阅读说明：本技术 天线封装和图像显示装置 (Antenna package and image display device ) 是由 崔秉搢 尹号栋 李元熙 洪源斌 于 2021-05-07 设计创作，主要内容包括：根据本发明的实施方式,提供了一种天线封装和一种图像显示装置。该天线封装包括天线单元和与天线单元电连接的电路板。该电路板包括：芯层；设置在芯层的一个表面上的信号传输布线,该信号传输布线的一个端部与天线单元连接；设置在芯层的与上述一个表面相对的对向表面上的接地层；以及第一过孔结构,其穿过芯层形成并在信号传输布线的上述一个端部周围设置为与接地层接触。(According to an embodiment of the present invention, there are provided an antenna package and an image display device. The antenna package includes an antenna element and a circuit board electrically connected to the antenna element. The circuit board includes: a core layer; a signal transmission wiring provided on one surface of the core layer, one end portion of the signal transmission wiring being connected to the antenna element; a ground layer provided on an opposite surface of the core layer to the one surface; and a first via structure formed through the core layer and disposed around the one end portion of the signal transmission wiring in contact with the ground layer.)

1. An antenna package, comprising:

an antenna unit; and

a circuit board electrically connected to the antenna unit, the circuit board comprising:

a core layer;

a signal transmission wiring provided on one surface of the core layer, one end portion of the signal transmission wiring being connected to the antenna element;

a ground layer provided on an opposite surface of the core layer opposite to the one surface; and

a first via structure formed through the core layer and disposed around the one end portion of the signal transmission wiring in contact with the ground layer.

2. The antenna package of claim 1, wherein the circuit board further comprises a bonding pattern disposed around the one end of the signal transmission wiring on the one surface of the core layer.

3. The antenna package of claim 2, wherein the first via structure is in contact with the bond pattern and the ground layer.

4. The antenna package of claim 2, wherein the antenna element comprises a plurality of the antenna elements arranged in a width direction, and the signal transmission wiring comprises a plurality of the signal transmission wirings, wherein each of the signal transmission wirings is connected to each of the antenna elements.

5. The antenna package according to claim 4, wherein the bonding pattern includes a plurality of the bonding patterns that are disposed apart from the signal transmission wiring along the width direction, and

the first via structure includes a plurality of the first via structures in contact with the bonding pattern, and the plurality of the first via structures are arranged along the width direction to form a first via row.

6. The antenna package of claim 2, wherein the antenna element includes a radiation pattern, a transmission line protruding from the radiation pattern, a signal pad formed at an end of the transmission line, and an antenna ground pad disposed around the signal pad, and

the signal transmission wiring is electrically connected to the signal pad, and the bonding pattern is electrically connected to the antenna ground pad.

7. The antenna package of claim 1, wherein the circuit board further comprises a second via structure disposed around the signal transmission trace, and wherein the second via structure is formed through the core layer in contact with the ground layer.

8. The antenna package of claim 7, wherein the second via structures are arranged to form a second via column along the direction of extension of the signal transmission wire, and wherein

Wherein the signal transmission wiring includes a plurality of the signal transmission wirings, and the second via column is disposed between the plurality of the signal transmission wirings.

9. The antenna package of claim 1, wherein the circuit board further comprises a ground pattern disposed around opposing ends of the signal transmission routing on the one surface of the core layer.

10. The antenna package of claim 9, wherein the circuit board further comprises a third via structure formed through the core layer in contact with the ground pattern and the ground layer.

11. The antenna package of claim 10, wherein the third via structure comprises a plurality of the third via structures arranged to form a third via column along the extension direction of the signal transmission wiring or the ground pattern.

12. The antenna package of claim 11, wherein the third column of vias comprises a plurality of the third column of vias and the signaling routing comprises a plurality of the signaling routing, and

the plurality of third via columns are disposed between the plurality of signal transmission wirings.

