阅读说明：本技术 一种3英寸石英晶片双面研磨装置及方法 (3-inch quartz wafer double-side grinding device and method ) 是由 郑嵩 夏良军 刘超 于 2021-08-02 设计创作，主要内容包括：本发明公开了一种英寸石英晶片双面研磨装置,包括：加工组件,其包括操作台、设置在操作台上的研磨件、以及设置在操作台底部的用于驱动研磨件的驱动件,所述操作台上设有用于对研磨件进行升降的升降件,所述升降件与驱动件之间设有用于连接的连接件；研磨液使用组件,包括设置在操作台底部的用于收集的集料件和设置在升降件上的输料喷嘴。本发明启动伸缩气缸,使得六边形插杆插入插槽中,关闭伸缩气缸,随后启动伺服电机,使得转轴正向转动,带动下研磨板正向转动,同时转轴的转动带动六边形插杆转动,使得第一锥齿轮正向转动,带动第二锥齿轮转动,使得第三锥齿轮反向转动,通过第二连接杆的连接,带动上研磨板反向同速转动。(The invention discloses a double-side grinding device for an inch quartz wafer, which comprises: the processing assembly comprises an operating platform, a grinding piece arranged on the operating platform and a driving piece arranged at the bottom of the operating platform and used for driving the grinding piece, wherein a lifting piece used for lifting the grinding piece is arranged on the operating platform, and a connecting piece used for connecting is arranged between the lifting piece and the driving piece; the grinding liquid using assembly comprises a collecting part arranged at the bottom of the operating platform and used for collecting and a material conveying nozzle arranged on the lifting part. The invention starts the telescopic cylinder to enable the hexagonal inserted bar to be inserted into the slot, closes the telescopic cylinder, then starts the servo motor to enable the rotating shaft to rotate in the forward direction to drive the lower grinding plate to rotate in the forward direction, simultaneously enables the rotating shaft to rotate to drive the hexagonal inserted bar to rotate, enables the first bevel gear to rotate in the forward direction to drive the second bevel gear to rotate, enables the third bevel gear to rotate in the reverse direction, and drives the upper grinding plate to rotate in the reverse direction at the same speed through the connection of the second connecting rod.)

1. A double-sided grinding apparatus for a 3-inch quartz wafer, comprising:

the machining assembly comprises an operating platform (101), a grinding piece (100) arranged on the operating platform (101) and a driving piece (200) arranged at the bottom of the operating platform (101) and used for driving the grinding piece (100), wherein a lifting piece (300) used for lifting the grinding piece (100) is arranged on the operating platform (101), and a connecting piece (400) used for connecting is arranged between the lifting piece (300) and the driving piece (200);

the grinding liquid using assembly comprises a collecting part (500) arranged at the bottom of the operating platform (101) and used for collecting and a material conveying nozzle (601) arranged on the lifting part (300).

2. The double-sided grinding device for the 3-inch quartz wafers according to claim 1, wherein the grinding member (100) comprises a lower grinding plate (103) and an upper grinding plate (108), a rectangular opening (107) is formed in the bottom of the operating platform (101), a circular through hole (102) communicated with the rectangular opening (107) is formed in the top of the operating platform (101), the lower grinding plate (103) is arranged in the circular through hole (102), an annular toothed plate (104) is fixedly connected to the side wall of the circular through hole (102), a plurality of circular toothed plates (105) matched with the annular toothed plate (104) are arranged on the lower grinding plate (103), a plurality of grinding through holes (106) for placing the quartz wafers are formed in the circular toothed plate (105), and the upper grinding plate (108) is arranged above the lower grinding plate (103).

3. The double-sided grinding device for the 3-inch quartz wafers as claimed in claim 2, wherein the driving member (200) comprises a servo motor (201), the servo motor (201) is disposed on the bottom wall of the rectangular opening (107), a rotating shaft (202) is fixedly connected to an output end of the servo motor (201), the rotating shaft (202) is fixedly inserted on the lower grinding plate (103), a driving gear (203) disposed on the top wall of the lower grinding plate (103) is fixedly connected to the rotating shaft (202), and the driving gear (203) is engaged with the circular toothed plate (105).

