阅读说明：本技术 一种柔性光电子装置 (Flexible optoelectronic device ) 是由 方铉 刘思宁 李含 张强 房丹 于 2021-08-09 设计创作，主要内容包括：本发明属于柔性电子技术领域,尤其为一种柔性光电子装置,包括衬底,粘接固定在所述衬底上表面的导电薄膜层,包括设置在所述衬底和所述导电薄膜层之间起到性能优化的性能优化组件,所述性能优化组件包括弹性柔性支撑膜、有机缓冲层和第一粘合层,所述弹性柔性支撑膜和所述有机缓冲层自下而上的粘接固定在所述衬底和所述导电薄膜层之间；有机缓冲层增强了导电薄膜层底面的平整度,扩大导电薄膜层和衬底粘合的接触面,弹性柔性支撑膜增强了衬底的支撑性,配合第一粘合层和第二粘合层,提高弹性柔性支撑膜和有机缓冲层的粘合,同时弹性柔性支撑膜底面和有机缓冲层上表面的第一粘合层和第二粘合层,增强衬底和导电薄膜层的粘合性。(The invention belongs to the technical field of flexible electronics, and particularly relates to a flexible optoelectronic device which comprises a substrate, a conductive thin film layer adhered and fixed on the upper surface of the substrate, and a performance optimization assembly arranged between the substrate and the conductive thin film layer and having optimized performance, wherein the performance optimization assembly comprises an elastic flexible support film, an organic buffer layer and a first bonding layer, and the elastic flexible support film and the organic buffer layer are adhered and fixed between the substrate and the conductive thin film layer from bottom to top; the organic buffer layer enhances the flatness of the bottom surface of the conductive thin film layer, the contact surface between the conductive thin film layer and the substrate is enlarged, the elastic flexible supporting film enhances the supporting performance of the substrate, the first bonding layer and the second bonding layer are matched to improve the bonding between the elastic flexible supporting film and the organic buffer layer, and meanwhile, the first bonding layer and the second bonding layer on the bottom surface of the elastic flexible supporting film and the upper surface of the organic buffer layer enhance the bonding between the substrate and the conductive thin film layer.)

1. A flexible optoelectronic device comprising a substrate (10), a conductive film layer (11) adhesively secured to an upper surface of said substrate (10), characterized in that:

comprises a performance optimization component (20) which is arranged between the substrate (10) and the conductive film layer (11) and is used for optimizing the performance;

the performance optimization assembly (20) comprises an elastic flexible support film (21), an organic buffer layer (22) and a first bonding layer (23), the elastic flexible support film (21) and the organic buffer layer (22) are fixedly bonded between the substrate (10) and the conductive thin film layer (11) from bottom to top, and the first bonding layer (23) is fixedly bonded between the elastic flexible support film (21) and the organic buffer layer (22).

2. The flexible optoelectronic device of claim 1 wherein: the performance optimization assembly (20) further comprises a second adhesive layer (24), and the second adhesive layer (24) is fixedly adhered to the upper surface of the first adhesive layer (23) and is positioned on the lower surface of the organic buffer layer (22).

3. The flexible optoelectronic device of claim 2 wherein: the performance optimization assembly (20) is sequentially arranged from bottom to top into the elastic flexible support film (21), the first bonding layer (23), the second bonding layer (24) and the organic buffer layer (22).

4. The flexible optoelectronic device of claim 3 wherein: the lower surface of the elastic flexible support film (21) and the upper surface of the organic buffer layer (22) are both provided with the first bonding layer (23) and the second bonding layer (24) from bottom to top.

5. The flexible optoelectronic device of claim 1 wherein: the conductive film is characterized by further comprising a conductive component (30) which is arranged on the bottom surface of the conductive film layer (11) and plays a conductive role;

the conductive assembly (30) comprises a graphene layer (31), an organic dielectric layer (32) and carbon nano tubes (33), the graphene layer (31) is fixedly bonded on the bottom surface of the conductive film layer (11), the organic dielectric layer (32) is fixedly bonded on the bottom surface of the graphene layer (31), and the carbon nano tubes (33) are embedded in the conductive film layer (11).

6. The flexible optoelectronic device of claim 5 wherein: the cumulative thickness of the graphene layer (31) and the organic dielectric layer (32) is greater than the thickness of the conductive thin film layer (11).

