阅读说明：本技术 一种传感器元件生产工艺及加工机构 (Sensor element production process and processing mechanism ) 是由 张青 于 2021-08-03 设计创作，主要内容包括：本发明属于传感器加工制造技术领域,提供了一种传感器元件生产工艺及加工机构,所述传感器元件加工机构包括：壳体,壳体的内部设置有输送板,输送板用于输送以及支撑待加工的传感器元件,所述输送板的顶部设置有用于对输送板上的传感器元件进行压合安装的重力压块,重力压块顶部转动连接有升降组件,升降组件用于控制重力压块循环升降；其中,将待压合的传感器元件依次置于输送板上,启动升降组件带动重力压块循环升降,同时高温加热器提高输送板周围的温度,使得传感器零部件之间的热压型贴膜软化,实现传感器元件内部之间的紧密压合安装。(The invention belongs to the technical field of sensor processing and manufacturing, and provides a sensor element production process and a sensor element processing mechanism, wherein the sensor element processing mechanism comprises: the sensor element processing device comprises a shell, wherein a conveying plate is arranged in the shell and used for conveying and supporting a sensor element to be processed, a gravity pressing block used for pressing and installing the sensor element on the conveying plate is arranged at the top of the conveying plate, the top of the gravity pressing block is rotatably connected with a lifting assembly, and the lifting assembly is used for controlling the gravity pressing block to circularly lift; wherein, to treat that the sensor element of pressfitting arranges in the delivery board in proper order on, start the lift subassembly and drive gravity briquetting circulation lift, high temperature heater improves the temperature around the delivery board simultaneously for the hot pressing type pad pasting between the sensor spare part is softened, realizes the inseparable pressfitting installation between the sensor element inside.)

1. A sensor element machining mechanism, characterized by comprising:

the sensor comprises a shell, wherein a conveying plate is arranged in the shell and used for conveying and supporting a sensor element to be processed, and a hot-pressing type adhesive film is arranged between parts in the sensor element;

the top of the conveying plate is provided with a gravity pressing block for pressing and installing the sensor element on the conveying plate, the top of the gravity pressing block is rotatably connected with a lifting assembly, and the lifting assembly is used for controlling the gravity pressing block to circularly lift;

the high-temperature heater is fixedly arranged outside two sides of the shell and used for increasing the temperature around the conveying plate;

wherein, to treat that the sensor element of pressfitting arranges in the delivery board in proper order on, start the lift subassembly and drive gravity briquetting circulation lift, high temperature heater improves the temperature around the delivery board simultaneously for the hot pressing type pad pasting between the sensor spare part is softened, realizes the inseparable pressfitting installation between the sensor element inside.

2. The sensor element processing mechanism according to claim 1, wherein an inlet and an outlet are formed in two sides of the housing, an elastic baffle is rotatably connected inside the inlet and the outlet, and a torsion spring for keeping the elastic baffle at a vertical angle is elastically connected to the top of the inner side wall of the elastic baffle; the driving mechanism of the conveying plate is set to be a servo motor.

3. The sensor element processing mechanism according to claim 1, wherein two ends of the gravity pressing block are fixedly provided with sliding blocks, and the sliding blocks are slidably connected to sliding rails disposed on two side walls inside the housing.

4. The sensor element processing mechanism according to claim 1, wherein the lifting assembly comprises a rotating motor fixed on the outer top of the housing, a connecting block is rotatably connected to a free end of the rotating motor, a rotating plate of a rectangular structure is rotatably connected to the bottom of the connecting block, a rotating connecting rod is rotatably connected to one side of the bottom of the rotating plate, and the bottom end of the rotating connecting rod is rotatably connected to the top of the rotating handle.

5. The sensor element processing mechanism according to claim 4, wherein a notch is formed in the bottom of the rotating plate, a lead screw is rotatably connected to the inside of the notch, a rotating handle is rotatably connected to one end of the lead screw, a nut is slidably connected to the lead screw, a connecting block is connected to the bottom of the nut, and the top end of the rotating connecting rod is rotatably connected to the connecting block.

6. The sensor element processing mechanism according to claim 1, wherein the output end of the high temperature heater is communicated with an air outlet hole provided on the inner side wall of the housing toward the conveying plate, and the air outlet hole is provided in a horn-shaped structure.

