Balanced to single-ended power division filter

文档序号:1833871 发布日期:2021-11-12 浏览:34次 中文

阅读说明:本技术 一种平衡到单端功分滤波器 (Balanced to single-ended power division filter ) 是由 杨华 张钢 章秀银 刘郑康 张其运 谭歆榕 刘纪峰 孙乾 于 2021-07-13 设计创作,主要内容包括:本发明公开了一种平衡到单端功分滤波器,包括第一基板、第二基板和接地板,接地板位于第一基板与第二基板之间;第一基板设有第一贴片、第一输入端口馈线和第二输入端口馈线,以形成TM11谐振模式;所述第二基板设有第二贴片、第一输出端口馈线和第二输出端口馈线;接地板设有通孔,用于将TM11谐振模式从第一贴片耦合到第二贴片;通过双层贴片结构,结构更简单,具有良好的共模抑制性能;且第一输入端口馈线、第二输入端口馈线、第一输出端口馈线和第二输出端口馈线位于TM11谐振模式电场的最强处,能高效地传输差模信号。(The invention discloses a balanced to single-ended power division filter, which comprises a first substrate, a second substrate and a grounding plate, wherein the grounding plate is positioned between the first substrate and the second substrate; the first substrate is provided with a first patch, a first input port feeder line and a second input port feeder line so as to form a TM11 resonance mode; the second substrate is provided with a second patch, a first output port feeder line and a second output port feeder line; the ground plate is provided with a through hole for coupling the TM11 resonant mode from the first patch to the second patch; by the double-layer patch structure, the structure is simpler, and the common mode rejection performance is good; and the first input port feeder line, the second input port feeder line, the first output port feeder line and the second output port feeder line are positioned at the strongest part of an electric field of a TM11 resonance mode, so that differential mode signals can be transmitted efficiently.)

1. A balanced-to-single-ended power division filter comprising a first substrate, a second substrate, and a ground plane, the ground plane being located between the first substrate and the second substrate; a first patch, a first input port feeder line and a second input port feeder line are arranged on one side, far away from the grounding plate, of the first substrate to form a TM11 resonance mode; a second patch, a first output port feeder line and a second output port feeder line are arranged on one side, far away from the grounding plate, of the second substrate; the ground plate is provided with a through hole for coupling the TM11 resonant mode from the first patch to the second patch; the first and second input port feed lines are located at the strongest of the electric fields generated by the TM11 resonant mode corresponding to the first patch, and the first and second output port feed lines are located at the strongest of the electric fields generated by the TM11 resonant mode corresponding to the second patch.

2. A balanced to single-ended power division filter according to claim 1, wherein the first substrate, the second substrate and the ground plane have the same size and shape, the first substrate, the second substrate and the ground plane completely overlap; the first substrate comprises a first side, a second side, a third side, a fourth side, a fifth side and a sixth side which are sequentially connected end to form an outer edge of the first substrate; the first edge, the second edge, the fourth edge and the fifth edge are equal in length; the third side and the sixth side are arranged in parallel and have the same length; the first side and the fourth side are arranged in parallel, and the second side and the fifth side are arranged in parallel; the first side and the second side are vertically arranged, and the fourth side and the fifth side are vertically arranged.

3. A balanced to single-ended power division filter according to claim 2, wherein the first patch is located at the center of the first substrate; one end of the first input port feeder line and one end of the second input port feeder line are both connected with the first patch; the other end of the first input port feeder line and the other end of the second input port feeder line are both connected with the outer edge of the first substrate;

the second patch is positioned in the center of the second substrate; one end of the first output port feeder line and one end of the second output port feeder line are both connected with the second patch; the other end of the first output port feeder line and the other end of the second output port feeder line are both connected with the outer edge of the second substrate.

4. A balanced to single-ended power division filter according to claim 3, wherein the first input port feed line is provided with a first patch connection portion, the first patch connection portion is located in the first patch, and a first spacing slot is formed between two sides of the first patch connection portion and the first patch; the second input port feeder is provided with a second patch connecting part, the second patch connecting part is located in the first patch, and a second spacing groove is formed between two sides of the second patch connecting part and the first patch.