7. The flexible optoelectronic device of claim 1 wherein: the protective component (40) is arranged on the bottom surface of the substrate (10) and plays a role in protection;

the protective assembly (40) comprises a first protective layer (41), a second protective layer (42) and a metal film (43), the first protective layer (41) and the second protective layer (42) are respectively bonded on the bottom surface of the substrate (10) and the upper surface of the conductive film layer (11), and the metal film (43) is arranged inside the first protective layer (41) and the second protective layer (42).

8. The flexible optoelectronic device of claim 7 wherein: the metal film (43) is arranged in a double-layer corrugated mode, and the area of the metal film (43) is smaller than that of the first protection layer (41).

9. The flexible optoelectronic device of claim 7 wherein: the first protective layer (41) and the second protective layer (42) are identical in structure size.

10. The flexible optoelectronic device of claim 7 wherein: the first protective layer (41) and the second protective layer (42) are both polymethyl methacrylate.

Technical Field

The invention belongs to the technical field of flexible electronics, and particularly relates to a flexible optoelectronic device.

Background

Flexible electronics can be summarized as an emerging electronic technology for fabricating organic/inorganic material electronic devices on flexible/ductile plastic or thin metal substrates, with its unique flexibility/ductility and efficient, low-cost manufacturing processes, such as flexible electronic displays, printed RFID, surface mounting for electronics, etc., due to the rough surface of the conductive film layer, which is not conducive to bonding to and between substrates, resulting in poor adhesion and affecting the performance of the device, relying only on the substrate for single conduction, poor conductivity, and due to the absence of protective measures, increasing the vulnerability of the device, poor protection.

To solve the above problems, a flexible optoelectronic device is proposed in the present application.

Disclosure of Invention

To solve the problems set forth in the background art described above. The invention provides a flexible optoelectronic device which has the characteristics of good adhesion, good performance, good conductivity and good protection.

In order to achieve the purpose, the invention provides the following technical scheme: a flexible optoelectronic device comprises a substrate, a conductive film layer adhered and fixed on the upper surface of the substrate;

the device comprises a performance optimization component which is arranged between the substrate and the conductive film layer and is used for optimizing the performance;

the performance optimization assembly comprises an elastic flexible supporting film, an organic buffer layer and a first bonding layer, the elastic flexible supporting film and the organic buffer layer are fixedly bonded between the substrate and the conductive thin film layer from bottom to top, and the first bonding layer is fixedly bonded between the elastic flexible supporting film and the organic buffer layer.

Preferably, in the flexible optoelectronic device according to the present invention, the performance optimization module further includes a second adhesive layer adhesively fixed to an upper surface of the first adhesive layer and located on a lower surface of the organic buffer layer.

Preferably, the performance optimization module is sequentially disposed from bottom to top on the elastic flexible support film, the first adhesive layer, the second adhesive layer, and the organic buffer layer.

In the flexible optoelectronic device according to the present invention, the first adhesive layer and the second adhesive layer are preferably provided from bottom to top on both the lower surface of the elastic flexible support film and the upper surface of the organic buffer layer.

The flexible optoelectronic device preferably further comprises a conductive component arranged on the bottom surface of the conductive film layer and having a conductive effect;

the conductive assembly comprises a graphene layer, an organic dielectric layer and carbon nano tubes, the graphene layer is fixedly bonded to the bottom surface of the conductive film layer, the organic dielectric layer is fixedly bonded to the bottom surface of the graphene layer, and the carbon nano tubes are embedded in the conductive film layer.

Preferably, in the flexible optoelectronic device according to the present invention, the cumulative thickness of the graphene layer and the organic dielectric layer is greater than the thickness of the conductive thin film layer.

Preferably, the flexible optoelectronic device further comprises a protection component arranged on the bottom surface of the substrate for protection;

the protection assembly comprises a first protection layer, a second protection layer and a metal film, the first protection layer and the second protection layer are respectively bonded on the bottom surface of the substrate and the upper surface of the conductive film layer, and the metal film is arranged inside the first protection layer and the second protection layer.

Preferably, in the flexible optoelectronic device according to the present invention, the metal film is a double-layer corrugated structure, and an area of the metal film is smaller than an area of the first protection layer.

Preferably, the first protective layer and the second protective layer are both the same size.

Preferably, the first protective layer and the second protective layer are both polymethyl methacrylate.