13. The antenna package of claim 1, further comprising an antenna driver integrated circuit chip electrically connected with opposing ends of the signal transmission wiring.

14. The antenna package of claim 13, further comprising an intermediate circuit board disposed between the opposing ends of the signal transmission wires and the antenna driver integrated circuit chip.

15. The antenna package of claim 14, wherein the circuit board comprises a flexible printed circuit board and the intermediate circuit board comprises a rigid printed circuit board.

16. An image display device, characterized in that it comprises an antenna package according to claim 1.

Technical Field

The present invention relates to an antenna package and an image display device. More particularly, the present invention relates to an antenna package including an antenna device and a circuit board and an image display device including the antenna package.

Background

With the development of information technology, wireless communication technologies such as Wi-Fi, bluetooth, and the like are combined with image display devices such as in the form of smart phones. In this case, the antenna may be combined with the image display device to provide a communication function.

With the rapid development of mobile communication technology, there is a need for an antenna capable of high-frequency or ultra-high-frequency communication in an image display device.

However, as the driving frequency of the antenna increases, the signal loss may also increase. Further, as the length of the transmission path increases, the degree of signal loss may further increase.

In addition, when the driving integrated circuit chip and the antenna are electrically connected for antenna feeding/driving control using an intermediate circuit structure such as a Flexible Printed Circuit Board (FPCB), additional signal loss and signal interference may be generated.

For example, radiation and impedance characteristics generated by a radiation electrode and/or a pad included in the antenna may be disturbed by a wiring or an electrode pattern included in the FPCB, or may also cause signal loss due to contact resistance.

Therefore, there is a need for an antenna design that stably achieves radiation at a desired high frequency band without being affected by an intermediate circuit structure. For example, korean patent application laid-open No. 2013 and 0095451 discloses an antenna integrated with a display panel.

Disclosure of Invention

According to an aspect of the present invention, an antenna package with improved operational reliability and signal efficiency is provided.

According to an aspect of the present invention, there is provided an image display device including an antenna package having improved operational reliability and signal efficiency.

(1) An antenna package, comprising: an antenna unit; and a circuit board electrically connected to the antenna unit, the circuit board including: a core layer; a signal transmission wiring provided on one surface of the core layer, one end portion of the signal transmission wiring being connected to the antenna element; a ground layer provided on an opposite surface of the core layer to the one surface; and a first via structure formed through the core layer and disposed around the one end portion of the signal transmission wiring in contact with the ground layer.

(2) The antenna package according to the above (1), wherein the circuit board further includes a bonding pattern provided around the one end portion of the signal transmission wiring on the one surface of the core layer.

(3) The antenna package according to the above (2), wherein the first via structure is in contact with the bonding pattern and the ground layer.

(4) The antenna package according to the above (2), wherein the antenna element includes a plurality of antenna elements arranged in the width direction, and the signal transmission wiring includes a plurality of signal transmission wirings each of which is connected to each of the antenna elements.

(5) The antenna package according to the above (4), wherein the bonding pattern includes a plurality of bonding patterns that are arranged apart from the signal transmission wiring along the width direction, and the first via structure includes a plurality of first via structures that are in contact with the bonding pattern, and the plurality of first via structures are arranged along the width direction to form a first via row.

(6) The antenna package according to the above (2), wherein the antenna element includes a radiation pattern, a transmission line protruding from the radiation pattern, a signal pad formed at an end of the transmission line, and an antenna ground pad provided around the signal pad, and the signal transmission wiring is electrically connected to the signal pad, and the bonding pattern is electrically connected to the antenna ground pad.

(7) The antenna package according to the above (1), wherein the circuit board further includes a second via structure provided around the signal transmission wiring, and the second via structure is formed through the core layer to be in contact with the ground layer.

(8) The antenna package according to the above (7), wherein the second via structure is provided along an extending direction of the signal transmission wiring line to form a second via column, and wherein the signal transmission wiring line includes a plurality of signal transmission wiring lines, and the second via column is provided between the plurality of signal transmission wiring lines.