4. The double-sided grinding device for the 3-inch quartz wafers as claimed in claim 3, wherein the lifter (300) comprises a mounting frame (301), the mounting frame (301) is arranged on the operating platform (101), a telescopic cylinder (302) is arranged on the mounting frame (301), a connecting disc (303) is fixedly connected to the bottom end of the telescopic cylinder (302), a plurality of first connecting rods (304) are fixedly connected to the bottom surface of the connecting disc (303), and the first connecting rods (304) are slidably connected to the upper grinding plate (108).

5. The double-sided grinding device for the 3-inch quartz wafers as claimed in claim 4, wherein the connecting member (400) comprises a sleeve (401) and a hexagonal inserting rod (410), the top end of the sleeve (401) is fixedly connected to the connecting disc (303), the bottom surface of the connecting disc (303) is rotatably connected with an upright rod (402), the bottom end of the upright rod (402) is fixedly connected with a first bevel gear (403), the first bevel gear (403) is provided with a slot (404), the inner side wall of the sleeve (401) is fixedly connected with a cross rod (405), one end of the cross rod (405) far away from the inner wall of the sleeve (401) is rotatably connected with a second bevel gear (406), a third bevel gear (407) is arranged below the second bevel gear (406), and the second bevel gear (406) is respectively engaged with the first bevel gear (403) and the third bevel gear (407), first connecting through holes (408) are formed in the third bevel gear (407), a plurality of second connecting rods (409) are fixedly connected between the third bevel gear (407) and the upper grinding plate (108), second connecting through holes (411) are formed in the upper grinding plate (108), the hexagonal inserting rod (410) is fixedly connected to the top end of the rotating shaft (202) located below the sleeve (401), and the hexagonal inserting rod (410) is matched with the second connecting through holes (411), the first connecting through holes (408) and the inserting grooves (404) respectively.

6. The double-sided grinding device for the 3-inch quartz wafers as claimed in claim 5, wherein the material collecting member (500) comprises a flow guiding plate (503), the flow guiding plate (503) is arranged below the circular through opening (102), the flow guiding plate (503) is arranged obliquely, a first annular plate (501) is fixedly connected between the flow guiding plate (503) and the operation table (101), a discharge hole (504) is formed in the first annular plate (501), a second annular plate (502) is fixedly connected to the flow guiding plate (503) inside the first annular plate (501), the second annular plate (502) is rotatably connected to the lower grinding plate (103), a plurality of discharge channels (505) are formed in the lower grinding plate (103), the inner bottom walls of the discharge channels (505) are arranged obliquely, and a collecting box (506) is arranged on the bottom wall of the rectangular opening (107), the collection box (506) is located below the discharge port (504).

7. The double-sided grinding device for the 3-inch quartz wafers as claimed in claim 4, wherein the material delivery nozzle (601) is fixedly inserted on the connecting plate (303), and the material delivery nozzle (601) is provided with a liquid delivery pipe for connecting with external liquid delivery equipment, and the upper grinding plate (108) is provided with a plurality of liquid delivery holes which are matched with the material delivery nozzle (601).

8. A use method of a 3-inch quartz wafer double-side grinding device is characterized by comprising the following steps:

1) when in use, the quartz wafer to be ground is placed in the grinding through hole (106), and the infusion tube is connected with external infusion equipment;

2) starting the telescopic cylinder (302), so that the bottom end of the telescopic cylinder (302) descends to drive the connecting disc (303) and the upper grinding plate (108) to move downwards together, so that the hexagonal inserting rod (410) penetrates through the second connecting through hole (411) and the first connecting through hole (408) and is inserted into the inserting groove (404), and the telescopic cylinder (302) is closed;

3) spraying grinding fluid to the upper grinding plate (108) through a material conveying nozzle (601);

4) the servo motor (201) is started, so that the rotating shaft (202) rotates forwards to drive the lower grinding plate (103) to rotate forwards, meanwhile, the rotating shaft (202) rotates to drive the hexagonal inserted rod (410) to rotate, the first bevel gear (403) rotates forwards to drive the second bevel gear (406) to rotate, the third bevel gear (407) rotates reversely, the upper grinding plate (108) is driven to rotate reversely through connection of the second connecting rod (409), meanwhile, the rotating shaft (202) rotates to drive the driving gear (203) to rotate, the circular toothed plate (105) rotates and moves on the lower grinding plate (103), and quartz wafers in the circular toothed plate (105) are ground in a matched mode;

5) when grinding, the grinding fluid flows downwards through the infusion hole on last lapping plate (108), the piece that the grinding produced is being smugglied secretly to the grinding fluid that uses up gets into discharging channel (505), along with the rotation of lapping plate (103) down, under the effect of centrifugal force, grinding fluid and piece move to circular opening (102) lateral wall direction, drop to on guide plate (503), discharge to collecting box (506) through discharge gate (504) along guide plate (503) afterwards in, make things convenient for the staff to collect the grinding fluid after the use.

