the pressure on the wafer silicon chip is adjusted, and then the friction between the wafer silicon chip and the grinding part 8 is adjusted, so that the polishing effect of different degrees is realized, and the application range of the polishing equipment is enlarged.

As shown in fig. 3 to 5, the grinding member 8 includes a grinding cloth 82 and a pressing ring 81; polishing cloth 82 is laid on the upper part of the turntable 2; the outer side of the turntable 2 is provided with threads; the pressing ring 81 is arranged on the outer side of the rotary disc 2; the pressing ring 81 is in threaded connection with the rotary disc 2.

During working, because the required surface polishing quality of wafer silicon wafers required by different production processes is different, in the conventional common method, polishing equipment of different types is usually adopted for polishing, and meanwhile, because the polishing head needs to be replaced after the polishing equipment is used for a period of time, because the connection mode of the polishing head of the conventional polishing equipment is complex, the replacement of the polishing head is more complex; therefore, in the scheme, the pressing ring 81 is arranged, so that a circle of polishing cloth tiled on the turntable 2 is pressed, the polishing cloth can be flatly laid on the turntable 2, when different polishing effects are required to be obtained, the pressing ring 81 is rotated, so that the pressing ring 81 is far away from the polishing cloth, the polishing cloth is loosened, the polishing cloth can be taken down at the moment, the polishing cloth with different requirements can be replaced, and the purposes of different polishing qualities are achieved; because in the process of replacing the polishing cloth, an operator only needs to rotate the pressing ring 81 to realize the pressing and releasing of the polishing cloth, the polishing cloth is replaced simply and conveniently, different polishing effects are obtained simply, and the application range of the polishing equipment is enlarged.

As shown in fig. 7, the upper part of the pressing ring 81 is provided with protrusions 83 at regular intervals; the protrusion 83 is of an arc-shaped structure; the projection 83 is disposed obliquely.

When the polishing device works, the polishing device is in transmission with the motor 40 and the gear, so that the polishing device inevitably has vibration, and further the pressing ring 81 is easy to loosen, so that the polishing cloth is loosened, further the polishing cloth is wrinkled, and further the polishing quality is poor; therefore, in the scheme, the bulge 83 is arranged on one side, close to the polishing cloth, of the pressing ring 81, so that when the pressing ring 81 is pressed on the polishing cloth, due to the flexible characteristic of the polishing cloth, the bulge 83 is extruded inside the polishing cloth, the contact area between the polishing cloth and the pressing ring 81 is increased, the resistance applied when the pressing ring 81 is loosened is increased, the effect of preventing the pressing ring 81 from loosening is achieved, the problem of poor polishing quality caused by loosening of the polishing cloth in the use process of the polishing equipment is reduced, and the polishing quality of the polishing equipment is ensured; simultaneously because protruding 83 becomes spiral slope setting, and then at the in-process that clamping ring 81 screwed up, under protruding 83's drive, and then make polishing cloth gather together towards the centre, and then make polishing cloth tightened, and then make polishing cloth can be more smooth lay on carousel 2, and then improved polishing effect.

As shown in fig. 3 to 5, the middle part of the rotating disc 2 is hollow; a fixing nut 9 is arranged in the middle of the turntable 2; two ends of the fixing nut 9 are fixedly connected with the turntable 2 through connecting plates; the upper part of the polishing cloth 82 is provided with a pressing ball 10; a conical rod is arranged on the pressing ball 10; the taper rod is fixedly connected with the pressing ball 10; the taper rod is provided with threads.

When the polishing cloth is in work, the polishing cloth is flexible, and the area of the rotary table 2 is large, so that after the polishing cloth is used for a long time, the elasticity of the polishing cloth is reduced, the middle part of the polishing cloth is loosened, wrinkles of the polishing cloth can be caused, and the polishing quality is poor; therefore, in the scheme, the pressing ball 10 is arranged in the middle of the turntable 2, and the polishing cloth is tightened in the middle through the pressing ball 10, so that the polishing cloth is kept in a tightened and flat state, and the polishing quality is ensured; because the pressing ball 10 is spherical, the pressing ball is in uniform contact with the polishing cloth in the downward movement process of the pressing ball 10, so that the force of the pressing ball 10 on the polishing cloth is more uniform, and the polishing cloth can be tightened more uniformly; the flatness of the polishing cloth is further ensured, and the polishing quality is further ensured; simultaneously after using a period, when the polishing cloth appears lax, compress tightly ball 10 through rotating, and then make and compress tightly ball 10 and remove downwards, and then make the middle part of polishing cloth remove downwards, make the polishing cloth be the state of tightening once more, and then can remain the level and smooth of polishing cloth all the time, and then guarantee the polishing quality of different periods.