(9) The antenna package according to the above (1), wherein the circuit board further includes a ground pattern provided around an opposite end portion of the signal transmission wiring on the one surface of the core layer.

(10) The antenna package according to the above (9), wherein the circuit board further includes a third via structure formed through the core layer to be in contact with the ground pattern and the ground layer.

(11) The antenna package according to the above (10), wherein the third via structure includes a plurality of third via structures arranged along an extending direction of the signal transmission wiring or the ground pattern to form a third via column.

(12) The antenna package according to the above (11), wherein the third via column includes a plurality of third via columns, and the signal transmission wiring includes a plurality of signal transmission wirings, and the plurality of third via columns are provided between the plurality of signal transmission wirings.

(13) The antenna package according to the above (1), further comprising an antenna driving Integrated Circuit (IC) chip electrically connected to the opposite end portions of the signal transmission wiring.

(14) The antenna package according to the above (13), further comprising an intermediate circuit board provided between the above-mentioned opposite end portions of the signal transmission wiring and the antenna driving IC chip.

(15) The antenna package according to the above (14), wherein the circuit board comprises a Flexible Printed Circuit Board (FPCB), and the intermediate circuit board comprises a rigid printed circuit board.

(16) An image display device comprising an antenna package according to the above embodiments.

In the antenna package including the antenna device and the circuit board, the circuit board may include a ground layer and a signal transmission wiring facing and overlapping each other. Therefore, the dielectric characteristics of the signal transmission wiring can be uniformly maintained. In addition, generation of an electric field around the signal transmission wiring may be facilitated by the ground layer, so that feeding/signal transmission efficiency with respect to the antenna element may be improved.

In an exemplary embodiment, a via structure connecting the antenna bonding pattern and the ground layer of the circuit board to each other may be formed. Noise absorption/blocking efficiency and electric field generation can be further promoted by the via structure in the bonding region, thereby suppressing signal/feed loss and improving antenna signal/radiation efficiency.

Drawings

Fig. 1 and 2 are a schematic top plan view and a schematic cross-sectional view, respectively, illustrating an antenna package according to an exemplary embodiment.

Fig. 3 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment.

Fig. 4 and 5 are schematic top plan views illustrating an antenna package according to an exemplary embodiment.

Fig. 6 is a schematic top plan view illustrating an image display device according to an exemplary embodiment.

Detailed Description

According to an exemplary embodiment of the present invention, there is provided an antenna package including an antenna unit and a circuit board that may include a signal transmission wiring and a ground layer. In addition, an image display device including the antenna package is also provided.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. However, those skilled in the art will appreciate that the embodiments described with reference to the drawings are provided for further understanding of the spirit of the invention and are not meant to limit the claimed subject matter disclosed in the detailed description and the appended claims.

The terms "first," "second," "upper," "lower," "top," "bottom," and the like as used herein do not denote absolute positions, but rather are used to relatively distinguish between different elements and positions.

Fig. 1 and 2 are a schematic top plan view and a schematic cross-sectional view, respectively, illustrating an antenna package according to an exemplary embodiment.

Referring to fig. 1 and 2, the antenna package may include an antenna device 100 and a circuit board 200. The circuit board 200 may include a core layer 230, a circuit wiring layer 210, and a ground layer 250, and the circuit wiring layer 210 and the antenna element included in the antenna device 100 may be electrically connected to each other.

The antenna device 100 may include an antenna dielectric layer 110 and an antenna electrode layer 120 disposed on the antenna dielectric layer 110.