7. A sensor element processed by a sensor element processing mechanism according to any one of claims 1 to 6, wherein the sensor element comprises: a sensor element body including an electrode substrate; semiconductor elements are symmetrically arranged on two sides of the electrode substrate, the outer side of each semiconductor element is provided with a covering plate, a space between the electrode substrate and each semiconductor element forms an interval reaction zone, each semiconductor element is fixedly arranged on the electrode substrate, a gas sensitive layer is arranged on each semiconductor element, the semiconductor elements are arranged in the interval reaction zones, and the semiconductor elements are opposite to the gas input direction;

the semiconductor element comprises contact film layers which are symmetrical up and down and made of a polyimide film substrate, a filling layer is arranged in the middle between the two contact film layers, and a silver-palladium slurry conducting layer is arranged on the side surface of each contact film layer facing the direction of the filling layer; a hot-pressing type adhesive film is filled between the contact film layer and the filling layer;

wherein, heat softening is carried out hot pressing type pad pasting, then exert pressure to two contact film layers to carry out the pressfitting installation with contact film layer, filling layer and silver palladium thick liquid conducting layer, through set up the contact film layer on semiconductor element, and carry out electrically conductive silver palladium thick liquid conducting layer, the semiconductor element of being convenient for when detecting gas, utilizes the contact film layer to realize the contact detection to the solid particle in the gas.

8. The sensor element according to claim 7, wherein a plurality of sets of embedding mechanisms are arranged between the contact film layer and the filling layer in an equally spaced and staggered manner, and each embedding mechanism comprises an embedding rod fixed on the contact film layer and an embedding groove formed in the filling layer.

9. The sensor element according to claim 7, wherein the electrode substrate is fixedly provided with connection substrates arranged in a groove-like structure at both sides thereof, the semiconductor element is inserted into the connection substrates, and a thermal compression type adhesive film is laid in the notch of the connection substrates.

10. A process for producing a sensor element according to claims 7-9, characterized in that it comprises the following steps:

s1, printing silver palladium paste on one side of a polyimide film substrate by using a thick film screen printing method to form a silver palladium paste conducting layer on the inner side of a contact film layer, and then drying the silver palladium paste conducting layer for later use;

s2, printing the nano-scale conductive plastic resin slurry on the silver-palladium slurry conductive layer by adopting the method to form an upper conductive plastic resin slurry layer attached to the silver-palladium slurry conductive layer, and then drying for later use;

s3, cutting the substrate printed with the slurry in the S2 to form a contact film layer with an appropriate size and an independent function for later use;

s4, cutting a filling layer with the same size as the contact film layer in the S3 on a polyimide film substrate, cutting some caulking grooves on the filling layer, extending and installing caulking rods on the caulking grooves corresponding to the contact film layer, and fixing the caulking rods through glue for later use;

s5, cutting a complete hot-pressing adhesive film into a size matched with the contact film layer and the filling layer for later use;

s6, horizontally placing the filling layer, sequentially attaching the cut hot-pressing type adhesive films to the upper surface and the lower surface of the filling layer, correspondingly inserting the contact film layers in the S3 and the S4 and the embedded rods on the filling layer into the embedded grooves, and then placing the processing mechanism into the processing mechanism for heating and pressing to form a sensing mechanism during contact;

s7, selecting a covering plate made of insulating materials such as polyvinyl chloride and the like, then placing the semiconductor element pressed in S6 between the covering plate and the electrode substrate to form an interval reaction zone, and then arranging a gas sensitive layer on the semiconductor element at the same time to enable the semiconductor element to have a gas detection sensing effect;

s8, fixedly installing connecting substrates which are arranged into groove-shaped structures on two sides of the electrode substrate, inserting the semiconductor element onto the connecting substrates, then paving a layer of hot-pressing type adhesive film in a notch of the connecting substrates, and heating and pressing the semiconductor element and the electrode substrate by a processing mechanism by using the adhesive film to realize the installation of the semiconductor element and the electrode substrate;

s9, laying a layer of graphene on the reaction zone at intervals, then imprinting a metal grid electrode pattern, then placing the ceramic substrate in magnetron sputtering equipment, then placing the ceramic substrate in an oxygen furnace for ablation, and then depositing to form a complete sensor element body.

Technical Field

The invention belongs to the technical field of sensor processing and manufacturing, and particularly relates to a sensor element production process and a sensor element processing mechanism.

