阅读说明：本技术 一种硅麦叠装wb封装工艺 (Silicon wheat stacked WB packaging process ) 是由 艾育林 叶奕翔 于鲁川 刘文强 曹必水 于 2021-06-17 设计创作，主要内容包括：本发明公开了一种硅麦叠装WB封装工艺,工艺步骤包括：(1)在PCB基板上固定ASIC集成芯片；(2)在ASIC集成芯片正面点涂MEMS感应器贴片固定胶,以及在焊接点点位点涂锡膏或导电银胶；(3)在MEMS感应器背面设计相对应的焊接点,把MEMS感应器定位摆放在ASIC集成芯片正面对应位置,然后经过回流焊或烘烤实现ASIC集成芯片与MEMS感应器上的焊接点导通；(4)在PCB基板上涂锡后组装外壳,外壳与PCB基板形成包裹MEMS感应器及ASIC集成芯片的腔体。本发明采用叠片焊接点点对点式设计封装布局,减少产品设计摆件空间,便于产品小型化；封装减少了金线使用,可降低产品作业成本、简化封装工艺流程。(The invention discloses a silicon wheat stacked WB packaging process, which comprises the following steps: (1) fixing an ASIC integrated chip on a PCB substrate; (2) point-coating MEMS sensor patch fixing glue on the front side of the ASIC integrated chip, and point-coating solder paste or conductive silver glue on the point position of the welding point; (3) designing corresponding welding points on the back of the MEMS sensor, positioning the MEMS sensor at corresponding positions on the front of the ASIC integrated chip, and then realizing the conduction of the ASIC integrated chip and the welding points on the MEMS sensor through reflow soldering or baking; (4) and coating tin on the PCB substrate, and assembling a shell, wherein the shell and the PCB substrate form a cavity for wrapping the MEMS sensor and the ASIC integrated chip. The invention adopts the point-to-point type design packaging layout of the laminated welding points, reduces the space of a product design ornament and is convenient for the miniaturization of the product; the gold wire is used in the packaging process, so that the product operation cost can be reduced, and the packaging process flow is simplified.)

1. A silicon wheat stacked WB packaging process is characterized by comprising the following process steps:

(1) fixing an ASIC integrated chip on a PCB substrate by using a patch fixing adhesive;

(2) point-coating MEMS sensor patch fixing glue on the front side of the ASIC integrated chip, and point-coating solder paste or conductive silver glue on the point position of the welding point;

(3) designing a welding point corresponding to the front welding point of the ASIC integrated chip on the back surface of the MEMS sensor, positioning and placing the MEMS sensor at the corresponding position on the front surface of the ASIC integrated chip by using corresponding equipment, and then realizing the conduction of the ASIC integrated chip and the welding point on the MEMS sensor through reflow soldering or baking;

(4) the shell is assembled after tin coating is carried out on the corresponding position on the PCB substrate, and the shell and the PCB substrate are fixed after reflow soldering so that the shell completely wraps the MEMS sensor and the ASIC integrated chip to form a required cavity, and finally the functional requirement of converting product acoustics into electric signals is met.

2. The silicon-on-wheat WB packaging process of claim 1, wherein: and (4) coating the MEMS sensor patch fixing glue points on the non-welding point area on the front surface of the ASIC integrated chip in the step (3).

Technical Field

The invention belongs to the technical field of semiconductor packaging, and particularly relates to a silicon-microphone stacked WB packaging process.

Background

The existing conventional silicon microphone design package is that an MEMS sensor and an ASIC integrated chip are placed on a PCB substrate in parallel, the MEMS sensor and the ASIC integrated chip are fixed with the PCB by using a surface mount adhesive, then the MEMS sensor and the ASIC integrated chip are respectively connected and conducted with a PAD (welding point) on the PCB substrate by using gold wires through special equipment, then a shell is assembled after tin is coated at a corresponding position on the PCB, the shell is fixed with the PCB substrate after reflow soldering so that the shell completely wraps the MEMS sensor and the ASIC integrated chip to form a required cavity, and finally the functional requirement of converting product acoustics into electric signals is realized. This has the following disadvantages: 1. the gold wire and the corresponding special gold wire punching equipment are required to be used for 2 times in packaging, so that the production cost is high; 2. the product structure design is not compact enough, and the product volume is larger; 3. the production process is relatively complex.

Disclosure of Invention

The invention aims to solve the problems, and provides a silicon microphone stacked WB packaging process, which adopts a point-to-point design packaging layout of laminated welding points, can simplify the production process, only needs one-time gold wires and corresponding special gold wire-punching equipment for packaging, reduces the production cost, has a more compact product structure, and is beneficial to the miniaturization of the product volume.

The technical scheme of the invention is realized in such a way.

