阅读说明：本技术 电子/电气设备部件屑的处理方法 (Method for processing electronic/electric equipment component scraps ) 是由 青木胜志 笹冈英俊 武田翼 于 2020-03-27 设计创作，主要内容包括：本发明提供一种能够提高从电子/电气设备部件屑中筛选出投入冶炼步骤的原料的效率,从而减少有价金属的损失的电子/电气设备部件屑的处理方法。一种电子/电气设备部件屑的处理方法,其特征在于,在使用具备金属传感器、彩色相机、气阀、输送机的金属分类机从包含金属物及非金属物的电子/电气设备部件屑中分离非金属物或金属物的分离步骤之前,将电子/电气设备部件屑所包含的粉状物去除。(The invention provides a method for treating scrap of electronic/electrical equipment parts, which can improve the efficiency of screening out raw materials which are put into a smelting step from the scrap of electronic/electrical equipment parts, thereby reducing the loss of valuable metals. A method for processing electronic/electric equipment component scraps, characterized in that before a separation step of separating non-metallic objects or metallic objects from electronic/electric equipment component scraps containing metallic objects and non-metallic objects by using a metal sorting machine provided with a metal sensor, a color camera, a gas valve, and a conveyor, powder contained in the electronic/electric equipment component scraps is removed.)

1. A method for processing electronic/electric equipment part scraps,

before a separation step of separating a non-metal object or a metal object from electronic/electrical equipment component dust containing a metal object and a non-metal object by using a metal sorting machine provided with a metal sensor, a color camera, a gas valve and a conveyor, powder contained in the electronic/electrical equipment component dust is removed.

2. The method of processing electronic/electric equipment parts scraps according to claim 1,

the particle size of the powder is less than 5 mm.

3. The method of processing electronic/electric equipment part dust according to claim 1 or 2,

the electronic/electrical equipment component dust after the step of removing the powder is 1 mass% or less of the electronic/electrical equipment component dust before the step of removing the powder contained in the electronic/electrical equipment component dust.

4. The method of processing electronic/electric equipment part dust according to any one of claims 1 to 3,

the treatment for removing the powder uses either of pneumatic screening and screening.

5. The method of processing electronic/electric equipment parts scraps according to claim 4,

and the wind power screening is carried out at a wind speed of 5-8 m/s.

6. The method of processing electronic/electric equipment parts scraps according to claim 4,

and screening the materials by using sieve holes of 2-5 mm.

7. The electronic/electric equipment parts scrap handling method according to any one of claims 1 to 6,

removing powder contained in the electronic/electric equipment component dust immediately after at least one of crushing, sieving, magnetic sieving, and color sieving.

Technical Field

The present invention relates to a method for processing electronic/electric equipment component dust, and more particularly, to a method for processing electronic/electric equipment component dust suitable for recycling processing of used electronic/electric equipment.

Background

In recent years, from the viewpoint of resource conservation, it has been increasingly prevalent to recover valuable metals from scrap of electronic/electrical equipment parts such as waste home appliances, PCs, and mobile phones, and methods for efficiently recovering such valuable metals have been studied and proposed.

For example, japanese patent laying-open No. 9-78151 (patent document 1) describes a method for recycling valuable metals, which includes the steps of: scrap containing valuable metals is charged into a flash smelting furnace for smelting copper ores, and the valuable metals are recovered to sulfur slag (mate) retained in the furnace. According to this recycling method, scrap treatment and a copper smelting step using a copper smelting flash smelting furnace can be combined, and therefore valuable metals can be recovered at low cost even from scrap having a low content of valuable metals.

However, in the treatment using the copper smelting flash smelting furnace as described in patent document 1, if the amount of the electronic/electric equipment component scrap to be treated increases, the carbon content contained in organic matter such as resin constituting the electronic/electric equipment component scrap increases, and there is a case where a trouble occurs due to excessive reduction in the smelting furnace. On the other hand, the amount of electronic/electrical equipment component scrap to be treated tends to increase in recent years, and therefore, it is desired to efficiently perform treatment by a copper melting flash melting furnace.

As one of methods for preventing the occurrence of a trouble due to excessive reduction in the copper smelting flash smelting furnace, there is proposed a method for reducing the capacity by pulverizing scrap electronic/electric equipment components before the scrap electronic/electric equipment components are processed in the copper smelting flash smelting furnace. For example, japanese patent application laid-open publication No. 2015-123418 (patent document 2) describes the following: the scrap of electronic/electric equipment parts containing copper is incinerated, then crushed to a predetermined size or less, and the crushed scrap of electronic/electric equipment parts is treated by a copper melting furnace.

