阅读说明：本技术 一种电子产品后壳的制作方法 (Manufacturing method of electronic product rear shell ) 是由 曹祖铭 于 2021-07-23 设计创作，主要内容包括：本发明属于电子产品后壳加工技术领域,具体涉及一种电子产品后壳的制作方法,包括以下步骤：(1)、制作膜片,选取一张离型基材,在离型基材上依次制作纹理层、电镀层、遮盖层及粘接层,得到贴合膜片；(2)、制作贴合板材,选用玻纤、碳纤、凯夫拉纤维中的任一种或几种材料制作热塑板材或热固板材；(3)、贴合,将步骤(1)得到的贴合膜片贴合到热塑板材或热固板材上,得到成品后壳；采用上述工艺制作的外壳,有利于节约材料成本,而且,成品更轻薄；后壳成品表面内无相应应力,无变形反弹风险；同现有常用的注塑壳料相比,具有刚性强、耐摔以及防火抗阻燃的效果；而且,贴合板材内可放置一些功能元件,有利于实现产品的轻薄化。(The invention belongs to the technical field of electronic product rear shell processing, and particularly relates to a manufacturing method of an electronic product rear shell, which comprises the following steps: (1) manufacturing a membrane, namely selecting a release substrate, and sequentially manufacturing a texture layer, an electroplated layer, a covering layer and an adhesive layer on the release substrate to obtain a laminated membrane; (2) manufacturing a laminated plate, namely manufacturing a thermoplastic plate or a thermosetting plate by selecting any one or more materials of glass fiber, carbon fiber and Kevlar fiber; (3) laminating, namely laminating the laminated membrane obtained in the step (1) on a thermoplastic plate or a thermosetting plate to obtain a finished rear shell; the shell manufactured by the process is beneficial to saving material cost, and the finished product is lighter and thinner; the surface of the rear shell finished product has no corresponding stress and no deformation rebound risk; compared with the existing common injection molding shell material, the material has the effects of strong rigidity, drop resistance, fire resistance and flame retardance; moreover, functional elements can be placed in the laminated plate, so that the light and thin product is realized.)

1. A manufacturing method of a rear shell of an electronic product is characterized by comprising the following steps:

(1) manufacturing a membrane, namely selecting a release substrate, and sequentially manufacturing a texture layer, an electroplated layer, a covering layer and an adhesive layer on one surface of the release substrate to obtain a laminated membrane;

(2) the method comprises the following steps of manufacturing a laminated plate, soaking any one or more materials of glass fiber, carbon fiber and Kevlar fiber in epoxy resin, and heating and curing or semi-curing the soaked material by using a press bearing machine to obtain a thermoplastic plate or a thermosetting plate;

(3) bonding, bonding the bonded membrane obtained in the step (1) to the thermoplastic sheet obtained in the step (2) through a bonding layer, tearing off the release substrate, softening the thermoplastic sheet through a heating system of hot pressing or high-pressure equipment, and performing shape profiling processing on the thermoplastic sheet through an outline mold with the shape consistent with that of the shell of the electronic product to obtain a finished rear shell; or, profiling the thermosetting plate by using hot pressing equipment and a profiling mold to form the shape of the rear shell of the electronic product, then laminating the membrane obtained in the step (1) with the profiled thermosetting plate by using a vacuum high-pressure laminating machine, and tearing off the release substrate on the surface after lamination to obtain the finished rear shell.

2. The method for manufacturing the rear shell of the electronic product according to claim 1, further comprising the step (1a) before the step (1): and manufacturing a semi-transparent color layer on the surface of the release substrate, wherein the texture layer is manufactured on the surface of the semi-transparent color layer.

3. The method of claim 2, wherein the release substrate is a substrate having no adhesion to the semi-permeable color layer or the texture layer, or a release layer is coated on a surface of a common substrate, and then the semi-permeable color layer or the texture layer is formed on the release layer.