Technical Field

The invention relates to the technical field of quartz wafer processing, in particular to a 3-inch quartz wafer double-side grinding device and method.

Background

After the 21 st century, the IT information revolution has progressed from analog to digital, and combined with wireless and wired networks, large-capacity information such as data, music, audio and video, etc. can be used with each other through networks and various media between the media developed independently. The quartz chip of the crystal product is an important part in the digital information society.

Quartz wafer need grind its upper and lower two sides in its production process, however current grinder is when using, because of the difference of the rotational speed of upper and lower lapping plate, can cause the product to grind the face and appear two kinds of different effects, is particularly unfavorable to production process, and grinding debris is being smugglied secretly to the lapping liquid in grinding process, stops on the lapping plate, and these grinding debris can be to quartz wafer's surface fish tail, influence quartz wafer's processing effect.

Disclosure of Invention

The invention aims to overcome the defects that in the prior art, two different effects can be caused on the grinding surface of a product due to different rotating speeds of an upper grinding plate and a lower grinding plate when the existing grinding device is used, the production process is particularly unfavorable, grinding chips are carried by grinding liquid in the grinding process and stay on the grinding plates, and the grinding chips can scratch the surface of a quartz wafer and influence the processing effect of the quartz wafer, so that the 3-inch double-side grinding device and the method for the quartz wafer are provided.

In order to achieve the purpose, the invention adopts the following technical scheme:

an apparatus for double side grinding of an inch quartz wafer, comprising:

the processing assembly comprises an operating platform, a grinding piece arranged on the operating platform and a driving piece arranged at the bottom of the operating platform and used for driving the grinding piece, wherein a lifting piece used for lifting the grinding piece is arranged on the operating platform, and a connecting piece used for connecting is arranged between the lifting piece and the driving piece;

the grinding liquid using assembly comprises a collecting part arranged at the bottom of the operating platform and used for collecting and a material conveying nozzle arranged on the lifting part.

Preferably, the grinding piece includes lower grinding plate and last grinding plate, the operation panel bottom is equipped with the rectangle opening, the operation panel top is equipped with the circular opening that is linked together with the rectangle opening, lower grinding plate sets up in circular opening, fixedly connected with annular toothed plate on the circular opening lateral wall, be equipped with a plurality of circular toothed plate with annular toothed plate matched with down on the grinding plate, be equipped with a plurality of grinding through-holes that are used for placing quartz wafer on the circular toothed plate, it sets up grinding plate top down to go up the grinding plate.

Preferably, the driving piece includes servo motor, servo motor sets up on rectangle opening diapire, servo motor output fixedly connected with pivot, the fixed interlude of pivot is on lapping plate down, fixedly connected with sets up the driving gear on lapping plate roof down in the pivot, the driving gear is connected with circular pinion rack meshing.

Preferably, the lifting piece comprises a mounting frame, the mounting frame is arranged on the operating platform, a telescopic cylinder is arranged on the mounting frame, a connecting disc is fixedly connected to the bottom end of the telescopic cylinder, a plurality of first connecting rods are fixedly connected to the bottom surface of the connecting disc, and the first connecting rods are slidably connected to the upper grinding plate.

Preferably, the connecting piece comprises a sleeve and a hexagonal inserted bar, the top end of the sleeve is fixedly connected to the connecting disc, the bottom surface of the connecting disc is rotatably connected with a vertical rod, a first bevel gear is fixedly connected to the bottom end of the vertical rod, an insertion slot is formed in the first bevel gear, a cross rod is fixedly connected to the inner side wall of the sleeve, a second bevel gear is rotatably connected to one end, away from the inner wall of the sleeve, of the cross rod, a third bevel gear is arranged below the second bevel gear, the second bevel gear is respectively meshed with the first bevel gear and the third bevel gear, a first connecting through hole is formed in the third bevel gear, a plurality of second connecting rods are fixedly connected between the third bevel gear and the upper grinding plate, a second connecting through hole is formed in the upper grinding plate, the hexagonal inserted bar is fixedly connected to the top end of a rotating shaft below the sleeve, and the hexagonal inserted bar is respectively connected to the top end of the rotating shaft below the sleeve, and the hexagonal inserted bar is respectively connected to the second connecting through hole, The first connecting through hole is matched with the slot.