Compared with the prior art, the invention has the beneficial effects that:

the performance optimizing assembly is arranged, the flatness of the bottom surface of the conductive thin film layer is enhanced through the organic buffer layer, the contact surface for bonding the conductive thin film layer and the substrate is enlarged, the foundation is made for later-stage bonding improvement, the support performance of the substrate is enhanced through the elastic flexible supporting film, the bonding of the elastic flexible supporting film and the organic buffer layer is improved through the cooperation of the first bonding layer and the second bonding layer, meanwhile, the bonding performance of the substrate and the conductive thin film layer is enhanced through the first bonding layer and the second bonding layer on the bottom surface of the elastic flexible supporting film and the upper surface of the organic buffer layer, and the performance of the device is improved;

by arranging the conductive assembly, the graphene layer and the organic dielectric layer have good conductivity, so that the conductive effect between the substrate and the conductive thin film layer is optimized, the conductivity of the conductive thin film layer is enhanced, and the conductivity of the conductive thin film layer is optimized again by being matched with a metal thin film with good conductivity embedded in the conductive thin film layer;

through setting up the protection subassembly, first protective layer and second protective layer are pointed protects substrate and conductive film layer, and the metal film of double-deck design improves toughness and the support nature of first protective layer and second protective layer simultaneously, and then improves toughness and the protectiveness to substrate and conductive film layer, reduces the fragile possibility of the device, does benefit to increase of service life.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view showing the connection between a metal thin film and a first protective layer in the present invention;

FIG. 3 is a cross-sectional view showing the connection between the conductive thin film layer and the carbon nanotubes in the present invention;

FIG. 4 is a partial connection view of the elastic flexible support film, the organic buffer layer, the first adhesive layer and the second adhesive layer in the present invention;

in the figure:

10. a substrate;

11. a conductive thin film layer;

20. a performance optimization component;

21. an elastic flexible support membrane; 22. an organic buffer layer; 23. a first adhesive layer; 24. a second adhesive layer;

30. a conductive component;

31. a graphene layer; 32. an organic dielectric layer; 33. a carbon nanotube;

40. a protection component;

41. a first protective layer; 42. a second protective layer; 43. a metal thin film.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

As shown in fig. 1 and 4;

a flexible optoelectronic device comprises a substrate 10 and a conductive film layer 11 adhesively secured to an upper surface of the substrate 10.

In this embodiment: the flexible photoelectronic device main body consists of a substrate 10 and a conductive film layer 11, the existing flexible photoelectronic device main body has the problem of poor adhesion caused by the fact that the surface of the conductive film layer 11 is rough and is not beneficial to the bonding with the substrate 10, and a performance optimization assembly 20 is added in the scheme aiming at the main body.

Further:

with the above in mind: the flexible photoelectronic device comprises a performance optimization assembly 20 which is arranged between a substrate 10 and a conductive film layer 11 and has optimized performance, wherein the performance optimization assembly 20 comprises an elastic flexible support film 21, an organic buffer layer 22 and a first bonding layer 23, the elastic flexible support film 21 and the organic buffer layer 22 are fixedly bonded between the substrate 10 and the conductive film layer 11 from bottom to top, and the first bonding layer 23 is fixedly bonded between the elastic flexible support film 21 and the organic buffer layer 22.

In this embodiment: the flatness of the bottom surface of the conductive thin film layer 11 is enhanced through the organic buffer layer 22, the contact surface between the conductive thin film layer 11 and the substrate 10 is enlarged, the basis is made for later-stage adhesion improvement, the supporting property of the substrate 10 is enhanced through the elastic flexible supporting film 21, the first adhesive layer 23 and the second adhesive layer 24 are matched, the adhesion between the elastic flexible supporting film 21 and the organic buffer layer 22 is improved, meanwhile, the first adhesive layer 23 on the bottom surface of the elastic flexible supporting film 21 is enhanced, the adhesion between the substrate 10 and the conductive thin film layer 11 is enhanced, and the performance of the device is improved.

Further, the method comprises the following steps of;

in an alternative embodiment: the performance optimization assembly 20 further includes a second adhesive layer 24, and the second adhesive layer 24 is adhesively fixed on the upper surface of the first adhesive layer 23 and is located on the lower surface of the organic buffer layer 22.

