阅读说明：本技术 一种可更换探针组及探针卡 (Replaceable probe set and probe card ) 是由 兰欣 周卫金 谢国芳 于 2021-08-11 设计创作，主要内容包括：本发明公开一种可更换探针组及探针卡,包括：多组铜排、针套和探针,每组铜排上安装针套,针套上连接探针,多组铜排的布局根据被测器件自适应调整。可更换探针组可以根据被测功率芯片pad布局进行自适应调整,并且通过将探针组可拆卸连接在探针卡上,在测试不同pad布局的被测功率芯片时,可以避免更换探针卡,降低定制动态测试探针卡的时间和经济成本。(The invention discloses a replaceable probe set and a probe card, comprising: the probe comprises a plurality of groups of copper bars, a needle sleeve and probes, wherein the needle sleeve is arranged on each group of copper bars, the needle sleeve is connected with the probes, and the layout of the plurality of groups of copper bars is self-adaptively adjusted according to a tested device. The replaceable probe group can be adjusted in a self-adaptive mode according to the pad layout of the power chip to be tested, the probe group is detachably connected to the probe card, the probe card can be prevented from being replaced when the power chip to be tested with different pad layouts is tested, and the time and the economic cost for customizing the dynamic test probe card are reduced.)

1. A replaceable probe set, comprising: the probe comprises a plurality of groups of copper bars, a needle sleeve and probes, wherein the needle sleeve is arranged on each group of copper bars, the needle sleeve is connected with the probes, and the layout of the plurality of groups of copper bars is self-adaptively adjusted according to a tested device.

2. The replaceable probe set of claim 1, further comprising a pin header, wherein each set of copper bars is provided with a pin header mounting hole for connecting the pin header.

3. The replaceable probe set of claim 2, wherein the plurality of copper bars are arranged in two or more layers with different layouts, and the pins are connected with the copper bars in different layers.

4. The interchangeable probe set of claim 2, wherein the needle guard, the copper bar, and the row of needles are encapsulated within a housing.

5. The replaceable probe set of claim 1, wherein one end of the probe is disposed within the sleeve and the other end of the probe is disposed on the device under test.

6. The replaceable probe set of claim 1, wherein the number of probes is adaptively adjusted according to the device under test.

7. The replaceable probe set of claim 1, wherein the copper bars are arranged in four groups, and the four groups are used for respectively leading out four test signals of the probe.

8. The replaceable probe set of claim 1, wherein the needle guard has a receptacle on one side for receiving the probe, the receptacle having a depth less than the length of the needle guard.

9. A probe card comprising the replaceable probe set of any one of claims 1-8.

10. A semiconductor device wafer dynamic parametric test system comprising the probe card of claim 9.

Technical Field

The invention relates to the technical field of power device packaging test, in particular to a replaceable probe set and a probe card, and particularly relates to the replaceable probe set suitable for the probe card for testing dynamic parameters of a semiconductor device wafer.

Background

The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.

Because the current for testing the power chip is generally large, and a single probe can only bear limited current, a plurality of probes are required to be simultaneously inserted into the pad of the power chip. A conventional probe card is a PCB including probe sets for collecting currents of different probes. One probe card can only be used for testing one type of power chip, and the pad layouts of different power chips are different, so that the probe card needs to be customized for testing various power chips, and the time and economic cost are high. For a probe card suitable for wafer dynamic parametric testing of semiconductor devices, the cost for customization and replacement will be higher because of its more complex structure compared to conventional probe cards.

Disclosure of Invention

In order to solve the problems, the invention provides a replaceable probe group and a probe card, wherein the replaceable probe group can be adaptively adjusted according to the pad layout of a power chip to be tested, and the probe group is detachably connected to the probe card, so that when the power chip to be tested with different pad layouts is tested, the probe card can be prevented from being replaced, and the time and the economic cost for customizing a dynamic test probe card are reduced.

In order to achieve the purpose, the invention adopts the following technical scheme:

in a first aspect, the present invention provides a replaceable probe set comprising: the probe comprises a plurality of groups of copper bars, a needle sleeve and probes, wherein the needle sleeve is arranged on each group of copper bars, the needle sleeve is connected with the probes, and the layout of the plurality of groups of copper bars is self-adaptively adjusted according to a tested device.