Preferably, the piece that gathers materials includes the guide plate, the guide plate sets up in circular opening below, and the guide plate is the slope setting, the first annular plate of fixedly connected with between guide plate and the operation panel, the discharge gate has been seted up on the first annular plate, fixedly connected with second annular plate on the guide plate of first annular plate inside, the second annular plate rotates and connects under on the lapping plate, be equipped with a plurality of discharging channel down on the lapping plate, discharging channel's interior diapire is the slope setting, be equipped with the collecting box on the rectangle opening diapire, the collecting box is located the discharge gate below.

Preferably, the material conveying nozzle is fixedly inserted on the connecting disc, a liquid conveying pipe used for being connected with external liquid conveying equipment is arranged on the material conveying nozzle, a plurality of liquid conveying holes are formed in the upper grinding plate, and the liquid conveying holes are matched with the material conveying nozzle.

The use method of the double-side grinding device for the inch quartz wafers comprises the following steps:

when in use, the quartz wafer to be ground is placed in the grinding through hole, and the infusion tube is connected with external infusion equipment;

starting the telescopic cylinder to enable the bottom end of the telescopic cylinder to descend, driving the connecting disc and the upper grinding plate to move downwards together, enabling the hexagonal inserting rod to penetrate through the second connecting through hole and the first connecting through hole, inserting the hexagonal inserting rod into the inserting slot, and closing the telescopic cylinder;

spraying grinding fluid to the upper grinding plate through a material conveying nozzle;

starting a servo motor to enable a rotating shaft to rotate in a forward direction to drive a lower grinding plate to rotate in a forward direction, simultaneously driving a hexagonal inserted bar to rotate by rotation of the rotating shaft, enabling a first bevel gear to rotate in the forward direction to drive a second bevel gear to rotate, enabling a third bevel gear to rotate in a reverse direction, driving an upper grinding plate to rotate in the reverse direction through connection of a second connecting bar, simultaneously driving a driving gear to rotate by rotation of the rotating shaft, enabling a circular toothed plate to rotate and move on the lower grinding plate, and mutually matching to grind quartz wafers in the circular toothed plate;

when grinding, the infusate flows downwards through the infusion hole on the last lapping plate, and the piece that the grinding produced is being smugglied secretly to the lapping liquid that uses up gets into discharging channel, along with the rotation of lapping plate down, under the effect of centrifugal force, and lapping liquid and piece move to circular opening lateral wall direction, drop to the guide plate on, discharge to the collecting box in through the discharge gate along the guide plate afterwards, make things convenient for the staff to collect the lapping liquid after using.

Compared with the prior art, the invention has the beneficial effects that:

1. start telescopic cylinder, make telescopic cylinder bottom decline, drive connection pad and last grinding plate downstream together, make the hexagon inserted bar pass second connect the via hole and first connect the via hole, insert in the slot, close telescopic cylinder, start servo motor afterwards, make pivot forward rotation, it rotates to drive grinding plate forward down, the rotation of pivot drives the hexagon inserted bar simultaneously and rotates, make first bevel gear forward rotation, drive second bevel gear and rotate, make third bevel gear reverse rotation, through the connection of second connect lever, it rotates to drive grinding plate reverse same speed, grind the quartz wafer in the circular pinion rack, avoided because of last, the difference of the rotational speed of lower grinding plate, probably cause the phenomenon of the effect of two kinds of differences to appear in the product grinding face, the grinding effect of the device has been improved.

2. When grinding, the infusate flows downwards through the infusion hole on the last lapping plate, the piece that the grinding produced is being smugglied secretly to the lapping liquid that uses up gets into discharging channel, along with the rotation of lapping plate down, under the effect of centrifugal force, to circular opening lateral wall direction motion, drop to on the guide plate, discharge to the collecting box in through the discharge gate along the guide plate afterwards, make things convenient for the staff to collect the lapping liquid after using, avoided the lapping liquid to stop on lapping plate down and caused the phenomenon of damage to quartz wafer.

Drawings

FIG. 1 is a schematic front view of a 3-inch double-side polishing apparatus for quartz wafers according to the present invention;

FIG. 2 is a top view of the console of FIG. 1;

FIG. 3 is a side view of FIG. 1;

FIG. 4 is a schematic view of the internal structure of the sleeve of FIG. 1;

FIG. 5 is a schematic view of the connections at the servo motor of FIG. 2;

fig. 6 is a schematic cross-sectional view of the console of fig. 1.