However, if the amount of the smelting-inhibiting substance charged into the smelting step increases due to an increase in the amount of the electronic/electrical equipment component scrap to be processed, the amount of the electronic/electrical equipment component scrap to be charged may have to be limited.

Therefore, it is desirable that the raw material to be charged into the smelting step is reduced in the amount of smelting-inhibiting substances as much as possible and the content of valuable metals is high, but depending on the kind of electronic/electrical equipment component scrap, in the screening step for screening out the raw material to be charged into the smelting step, there is a case where the screening efficiency is lowered due to the inclusion of a substance that significantly reduces the screening ability of the screening machine used in the screening step, and the loss of valuable metals is increased.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 9-78151

Patent document 2: japanese patent laid-open publication No. 2015-123418

Disclosure of Invention

Problems to be solved by the invention

In view of the above problems, the present invention provides a method for treating scrap of electronic/electrical equipment components, which can improve the efficiency of screening out raw materials to be charged into a smelting step from scrap of electronic/electrical equipment components, thereby reducing the loss of valuable metals.

Means for solving the problems

The present inventors have intensively studied to solve the above problems and found that: it is effective to remove powder contained in electronic/electric equipment part dust before a step of separating a non-metal object or a metal object from the electronic/electric equipment part dust containing the metal object and the non-metal object by using a metal sorting machine including a metal sensor, a color camera, a gas valve, and a conveyor.

An aspect of the present invention made based on the above-described findings is a method for processing electronic/electrical equipment component scrap, including: before a separation step of separating a non-metal object or a metal object from electronic/electrical equipment component dust containing a metal object and a non-metal object by using a metal sorting machine provided with a metal sensor, a color camera, a gas valve and a conveyor, powder contained in the electronic/electrical equipment component dust is removed.

Effects of the invention

According to the present invention, there is obtained a method for treating electronic/electrical equipment component scrap, which can improve the efficiency of screening out raw materials to be charged into a smelting step from electronic/electrical equipment component scrap, thereby reducing the loss of valuable metals.

Drawings

Fig. 1 is a schematic view of a sorting machine for electronic/electric equipment part scrap processing method according to an embodiment of the present invention.

Fig. 2 is an explanatory view showing a state where no erroneous detection occurs when the metal sorting machine detects metal materials in the electronic/electric equipment parts scrap.

Fig. 3 is an explanatory view showing a case where a metal sorting machine detects metal materials in electronic/electric equipment parts scraps and a false detection may occur.

Detailed Description

In the present embodiment, the "electronic/electrical equipment component scrap" is scrap obtained by crushing waste electric appliances, electronic/electrical equipment such as PCs and mobile phones, and is scrap which is collected and crushed into an appropriate size. In the present embodiment, the scrap pieces for producing the electronic/electric equipment components may be crushed by the processor itself, but the crushed scrap pieces may be purchased on the market.

The crushing method is not limited to a specific device, and may be a shearing method or an impact method, but it is preferable to crush the material without damaging the shape of the material as much as possible. Therefore, a device belonging to the mill class for the purpose of grinding finer particles is not included.

Preferably, the electronic/electric device component chips are roughly crushed in advance, and are separated individually in the form of a substrate, a wire chip, a component such as an IC or a connector, a synthetic resin (plastic) used for a metal or a housing, or the like. This makes it easier to screen specific individual parts by the metal sorting machine 10 described below, and improves the screening efficiency.

The scrap of electric/electronic equipment parts put into the metal sorting machine 10 is preferably crushed to a maximum diameter of 100mm or less, more preferably 50mm or less, and the representative diameter is preferably about 4 to 70mm or about 4 to 50 mm. The "representative diameter" means an average value of 5 times in the case where an arbitrary 100 points are decimated from the electronic/electric component chips, an average value of major diameters of the decimated electronic/electric component chips is calculated, and this operation is repeated 5 times.

A metal sorting machine 10

Fig. 1 is a schematic diagram showing an example of a metal sorter according to an embodiment of the present invention. In the present embodiment, for example, the metal sorter 10 shown in fig. 1 can be used to sort the metal objects 1a from the metal objects₁、1a₂And separating the non-metal object 1b or the metal object 1a from the electronic/electric equipment part scraps 1 of the non-metal object 1b₁、1a₂. It should be noted that fig. 1 is merely an example, and the positions of the respective members, the positional relationship between the respective members, and the like are not limited to the example of fig. 1.