As an alternative embodiment, the replaceable probe set further comprises row pins, and each group of copper bars is provided with row pin mounting holes for connecting the row pins.

As an alternative embodiment, the multiple groups of copper bars are arranged into two or more layers with different layouts, and the row pins are connected with the copper bars on different layers.

As an alternative embodiment, the needle guard, the copper bar and the pin header are all encapsulated in the housing.

In an alternative embodiment, one end of the probe is arranged in the needle sleeve, and the other end of the probe is arranged on the tested device.

As an alternative embodiment, the number of probes is adaptively adjusted according to the device under test.

In an alternative embodiment, the copper bars are arranged in four groups, and four test signals of the probes are respectively led out.

In an alternative embodiment, the needle sleeve is provided with a jack matched with the probe at one side, and the depth of the jack is smaller than the length of the needle sleeve.

In a second aspect, the present invention provides a probe card comprising the replaceable probe set of the first aspect.

In a third aspect, the present invention provides a semiconductor device wafer dynamic parameter testing system, which includes the probe card of the second aspect.

Compared with the prior art, the invention has the beneficial effects that:

reducing the time and economic cost of customizing a pin card, the present invention provides a replaceable probe set suitable for a dynamic parametric test probe card.

The probe set of the conventional probe card can not be directly replaced, so that the probe card needs to be integrally replaced and the position of the probe card needs to be readjusted when different chips are tested, and the operation is complicated. In order to solve the problem, the invention provides the replaceable probe group suitable for the dynamic parameter test probe card, the probe group part is separated from the probe card on the basis of the traditional probe card, different probe groups can be designed according to different layouts of power chips pad, the probe group packaged independently can be directly inserted on the probe card, and the operation is simple.

The replaceable probe set can be adjusted in a self-adaptive manner according to the pad layout of the power chip to be tested, one probe set corresponds to one power chip to be tested, and the probe set is detachably connected to the probe card, so that the probe card can be prevented from being replaced when the power chips to be tested with different pad layouts are tested, and the time and the economic cost for customizing the dynamic test probe card are reduced.

When testing various power chips, only the probe group is replaced, the probe card does not need to be replaced, the position of the probe card is fixed, and the position deviation error of the probe card is reduced.

Advantages of additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is an overall structural diagram of a replaceable probe set provided in example 1 of the present invention;

fig. 2 is a diagram illustrating an internal structure of a replaceable probe set provided in embodiment 1 of the present invention;

FIG. 3 is a schematic view of a probe provided in example 1 of the present invention;

FIG. 4 is a schematic three-dimensional view of a pin header provided in embodiment 1 of the present invention;

fig. 5(a) -5(c) are schematic diagrams illustrating a copper bar layout of a first power chip according to embodiment 1 of the present invention;

fig. 6(a) -6(c) are schematic copper bar layouts of a second power chip according to embodiment 1 of the present invention;

the probe comprises a packaging shell 1, a packaging shell 2, a probe 3, a needle sleeve 4, a copper bar 5, a pin header 6 and a power chip.

The specific implementation mode is as follows:

the invention is further described with reference to the following figures and examples.

It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and it should be understood that the terms "comprises" and "comprising", and any variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The embodiments and features of the embodiments of the present invention may be combined with each other without conflict.

Example 1

As shown in fig. 1 and fig. 2, the present embodiment provides a replaceable probe set, which includes a package housing 1, a probe 2, a needle sheath 3, a copper bar 4, a pin header 5, and a power chip 6, wherein:

the packaging shell 1 is used for packaging one ends of the needle guard 3, the copper bar 4 and the row needle 5, and has the functions of mechanical support, protection isolation and cooling, so that the electrical connection of the independently packaged replaceable probe set is realized.

Preferably, the size of the package housing 1 is adapted to the layout of the copper bar 4, and in this embodiment, the length, the width, and the thickness of the package housing 1 are set to 40mm, and 3mm, respectively.

Preferably, the middle of the package shell 1 is provided with an opening, the opening is a probe assembly area and is also a test observation area, and the power chip is identified, positioned and monitored in the probe pricking position through the observation area by a CCD camera.

Preferably, the material of the package housing 1 is epoxy resin or other packaging materials.