4. The method for manufacturing a rear case of an electronic product according to claim 2, wherein the semi-permeable color layer is manufactured on the release substrate by any one of spraying, offset printing, gravure printing, letterpress printing, digital printing, dip dyeing and coating processes; it is made of any one of polyester, polyurethane and acrylate.

5. The method as claimed in claim 2, wherein the texture layer is formed by UV transfer printing or embossing, and is made of acrylate or polyurethane.

6. The method of claim 5, wherein the plating layer is formed by performing a vacuum deposition process on the textured layer by PVD.

7. The method for manufacturing the rear shell of the electronic product as claimed in claim 6, wherein the covering layer is manufactured on the surface of the electroplated layer by any one of silk-screen printing and spraying processes.

8. The method for manufacturing the rear shell of the electronic product according to claim 1, further comprising the step (4) of manufacturing a surface functional layer for preventing fingerprints and improving wear resistance on the back surface of the texture layer by adopting a spraying or curtain coating process; the spraying liquid or the curtain coating liquid is made of fluorine-silicon materials.

9. The method for manufacturing the rear shell of the electronic product according to claim 8, wherein after spraying or curtain coating, the surface functional layer is formed by curing in a heating baking mode or a UV curing mode; heating and baking time: 3-5 minutes, baking temperature: 60-90 ℃; UV curing mode: using a UV lamp: energy: 2000-4000mj/CM²And curing time: 2-5 seconds.

10. The method for manufacturing the rear shell of the electronic product according to claim 4, further comprising the step (4)', wherein the surface functional layer for preventing fingerprints and improving the wear resistance is manufactured on the back surface of the semi-permeable color layer by adopting a spraying or curtain coating process; the spraying liquid or the curtain coating liquid is made of fluorine-silicon materials.

11. The method for manufacturing a rear case of an electronic product according to claim 10, wherein after the spraying or curtain coating, the surface functional layer is formed by curing in a heating baking manner or a UV curing manner; heating and baking time: 3-5 minutes, baking temperature: 60-90 ℃; UV curing mode: using a UV lamp: energy: 2000-4000mj/CM²And curing time: 2-5 seconds.

12. The method for manufacturing the rear shell of the electronic product as claimed in claim 2, wherein in the step (2), the soaked material is heated and cured by a pressing machine to obtain the thermoplastic plate, and the heating temperature is determined according to the material characteristics to completely cure the material.

13. The method for manufacturing the rear shell of the electronic product according to claim 12, wherein in the step (2), the soaked material is subjected to low-temperature semi-curing treatment by using a press machine to obtain the thermosetting plate.

14. The method of claim 9 or 11, further comprising a cutting step of removing an excess portion of the surface functional layer by an engraving machine to obtain a finished rear shell.

15. The method of claim 3, wherein the release substrate has a texture on a surface thereof.

Technical Field

The invention relates to the technical field of electronic product rear shell processing, in particular to a method for manufacturing an electronic product rear shell by adopting a bonding process.

Background

The backshell is one of indispensable parts of electronic product, extensively is used for electronic product such as cell-phone, panel computer, game machine on, and its bearing structure adopts plastics to make usually, for example the plastics shell that common injection molding process made, then makes the diaphragm that realizes different functions on the plastics shell, this diaphragm includes substrate layer, texture layer, electroplated layer, offset printing layer and cover layer etc. for realize different functions, the product backshell that adopts this kind of technology to make exists following shortcoming: poor rigidity and falling resistance; the fireproof and flame-retardant performance is poor; the material layer that realizes various functions is made on the substrate layer, consequently has the internal stress in the diaphragm, and there is the deformation bounce-back risk after diaphragm and the combination of plastic casing.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention aims to provide a manufacturing method of a rear shell of an electronic product, which aims to solve the problems of poor rigidity and poor fireproof and flame-retardant performances of the conventional rear shell.