Background

Various efforts to reduce the load of environmental influences are being made worldwide in various industries, and among them, in the automobile industry, development is progressing daily for the popularization of so-called eco-vehicles such as hybrid vehicles and electric vehicles and further performance improvement thereof;

the purification of exhaust gas and the improvement of fuel economy of a vehicle are performed by detecting the oxygen concentration in a measured gas such as exhaust gas by a gas sensor to precisely control the fuel injection amount and the intake air amount, and at the same time, since many solid particles are doped in the exhaust gas due to the difference in mass of an exhaust system of the vehicle, a simple gas sensor is used, and in many cases, the kind of solid impurities in the exhaust gas cannot be accurately detected, which affects the treatment efficiency of the exhaust gas, and causes some solid particles to be mixed with or decomposed with the gas in the air when being discharged into the air, thereby polluting the environment, so that it is necessary to detect the exhaust gas by the gas sensor while having the capability of detecting the solid particles, but the gas sensor and the contact sensor need to be used simultaneously, and the space occupation and the detection use cost are increased, there is a need for a sensor that addresses the above problems simultaneously.

Disclosure of Invention

The embodiment of the invention aims to provide a sensor element production process and a processing mechanism, and aims to solve the problem of simultaneous detection of solid and gas impurities in waste gas.

The present invention is achieved in that the sensor element processing mechanism includes: the sensor comprises a shell, wherein a conveying plate is arranged in the shell and used for conveying and supporting a sensor element to be processed, and a hot-pressing type adhesive film is arranged between parts in the sensor element;

the top of the conveying plate is provided with a gravity pressing block for pressing and installing the sensor element on the conveying plate, the top of the gravity pressing block is rotatably connected with a lifting assembly, and the lifting assembly is used for controlling the gravity pressing block to circularly lift;

the high-temperature heater is fixedly arranged outside two sides of the shell and used for increasing the temperature around the conveying plate;

wherein, to treat that the sensor element of pressfitting arranges in the delivery board in proper order on, start the lift subassembly and drive gravity briquetting circulation lift, high temperature heater improves the temperature around the delivery board simultaneously for the hot pressing type pad pasting between the sensor spare part is softened, realizes the inseparable pressfitting installation between the sensor element inside.

Preferably, the two sides of the shell are provided with an inlet and an outlet, the interior of the inlet and the outlet is rotatably connected with an elastic baffle, the top of the inner side wall of the elastic baffle is elastically connected with a torsion spring for keeping the elastic baffle at a vertical angle, the sensor elements are sequentially fed into and discharged from the interior of the shell through the inlet and the outlet, and then the large batch of sensor elements are subjected to pressing operation through the automatic conveying action of the conveying plate; the driving mechanism of the conveying plate is a servo motor, and the conveying plate is controlled to run intermittently and then is matched with the circulating lifting of the gravity pressing block, so that the sensor elements on the conveying plate are pressed.

Preferably, the two ends of the gravity pressing block are fixedly provided with sliding blocks, and the sliding blocks are connected to sliding rails arranged on two side walls in the shell in a sliding manner; referring to the drawing, simultaneously the lifting unit is including fixing the rotating electrical machines at the outer top of casing, the rotating electrical machines free end rotates and is connected with the connecting block, the bottom of connecting block rotates the rotor plate that is connected with the rectangle structure, bottom one side of rotor plate rotates and is connected with the rotation connecting rod, the bottom of rotating the connecting rod rotates and is connected to the turning handle top, it is rotatory to utilize the rotating electrical machines drive connecting block to drive the rotor plate, then rotate the rotor plate through rotating the connecting rod and be connected with the gravity briquetting, thereby it goes up and down to drive the gravity briquetting circulation on the slide rail, then carry out the pressfitting to the sensor element on the delivery board.

Preferably, the notch has been seted up to the bottom of rotor plate, the inside rotation of notch is connected with the lead screw, the one end of lead screw is rotated and is connected with the turning handle, sliding connection has the nut on the lead screw, it rotates to drive the lead screw through manual rotatory turning handle, then the position on the lead screw is arranged in to adjusting nut, the bottom of nut is connected with the connecting block, the rotation connecting rod top of this moment is rotated and is connected on the connecting block, arrange the position on the lead screw in through the adjustment connecting block, thereby adjust the rotation connecting rod when following the rotor plate swing, the height of lift, the intensity of the pressfitting force is applyed to sensor element on the delivery board to the regulation gravity briquetting.