The metal sorter 10 includes a metal sensor 2, a color camera 3, an air valve 4, and a conveyor 5. A color camera illumination 8 for illuminating the photographing field of view of the color camera 3 is provided in the vicinity of the color camera 3. A near infrared sensor 6 for further improving detection efficiency may be further provided at a position facing the metal sensor 2 with the conveyor 5 interposed therebetween.

The metal sensor 2 of the metal sorting machine 10 detects the metal object 1a on the conveyor 5₁、1a₂. Thereafter, the conveyor 5 conveys and discharges the metal object 1a₁、1a₂And a non-metal object 1b which is disposed on the downstream side in the conveying direction of the metal sensor 2 and receives light from the color camera 3, the light being directed to the metal object 1a by the color camera illumination 8₁、1a₂And the light irradiated from the optical detection position of the color camera 3 on the falling track of the non-metal object 1b is irradiated to the metal object 1a₁、1a₂And light reflected by the nonmetal object 1 b. Thereafter, the absence of the metal object 1a recognized by the metal sensor 2 is immediately recognized₁、1a₂Zone (D) ofInformation of the domain and the presence of the metal object 1a detected by the color camera₁、1a₂And the position information of the non-metal object 1b, the position of the non-metal object 1b is determined by a determination means of the metal sorter 10, not shown. Then, based on the discrimination information of the non-metal object 1b, the air valve 4 disposed downstream of the optical detection position of the color camera 3 blows air to the non-metal object 1b to hit down the non-metal object 1b, thereby separating the non-metal object 1b and the metal object 1a₁、1a₂Are stored in different screening containers 7.

As the metal sensor 2, a general-purpose sensor for detecting a metal can be employed. For example, a sensor for detecting a metal by electromagnetic induction can be suitably used. Specifically, the metal sensor 2 including one or more electromagnetic induction coils (not shown) may be used, and the detection range of the metal sensor 2 may be changed by the size of the electromagnetic induction coil.

Fig. 2 is a schematic diagram showing a positional relationship between a detection range of the metal sensor 2 and the electronic/electric equipment chip 1. The detection range of the metal sensor 2 has a width equal to the width of the conveyor 5 (the vertical direction of the paper), and has a length L along the moving direction of the conveyor 5, that is, the conveying direction of the electronic/electric equipment parts chips 1.

Metal object 1a contained in electronic/electrical equipment part scrap 1₁、1a₂And non-metallic objects 1b, as shown in FIG. 2, in the screening of the metallic objects 1a₁With metal object 1a₁In the case where the non-metal object 1b is present therebetween, the non-metal object 1b is interposed between the metal objects 1a₁、1a₂The non-metal object 1b in between is not recognized as the non-metal object 1b and is not knocked down by the gas valve 4. The reason for this is that: in the metal objects 1a adjacent to each other₁With metal object 1a₂When the distance of (1 a) is too short, the metal object 1a₁With metal object 1a₂Is recognized as a metal object and is located on the metal object 1a₁With metal object 1a₂The non-metal object 1b in between is not recognized as the non-metal object 1 b.

In the present embodiment, it is preferable that the metal objects 1a adjacent to each other are provided₁With metal object 1a₂At least a certain distance d (shortest distance) is provided between them so that the metal sensor 2 can detect the metal object 1a in the electronic/electric equipment chip 1₁、1a₂Without misdetecting the metal objects 1a adjacent to each other₁With metal object 1a₂With a non-metal object 1b in between.

Specifically, it is preferable to adjust the metal object 1a as shown in fig. 2 in the following manner₁、1a₂That is, the metal object 1a in the electronic/electric equipment part dust 1 is detected by the metal sensor 2₁、1a₂At least in the metal object 1a₁And a metal object a₂Metallic object 1a with non-metallic object 1b interposed therebetween₁With metal object 1a₂Is greater than the length L of the detection range of the metal sensor. Thereby, the metal sensor 2 can detect the metal object 1a₁With metal object 1a₂Metal objects 1a recognized as individual₁、1a₂Therefore, the presence of the metal object 1a in the metal sensor 2 can be further improved by suppressing the erroneous detection₁、1a₂The efficiency of separation of the non-metallic substance 1 b. Further, the metal object 1a₁With metal object 1a₂In the case where the non-metal object 1b is not present, the non-metal object can be formed on the metal object 1a₁With metal object 1a₂A certain interval is arranged between the metal objects 1a, specifically, the metal objects 1a are increased by a certain interval which is larger than the length L of the detection range of the metal sensor₁、1a₂Screening efficiency with respect to the nonmetal substances 1 b.