In order to achieve the purpose, the invention adopts the technical scheme that: a manufacturing method of a rear shell of an electronic product is characterized by comprising the following steps:

(1) manufacturing a membrane, namely selecting a release substrate, and sequentially manufacturing a texture layer, an electroplated layer, a covering layer and an adhesive layer on one surface of the release substrate to obtain a laminated membrane;

(2) the method comprises the following steps of manufacturing a laminated plate, soaking any one or more materials of glass fiber, carbon fiber and Kevlar fiber in epoxy resin, and heating and curing or semi-curing the soaked material by using a press bearing machine to obtain a thermoplastic plate or a thermosetting plate;

(3) bonding, bonding the bonded membrane obtained in the step (1) to the thermoplastic sheet obtained in the step (2) through a bonding layer, tearing off the release substrate, softening the thermoplastic sheet through a heating system of hot pressing or high-pressure equipment, and performing shape profiling processing on the thermoplastic sheet through an outline mold with the shape consistent with that of the shell of the electronic product to obtain a finished rear shell; or, profiling the thermosetting plate by using hot pressing equipment and a profiling mold to form the shape of the rear shell of the electronic product, then laminating the membrane obtained in the step (1) with the profiled thermosetting plate by using a vacuum high-pressure laminating machine, and tearing off the release substrate on the surface after lamination to obtain the finished rear shell.

Preferably, before the step (1), the method further comprises the step (1 a): and manufacturing a semi-transparent color layer on the surface of the release substrate, wherein the texture layer is manufactured on the surface of the semi-transparent color layer.

Preferably, the release substrate is a substrate without adhesive force with the semi-permeable color layer or the texture layer, or the release layer is coated on the surface of a common substrate, and then the semi-permeable color layer or the texture layer is manufactured on the release layer.

Preferably, the semi-permeable color layer is manufactured on the release substrate by adopting any one of spraying, offset printing, intaglio printing, relief printing, digital printing, dip dyeing and coating processes; it is made of any one of polyester, polyurethane and acrylate.

Preferably, the texture layer is manufactured by a UV transfer printing process or an embossing process, and is made of acrylic ester or polyurethane.

Preferably, the plating layer is obtained by performing a vacuum plating process on the texture layer by PVD.

Preferably, the covering layer is manufactured on the surface of the electroplated layer through any one of silk-screen printing and spraying processes.

Preferably, the method further comprises the step (4) of manufacturing a surface functional layer for preventing fingerprints and improving the wear resistance on the back surface of the texture layer by adopting a spraying or curtain coating process; the spraying liquid or the curtain coating liquid is made of fluorine-silicon materials.

Preferably, after spraying or curtain coating, the surface functional layer is formed by curing in a heating baking mode or a UV curing mode; heating and baking time: 3-5 minutes, baking temperature: 60-90 ℃; UV curing mode: using a UV lamp: energy: 2000-4000mj/CM²And curing time: 2-5 seconds.

The method also comprises a step (4)', wherein a surface functional layer for preventing fingerprints and improving the wear resistance is manufactured on the back surface of the semi-permeable color layer by adopting a spraying or curtain coating process; the spraying liquid or the curtain coating liquid is made of fluorine-silicon materials.

Preferably, after spraying or curtain coating, baking by heatingCuring in a formula or UV curing mode to form a surface functional layer; heating and baking time: 3-5 minutes, baking temperature: 60-90 ℃; UV curing mode: using a UV lamp: energy: 2000-4000mj/CM²And curing time: 2-5 seconds.

Preferably, in the step (2), the soaked material is heated and cured by a pressing machine to obtain a thermoplastic plate, and the heating temperature is determined according to the material characteristics to completely cure the material.

Preferably, in the step (2), a press is adopted to perform low-temperature semi-curing treatment on the soaked material to obtain the thermosetting plate.

Preferably, the method further comprises a cutting process, and redundant parts of the surface functional layer are removed through an engraving machine, so that a finished rear shell is obtained.

Preferably, the release substrate has a texture on a surface thereof.