A silicon wheat stacked WB packaging process is characterized by comprising the following process steps:

(1) fixing an ASIC integrated chip on a PCB substrate by using a patch fixing adhesive;

(2) the ASIC integrated chip is communicated with the welding point on the PCB substrate by using gold wires by using special equipment;

(3) point-coating MEMS sensor patch fixing glue on the front side of the ASIC integrated chip, and point-coating solder paste or conductive silver glue on the point position of the welding point;

(4) designing a welding point corresponding to the front welding point of the ASIC integrated chip on the back surface of the MEMS sensor, positioning and placing the MEMS sensor at the corresponding position on the front surface of the ASIC integrated chip by using corresponding equipment, and then realizing the conduction of the ASIC integrated chip and the welding point on the MEMS sensor through reflow soldering or baking;

(5) the shell is assembled after tin coating is carried out on the corresponding position on the PCB substrate, and the shell and the PCB substrate are fixed after reflow soldering so that the shell completely wraps the MEMS sensor and the ASIC integrated chip to form a required cavity, and finally the functional requirement of converting product acoustics into electric signals is met.

Further, the silicon microphone stacked WB packaging process is characterized in that in the step (3), the MEMS sensor patch fixing glue is coated on the non-welding point area on the front side of the ASIC integrated chip.

The invention has the beneficial effects that: 1. the invention adopts the point-to-point type design packaging layout of the laminated welding points, reduces the space of a product design ornament and can realize the miniaturization of the product; 2. the laminated welding point-to-point type design packaging layout is adopted, and only one-time gold wire and corresponding gold wire punching special equipment are needed for packaging, so that the production cost of a product can be reduced, and the packaging process flow can be simplified.

Drawings

FIG. 1 is a schematic diagram of a product packaged by the process of the present invention.

Fig. 2 is a schematic diagram of a product structure packaged by a prior art process.

In the figure, 1, a PCB substrate, 2, an ASIC integrated chip, 3, an MEMS sensor, 4, a shell, 5, a sound inlet hole, 6, a patch fixing adhesive, 7, a welding point, 8, a welding point connecting tin paste or a conductive silver adhesive, 9, a shell connecting tin paste, 10, a gold thread, 11 and COB adhesive.

Detailed Description

The technical solution of the present invention will be further described in detail by the following examples and the drawings attached to the specification.

As shown in fig. 1, the process of packaging WB of the silicon-wheat stack of the present invention includes the following steps:

(1) the ASIC integrated chip 2 is fixed on the PCB substrate 1 by using the patch fixing glue 6.

(2) The ASIC integrated chip 2 is connected to the bonding pads 7 on the PCB substrate 1 by gold wires 10 using a dedicated device.

(3) And point-coating MEMS sensor patch fixing glue 6 on the non-welding point area on the front surface of the ASIC integrated chip 2 and point-coating welding points at the point positions of the welding points 7 to connect solder paste or conductive silver glue 8.

(4) And designing a welding point 7 corresponding to the welding point 7 on the front surface of the ASIC integrated chip 2 on the back surface of the MEMS sensor 3, positioning the MEMS sensor 3 at the corresponding position on the front surface of the ASIC integrated chip 2 by using corresponding equipment, and then conducting reflow soldering or baking on the welding point 7 on the ASIC integrated chip 2 and the welding point 7 on the MEMS sensor 3 by using solder paste or conductive silver adhesive 8.

(4) The shell 4 is assembled after the shell is coated at the corresponding position on the PCB substrate 1 and connected with the solder paste 9, the shell 4 is provided with the sound inlet hole 5, the shell 4 is fixed with the PCB substrate 1 after reflow soldering, so that the shell 4 completely wraps the MEMS sensor 3 and the ASIC integrated chip 2 to form a required cavity, and finally the functional requirement of converting product acoustics into electric signals is realized.

As shown in fig. 2, in the WB packaging process of the silicon microphone stack assembly in the prior art, an ASIC integrated chip 2 and an MEMS sensor 3 (the ASIC integrated chip 2 and the MEMS sensor 3 are arranged side by side on a PCB substrate 1) are respectively fixed on the PCB substrate 1 by a patch fixing glue 6, then a soldering point on the ASIC integrated chip 2 and the PCB substrate 1, and a soldering point on the MEMS sensor 3 and the ASIC integrated chip 2 are respectively connected and conducted by a gold wire 10 through a dedicated device (the gold wire 10 is used twice), then a housing 4 is assembled by coating tin on a corresponding position on the PCB substrate 1, and the housing 4 is fixed with the PCB substrate 1 after reflow soldering, so that the housing 4 completely wraps the MEMS sensor 3 and the ASIC integrated chip 2 to form a required cavity, and finally the functional requirement of converting product acoustics into electrical signals is achieved. Be equipped with into sound hole 5 on the shell 4, be in advance the gold thread 10 tie point on ASIC integrated chip 2 of sound hole 5 below need scribble COB and glue 11.

In view of the comparison, the silicon microphone stacked WB packaging process adopts the point-to-point type design packaging layout of the laminated welding points, reduces the space of a product design ornament and can realize the miniaturization of the product; and the encapsulation only needs to use gold wires and corresponding gold wire special equipment once, so that the production cost of the product can be reduced.

While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.