As a preferred embodiment of the present invention, the output end of the high temperature heater is communicated with an air outlet hole arranged on the inner side wall of the housing in a direction towards the conveying plate, the air outlet hole is arranged in a horn-shaped structure, and the ambient temperature around the conveying plate is increased by starting the high temperature heater to generate high temperature gas and then conveying the high temperature gas around the conveying plate through the air outlet hole.

An embodiment of the present invention further provides a sensor element structure diagram, including: a sensor element body including an electrode substrate; semiconductor elements are symmetrically arranged on two sides of the electrode substrate, the outer side of each semiconductor element is provided with a covering plate, an interval reaction zone is formed in a space between the electrode substrate and the semiconductor elements, the semiconductor elements are fixedly arranged on the electrode substrate, a gas sensitive layer is arranged on each semiconductor element, the semiconductor elements are arranged in the interval reaction zone, the semiconductor elements are opposite to the gas input direction, and the gas sensitive layer is utilized to detect the input gas.

Meanwhile, the semiconductor element comprises contact film layers which are symmetrical up and down and are made of a polyimide film substrate, a filling layer is arranged in the middle between the two contact film layers, a silver palladium slurry conducting layer is arranged on the side face, facing the direction of the filling layer, of each contact film layer, and the conducting performance of the semiconductor element is realized by utilizing the silver palladium slurry conducting layer; a hot-pressing type adhesive film is filled between the contact film layer and the filling layer, and is heated and softened, and then the two contact film layers are pressurized, so that the contact film layer, the filling layer and the silver-palladium slurry conducting layer are mounted in a pressing manner; the semiconductor element is provided with the contact film layer and the conductive silver palladium paste conductive layer, so that the semiconductor element can detect gas conveniently, and the contact film layer can be used for realizing contact detection of solid particles in the gas;

preferably, in order to increase the pressfitting installation dynamics between contact rete and the filling layer, through the crisscross multiunit embedding mechanism that is provided with of equidistant between contact rete and filling layer, embedding mechanism is including fixing the inserted bar on the contact rete and seting up the caulking groove on the filling layer, utilizes the embedded grafting of inserted bar and caulking groove, fixes a position contact rete and filling layer when carrying out the pressfitting operation.

Preferably, the two sides of the electrode substrate are fixedly provided with connecting substrates which are arranged into groove-shaped structures, the semiconductor element is inserted into the connecting substrates, a layer of hot-pressing type adhesive film is laid in a notch of the connecting substrates, and the adhesive film is used for heating and pressing the semiconductor element and the electrode substrate, so that the semiconductor element and the electrode substrate are installed.

The embodiment of the invention also provides a sensor element production process, which comprises the following specific steps:

s1, printing silver palladium paste on one side of a polyimide film substrate by using a thick film screen printing method to form a silver palladium paste conducting layer on the inner side of a contact film layer, and then drying the silver palladium paste conducting layer for later use;

s2, printing the nano-scale conductive plastic resin slurry on the silver-palladium slurry conductive layer by adopting the method to form an upper conductive plastic resin slurry layer attached to the silver-palladium slurry conductive layer, and then drying for later use;

s3, cutting the substrate printed with the slurry in the S2 to form a contact film layer with an appropriate size and an independent function for later use;

s4, cutting a filling layer with the same size as the contact film layer in the S3 on a polyimide film substrate, cutting some caulking grooves on the filling layer, extending and installing caulking rods on the caulking grooves corresponding to the contact film layer, and fixing the caulking rods through glue for later use;

s5, cutting a complete hot-pressing adhesive film into a size matched with the contact film layer and the filling layer for later use;

s6, horizontally placing the filling layer, sequentially attaching the cut hot-pressing type adhesive films to the upper surface and the lower surface of the filling layer, correspondingly inserting the contact film layers in the S3 and the S4 and the embedded rods on the filling layer into the embedded grooves, and then placing the processing mechanism into the processing mechanism for heating and pressing to form a sensing mechanism during contact;

s7, selecting a covering plate made of insulating materials such as polyvinyl chloride and the like, then placing the semiconductor element pressed in S6 between the covering plate and the electrode substrate to form an interval reaction zone, and then arranging a gas sensitive layer on the semiconductor element at the same time to enable the semiconductor element to have a gas detection sensing effect;