The beneficial technical effects are as follows: the diaphragm adopted by the rear shell finished product only comprises a texture layer, an electroplated layer, a covering layer and an adhesive layer, wherein the adhesive layer is mainly used for bonding, a base material layer contained in the diaphragm adopted by the conventional rear shell is not contained, and a release substrate is directly torn off and discarded; meanwhile, the surface of the membrane has no base material layer, so that the surface of a finished product of the rear shell has no corresponding stress and no deformation rebound risk; the shell is made of any one or more of glass fiber, carbon fiber and Kevlar fiber, and compared with the existing common injection molding shell material, the shell has the effects of strong rigidity, drop resistance, fire resistance and flame retardance; moreover, the laminated board made of the glass fiber material has enough strength, can be machined on the laminated board to accommodate cavities, is used for placing some functional elements generally arranged on a circuit board in a product, and is beneficial to realizing the lightness and thinness of the product.

Drawings

FIG. 1 is a view showing a structure of a material layer of example 1 of the present invention;

FIG. 2 is a view showing the structure of a material layer in example 3 of the present invention;

FIG. 3 is a view showing the structure of a material layer in example 4 of the present invention;

FIG. 4 is a schematic diagram of a texture forming process in embodiment 1 of the present invention;

FIG. 5 is a schematic view of a bonding step in example 1 of the present invention;

fig. 6 is a structure diagram of a material layer of example 5 of the present invention.

Detailed Description

In order that those skilled in the art will better understand the technical solution of the present invention, the following detailed description of the present invention is provided in conjunction with the accompanying drawings and embodiments.

Example 1

The embodiment of the invention provides a method for manufacturing a rear shell of an electronic product, which comprises the following steps:

(1) manufacturing a membrane, namely selecting a release substrate, and sequentially manufacturing a texture layer, an electroplated layer, a covering layer and an adhesive layer on one surface of the release substrate to obtain a laminated membrane;

(2) the method comprises the following steps of manufacturing a laminated plate, soaking any one or more of glass fiber, carbon fiber and Kevlar fiber in epoxy resin, and heating and curing the soaked material by using a bearing press to obtain a thermoplastic plate; here, the material selection principle is: select any kind of material preparation laminating panel, for example select glass fibre or carbon fibre or Kevlar fibre preparation laminating panel, but to the electronic product that has the communication demand, for example the electronic product that sets up the antenna in it, then can not choose the carbon fibre alone for use as raw and other materials, to the backshell of this kind of electronic product, can select glass fibre and carbon fibre to mix the preparation backshell, use glass fibre with the position that the antenna corresponds on the backshell promptly, other positions use the carbon fibre, compromise the rigidity and the communication effect of backshell simultaneously.

(3) And (3) attaching, namely attaching the attached membrane obtained in the step (1) to the thermoplastic plate obtained in the step (2) through an adhesive layer, tearing off the release substrate, softening the thermoplastic plate through a heating system of hot pressing or high-pressure equipment, and performing shape profiling on the thermoplastic plate through an outline mold in the same shape as the electronic product shell to obtain a finished rear shell.

Wherein:

in the step (1), a commercially available release substrate is selected, and the release substrate has no adhesive force with other material layers so as to be torn off as required; the texture layer is manufactured on the surface of the release substrate, different processes are respectively adopted for the shapes of different substrates, and the specific process is as follows:

A. the manufacturing method of the UV transfer printing texture of the sheet substrate comprises the following steps: pouring UV glue on the texture mold, uniformly coating a layer of UV glue on the whole UV texture by using a roller press, placing a release substrate, exposing by using a mercury lamp, a metal halogen lamp or an LED (main spectrum is 350nm-450nm), exposing for 3-5 seconds, tearing off the release substrate after the UV glue is cured, and transferring the UV glue texture onto the release substrate. The texturing layer is used for optical texturing effects.

In the present embodiment, the texture rendering material: acrylate (UV glue), curing energy: 1000mj/CM²-3500mj/CM²。

B. The manufacturing method of the UV transfer printing texture of the coil stock substrate comprises the following steps: use the coating machine evenly to scribble UV glue to from type substrate, reuse the cylinder that has the texture and coat the complete sealing of glue and combine together, concrete process is: after the release substrate 10 passes through the glue tank 11, a layer of glue is coated on the surface of the release substrate, the release substrate is moved to a laminating main roller 12 (namely, a roller with textures), the laminating main roller 12 is sealed with the glue of the release substrate at the position, as shown in fig. 4, the release substrate is directly exposed by a mercury lamp, a metal halogen lamp or an LED lamp 13 (the main spectrum is 350nm-450nm), the exposure is carried out for 1-3 seconds, after the UV glue is cured, the release substrate is separated from the texture roller, finally, the UV textures are obtained on the surface of the roll release substrate, and then, the material is coated and rolled for standby.