As shown in fig. 3 and 4, the lower part of the rotating disc 2 is provided with a circulating pump 11; the circulating pump 11 is fixedly connected with the turntable 2; a circulating cavity 12 is formed in the turntable 2; the circulation cavity 12 is in a vortex shape; a cooling pipe 13 is arranged at the lower part of the rotary table 2; one end of the cooling pipe 13 is fixedly connected with the rotary table 2; the cooling pipe 13 is communicated with the inside of the circulation chamber 12; the other end of the cooling pipe 13 is communicated with the circulating pump 11; the other port of the circulation pump 11 is communicated with the circulation chamber 12; cooling liquid is arranged in the circulating cavity 12 and the cooling pipe 13; a cooling cylinder 14 is arranged in the shell 1; the cooling cylinder 14 is filled with cooling liquid; the cooling pipe 13 is located inside the cooling cylinder 14.

During working, a large amount of heat is generated in the polishing process, and if the heat is not dissipated for a long time, the damage to the wafer silicon wafer and the polishing cloth can be caused, so that the polishing quality is poor, therefore, in the scheme, the circulating cavity 12 is arranged in the turntable 2, and then under the action of the circulating pump 11, the cooling liquid in the inner part flows, so that the heat generated by polishing is driven to the outside of the turntable 2 through the flowing cooling liquid, the dissipation of the heat is accelerated, the over-high temperature of the wafer silicon wafer is prevented, and the wafer silicon wafer is prevented from being damaged due to the over-high temperature; meanwhile, the cooling pipe 13 is arranged to be spiral, so that the contact area between the cooling pipe 13 and the external cooling liquid is increased, the dissipation of heat generated by polishing is accelerated, and the wafer silicon chip is further prevented from being thermally damaged.

As shown in fig. 1 to 5, a thrust bearing 15 is provided at a lower portion of the turntable 2; one side of the thrust bearing 15 is abutted against the housing 1; the other side of the thrust bearing 15 is abutted against the turntable 2; the thrust bearing 15 is near the edge of the turntable 2.

In operation, because the area of carousel 2 is great, and 3 weight of blowing parts that 2 upper portions of carousel prevent are also great, and blowing parts 3 keep away from carousel 2 center and place, and then at the pivoted in-process, be difficult to guarantee can keep balance between a plurality of blowing parts 3 that upper portion was placed, and then can lead to carousel 2 unstability, and then cause the incline of carousel 2, therefore in this scheme, be provided with thrust bearing 15 through the edge at carousel 2, and then can play the effect of supporting carousel 2 in vertical direction, and then prevent that the incline from appearing in the vertical direction of carousel 2, and then increased the stability of carousel 2, and then guaranteed the stability and the roughness of polishing part 8, and then guaranteed polishing effect.