5. A balanced to single-ended power division filter according to claim 3, wherein the first output port feeder is provided with a third patch connection portion, the third patch connection portion is located in the second patch, and a third spacing slot is formed between two sides of the third patch connection portion and the second patch; the second output port feeder is provided with a fourth patch connecting portion, the fourth patch connecting portion is located in the second patch, and a fourth spacing groove is formed between two sides of the third patch connecting portion and the second patch.

6. The balanced-to-single-ended power division filter according to claim 2, wherein a first isolation port and a second isolation port are further provided on a side of the first substrate away from the ground plate; one end of the first isolation port and one end of the second isolation port are both connected with the first patch, and the other end of the first isolation port and the other end of the second isolation port are both far away from the first patch.

7. The balanced to single-ended power division filter according to claim 6, wherein the first isolation port comprises a first isolation conduction band, a first isolation resistor, a first ground post, and a first isolation port contact surface; one end of the first isolation conduction band is provided with a fifth patch connecting part positioned in the first patch, a fifth spacing groove is formed between two sides of the fifth patch connecting part and the first patch, the other end of the first isolation conduction band is connected with the first isolation resistor, the first isolation resistor is connected with the first isolation port contact surface, one end of the first grounding column is connected with the first isolation port contact surface, and the other end of the first grounding column is connected with the grounding plate;

the second isolation port comprises a second isolation conduction band, a second isolation resistor, a second grounding column and a second isolation port contact surface; one end of the second isolation conduction band is provided with a sixth patch connecting part located in the first patch, a sixth spacing groove is formed between two sides of the sixth patch connecting part and the first patch, the other end of the second isolation conduction band is connected with the second isolation resistor, the second isolation resistor is connected with the second isolation port contact surface, one end of the second grounding post is connected with the second isolation port contact surface, and the other end of the second grounding post is connected with the grounding plate.

8. The balanced-to-single ended power splitting filter of claim 6, wherein the first patch is circular, and the center of the first patch coincides with the center of the first substrate;

the first input port feeder line and the second input port feeder line are arranged oppositely, a connecting line of the first input port feeder line and the second input port feeder line passes through the circle center of the first patch, the first input port feeder line is arranged perpendicular to the third edge of the first substrate, and the second input port feeder line is arranged perpendicular to the sixth edge of the first substrate;

the first isolation port and the second isolation port are arranged oppositely, the connecting line of the first isolation port and the second isolation port passes through the circle center of the first patch, and the connecting line of the first isolation port and the second isolation port is perpendicular to the connecting line of the first input port feeder line and the second input port feeder line.

9. The balanced-to-single ended power splitting filter of claim 2, wherein the second patch is circular, and the center of the second patch coincides with the center of the second substrate;

the first output port feeder line is perpendicular to the second edge of the second substrate, and the extension line of the first output port feeder line passes through the circle center of the second patch;

the second output port feeder line is perpendicular to the fourth edge of the second substrate, and an extension line of the second output port feeder line passes through the circle center of the second patch.

10. The balanced-to-single ended power division filter according to claim 2, wherein the through hole is circular, and the center of the through hole coincides with the center of the ground plate.

Technical Field

The invention relates to the field of filters, in particular to a balanced to single-ended power division filter.

Background

With the rapid development of wireless communication systems, microwave devices are widely used. Among them, the balance element has attracted attention because of its advantages such as suppression of common mode signals and high reliability. As one of the most critical elements of the balanced element, the balanced power division filter is receiving more and more attention. Generally, a balanced power division filter is divided into three parts, namely, balanced to balanced, single-ended to balanced and balanced to single-ended, and the balanced to single-ended power division filter is an important component for connecting a balanced system and a single-ended system and plays a role in power distribution and filtering.

The partial balanced to single-end power division filter is a microstrip line structure, and is loaded by using a coupling line and a plurality of branches, but the microstrip line structure has a complex structure and is difficult to determine the compression size. The partial balance to single-end power division filter realizes the same phase performance of two output ports, but the isolation between the output ports is poor, the stop band is narrow, and the selectivity is poor. The partial balanced to single-ended power division filter realizes the in-phase and good common-mode rejection performance of the two output ports, but the insertion loss is larger due to the design of the coupling line.

Disclosure of Invention

The present invention is directed to solve at least one of the problems of the prior art and to provide a balanced to single-ended power division filter.