On the other hand, the metal object 1a shown in FIG. 3₁With metal object 1a₂When the distance d between the metal sensors 2 is equal to or less than the length L of the detection range of the metal sensor 2, the metal sensor 2 detects the non-metal object 1b and the metal object 1a₁、1a₂Since the entire non-metal object 1b is not recognized as a foreign object, the non-metal object 1b may not be separated because the entire non-metal object M is recognized as one metal object.

The length L of the metal sensor 2 is not particularly limited depending on the device, but the electronic/electrical equipment part dust to be the object of the present invention is preferably 4mm to 200mm, more preferably 20mm to 60 mm. Since the air valve 4 continuously injects air while the non-metal material flows, the number of times of air injection is relatively small when the length L is the same as the size of the non-metal material in the electronic/electric component dust, but if the length L is too small, the number of times of air injection becomes very large, and there is a case where insufficient air is generated during operation, and therefore, in order to prevent the insufficient air, it is necessary to increase the capacity of the compressor. Therefore, the length L is preferably selected according to the size of the non-metal material in the electronic/electric component dust.

To make the metal object 1a₁、1a₂And the non-metal object 1b are separated to such an extent that the misdetection of the metal sensor 2 can be suppressed, and it is preferable that the metal object 1a is caused to move by the conveyor 5 by applying vibration or the like to the conveyor 5₁、1a₂And the nonmetal 1b are dispersed in advance.

The feeding speed of the conveyor 5 is fixed at 3m/s, but may be variable. For example, the amount of the solvent can be varied from 1 to 5 m/s.

Furthermore, even if the metal sensor 2 can accurately detect the metal object 1a₁、1a₂Further, the position information of the non-metal object 1b can be accurately recognized by the color camera 3, and even when the opening/closing speed of the air valve 4 is not appropriately adjusted, it is difficult to drop the non-metal object 1b to an appropriate position.

In the present embodiment, the opening/closing speed of the air valve 4 is preferably 0.5 to 4 ms/time, and more preferably 2 to 4 ms/time.

According to the method of processing electronic/electric equipment part scrap 1 of the embodiment of the present invention, the metal sorter 10 can efficiently sort out the metal objects 1a including the substrate treated as the valuable metal containing a large amount of metal components such as wiring and lead on the surface or inside thereof₁、1a₂And a non-metal object 1b including a resin-treated substrate containing no or a trace amount of metal on the surface or inside thereof.

Because the metal object 1a is screened₁、1a₂The substrate containing valuable metals such as copper and noble metals is concentrated, and thusCan be prepared by including the metal object 1a in the smelting step₁、1a₂The screening material of (2) is treated as a treatment object to improve the recovery efficiency of valuable metals. On the other hand, since the separated non-metallic substance 1b includes a substrate treated as a resin containing Sb as a smelting-inhibiting substance, it is possible to suppress the mixing of a substance that inhibits the treatment in the smelting step into the smelting step, and the treatment efficiency in the smelting step is also improved.

(wind screening)

By continuously performing the treatment using the metal sorter 10, the substrate containing a large amount of valuable metals can be concentrated from the electronic/electric equipment component scrap with good mechanical efficiency, and the valuable metal recovery efficiency can be improved while suppressing the inclusion of smelting-inhibiting substances as compared with the conventional physical screening step.

However, since a large amount of electronic/electric equipment scrap 1 is continuously processed, the powder contained in the electronic/electric equipment scrap 1 flies in the metal sorting machine 10 and adheres to peripheral equipment such as the color camera 3, the gas valve 4, the near infrared sensor 6, and the color camera lighting 8, and there is a problem that the metal sorting machine malfunctions (misdetection), or the metal sorting machine 10 malfunctions.

Therefore, in the present embodiment, the metal sorter 10 is used to sort the metal-containing object 1a₁、1a₂And non-metallic object 1a from electronic/electric equipment part scrap 1 of non-metallic object 1b₁、1a₂Or the step of separating the metal objects 1b, a treatment for removing the powder is performed. This can reduce the ratio of the powder in the electrical/electronic equipment component dust 1 supplied into the metal sorting machine 10, suppress a drop in the recognition accuracy and screening accuracy of the metal sorting machine 10, and suppress erroneous recognition of the color camera 3 due to the flying of the powder, thereby improving the screening efficiency of the metal sorting machine 10.

As a result of continuously operating the metal sorter 10, it was found that one of the reasons for the degradation of the recognition accuracy and the screening accuracy of the metal sorter 10 is: powder having a particle size of 5mm or less enters the metal classifier 10. Preferably, in this embodiment, the powder having a particle size of 3mm or less is removed to the light weight side by the air classifying treatment, and in another embodiment, the powder having a particle size of 2mm or less is removed to the light weight side. The "particle size" of the powder is the median particle diameter of the powder measured by a commercially available laser diffraction particle size distribution measuring apparatus.