The antenna dielectric layer 110 may include, for example, a transparent resin film such as polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, polybutylene terephthalate, and the like; cellulose-based resins such as diacetylcellulose and triacetylcellulose; a polycarbonate-series resin; acrylic resins such as polymethyl (meth) acrylate and polyethyl (meth) acrylate; styrenic resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin-based resins such as polyethylene, polypropylene, cycloolefin or polyolefin having a norbornene structure, and ethylene-propylene copolymer; vinyl chloride-based resins; amide-based resins such as nylon and aramid; an imide resin; polyether sulfone resins; sulfone resins; polyether ether ketone resin; polyphenylene sulfide resin; a vinyl alcohol resin; vinylidene chloride resin; vinyl butyral resins; an allylic resin; a polyoxymethylene resin; an epoxy resin; urethane or acrylic urethane resins; silicone resins, and the like. They may be used alone or in combination of two or more.

The antenna dielectric layer 110 may contain an adhesive material such as Optically Clear Adhesive (OCA), Optically Clear Resin (OCR), or the like. In some embodiments, the antenna dielectric layer 110 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, silicon oxynitride, or the like.

In some embodiments, the dielectric constant of the antenna dielectric layer 110 may be adjusted to be in the range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively lowered, so that driving at a desired high frequency band or ultra high frequency band may not be achieved.

The antenna electrode layer 120 may be formed on one surface of the antenna dielectric layer 110. As shown in fig. 2, the antenna electrode layer 120 may include an antenna element having a radiation pattern 122.

In an exemplary embodiment, the antenna unit may include an antenna pattern or a radiator capable of radiating at a high frequency band or an ultra high frequency band of 3G, 4G, 5G or higher.

The antenna element may also include a transmission line 124, a signal pad 126, and an antenna ground pad 125. The radiation pattern 122 may have, for example, a polygonal plate shape, and the transmission line 124 may protrude from one side of the radiation pattern 122 to be electrically connected with the signal pad 126. The transmission line 124 may be formed as a single member substantially integral with the radiation pattern 122.

The signal pad 126 may be connected to an end of the transmission line 124. The signal pad 126 may be provided as a substantially integral member with the transmission line 124, and the end of the transmission line 124 may serve as the signal pad 126.

In an exemplary embodiment, a pair of antenna ground pads 125 may face each other with a transmission line 124 or a signal pad 126 interposed therebetween. The antenna ground pad 125 may be electrically and physically separated from the transmission line 124 and the signal pad 126.

In an exemplary embodiment, vertical radiation (e.g., radiation in the thickness direction of the antenna device 100) may be substantially achieved by the radiation pattern 122. In addition, the antenna ground pads 125 may face each other and may be close to the radiation patterns 122, so that horizontal radiation may be achieved through the antenna ground pads 125.

The antenna element may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of them. They may be used alone or in combination.

In one embodiment, the antenna element may include silver (Ag) or a silver alloy (e.g., silver-palladium-copper (APC)) or copper (Cu) or a copper alloy (e.g., copper-calcium (CuCa)) to achieve low resistance and a fine line width pattern.

The antenna unit may include a transparent conductive oxide such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), zinc oxide (ZnOx), Indium Zinc Tin Oxide (IZTO), and the like.

In some embodiments, the antenna element may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the antenna element may include a double-layer structure of a transparent conductive oxide layer-metal layer, or a triple-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the flexibility can be improved by the metal layer, and the signal transmission speed can also be improved by the low resistance of the metal layer. The corrosion resistance and transparency can be improved by the transparent conductive oxide layer.

In some embodiments, the radiation pattern 122 and the transmission line 124 may include a mesh pattern structure to improve light transmittance. In this case, a dummy mesh pattern (not shown) may be formed around the radiation pattern 122 and the transmission line 124.

The signal pad 126 and the antenna ground pad 125 may be solid patterns formed of the above-described metal or alloy in consideration of reduction of feed resistance, improvement of noise absorption efficiency, horizontal radiation characteristics, and the like.

In some embodiments, at least one portion of the antenna ground pad 125 may have a solid pattern structure. In one embodiment, a portion of the antenna ground pad 125 near the radiation pattern may have a mesh pattern structure. For example, the antenna ground pad 125 may additionally extend toward the radiation pattern 122 to be disposed in a display area of the image display device together with the radiation pattern 122.