The technical scheme adopted by the invention for solving the problems is as follows:

a balanced-to-single-ended power division filter comprising a first substrate, a second substrate, and a ground plate, the ground plate being located between the first substrate and the second substrate; a first patch, a first input port feeder line and a second input port feeder line are arranged on one side, far away from the grounding plate, of the first substrate to form a TM11 resonance mode; a second patch, a first output port feeder line and a second output port feeder line are arranged on one side, far away from the grounding plate, of the second substrate; the ground plate is provided with a through hole for coupling the TM11 resonant mode from the first patch to the second patch; the first and second input port feed lines are located at the strongest of the electric fields generated by the TM11 resonant mode corresponding to the first patch, and the first and second output port feed lines are located at the strongest of the electric fields generated by the TM11 resonant mode corresponding to the second patch.

Further, the first substrate, the second substrate and the ground plate have the same size and shape, and the first substrate, the second substrate and the ground plate are completely overlapped; the first substrate comprises a first side, a second side, a third side, a fourth side, a fifth side and a sixth side which are sequentially connected end to form an outer edge of the first substrate; the first edge, the second edge, the fourth edge and the fifth edge are equal in length; the third side and the sixth side are arranged in parallel and have the same length; the first side and the fourth side are arranged in parallel, and the second side and the fifth side are arranged in parallel; the first side and the second side are vertically arranged, and the fourth side and the fifth side are vertically arranged.

Further, the first patch is positioned in the center of the first substrate; one end of the first input port feeder line and one end of the second input port feeder line are both connected with the first patch; the other end of the first input port feeder line and the other end of the second input port feeder line are both connected with the outer edge of the first substrate; the second patch is positioned in the center of the second substrate; one end of the first output port feeder line and one end of the second output port feeder line are both connected with the second patch; the other end of the first output port feeder line and the other end of the second output port feeder line are both connected with the outer edge of the second substrate.

Further, the first input port feeder line is provided with a first patch connecting part, the first patch connecting part is positioned in the first patch, and a first spacing groove is formed between two sides of the first patch connecting part and the first patch; the second input port feeder is provided with a second patch connecting part, the second patch connecting part is located in the first patch, and a second spacing groove is formed between two sides of the second patch connecting part and the first patch.

Further, the first output port feeder line is provided with a third patch connecting part, the third patch connecting part is positioned in the second patch, and a third spacing groove is formed between two sides of the third patch connecting part and the second patch; the second output port feeder is provided with a fourth patch connecting portion, the fourth patch connecting portion is located in the second patch, and a fourth spacing groove is formed between two sides of the third patch connecting portion and the second patch.

Furthermore, a first isolation port and a second isolation port are further arranged on one side, far away from the grounding plate, of the first substrate; one end of the first isolation port and one end of the second isolation port are both connected with the first patch, and the other end of the first isolation port and the other end of the second isolation port are both far away from the first patch.

Further, the first isolation port comprises a first isolation conduction band, a first isolation resistor, a first ground post and a first isolation port contact surface; one end of the first isolation conduction band is provided with a fifth patch connecting part positioned in the first patch, a fifth spacing groove is formed between two sides of the fifth patch connecting part and the first patch, the other end of the first isolation conduction band is connected with the first isolation resistor, the first isolation resistor is connected with the first isolation port contact surface, one end of the first grounding column is connected with the first isolation port contact surface, and the other end of the first grounding column is connected with the grounding plate; the second isolation port comprises a second isolation conduction band, a second isolation resistor, a second grounding column and a second isolation port contact surface; one end of the second isolation conduction band is provided with a sixth patch connecting part located in the first patch, a sixth spacing groove is formed between two sides of the sixth patch connecting part and the first patch, the other end of the second isolation conduction band is connected with the second isolation resistor, the second isolation resistor is connected with the second isolation port contact surface, one end of the second grounding post is connected with the second isolation port contact surface, and the other end of the second grounding post is connected with the grounding plate.

Further, the first patch is circular, and the circle center of the first patch is overlapped with the center of the first substrate; the first input port feeder line and the second input port feeder line are arranged oppositely, a connecting line of the first input port feeder line and the second input port feeder line passes through the circle center of the first patch, the first input port feeder line is arranged perpendicular to the third edge of the first substrate, and the second input port feeder line is arranged perpendicular to the sixth edge of the first substrate; the first isolation port and the second isolation port are arranged oppositely, the connecting line of the first isolation port and the second isolation port passes through the circle center of the first patch, and the connecting line of the first isolation port and the second isolation port is perpendicular to the connecting line of the first input port feeder line and the second input port feeder line.