During working, in the existing polishing equipment for the wafer silicon wafer, the rotating polishing head and the static wafer silicon wafer slide relatively to each other, so that mutual friction between the rotating polishing head and the static wafer silicon wafer is realized, and further the surface polishing effect of the wafer silicon wafer is achieved; meanwhile, as the wafer silicon wafer is kept static, the contact tracks of all points on the wafer silicon wafer and the polishing head are always overlapped during polishing, so that the surface flatness of the wafer silicon wafer is completely consistent with the surface of the polishing head (namely when a small bulge appears on the surface of the polishing head and is in contact with the wafer silicon wafer, after the polishing head rotates for one circle, the small bulge returns to the initial contact position with the wafer silicon wafer, the path which the small bulge slides on the wafer silicon wafer for each circle of rotation is overlapped, and scratches appear on the path), and the polishing uniformity is reduced; therefore, in the scheme, before polishing, the wafer silicon wafer is prevented from being placed on the placing mechanism, the wafer silicon wafer is pressed on the polishing component 8 through the placing mechanism, then the driving wheel 41 is driven to rotate through the rotation of the arranged motor 40, the driven wheel 42 is driven to rotate, the second gear 44 is driven to rotate, the first gear 43 is driven to rotate, the turntable 2 is driven to rotate and the polishing component 8 is driven to rotate, the turntable 2 drives the upper wafer silicon wafer and the placing component 3 to move, after the wafer is moved for a certain distance, the placing component 3 is in contact with the limiting wheel 7, due to the limitation of the limiting wheel 7, relative sliding occurs between the wafer silicon wafer and the polishing component 8, the polishing component 8 generates sliding friction force on the wafer silicon wafer, and simultaneously under the supporting action of the two limiting wheels 7, the intersection point of the acting forces of the two limiting wheels 7 passes through the central point (i.e. point O in fig. 8) of the wafer, meanwhile, because the center of the wafer silicon wafer is not overlapped with the center of the turntable 2, the friction force acting on each point on the wafer silicon wafer is distributed on the arc line of each concentric circle taking the center of the turntable 2 as the center of the circle, wherein the friction force distributed on the point on the arc (taking the arc as the dividing arc) taking the center of the turntable 2 as the center of the circle and the distance from the point O to the center of the turntable 2 as the radius passes through the center of the wafer silicon wafer, the wafer silicon wafer cannot rotate around the point O by changing the friction force, the friction force of each point on the area on one side of the dividing arc (namely the area B in figure 8) can enable the wafer silicon wafer to rotate anticlockwise, the friction force generated by each point on the area on the other side of the dividing arc (namely the area A in figure 8) can enable the wafer silicon wafer to rotate clockwise, and because the area B is larger than the area A, the points generating the friction force in the area B are more than the area A, furthermore, the resultant force of the friction force in the area B (i.e. fb in fig. 8) is greater than the resultant force of the friction force in the area a (i.e. fa in fig. 8), so that the wafer silicon wafer can rotate counterclockwise, and further, in the polishing process, the wafer silicon wafer can rotate, so that the moving distance of each point on the wafer silicon wafer relative to the polishing component 8 in the polishing process is increased, and further, the polishing efficiency is improved, and meanwhile, due to the rotation of the wafer silicon wafer, after the turntable 2 rotates for a circle, the relative position of each point on the wafer silicon wafer relative to the polishing component 8 changes, so that the situation that the local polishing of the wafer silicon wafer cannot be achieved due to the unevenness of the polishing component 8 is prevented, and further, the polishing uniformity is improved; since the wafer silicon wafer is fragile, it is easy to be damaged during clamping, and meanwhile, during polishing, the force applied on the wafer silicon wafer is kept uniform, in this scheme, during clamping the wafer silicon wafer, a user manually pulls the hook 35 and the hanging rod away, and then rotates the upper cover 32 to open the upper part of the material cylinder 31, then places the material cylinder 31 on the upper part of the polishing component 8, then places the wafer silicon wafer inside the material cylinder 31, and then rotates the upper cover 32, and with the closing of the upper cover 32, the hanging rod is made to approach the hook 35, and further deflects the hook 35, and with the continued downward movement of the hanging rod, further the hanging rod is made to disengage from the outer side of the hook 35, and further under the elastic force of the torsion spring, the hook 35 is made to return to the initial position, and further the hanging rod is made to be located inside the hook 35, and further the locking of the upper cover 32 is achieved, then, the screw 33 is rotated, so that the pressing plate 34 moves downwards, the pressing plate 34 is pressed to the wafer silicon wafer, the contact area between the pressing plate 34 and the wafer silicon wafer is large due to the large area of the pressing plate 34, the acting force of the pressing plate 34 on the wafer silicon wafer is uniform, and the wafer silicon wafer is prevented from being damaged when being pressed tightly; meanwhile, when the silicon wafer pressing device is used, the tightness of the pressing plate 34 pressed on the wafer silicon wafer can be adjusted by rotating the screw 33; and then the pressure on the wafer silicon chip is adjusted, and then the friction between the wafer silicon chip and the grinding part 8 is adjusted, so that the polishing effect of different degrees is realized, and the application range of the polishing equipment is enlarged.

While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.