s8, fixedly installing connecting substrates which are arranged into groove-shaped structures on two sides of the electrode substrate, inserting the semiconductor element onto the connecting substrates, then paving a layer of hot-pressing type adhesive film in a notch of the connecting substrates, and heating and pressing the semiconductor element and the electrode substrate by a processing mechanism by using the adhesive film to realize the installation of the semiconductor element and the electrode substrate;

s9, laying a layer of graphene on the reaction zone at intervals, then imprinting a metal grid electrode pattern, then placing the ceramic substrate in magnetron sputtering equipment, then placing the ceramic substrate in an oxygen furnace for ablation, and then depositing to form a complete sensor element body.

According to the sensor element production process and the processing mechanism, the contact film layer with the touch detection capability is arranged on the basis of the existing gas sensitive layer of the semiconductor element on the basis of the existing gas detection sensor, and then the contact film layer is combined and placed in the spaced reaction zone, so that the capability of simultaneously detecting gas and solid in waste gas is realized, and the application range of the sensor is greatly enlarged; the conveying plate moving intermittently is matched with the circulating lifting gravity pressing block, so that the forming operation of a plurality of substrates or sensor element bodies needing high-temperature pressing operation can be continuously and conveniently carried out.

Drawings

FIG. 1 is a schematic diagram of a sensor element;

FIG. 2 is a schematic front view of a sensor element processing mechanism;

FIG. 3 is a schematic side view of a sensor element processing mechanism;

FIG. 4 is a schematic view of a lift assembly in a sensor element processing mechanism;

fig. 5 is a schematic view of a semiconductor device in a sensor device processing mechanism.

In the drawings: the device comprises a shell 10, a conveying plate 11, an elastic baffle plate 12, a torsion spring 13, a high-temperature heater 14, an air outlet 15, a gravity pressing block 17, a sliding rail 18, a sliding block 19, a lifting assembly 20, a rotating plate 21, a connecting block 22, a lead screw 23, a nut 24, a connecting block 25, a rotating connecting rod 26, a rotating handle 27, a rotating motor 28, a sensor element body 29, a covering plate 30, a semiconductor element 31, a motor substrate 32, a connecting substrate 33, an interval reaction belt 34, a contact film layer 35, a filling layer 36, a silver palladium slurry conducting layer 37, an embedded rod 38 and an embedded groove 39.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Specific implementations of the present invention are described in detail below with reference to specific embodiments.

As shown in fig. 2 to 3, a sensor element processing mechanism provided in an embodiment of the present invention further includes a housing 10, a conveying plate 11 is disposed inside the housing 10, the conveying plate 11 is used for conveying and supporting a sensor element to be processed, a hot-press type film is disposed between components inside the sensor element, a gravity press block 17 for press-fitting and mounting the sensor element on the conveying plate 11 is disposed on the top of the conveying plate 11, a lifting assembly 20 is rotatably connected to the top of the gravity press block 17, and the lifting assembly 20 is used for controlling the gravity press block 17 to circularly lift;

high temperature heaters 14 fixedly installed at both side outer portions of the case 10 for increasing the temperature around the conveying plate 11;

sensor elements to be pressed are sequentially arranged on the conveying plate 11, the lifting assembly 20 is started to drive the gravity pressing block 17 to circularly lift, and meanwhile, the high-temperature heater 14 improves the temperature around the conveying plate 11, so that hot-pressing type film sticking among sensor parts is softened, and tight pressing and mounting among the sensor elements are realized.

In an example of the present invention, an inlet and an outlet are formed on two sides of the housing 10, an elastic baffle 12 is rotatably connected inside the inlet and the outlet, a torsion spring 13 for keeping the elastic baffle 12 at a vertical angle is elastically connected to the top of the inner side wall of the elastic baffle 12, the sensor elements are sequentially passed into and out of the housing 10 through the inlet and the outlet, and then a large batch of sensor elements are subjected to a pressing operation through an automatic conveying function of the conveying plate 11; the driving mechanism of the conveying plate 11 is set as a servo motor, and the intermittent operation of the conveying plate 11 is controlled, and then the driving mechanism is matched with the circulating lifting of the gravity pressing block 17, so that the sensor elements on the conveying plate 11 are pressed.