Further, the second patch is circular, and the circle center of the second patch is overlapped with the center of the second substrate; the first output port feeder line is perpendicular to the second edge of the second substrate, and the extension line of the first output port feeder line passes through the circle center of the second patch; the second output port feeder line is perpendicular to the fourth edge of the second substrate, and an extension line of the second output port feeder line passes through the circle center of the second patch.

Further, the through hole is circular, and the circle center of the through hole is coincided with the center of the grounding plate.

The scheme at least has the following beneficial effects: through double-deck paster structure, for microstrip structure and tiled structure make full use of space more, with the integration of equalizer function and homophase power division filter function simultaneously for the structure is simpler, the size is littleer and the function is more perfect, has good common mode rejection performance. The first input port feed line and the second input port feed line are positioned at the strongest part of an electric field generated by a TM11 resonance mode corresponding to the first patch, so that the differential mode signal can be transmitted very efficiently when the differential mode signal is input. The first output port feed line and the second output port feed line are positioned at the strongest part of an electric field generated by a TM11 resonance mode corresponding to the second patch, so that differential mode signals can be transmitted efficiently.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The invention is further illustrated with reference to the following figures and examples.

Fig. 1 is an exploded view of a balanced-to-single-ended power division filter according to an embodiment of the present invention;

fig. 2 is a front cross-sectional view of a balanced to single-ended power division filter in accordance with an embodiment of the present invention;

FIG. 3 is a structural view of a first substrate;

fig. 4 is a structural view of the ground plate;

FIG. 5 is a structural view of a second substrate;

fig. 6 is an output isolation simulation diagram of an S parameter of a balanced-to-single-ended power division filter when differential mode input is performed according to an embodiment of the present invention;

fig. 7 is a simulation diagram of S parameters of a balanced-to-single-ended power division filter at a common-mode input according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

Referring to fig. 1 to 5, in an embodiment of the present invention, a balanced-to-single-ended power division filter is provided, including a first substrate 100, a second substrate 200, and a ground plate 300, where the ground plate 300 is located between the first substrate 100 and the second substrate 200; a first patch 110, a first input port feed line 120 and a second input port feed line 130 are arranged on the side of the first substrate 100 away from the ground plate 300 to form a TM11 resonance mode; a second patch 210, a first output port feeder 220 and a second output port feeder 230 are arranged on one side of the second substrate 200 far away from the grounding plate 300; the ground plate 300 is provided with a through-hole 310, the through-hole 310 being used to couple the TM11 resonance mode from the first patch 110 to the second patch 210; the first and second input port feed lines 120 and 130 are located at the strongest of the electric fields generated by the TM11 resonant mode corresponding to the first patch 110, and the first and second output port feed lines 220 and 230 are located at the strongest of the electric fields generated by the TM11 resonant mode corresponding to the second patch 210.

In the embodiment, the double-layer patch structure makes full use of space compared with a micro-strip structure and a tiled structure, and integrates the functions of a balancer and a same-phase power division filter, so that the structure is simpler, the size is smaller, the functions are more complete, and the common-mode rejection performance is good. The first input port feed line 120 and the second input port feed line 130 are located at the strongest points of the electric field generated by the TM11 resonant mode corresponding to the first patch 110, which ensures that the differential mode signal can be transmitted with high efficiency when the differential mode signal is input. The first output port feed line 220 and the second output port feed line 230 are located at the strongest points of the electric field generated by the TM11 resonance mode corresponding to the second patch 210, enabling efficient transmission of differential mode signals.