In this case, a portion of the antenna ground pad 125 disposed in the display area may have a mesh pattern structure.

In some embodiments, the antenna ground layer 130 may be disposed on an opposite surface of the antenna dielectric layer 110 to the one surface. The antenna ground layer 130 may be disposed to face the radiation pattern 122 with the antenna dielectric layer 110 interposed therebetween. Thus, the vertical radiation generated by the radiation pattern 122 may be facilitated.

As shown in fig. 2, the antenna ground layer 130 may overlap a portion of the antenna electrode layer 120 in the thickness direction. For example, the antenna ground layer 130 may not overlap with the antenna ground pad 125 in a plan view. Accordingly, the efficiency or concentration of horizontal radiation of the antenna ground pad 125 can be improved.

In one embodiment, a conductive member of a display device to which the above-described antenna package is applied may be used as the antenna ground layer 130.

The conductive member may include, for example, a gate electrode of a Thin Film Transistor (TFT) included in the display panel, various wirings such as a scan line or a data line, or various electrodes such as a pixel electrode or a common electrode.

In one embodiment, a metal member such as a SUS plate, a sensor member such as a digitizer, a heat sink, or the like, which is disposed at the rear of the display device, may be used as the antenna ground layer 130.

The circuit board 200 may be electrically connected with the antenna device 100 via the signal pad 126 of the antenna unit. In an exemplary embodiment, the circuit board 200 may be a Flexible Printed Circuit Board (FPCB).

The circuit board 200 may include a core layer 230, a circuit wiring layer 210, and a ground layer 250.

The core layer 230 may include, for example, a flexible resin such as a polyimide resin, a Modified Polyimide (MPI), an epoxy resin, a polyester, a Cyclic Olefin Polymer (COP), a Liquid Crystal Polymer (LCP), or the like.

The circuit wiring layer 210 may be formed on one surface of the core layer 230 (the top surface of the core layer 230 shown in fig. 2), and may include signal transmission wirings 212 and bonding patterns 214.

The signal transmission wiring 212 may be electrically connected with the signal pad 126 of the antenna unit. As shown in fig. 1, a plurality of antenna elements may be disposed along the width direction, and a plurality of signal transmission wirings 212 may be individually electrically connected to each signal pad 126 of the antenna elements.

The bonding pattern 214 may be electrically connected with the antenna ground pad 125 of the antenna unit. The pair of bonding patterns 214 may face each other with one end portion of the signal transmission wiring 212 interposed therebetween, and may be electrically connected with each antenna ground pad 125.

In some embodiments, the bonding pattern 214 may overlap with the antenna ground pads 125 (e.g., two adjacent antenna ground pads 125) included in different antenna units in a plan view.

As shown in fig. 2, the circuit wiring layer 210 and the antenna electrode layer 120 may be bonded to each other through the conductive intermediate structure 150. For example, the conductive intermediate structure 150 may include an Anisotropic Conductive Film (ACF).

In this case, the conductive intermediate structure 150 may be inserted into a region where the circuit board 200 and the antenna device 100 overlap each other, and the circuit board 200 and the antenna device 100 may be hot-pressed against each other.

Accordingly, the signal transmission wiring 212 and the signal pad 126 may be electrically connected to each other through the conductive intermediate structure 150. The bonding pattern 214 and the antenna ground pad 125 may also be electrically connected to each other through the conductive intermediate structure 150.

As shown in fig. 1, the antenna ground pad 125 and the bonding pattern 214 may partially overlap with each other in a plan view. The bonding pattern 214 may serve as a bonding pad to improve bonding adhesion through the conductive intermediate structure 150. In addition, the bonding pattern 214 may function as a ground pattern for shielding/absorbing noise around the signal transmission line 212. The bonding pattern 214 may have a floating pattern or an island pattern shape disposed around the signal transmission wiring in the bonding region.