As a preferred embodiment of the present invention, two ends of the gravity pressing block 17 are fixedly installed with sliding blocks 19, and the sliding blocks 19 are slidably connected to sliding rails 18 arranged on two side walls inside the casing 10; referring to fig. 4, meanwhile, the lifting assembly 20 includes a rotating motor 28 fixed at the outer top of the casing 10, a connecting block 22 is rotatably connected to a free end of the rotating motor 28, a rotating plate 21 with a rectangular structure is rotatably connected to the bottom of the connecting block 22, a rotating connecting rod 26 is rotatably connected to one side of the bottom of the rotating plate 21, the bottom end of the rotating connecting rod 26 is rotatably connected to the top of a rotating handle 27, the rotating motor 28 is used for driving the connecting block 22 to drive the rotating plate 21 to rotate, then the rotating plate 21 is rotatably connected with the gravity pressing block 17 through the rotating connecting rod 26, so that the gravity pressing block 17 is driven to circularly lift on the sliding rail 18, and then the sensor element on the conveying plate 11 is pressed.

As a preferred embodiment of the present invention, a notch is formed at the bottom of the rotating plate 21, a lead screw 23 is rotatably connected inside the notch, a rotating handle 27 is rotatably connected to one end of the lead screw 23, a nut 24 is slidably connected to the lead screw 23, the lead screw 23 is driven to rotate by manually rotating the rotating handle 27, then the adjusting nut 24 is placed at a position on the lead screw 23, a connecting block 25 is connected to the bottom of the nut 24, the top end of the rotating connecting rod 26 at this time is rotatably connected to the connecting block 25, the position on the lead screw 23 by adjusting the connecting block 25 is adjusted, so that the lifting height of the rotating connecting rod 26 when the rotating connecting rod 26 swings along with the rotating plate 21 is adjusted, and the strength of the gravity press block 17 applying a pressing force to a sensor element on the conveying plate 11 is adjusted.

In a preferred embodiment of the present invention, the output end of the high temperature heater 14 is communicated with an air outlet 15 arranged on the inner side wall of the housing 10 in a direction towards the conveying plate 11, the air outlet 15 is arranged in a trumpet-shaped structure, and the ambient temperature around the conveying plate 11 is increased by activating the high temperature heater 14 to generate high temperature gas and then conveying the high temperature gas towards the periphery of the conveying plate 11 through the air outlet 15.

As shown in fig. 1 and 5, a sensor element structure diagram according to an embodiment of the present invention includes: a sensor element body 29, the sensor element body 29 including an electrode substrate 32; the semiconductor elements 31 are symmetrically arranged on two sides of the electrode substrate 32, the covering plate 30 is arranged on the outer side of the semiconductor element 31, an interval reaction zone 34 is formed in a space between the electrode substrate 32 and the semiconductor element 31, the semiconductor element 31 is fixedly arranged on the electrode substrate 32, a gas sensitive layer is arranged on the semiconductor element 31, the semiconductor element 31 is arranged in the interval reaction zone 34, the semiconductor element 31 faces the gas input direction, and the gas sensitive layer is used for detecting the input gas.

Meanwhile, the semiconductor element 31 comprises contact film layers 35 which are made of polyimide film substrates and are symmetrical up and down, a filling layer 36 is arranged in the middle between the two contact film layers 35, a silver palladium slurry conducting layer 37 is arranged on the side surface of the contact film layer 35 facing the direction of the filling layer 36, and the conducting performance of the semiconductor element 31 is realized by utilizing the silver palladium slurry conducting layer 37; a hot-pressing type adhesive film is filled between the contact film layer 35 and the filling layer 36, and is heated and softened, and then pressure is applied to the two contact film layers 35, so that the contact film layer 35, the filling layer 36 and the silver-palladium paste conducting layer 37 are mounted in a pressing manner; by arranging the contact film layer 35 and the conductive silver palladium paste layer 37 on the semiconductor element 31, the semiconductor element 31 can detect gas conveniently, and meanwhile, the contact detection of solid particles in the gas is realized by using the contact film layer 35;

in an embodiment of the present invention, in order to increase the force of pressing and installing the contact film layer 35 and the filling layer 36, a plurality of sets of embedding mechanisms are arranged between the contact film layer 35 and the filling layer 36 in an equally spaced and staggered manner, each of the embedding mechanisms includes an embedded rod 38 fixed on the contact film layer 35 and an embedded groove 39 formed on the filling layer 36, and the contact film layer 35 and the filling layer 36 are positioned during the pressing operation by the embedded insertion of the embedded rods 38 and the embedded grooves 39.