C. The method for manufacturing the texture on the coil base material by the embossing process comprises the following steps: uniformly coating polyurethane glue on a release substrate by using a coating machine, baking for 3-5 minutes at the temperature of 60-80 ℃ by using a baking oven, forming a polyurethane glue film on the release substrate, completely sealing and combining a roller with grains and a film formed by coating the glue, directly pressing the glue film with the grains as shown in figure 4, separating the release substrate from the grain roller, and finally, laminating and rolling the material for later use after obtaining the UV grains on the coil material substrate.

The processing mode of the electroplated layer:

A. PVD electron beam evaporation: placing the release substrate with the texture layer into a coating device, and pumping the air in the coating device to 2.0-5.0x10^-3And pa, directly heating the evaporation material by using an electron beam in vacuum, so that the evaporation material is gasified and transported to the texture layer of the release substrate, and is condensed on the texture layer to form the color thin film layer. Depending on the product color and performance requirements, multiple layers of electroplated materials may be used in addition.

B. PVD plasma sputtering: placing the release substrate with the texture layer into a coating device, and pumping the air in the coating device to 2.0-5.0x10^-3And pa, bombarding the surface of the target material by using ions under vacuum, generating gas ionization by using gas discharge, bombarding a cathode target body by using positive ions at a high speed under the action of an electric field, knocking out atoms or molecules of the cathode target body, flying to the surface area of the texture of the release substrate to form a color thin film layer, and overlapping a plurality of layers of electroplating materials according to the color and performance requirements of a product.

The electroplated layer is used for texture protection and bottom color realization, and adopts ZRO₂、NB₂O₅、IN₂0₃、Sio₂、Tio₂And any one of ITO and the like is used as a plating material.

The processing mode of the covering layer is as follows:

A. and (3) silk-screen printing: and pouring the shading ink into the screen printing plate by using a screen printing machine, using a scraper to drain the ink through the screen printing plate to remove the surface of the electroplating layer of the release substrate, and curing the ink by heating and baking or uv curing to form a covering layer.

Baking conditions: baking time: 30-90 minutes, baking temperature: 60-90 ℃, printing times: 2-5 times.

uv cure mode: using uv lamps: energy: 800-²And curing time: 2-5 seconds.

B. Spraying: and directly spraying paint on the surface of the electroplated layer of the release substrate by using a spray gun, and curing the ink by heating and baking or uv curing to form a covering layer.

Baking conditions: baking time: 30-90 minutes, baking temperature: 60-90 ℃, spraying times: 1-3 times.

uv cure mode: using uv lamps: energy: 800-²And curing time: 2-5 seconds.

C. Offset printing: a. and (3) carrying out dot exposure on the PS plate by using a CTP plate making machine according to the requirements of a customer figure file to obtain dots to be printed. b. And (4) debugging the ink according to the color required by the customer. c. And (3) loading the exposed PS plate on an offset printing machine, transferring the ink onto the PS plate → transferring the ink onto the rubber plate → transferring the ink onto an electroplated layer of the release substrate, and curing by uv irradiation to realize the covering layer. Curing conditions of each procedure are as follows: 800-²。

D. Transfer printing: and (3) placing the printing ink into an ink groove by using a pad printing machine, adhering the printing ink onto the silica gel head by using the silica gel head, transferring the printing ink onto an electroplated layer of the release substrate, and curing the printing ink by heating and baking or uv curing to form a covering layer.

Baking conditions: baking time: 30-90 minutes, baking temperature: 60-90 ℃.

uv cure mode: using uv lamps: energy: 800-²And curing time: 2-5 seconds.