The term "bonding pattern" used herein refers to a conductive structure for bonding with the antenna ground pad 125 having a specific shape without particular limitation, and is used to cover structures formed by various processes such as a plating process, a deposition process, an etching process, and the like.

The ground layer 250 may be formed on an opposite surface of the core layer 230 (e.g., a bottom surface of the core layer 230 in fig. 2) to the one surface.

In an exemplary embodiment, the ground layer 250 may overlap the bonding pattern 214 and the signal transmission wiring 212 in a thickness direction. The ground layer 250 may continuously extend to commonly overlap with the signal transmission wiring 212 and the bonding pattern 214 included in the circuit board 200.

The ground layer 250 may simultaneously overlap and face the signal transmission wiring 212, so that the dielectric characteristics of the core layer 230 with respect to the signal transmission wiring 212 may be uniformly maintained. In addition, generation of an electric field around the signal transmission wiring 212 may be facilitated by the ground layer 250, so that feeding/signal transmission efficiency with respect to the antenna element may be improved.

The ground layer 250 may serve as a blocking layer that may shield noise input toward the signal transmission wiring 212.

In an exemplary embodiment, the ground layer 250 and the bonding pattern 214 may be electrically connected to each other through the via structure 270. The via structure 270 may be formed through the core layer 230 to electrically connect the ground layer 250 and the bonding pattern 214 to each other.

The ground layer 250 and the bonding pattern 214 may be connected to each other through the via structure 270, so that noise absorption/blocking efficiency in a bonding area may be improved, and reliability of feeding/signal transmission with respect to the antenna device 100 may be improved.

In addition, the via structures 270 may be distributed around the joint area, which may further facilitate the generation of an electric field in an area near the antenna element, thereby suppressing signal/feed loss and improving signal/radiation efficiency of the antenna.

For example, the via hole may be formed by the bonding pattern 214, the core layer 230, and the ground layer 250 together. The via structure 270 may be formed by filling the via hole with a conductive material using an electroplating process or the like.

As shown in fig. 1, two or more via structures 270 may be connected to one bonding pattern 214, and a plurality of via structures 270 may be arranged in a width direction in a bonding region to form via rows. Therefore, generation of an electric field in the joining region can be further promoted.

The antenna package may include an antenna driving Integrated Circuit (IC) chip 290. Feeding/signal transmission to the antenna element through the signal transmission wiring 212 can be controlled by the antenna driving IC chip 290.

For example, the intermediate circuit board 280 may be disposed between the opposite ends of the circuit board 200 and the antenna driving IC chip 290 to electrically connect the circuit board 200 and the antenna driving IC chip 290 to each other. The intermediate circuit board 280 may be, for example, a rigid printed circuit board. For example, the intermediate circuit board 280 may include an intermediate circuit pattern formed in a prepreg substrate.

The signal transmission wiring 212, the bonding pattern 214, the via structure 270, and the ground layer 250 described above may include a low-resistance conductive material such as a metal or an alloy.

Fig. 3 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment.

Referring to fig. 3, the via structure 270 may include a first via structure 270a and a second via structure 270 b. As described above, the first via structure 270a may be in contact with the ground layer 250 and the bonding pattern 214 within or around the bonding area.

The second via structure 270b may be disposed around the signal transmission wiring 212. In an exemplary embodiment, the second via structure 270b may be spaced apart or separated from the signal transfer wiring 212 and may be continuously disposed along the outline of the signal transfer wiring 212. The second via structure 270b may penetrate the core layer 230 and may be in contact with the ground layer 250.

For example, the second via structure 270b may be disposed in a direction substantially parallel to the signal transmission wiring 212 or along an extending direction of the signal transmission wiring 212.

As shown in fig. 3, the first via structures 270a may be arranged in a width direction to form a first via row. The second via structures 270b may be continuously disposed along the signal transmission wiring 212 to form a second via column. For example, a plurality of second via columns may be provided along the width direction. The second via columns may be disposed between adjacent signal transmission wirings 212.