Referring to fig. 3 to 5, in some embodiments of the present invention, the first substrate 100, the second substrate 200, and the ground plate 300 have the same size and shape, and the first substrate 100, the second substrate 200, and the ground plate 300 are completely overlapped; the outer edges of the first substrate 100 include a first edge 101 of the first substrate 100, a second edge 102 of the first substrate 100, a third edge 103 of the first substrate 100, a fourth edge 104 of the first substrate 100, a fifth edge 105 of the first substrate 100, and a sixth edge 106 of the first substrate 100; the first side 101 of the first substrate 100, the second side 102 of the first substrate 100, the third side 103 of the first substrate 100, the fourth side 104 of the first substrate 100, the fifth side 105 of the first substrate 100 and the sixth side 106 of the first substrate 100 are sequentially connected end to enclose the outer edge of the first substrate 100. The first side 101 of the first substrate 100, the second side 102 of the first substrate 100, the fourth side 104 of the first substrate 100, and the fifth side 105 of the first substrate 100 are equal in length; the third side 103 of the first substrate 100 and the sixth side 106 of the first substrate 100 are arranged in parallel and have the same length; the first side 101 of the first substrate 100 and the fourth side 104 of the first substrate 100 are arranged in parallel, and the second side 102 of the first substrate 100 and the fifth side 105 of the first substrate 100 are arranged in parallel; the first side 101 of the first substrate 100 is disposed perpendicular to the second side 102 of the first substrate 100, and the fourth side 104 of the first substrate 100 is disposed perpendicular to the fifth side 105 of the first substrate 100.

That is, the second substrate 200 is also hexagonal, and the outer edge of the second substrate 200 includes a first edge 201 of the second substrate 200, a second edge 202 of the second substrate 200, a third edge 203 of the second substrate 200, a fourth edge 204 of the second substrate 200, a fifth edge 205 of the second substrate 200, and a sixth edge 206 of the second substrate 200; the first edge 201 of the second substrate 200, the second edge 202 of the second substrate 200, the third edge 203 of the second substrate 200, the fourth edge 204 of the second substrate 200, the fifth edge 205 of the second substrate 200 and the sixth edge 206 of the second substrate 200 are sequentially connected end to enclose the outer edge of the second substrate 200. The relationship of the six sides of the second substrate 200 is the same as that of the first substrate 100; the ground plate 300 is also hexagonal-shaped, and the relationship of the six sides of the ground plate 300 is the same as that of the first substrate 100.

In fact, the hexagonal shape of the first substrate 100, the second substrate 200, and the ground plate 300 may be actually obtained by cutting off isosceles right triangles from two opposite corners of a square.

In this embodiment, the shape is designed such that a multi-layer structure can be formed and a desired pass band response can be ensured.

Referring to fig. 3, in some embodiments of the present invention, the first patch 110 is located at the center of the first substrate 100; one end of the first input port feed line 120 and one end of the second input port feed line 130 are both connected to the first patch 110; the other end of the first input port feed line 120 and the other end of the second input port feed line 130 are both connected to an outer edge of the first substrate 100; the second patch 210 is located at the center of the second substrate 200; one end of the first output port feeder 220 and one end of the second output port feeder 230 are both connected to the second patch 210; the other end of the first output port feed line 220 and the other end of the second output port feed line 230 are both connected to the outer edge of the second substrate 200.

A 50 ohm microstrip conduction band is disposed within each of first input port feed line 120 and second input port feed line 130.

In this embodiment, the design may excite the desired TM11 resonant mode at first substrate 100 such that first input port feed line 120 and second input port feed line 130 are located at the strongest of the electric fields generated by the TM11 resonant mode corresponding to first patch 110, and first output port feed line 220 and second output port feed line 230 are located at the strongest of the electric fields generated by the TM11 resonant mode corresponding to second patch 210.

In some embodiments of the present invention, the first input port feeder 120 is provided with a first patch connecting portion 121, the first patch connecting portion 121 is located in the first patch 110, and a first spacing slot 122 is formed between two sides of the first patch connecting portion 121 and the first patch 110; the second input port feeder 130 is provided with a second patch connecting portion 131, the second patch connecting portion 131 is located in the first patch 110, and a second spacing groove 132 is formed between two sides of the second patch connecting portion 131 and the first patch 110.

In this embodiment, the design can ensure balanced port input, the two input ports constitute a pair of balanced input ports, so that when the first input port feed line 120 and the second input port feed line 130 are in differential mode input, a TM11 resonance mode is excited on the first patch 110 resonator, and at the same time, TM21 resonance mode and TM02 resonance mode can be suppressed from being excited, and the first and second spaced grooves 122 and 132 can suppress the TM12 resonance mode from being generated on the first patch 110 resonator. When the common mode is input, the common mode signal can be well restrained. Thereby achieving the desired differential mode input and rejection of common mode input at the resonator formed by the first patch 110.