It is desirable that the electronic/electrical equipment component dust after the step contains 1 mass% or less of the powder with respect to the entire amount of the electronic/electrical equipment component dust before the step of removing the powder contained in the electronic/electrical equipment component dust.

As a specific removal method for removing the powdery material, it is effective to perform pneumatic screening or sieving screening. In the wind power screening, the powder is screened out as a light weight material, but if the wind speed is too high, other parts such as aluminum pieces are also separated into a light weight material, and therefore, if it is desired to selectively and efficiently separate only the powder, the wind speed is not preferably too high. Therefore, in order to more efficiently convey the powder contained in the electronic/electric device part dust to the light-weight side by the wind power sifting, the treatment is preferably performed at a wind speed of 5.0 to 8.0m/s, more preferably at a wind speed of 6.0 to 7.0m/s as the treatment condition of the wind power sifting.

In the case where a substance other than the powdery substance is to be further screened by the air-force screening, the air-force screening may be performed in at least two stages. For example, a first air-force sifting process of separating powder that affects a failure of the metal sorting machine 10 in advance and a second air-force sifting process of concentrating the substrate supplied to the metal sorting machine 10 and separating a metal containing Fe, Al, or the like may be combined. The second wind screening process for separating the precious metal-containing materials such as the substrate and IC and the metals including Fe, Al and the like from the electronic/electric equipment part scrap 1 is preferably performed at a wind speed of 10 to 18m/s, and more preferably 15 to 18 m/s. In order to increase the concentration of the capacitor and the metal fraction, it is preferable to set the optimum wind speed to 5 to 15m/s, and further 8 to 12 m/s.

In the sieve screening, when the mesh size is 2mm or more, the powder can be separated to the lower side of the sieve. If the sieve opening is too large, adjustment is possible, but there are cases where other part dust is also separated under the sieve, so if it is desired to separate only the powdery material, it is not preferable that the sieve opening is too large. Therefore, the mesh size is preferably 2mm to 5 mm. In addition, when the linear chips are to be removed by screening, it is preferable to use a slit-shaped screen hole, but the powdery materials may be removed together in this step.

The pneumatic screening process or the sieving process for removing the powdery material may be performed immediately before the process using the metal sorting machine 10, but may be performed in combination with any of the screening stages before it. For example, the electronic/electric equipment component scrap 1 immediately after at least one of the crushing process, the sieving process, the magnetic force screening process, and the color screening process performed before the process by the metal sorter 10 may be subjected to the pneumatic screening, and then the separation step using the metal sorter 10 may be performed.

Alternatively, the present embodiment may include a step of performing a pneumatic sifting process or a sifting process to remove powder at any stage of the raw material to be processed, which is obtained by roughly crushing the waste household electrical appliances, PC, mobile phones, and other electronic/electrical devices, which are raw materials of the electronic/electrical device parts scrap 1.

(modification example)

The electronic/electrical equipment component scrap 1 can be further processed to improve the metal content 1a in the electronic/electrical equipment component scrap 1 by performing a predetermined pretreatment before the treatment by the metal sorter 10 of the present embodiment₁、1a₂Screening efficiency with respect to the nonmetal substances 1 b.

For example, the metal sensor 2 can be used to detect the metal object 1a in the electronic/electric equipment part chip 1₁、1a₂Before, the metal object 1a contained in the electronic/electric equipment part scrap 1 is treated₁And the number ratio of 1a2 to nonmetal 1b (metal/nonmetal) is adjusted to 2.0 or less, further 1.6 or less, and further 1.3 or less, thereby increasing the metal 1a₁、1a₂Screening efficiency with respect to the nonmetal substances 1 b. TheThe adjustment can be efficiently performed by, for example, screening the substrate scrap among the electronic/electrical equipment component scrap using a color screening machine having at least two camera units capable of recognizing the colors of both the front and back surfaces of the object to be processed.

As described above, the present invention is not limited to the present embodiment, and the constituent elements may be modified and embodied without departing from the scope of the invention. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the present embodiment. For example, some of the components may be deleted from all the components shown in the present embodiment or the components may be combined as appropriate.

Description of the reference numerals

1 electronic/electric equipment parts scrap

1b non-metallic objects

1a₁、1a₂Metal object

2 Metal sensor

3 color camera

4 air valve

5 conveyor

6 near infrared ray sensor

7 screening container

8 color camera illumination

10 metal sorting machine.