According to the above-described exemplary embodiment, the second via structure 270b may be formed around the signal transmission wiring 212, so that mutual interference/noise between the signal transmission wirings 212 may be shielded, and thus independence/reliability between antenna elements may be improved.

Further, generation of an electric field through the signal transmission wiring 212 may be additionally facilitated by the second via structure 270b, so that feeding/signal directivity toward the antenna element may be improved.

Fig. 4 and 5 are schematic top plan views illustrating an antenna package according to an exemplary embodiment. Detailed descriptions of elements and/or structures that are substantially the same as or similar to those described with reference to fig. 1 and 2 are omitted.

Referring to fig. 4, as described with reference to fig. 1, one end portion of the circuit board 200 may be coupled to the antenna unit, and an opposite end portion of the circuit board 200 may be electrically connected with the antenna driving IC chip 290. For example, the above-mentioned opposite end portions of the circuit board 200 may include chip mounting regions coupled to the antenna driving IC chip 290.

The circuit wiring layer 210 of the circuit board 200 may further include a ground pattern 216 disposed around an end portion of the signal transmission wiring 212. The ground pattern 216 may also be disposed between adjacent signal transmission wirings 212 to absorb or shield signal noise in the chip mounting region.

In an exemplary embodiment, the via structure 270 may further include a third via structure 270 c. The third via structure 270c may be formed through the core layer 230 and may be in contact with the ground pattern 216 and the ground layer 250.

The via structure 270c may be disposed in or around the chip mounting region, and may facilitate generation of an electric field in a region near the antenna driving IC chip 290. Accordingly, the generation and directivity of the electric field at one end and at the opposite end of the circuit board 200 may be improved by the first and third via structures 270a and 270c, respectively, thereby improving the overall signal efficiency of the antenna package.

In some embodiments, more than two third via structures 270c may be formed on one ground pattern 216. For example, two or more third via structures 270c may be disposed along the extending direction of the signal transmission wiring 212 or the ground pattern 216 to form a third via column. A plurality of third via columns may be disposed around the end of the signal transmission wiring 212 in the width direction.

The ground layer 250 at the above-mentioned opposite end portions of the circuit board 200 may substantially entirely cover the ground pattern 216 in a plan view.

Referring to fig. 5, the ground layer 250 may not overlap with an end portion of the ground pattern 216 in a plan view. For example, the ground pattern 216 may protrude from the ground layer 250 in a plan view. In this case, it is possible to prevent the feeding/signal transmission generated from the antenna driving IC chip 290 from being partially interfered by the ground layer 250.

Fig. 6 is a schematic top plan view illustrating an image display device according to an exemplary embodiment.

Referring to fig. 6, the image display device 300 may be made in the form of, for example, a smart phone, and fig. 6 shows a front portion or a window surface of the image display device 300. The front portion of the image display device 300 may include a display area 310 and a peripheral area 320. The outer peripheral region 320 may correspond to, for example, a light shielding portion or a frame portion of the image display device.

The antenna device 100 included in the above-described antenna package may be disposed toward a front portion of the image display device 300, and may be disposed on a display panel, for example. In one embodiment, the radiation pattern 122 may at least partially overlap the display area 310 in a plan view.

In this case, the radiation pattern 122 may have a mesh pattern structure, and the reduction of light transmittance due to the radiation pattern 122 may be prevented. The antenna driving IC chip 280 included in the antenna package may be disposed in the outer circumferential region 320 to prevent image quality degradation in the display region 310.

In some embodiments, the antenna package may be bent by the circuit board 200 so that, for example, the intermediate circuit board 280 and the antenna driving IC chip 290 may be disposed at the rear of the image display device 300.

As described above, the configuration of the ground layer 250 and the via structure 270 of the circuit board 200 may be used to achieve efficient antenna radiation with suppressed signal loss while improving signal reliability from the antenna driving IC chip 290.