In the figure: 100 grinding parts, 101 operating tables, 102 circular through holes, 103 lower grinding plates, 104 annular toothed plates, 105 circular toothed plates, 106 grinding through holes, 107 rectangular openings, 108 upper grinding plates, 200 driving parts, 201 servo motors, 202 rotating shafts, 203 driving gears, 300 lifting parts, 301 mounting frames, 302 telescopic cylinders, 303 connecting discs, 304 first connecting rods, 400 connecting parts, 401 sleeves, 402 vertical rods, 403 first bevel gears, 404 slots, 405 cross rods, 406 second bevel gears, 407 third bevel gears, 408 first connecting through holes, 409 second connecting rods, 410 hexagonal inserting rods, 411 second connecting through holes, 500 collecting parts, 501 first annular plates, 502 second annular plates, 503 guide plates, 504 discharge holes, 505 discharge channels, 506 collecting boxes and 601 material conveying nozzles.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Referring to fig. 1 to 6, a double-side polishing apparatus for a 3-inch quartz wafer, comprising:

the processing assembly comprises an operating platform 101, a grinding part 100 arranged on the operating platform 101, and a driving part 200 arranged at the bottom of the operating platform 101 and used for driving the grinding part 100, wherein the grinding part 100 comprises a lower grinding plate 103 and an upper grinding plate 108, a rectangular opening 107 is arranged at the bottom of the operating platform 101, a circular through hole 102 communicated with the rectangular opening 107 is arranged at the top of the operating platform 101, the lower grinding plate 103 is arranged in the circular through hole 102, an annular toothed plate 104 is fixedly connected to the side wall of the circular through hole 102, a plurality of circular toothed plates 105 matched with the annular toothed plate 104 are arranged on the lower grinding plate 103, a plurality of grinding through holes 106 used for placing quartz wafers are arranged on the circular toothed plates 105, the upper grinding plate 108 is arranged above the lower grinding plate 103, so that a user can place the quartz wafers into the grinding through holes 106, and then the quartz wafers in the grinding through holes 106 are ground through the matching of the upper grinding plate 108 and the lower grinding plate 103, the driving member 200 comprises a servo motor 201, the servo motor 201 is arranged on the bottom wall of the rectangular opening 107, the output end of the servo motor 201 is fixedly connected with a rotating shaft 202, the rotating shaft 202 is fixedly inserted on the lower grinding plate 103, the rotating shaft 202 is fixedly connected with a driving gear 203 arranged on the top wall of the lower grinding plate 103, the driving gear 203 is meshed with the circular toothed plate 105, so that a user can start the servo motor 201 to drive the rotating shaft 202 to rotate, the driving gear 203 is driven to rotate to drive the grinding member 100 to grind quartz crystal, the operating platform 101 is provided with a lifting member 300 for lifting the grinding member 100, the lifting member 300 comprises a mounting frame 301, the mounting frame 301 is arranged on the operating platform 101, the mounting frame 301 is provided with a telescopic cylinder 302, the bottom end of the telescopic cylinder 302 is fixedly connected with a connecting disc 303, the bottom surface of the connecting disc 303 is fixedly connected with a plurality of first connecting rods 304, the first connecting rods 304 are slidably connected on the upper grinding plate 108, so that a user can lift the upper grinding plate 108 in the grinding member 100 through the lifting member 300 to complete the processing of quartz crystal, a connecting member 400 for connection is arranged between the lifting member 300 and the driving member 200, the connecting member 400 comprises a sleeve 401 and a hexagonal inserted bar 410, the top end of the sleeve 401 is fixedly connected to the connecting disc 303, the bottom surface of the connecting disc 303 is rotatably connected with an upright bar 402, the bottom end of the upright bar 402 is fixedly connected with a first bevel gear 403, the first bevel gear 403 is provided with an inserting groove 404, the inner side wall of the sleeve 401 is fixedly connected with a cross bar 405, one end of the cross bar 405 far away from the inner wall of the sleeve 401 is rotatably connected with a second bevel gear 406, a third bevel gear 407 is arranged below the second bevel gear 406, the second bevel gear 406 is respectively engaged with the first bevel gear 403 and the third bevel gear 407, the third bevel gear 407 is provided with a first connecting hole 408, a plurality of second connecting rods 409 are fixedly connected between the third bevel gear 407 and the upper grinding plate 108, go up to be equipped with second connect the via hole 411 on grinding plate 108, hexagon inserted bar 410 fixed connection is on being located the pivot 202 top of sleeve 401 below, hexagon inserted bar 410 cooperatees with second connect the via hole 411, first connect the via hole 408 and slot 404 respectively, make accessible connecting piece 400 connect driving piece 200, make when hexagon inserted bar 410 inserts in slot 404, can drive first bevel gear 403 and rotate, it rotates to drive second bevel gear 406, make third bevel gear 407 rotate towards the opposite direction with first bevel gear 403, it rotates to drive grinding plate 108 through the connection of second connecting rod 409.