E. Dip dyeing: tearing off the protection film on one side of the electroplated layer of the release substrate and putting the electroplated layer into a dip-dyeing tank, enabling the dye to gradually dye the surface of the electroplated layer of the release substrate through dye bath circulation or movement of a dyed object, and taking out the electroplated layer to form a covering layer by curing the dye in a heating and baking mode.

Baking conditions: baking time: 30-90 minutes, baking temperature: dip dyeing times are as follows at 60-90 ℃: 1-3 times.

F. Coating: according to the viscosity of different coatings, the covering coating can be uniformly coated on the surface of the electroplating layer of the release substrate in the modes of a line bar, an anilox roller, a comma scraper, a slit head and the like, and the coating is cured by heating baking or uv curing to form the covering layer.

Baking conditions: baking time: 3-5 minutes, baking temperature: 60-90 ℃.

uv curing mode: using uv lamps: energy: 800-²And curing time: 2-5 seconds.

G. And (3) transfer of covering materials: and transferring the covering layer on the covering material to the surface of the electroplating layer of the release substrate by using transfer glue to form the covering layer.

Transfer mode curing, using uv lamp, energy: 800-²And curing time: 2-5 seconds.

The covering layer is used for shading light and is made of polyester or epoxy resin.

Adhesive layer processing mode

A. The OCA glue is adhered: the coated OCA material was purchased directly and the OCA glue was applied to the masking layer using a flat bed laminator to form an adhesive layer.

B. Coating pressure-sensitive adhesive, heat-sensitive adhesive and hot melt adhesive: according to the viscosity of different bonding glues, the bonding glue can be uniformly coated on the covering layer in the modes of a line bar, a reticulate pattern roller, a comma scraper, a slit head and the like, and the printing ink is cured by heating, baking and curing to form the bonding layer.

Baking conditions: baking time: 3-5 minutes, baking temperature: 60-90 ℃.

In the step (2), the laminated plate is manufactured by selecting glass fiber or carbon fiber or Kevlar fiber or any two or three of the glass fiber, the carbon fiber and the Kevlar fiber, wherein the raw materials of the three materials are fibrous, weaving the three materials into a plate body in a warp and weft crossing mode, changing the variability of the plate body, soaking the plate body in epoxy resin, and finally heating and curing the soaked plate body through a pressure bearing machine to obtain the thermoplastic plate.

In the step (3), the laminating mold is used, the thermoplastic plate is placed into the lower mold 8, the membrane A is placed in the upper mold 9 above the thermoplastic plate (the membrane is not in contact with the thermoplastic plate) → air above and below the membrane in the upper mold and the lower mold is pumped to-101 kpa, namely in a vacuum state → a heating plate or hot water is used for softening the laminated membrane → then air is injected above the membrane in the upper mold 9 (or a silica gel sheet blowing ball mode is used) so that the membrane is perfectly laminated on the thermoplastic plate; here, in the laminating process, according to the characteristics of the laminating glue, the product is heated and pressurized after being laminated to improve the viscosity of the glue; as shown in fig. 5.

The release substrate of this embodiment can also be replaced by a common material, but in order to prevent adhesion between the release substrate and other materials and prevent the release substrate from being torn off, a layer of release layer material needs to be coated on the surface of the release substrate, and then the release substrate is processed on the release layer formed after the release layer material is cured.

The material layer structure diagram of the rear shell product obtained in this embodiment is shown in fig. 1, and includes a plate layer 1, and an adhesive layer 2, a masking layer 3, an electroplated layer 4, and a texture layer 5 disposed on the outer surface of the plate layer 1.