Referring to fig. 5, in some embodiments of the present invention, the first output port feeder 220 is provided with a third patch connecting portion 221, the third patch connecting portion 221 is located in the second patch 210, and a third spacing groove 222 is formed between two sides of the third patch connecting portion 221 and the second patch 210; the second output port feeder 230 is provided with a fourth patch connecting portion 231, the fourth patch connecting portion 231 is located in the second patch 210, and a fourth spacing groove 232 is formed between both sides of the third patch connecting portion 221 and the second patch 210.

In this embodiment, the first output port feeder 220 and the second output port feeder 230 may ensure that the two output ports are located at the same position in the electric field direction, so as to implement in-phase power division, and meanwhile, the symmetrical placement of the first output port feeder 220 and the second output port feeder 230 may also ensure that the two power division ratio is 1, and the third spacing slot 222 and the fourth spacing slot 232 may ensure that other resonant modes cannot be output on the second patch 210 resonator. Thereby achieving a desired in-phase power division output on the resonator formed by the second patch 210.

Referring to fig. 2 and 3, in some embodiments of the present invention, the first substrate 100 is further provided with a first isolation port 140 and a second isolation port 150 on a side away from the ground plate 300; one end of the first isolation port 140 and one end of the second isolation port 150 are both connected to the first patch 110, and the other end of the first isolation port 140 and the other end of the second isolation port 150 are both away from the first patch 110.

In some embodiments of the present invention, first isolation port 140 includes a first isolation conduction band 141, a first isolation resistor 142, a first ground post 144, and a first isolation port contact surface 143; one end of the first isolation conduction band 141 is provided with a fifth patch connection part 145 positioned in the first patch 110, a fifth spacing groove 146 is formed between two sides of the fifth patch connection part 145 and the first patch 110, the other end of the first isolation conduction band 141 is connected with the first isolation resistor 142, the first isolation resistor 142 is connected with the first isolation port contact surface 143, one end of the first grounding column 144 is connected with the first isolation port contact surface 143, and the other end of the first grounding column 144 is connected with the grounding plate 300; the second isolated port 150 includes a second isolated conduction band 151, a second isolated resistor 152, a second ground post 154, and a second isolated port contact surface 153; one end of the second isolation conduction band 151 is provided with a sixth patch connection portion 155 located in the first patch 110, a sixth spacing groove 156 is formed between two sides of the sixth patch connection portion 155 and the first patch 110, the other end of the second isolation conduction band 151 is connected with the second isolation resistor 152, the second isolation resistor 152 is connected with the second isolation port contact surface 153, one end of the second grounding post 154 is connected with the second isolation port contact surface 153, and the other end of the second grounding post 154 is connected with the ground plate 300.

Specifically, the first ground post 144, the second ground post 154, and the first patch 110 are vertically disposed, and the first ground post 144, the second ground post 154, and the ground plate 300 are vertically disposed.

The first and second isolation conduction bands 141 and 151 are 50 ohm microstrip conduction bands.

In this embodiment, first isolated port 140 and second isolated port 150 may ensure that the first patch 110 resonator values match, thereby enabling the desired TM11 resonant mode to be formed when the differential mode is input. When a TM11 resonant mode is transmitted from the first patch 110 to the second patch 210, the desired TM11 resonant mode can also be formed on the second patch 210. And the two pairs of balanced output ports are just arranged at the positions which can form isolation by means of the electric field distribution of the mode, so that good isolation between the two pairs of output ports is formed. Otherwise, the resonators of the first patch 110 are not matched in resistance, and cannot form the desired TM11 resonant mode, and even cannot form good isolation.

In some embodiments of the present invention, the first patch 110 is circular, and the center of the first patch 110 coincides with the center of the first substrate 100; the first input port feed line 120 and the second input port feed line 130 are arranged oppositely, a connecting line of the first input port feed line 120 and the second input port feed line 130 passes through a circle center of the first patch 110, the first input port feed line 120 is arranged perpendicular to the third side 103 of the first substrate 100, and the second input port feed line 130 is arranged perpendicular to the sixth side 106 of the first substrate 100; the first isolation port 140 and the second isolation port 150 are disposed opposite to each other, a connection line of the first isolation port 140 and the second isolation port 150 passes through a center of the first patch 110, and the connection line of the first isolation port 140 and the second isolation port 150 is disposed perpendicular to a connection line of the first input port feeder 120 and the second input port feeder 130.