The grinding fluid using component comprises a collecting part 500 arranged at the bottom of an operating platform 101 and used for collecting and a material conveying nozzle 601 arranged on a lifting part 300, wherein the collecting part 500 comprises a guide plate 503, the guide plate 503 is arranged below a circular through opening 102, the guide plate 503 is obliquely arranged, a first annular plate 501 is fixedly connected between the guide plate 503 and the operating platform 101, a discharge opening 504 is formed in the first annular plate 501, a second annular plate 502 is fixedly connected to the guide plate 503 inside the first annular plate 501, the second annular plate 502 is rotationally connected to a lower grinding plate 103, a plurality of discharge channels 505 are arranged on the lower grinding plate 103, the inner bottom wall of each discharge channel 505 is obliquely arranged, a collecting box 506 is arranged on the bottom wall of a rectangular opening 107, and the collecting box 506 is positioned below the discharge opening 504, so that grinding fluid can rotate along with the lower grinding plate 103 when grinding fluid enters the discharge channels 505 along with grinding debris during grinding, under the effect of centrifugal force, move to circular opening 102 lateral wall direction, drop to on the guide plate 503, discharge to collecting box 506 in through discharge gate 504 along guide plate 503 afterwards, make things convenient for the staff to collect the lapping liquid after the use, defeated material nozzle 601 is fixed to be alternates on connection pad 303, and be equipped with the transfer line that is used for being connected the usefulness with external infusion equipment on defeated material nozzle 601, upward be equipped with a plurality of infusate hole on the abrasive sheet 108, the infusate hole cooperatees with defeated material nozzle 601, make user's accessible defeated material nozzle 601 spray the lapping liquid to this equipment, and the downward seepage in lapping liquid accessible infusate hole.

The use method of the 3-inch quartz wafer double-side grinding device specifically comprises the following steps:

1) when in use, the quartz wafer to be ground is placed into the grinding through hole 106, and meanwhile, the infusion tube is connected with external infusion equipment;

2) starting the telescopic cylinder 302 to enable the bottom end of the telescopic cylinder 302 to descend, driving the connecting disc 303 to move downwards together with the upper grinding plate 108, enabling the hexagonal inserting rod 410 to penetrate through the second connecting through hole 411 and the first connecting through hole 408 to be inserted into the inserting groove 404, and closing the telescopic cylinder 302;

3) spraying grinding fluid to the upper grinding plate 108 through a material delivery nozzle 601;

4) the servo motor 201 is started, so that the rotating shaft 202 rotates forwards to drive the lower grinding plate 103 to rotate forwards, meanwhile, the rotation of the rotating shaft 202 drives the hexagonal inserted rod 410 to rotate, so that the first bevel gear 403 rotates forwards to drive the second bevel gear 406 to rotate, so that the third bevel gear 407 rotates reversely, the upper grinding plate 108 is driven to rotate reversely through the connection of the second connecting rod 409, meanwhile, the rotation of the rotating shaft 202 drives the driving gear 203 to rotate, so that the circular toothed plate 105 rotates and moves on the lower grinding plate 103, and quartz wafers in the circular toothed plate 105 are ground in a matched mode;

5) when grinding, the grinding fluid flows downwards through the infusion hole on the upper grinding plate 108, and the piece that the grinding produced is being smugglied secretly to the grinding fluid that has used up gets into discharging channel 505, along with the rotation of lower grinding plate 103, under the effect of centrifugal force, grinding fluid and piece move to circular opening 102 lateral wall direction, drop to guide plate 503 on, discharge to the collecting box 506 in through discharge gate 504 along guide plate 503 afterwards, make things convenient for the staff to collect the grinding fluid after using.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.