Example 2

The embodiment of the invention provides a method for manufacturing a rear shell of an electronic product, which comprises the following steps:

step (1) was the same as in example 1;

(2) the method comprises the following steps of manufacturing a laminated plate, soaking any one or more materials of glass fiber, carbon fiber and Kevlar fiber in epoxy resin, and heating and semi-curing the soaked material by using a press bearing machine to obtain a thermosetting plate;

(3) and (3) laminating, namely performing profiling processing on the thermosetting plate by using hot-pressing equipment and a profiling mold to form the shape of the rear shell of the electronic product, laminating the membrane obtained in the step (1) and the profiled thermosetting plate by using a vacuum high-pressure laminating machine, and tearing off the release substrate on the surface after laminating to obtain the rear shell of the finished product.

Example 3

The embodiment of the invention provides a method for manufacturing a rear shell of an electronic product, which comprises the following steps:

step (1 a): manufacturing a membrane, namely selecting a release substrate, and manufacturing a semi-permeable color layer on the surface of the release substrate;

step (1): sequentially manufacturing a texture layer, an electroplated layer, a covering layer and an adhesive layer on the surface of the semi-permeable color layer to obtain a laminated membrane;

the steps (2) and (3) are the same as in example 1; and finally obtaining a finished rear shell.

Wherein, the processing mode of the semi-permeable color layer is as follows:

A. and (3) silk-screen printing: and pouring shading ink into the screen printing plate by using a screen printing machine, using a scraper to drain the ink down the surface of the electroplated layer through the screen printing plate, and curing the ink by heating and baking or uv curing to form a semi-transparent color layer.

Baking conditions: baking time: 30-90 minutes, baking temperature: 60-70 ℃, printing times: 2 times.

uv cure mode: using uv lamp, energy: 800-²And curing time: 2-5 seconds.

B. Spraying: and directly spraying the paint on the surface of the electroplated layer by using a spray gun, and curing the ink by heating and baking or uv curing to form the semi-transparent color layer.

Baking conditions: baking time: 30-90 minutes, baking temperature: 60-70 ℃, spraying times: 1 time.

uv cure mode: using uv lamps: energy: 800-²And curing time: 2-5 seconds.

C. Offset printing: a. using a CTP plate making machine to expose the dots of the PS plate according to the requirements of a customer figure file to obtain the dots to be printed; b. debugging the printing ink according to the color required by a customer; c. and (3) loading the exposed PS plate on an offset printing machine, transferring the printing ink onto the PS plate, transferring the printing ink onto the rubber plate, transferring the printing ink onto an electroplated layer, and curing by uv irradiation to realize the semi-transparent color layer.

Curing conditions of each procedure are as follows: 1000-3000mj/cm²

D. Intaglio printing: a. manufacturing a gravure plate by carving, corroding and electronically carving according to the requirement of the pattern; b. coating ink on the whole surface of the gravure, then using a doctor blade to remove the ink in the blank part to ensure that the ink only remains in the groove part, then using uv irradiation or heating baking to cure the ink on the electroplated layer transferred by the ink under the action of larger pressure to form a semi-transparent pattern color layer.

Baking conditions and baking time: 3-5 minutes, baking temperature: 60-70 ℃.

uv cure mode, uv lamp: energy: 1000-3000mj/CM²Curing time: 2-5 seconds.

E. Relief printing: a. manufacturing relief printing plates on a wood plate and a rubber plate by using a photosensitive polymer according to the pattern requirement; b. the ink supply device of the printing machine firstly distributes the ink evenly, and then transfers the ink to the printing plate through the ink roller, and the ink on the ink roller can only be transferred to the image-text part of the printing plate and the non-image-text part is free of the ink because the pattern part on the relief printing plate is higher than the non-image-text part on the printing; and then, the pattern is transferred onto the electroplating plate all the time through the printing plate, and the semi-transparent pattern color layer is realized through heating baking or uv irradiation for curing.

Baking conditions: baking time: 3-5 minutes, baking temperature: 60-70 ℃.

uv cure mode: using uv lamps: energy: 1000-3000mj/CM²And curing time: 2-5 seconds.

F. Dip dyeing: and (3) putting the base material into a dip dyeing tank, gradually dyeing the dye onto the electroplated layer through dye bath circulation or movement of a dyed object, taking out, and curing the dye by using a heating and baking mode to form a semi-transparent pattern color layer.