As shown in fig. 3, the probe 2 includes a tip, an inclined arm, a horizontal arm, and a tail, the tip is inserted into a pad of the power chip 6, and the tail is inserted into the needle sheath 3.

Preferably, the size of the probe 2 needs to be designed according to the positions of the power chip 6 and the probe card, in this embodiment, the diameter of the probe tip is preferably set to be 6.0mils, the length of the inclined arm is 10-20 mm, the length of the horizontal arm is 2-5 mm, the angle alpha between the horizontal arm and the inclined arm is 90-120 degrees, and the curvature radius is 0.5-2 mm.

Preferably, the probes 2 are divided into four groups for leading out four test signals of SF, SS, G and GL.

Preferably, the number of the probes 2 can be determined according to the pad layout of the power chip and the rated parameters of the power chip.

Preferably, when the probe 2 is assembled with the needle sheath 3 and the copper bar 4, the position of the needle tip needs to be accurately adjusted, so that the levelness of the needle tip is kept within +/-0.2 mils, and the tolerance (Alignment) of the relative position of the needle tip is kept within +/-0.2 mils.

Preferably, the probe 2 material is come tungsten.

In this embodiment, the cross section of the outer shape of the needle sheath 3 is composed of an arc and a rectangle, one side of the needle sheath is provided with a jack suitable for the assembly of the probe 2, the aperture of the needle sheath 3 is suitable for the insertion of the needle tail of the probe 2, the depth of the jack is smaller than the length of the needle sheath 3, and the levelness of the central lines of different jacks is kept within +/-0.2 mils.

Preferably, the bottom surface of the needle sleeve 3 is flat, so as to facilitate the welding contact with the copper bar 4.

Preferably, the material of the needle sleeve 3 is copper.

In this embodiment, the copper bar 4 is divided into four groups, and is used for leading out four test signals of SF, SS, G, and GL of the probe;

preferably, every group copper bar all is equipped with row needle mounting hole, and row needle mounting hole is used for connecting row needle 5.

In this embodiment, the copper bar 4 is welded and fixed to the needle guard 3, a G signal is led out from the first area, an SS signal is led out from the second area, an SL signal is led out from the third area, and an SF signal is led out from the fourth area;

wherein the content of the first and second substances,

the first area is connected with the grid electrode of the power chip 6 through the needle sleeve 3 and the probes 2, and the number of the probes is 1-2;

the second area is connected with the source electrode of the power chip 6 through the needle sleeve 3 and the probes 2, and the number of the probes is 1-2;

the third area is connected with the source electrode of the power chip 6 through the needle sleeve 3 and the probes 2, and the number of the probes is 1-2;

the fourth area is connected with the source electrode of the power chip 6 through the needle sleeve 3 and the probe 2, and the number of the needles can be preferably set to 10-20 according to the rated current of the power chip.

Preferably, the position and number of the pin header mounting holes are determined by the pin header 5 for inserting one end of the pin header 5.

Preferably, the material of the copper bar 4 is copper.

In this embodiment, as shown in fig. 4, the pin header 5 has functions of mounting, fixing, and electrically connecting, and can be directly inserted into a pin header mounting hole reserved on a dynamic parameter test probe card, and the pin header layout of different probe sets corresponding to the same probe card is not changed, and is determined by the position of the reserved hole on the probe card.

In more embodiments, the layout and the outline of each group of copper bars 4 can be freely designed, the layout is not fixed, and the optimal design can be obtained according to the positions of the pins 5, the rated parameters of the power chip 6 and the pad layout; fig. 5(a) -5(c) and fig. 6(a) -6(c) show two different copper bar layouts designed for two SiC MOSFET chips with different pad layouts.

In more embodiments, the copper bar 4 can be designed into two or more layers with different layouts, and the electrical interconnection of the copper bar 4 on different layers is realized through the pin header 5, so that the power chip with the pad layout is suitable for a complicated power chip; if the pad layout on the surface of the power chip 6 is close, the adaptability to the chip layout can be improved by optimizing the layout of the probe and the copper bar, and the universality of the probe group to the layout of various chips is realized.

In further embodiments, there is also provided:

a probe card comprises the replaceable probe group.

A semiconductor device wafer dynamic parameter test system comprises the probe card.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.