In an embodiment of the present invention, the electrode substrate 32 is fixedly mounted with connection substrates 33 arranged in a groove-like structure on both sides, the semiconductor element 31 is inserted into the connection substrates 33, a thermal compression type adhesive film is laid in the notch of the connection substrate 33, and the semiconductor element 31 and the electrode substrate 32 are heated and pressed by the adhesive film, so as to realize the mounting between the semiconductor element 31 and the electrode substrate 32.

The embodiment of the invention also provides a sensor element production process, which comprises the following specific steps:

s1, printing silver palladium paste on one side of a polyimide film substrate by using a thick film screen printing method to form a silver palladium paste conducting layer 37 on the inner side surface of the contact film layer 35, and then drying the silver palladium paste conducting layer for later use;

s2, printing the nano-scale conductive plastic resin slurry on the silver-palladium slurry conductive layer 37 by the method to form an upper conductive plastic resin slurry layer attached to the silver-palladium slurry conductive layer 37, and then drying for later use;

s3, cutting the substrate printed with the slurry in the S2 to form a contact film layer 35 with an appropriate size and an independent function for later use;

s4, cutting a filling layer 36 with the same size as the contact film layer 35 in the S3 on a polyimide film substrate, cutting some embedding grooves 39 on the filling layer 36, installing embedding rods 38 on the embedding grooves 39 corresponding to the contact film layer 35 in an extending mode, and fixing the embedding rods 38 through glue for later use;

s5, cutting a complete hot-pressing type adhesive film into a size matched with the contact film layer 35 and the filling layer 36 for standby;

s6, horizontally placing the filling layer 36, sequentially attaching the cut hot-pressing type adhesive films to the upper surface and the lower surface of the filling layer 36, correspondingly inserting the contact film layer 35 in the S3 and the S4 and the embedded rod 38 on the filling layer 36 into the embedded groove 39, and then placing the processing mechanism for heating and pressing to form a sensing mechanism during contact;

s7, selecting a covering plate 30 made of insulating materials such as polyvinyl chloride and the like, then placing the semiconductor element 31 pressed in the S6 between the covering plate 30 and the electrode substrate 32 to form an interval reaction zone 34, and then simultaneously arranging a gas sensitive layer on the semiconductor element 31 to enable the semiconductor element 31 to have a gas detection sensing effect;

s8, fixedly mounting the connection substrates 33 arranged in a groove-shaped structure on two sides of the electrode substrate 32, inserting the semiconductor element 31 on the connection substrates 33, then paving a layer of hot-pressing type adhesive film in the notch of the connection substrates 33, and heating and pressing the semiconductor element 31 and the electrode substrate 32 by a processing mechanism by using the adhesive film to realize the mounting between the semiconductor element 31 and the electrode substrate 32;

s9, laying a layer of graphene on the spaced reaction zone 34, then imprinting a metal grid electrode pattern, then placing the ceramic substrate in magnetron sputtering equipment, then placing the ceramic substrate in an oxygen furnace for ablation, and then depositing to form the complete sensor element body 29.

The sensor element production process is provided in the above embodiment of the invention, and based on the sensor element and the production process, a sensor element processing mechanism is provided, which is used for stacking the substrate, the cover plate 30, the semiconductor element 31 and the electrode substrate 32 when the contact film layer 35, the filling layer 36 and the silver-palladium paste conductive layer 37 produced in the production process are stacked together through the hot press type film sticking, the sensor element body 29 when the semiconductor element 31 and the electrode substrate 32 are stacked together through the hot press type film sticking, placing the sensor element body on the conveying plate 11 through the elastic baffle plate 12 in sequence, controlling the intermittent operation time of the conveying plate 11 through the servo motor, controlling the circulating lifting distance of the gravity briquetting 17 through adjusting the rotating handle 27, applying the gravity briquetting 17 to the substrate to be pressed on the conveying plate 11 or the sensor element body 29 circularly, and starting the high-temperature heater 14 to convey hot air to the periphery of the conveying plate 11, the temperature of the thermocompression bonding film is raised to soften the film, and then the film is matched with the gravity pressing block 17, so that the stacked substrates and the sensor element body 29 are subjected to stable press-fitting mounting operation.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.