Baking conditions: baking time: 30-90 minutes, baking temperature: 60-70 ℃.

G. Coating: according to the viscosity of different printing inks, the semi-permeable coating can be uniformly coated on the electroplated layer in the modes of a line bar anilox roller, a comma scraper, a slit head and the like, and the printing inks are cured by heating baking or uv curing to form a semi-permeable pattern color layer.

Baking conditions: baking time: 3-5 minutes, baking temperature: 60-70 ℃.

uv cure mode: using uv lamps: energy: 1000-3000mj/CM²And curing time: 2-5 seconds.

The material layer structure of the present embodiment is shown in fig. 2, and includes a sheet material layer 1, an adhesive layer 2 disposed on the outer surface of the sheet material layer 1, a masking layer 3, a plating layer 4, a texture layer 5, and a semi-permeable color layer 7.

Example 4

The embodiment of the invention provides a manufacturing method of a rear shell of an electronic product, and on the basis of the steps (1) to (3) in the embodiment 1, in order to meet some special requirements, such as the requirement of hardness on the back surface of the rear shell, namely the surface directly contacting with the outside, wherein the hardness is more than 2H/1000G, or the requirement of high stretching, a surface functional layer is required to be made.

The method also comprises a step (4) of manufacturing a surface functional layer for preventing fingerprints and improving the wear resistance on the back surface of the texture layer by adopting a spraying or curtain coating process; the spraying liquid or the curtain coating liquid is made of fluorine-silicon materials.

After spraying or curtain coating, curing in a heating baking mode or a UV curing mode to form a surface functional layer; heating and baking time: 3-5 minutes, baking temperature: 60-90 ℃; UV curing mode: using a UV lamp: energy: 2000-4000mj/CM²And curing time: 2-5 seconds.

The material layer structure of the present embodiment is shown in fig. 3, and includes a plate layer 1, and an adhesive layer 2, a masking layer 3, a plating layer 4, a texture layer 5, and a surface functional layer 6, which are sequentially disposed on the outer surface of the plate layer 1.

Example 5

Corresponding to the embodiment 4, if the semi-permeable color layer is required to be manufactured on the release substrate according to the requirement of the user, after the release film is torn off, the semi-permeable color layer is directly contacted with the outside, if the hardening treatment is required, the surface functional layer is manufactured on the surface of the semi-permeable color layer, but not on the surface of the texture layer. The material layer structure diagram of the present embodiment is shown in fig. 6, and each material layer structure diagram includes a sheet material layer 1, and an adhesive layer 2, a masking layer 3, an electroplated layer 4, a texture layer 5, a semi-permeable color layer 7, and a surface functional layer 6, which are sequentially disposed on the outer surface of the sheet material layer 1.

The sheet material layer 1 in the material layer structure of the foregoing embodiment is a thermoplastic sheet material or a thermosetting sheet material.

The surface of the release substrate selected in the embodiment has no texture, the manufactured membrane has the effect of single-sided texture, when the surface of the selected release substrate has the texture, the texture layer is directly manufactured on the surface with the texture on the release substrate, and after the release substrate is torn off from the rear shell finished product, the two surfaces of the texture layer have the texture, so that the membrane has the effect of double-sided texture; or when the semi-transparent color layer 7 needs to be manufactured, the semi-transparent color layer 7 is directly manufactured on the surface with texture on the release substrate, after the release substrate is torn off from the rear shell finished product, the surface of the semi-transparent color layer 7 has texture, and the rear shell also has double-sided texture effect.

In the above description, it should be noted that the terms "mounted," "connected," and the like are used in a broad sense, and for example, they may be fixedly connected, detachably connected, or integrally connected; the connection may be direct or indirect via an intermediate medium, and the connection may be internal to the two components.

It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention without limiting its scope. This invention may be embodied in many different forms and, on the contrary, these embodiments are provided so that this disclosure will be thorough and complete. All equivalent structures made by using the contents of the specification and the attached drawings of the invention can be directly or indirectly applied to other related technical fields, and are also within the protection scope of the patent of the invention.