In this embodiment, it should be noted that: the second adhesive layer 24 is matched with the first adhesive layer 23 to optimize the viscosity, so that the adhesion degree between the elastic flexible support film 21 and the organic buffer layer 22 is improved, and the viscosity of the device is improved.

Further, the method comprises the following steps of;

in an alternative embodiment: the performance optimizing assembly 20 is sequentially provided with an elastic flexible support film 21, a first adhesive layer 23, a second adhesive layer 24 and an organic buffer layer 22 from bottom to top.

In this embodiment, it should be noted that: the above arrangement is reasonable, and the adhesion of the first adhesive layer 23 and the second adhesive layer 24, the adhesion flatness and the supporting force of the elastic flexible supporting film 21 and the organic buffer layer 22, and the like are fully exerted.

Further, the method comprises the following steps of;

in an alternative embodiment: the lower surface of the elastic flexible support film 21 and the upper surface of the organic buffer layer 22 are both provided with a first adhesive layer 23 and a second adhesive layer 24 from bottom to top.

In this embodiment, it should be noted that: the viscosity of the bottom surface of the elastic flexible support film 21 and the upper surface of the organic buffer layer 22 is increased, and the overall viscosity of the device is increased.

As shown in fig. 1 and 3;

the flexible photoelectronic device further comprises a conductive assembly 30 arranged on the bottom surface of the conductive thin film layer 11 and having a conductive effect, wherein the conductive assembly 30 comprises a graphene layer 31, an organic dielectric layer 32 and carbon nano tubes 33, the graphene layer 31 is fixedly bonded on the bottom surface of the conductive thin film layer 11, the organic dielectric layer 32 is fixedly bonded on the bottom surface of the graphene layer 31, and the carbon nano tubes 33 are embedded in the conductive thin film layer 11.

In this embodiment: because the graphene layer 31 and the organic dielectric layer 32 have good conductivity, the conductive effect between the substrate 10 and the conductive thin film layer 11 is optimized, the conductivity of the conductive thin film layer 11 is enhanced, and the metal thin film 43 with good conductivity is embedded in the conductive thin film layer 11 to optimize the conductivity of the conductive thin film layer 11 again.

Further, the method comprises the following steps of;

in an alternative embodiment: the cumulative thickness of the graphene layer 31 and the organic dielectric layer 32 is greater than the thickness of the conductive thin film layer 11.

In this embodiment, it should be noted that: the conductivity of the graphene layer 31 and the organic dielectric layer 32 bonded to each other is improved, and the conductivity between the substrate 10 and the conductive thin film layer 11 is enhanced.

As shown in fig. 1 and 2;

preferably, the flexible optoelectronic device of the present invention further includes a protective member 40 disposed on the bottom surface of the substrate 10 for protecting, wherein the protective member 40 includes a first protective layer 41, a second protective layer 42 and a metal film 43, the first protective layer 41 and the second protective layer 42 are respectively adhered to the bottom surface of the substrate 10 and the upper surface of the conductive film layer 11, and the metal film 43 is disposed inside each of the first protective layer 41 and the second protective layer 42.

In this embodiment: the first protective layer 41 and the second protective layer 42 protect the substrate 10 and the conductive thin film layer 11 in a targeted manner, and meanwhile, the metal film 43 with the double-layer design improves the toughness and the support of the first protective layer 41 and the second protective layer 42, so that the toughness and the protection of the substrate 10 and the conductive thin film layer 11 are improved, the possibility of damage of the device is reduced, and the service life of the device is prolonged.

Further, the method comprises the following steps of;

in an alternative embodiment: the metal film 43 is provided in a double-layer corrugated configuration, and the area of the metal film 43 is smaller than that of the first protective layer 41.

In this embodiment, it should be noted that: the double-corrugated metal film 43 enhances the toughness of the first protective layer 41, weakens the brittleness, and sufficiently facilitates the space available in the first protective layer 41.

Further, the method comprises the following steps of;

in an alternative embodiment: the first protective layer 41 and the second protective layer 42 have the same structure size.

In this embodiment, it should be noted that: the upper and lower surfaces of the device are sufficiently protected by the first protective layer 41 and the second protective layer 42, and the overall protection is improved.

Further, the method comprises the following steps of;

in an alternative embodiment: the first protective layer 41 and the second protective layer 42 are each polymethyl methacrylate.

In this embodiment, it should be noted that: the overall performance of the device is improved and optimized.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.