The center of the first substrate 100, the center of the second substrate 200, and the center of the ground plate 300 are the center points where all diagonals of the hexagon intersect.

Specifically, the radius of the first patch 110 is r 1; the first, second, fifth and sixth spacing grooves 122, 132, 146 and 156 are each l1 in length and w1 in width; the widths of microstrip line conduction bands in the first input port feeder line 120, the second input port feeder line 130, the first isolation port 140, and the second isolation port 150 are wf, the lengths of the microstrip line conduction band and the non-connection portion of the first patch 110 are lf, and the resistances of the first isolation resistor 142 and the second isolation resistor 152 are R.

In this embodiment, this ensures that the balanced input port is at the strongest of the TM11 electric field, so that the differential mode signal can be transmitted efficiently when it is input. Meanwhile, the first isolation port 140 and the second isolation port 150 are symmetrically distributed, so that the resistance matching of the resonators of the first patch 110 can be ensured.

In some embodiments of the present invention, the second patch 210 is circular, and the center of the second patch 210 coincides with the center of the second substrate 200; the first output port feeder 220 is perpendicular to the second edge 202 of the second substrate 200, and an extension line of the first output port feeder 220 passes through a circle center of the second patch 210; the second output port feeder 230 is perpendicular to the fourth edge 204 of the second substrate 200, and an extension line of the second output port feeder 230 passes through a center of the second patch 210.

The first output port feeder line 220 and the second output port feeder line 230 each have a 50 ohm microstrip conduction band disposed therein.

The radius of the second patch 210 is r 1; the third spacing groove 222 and the fourth spacing groove 232 have the length l1 and the width w 1; the widths of the microstrip conduction bands in the first output port feeder 220 and the second output port feeder 230 are wf, and the lengths of the microstrip conduction bands and the non-connection portion of the first patch 110 are lf.

Specifically, the parameters take the following values: r1-10 mm, l 1-3.25 mm, lf-5 mm, w 1-0.2 mm, wf-1.18 mm, R2-3.17 mm, R-50 Ω.

Referring to fig. 4, in some embodiments of the present invention, the through hole 310 is circular, and the center of the through hole 310 coincides with the center of the ground plate 300. That is, the center of the through hole 310 coincides with the center of the first substrate 100 and the center of the second substrate 200.

In this embodiment, the via 310 aperture of the ground plane 300 is located where the electric and magnetic fields generated by the TM11 resonant mode are the strongest, such that the TM11 resonant mode formed by the first patch 110 resonator can be efficiently coupled to the second patch 210 resonator through the electrical and magnetic coupling of the ground plane 300.

Specifically, the matrices of the first substrate 100 and the second substrate 200 of the balanced-to-single-ended power division filter are RO4003 matrices, the relative dielectric constant is 3.55, the thickness is 0.508mm, and the loss tangent is 0.0027. The total area of the first patch 110 and the second patch 210 is 20 x 20mm2, and the corresponding waveguide length dimension is 0.53 xg x 0.53 xg, where xg is the length of the waveguide with a center frequency of 4.2 GHz.

Of course, the parameter data are only an example of a specific embodiment, and in other embodiments, other parameter data may be adopted according to the actual application requirement.

Referring to fig. 6, fig. 6 is a simulation diagram of the output isolation of the S parameter of the balanced-to-single-ended power division filter at the time of differential mode input, and it can be seen from fig. 6 that the center frequency of the balanced-to-single-ended power division filter is 4.2GHz, the 3-dB bandwidth is 0.80GHz, the return loss in the pass band is lower than 19dB, the minimum insertion loss is 0.91dB (including no power division loss), and the isolation in the pass band is better than 20 dB. Referring to fig. 7, fig. 7 is a simulation diagram of the S-parameter of the balanced to single-ended power division filter at a common-mode input, and as seen in fig. 7, the passband of the balanced to single-ended power division filter has a common-mode rejection of less than 38 dB.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, and the present invention shall fall within the protection scope of the present invention as long as the technical effects of the present invention are achieved by the same means.

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