阅读说明：本技术 一种新型除雾加热膜制备方法及除雾加热膜 (Novel demisting heating film preparation method and demisting heating film ) 是由 邓景月 于 2021-05-27 设计创作，主要内容包括：本发明涉及一种新型除雾加热膜制备方法及除雾加热膜,包括以下步骤：提供基材和基板；利用钨钛合金靶材在基材上溅射形成透明的高温合金膜；通过热压的方式将基材贴合到所述基板上；在高温合金膜远离所述基材的表面上加工两个电极；两个所述电极沿所述高温合金膜的中轴线为轴对称设置,两个所述电极分别与所述高温合金膜电连接。加工形成的高温合金膜以及除雾加热膜,可长期在低于120℃条件下使用,所占空间小,质量轻,厚度极薄,一般低于0.2mm,同时耐弯折性能高；能够克服现有技术中,普通导电材料耐老化差,高电阻,高功耗,热膨胀导致金属层龟裂问题。(The invention relates to a preparation method of a novel demisting heating film and the demisting heating film, which comprises the following steps: providing a base material and a substrate; sputtering a tungsten-titanium alloy target material on a base material to form a transparent high-temperature alloy film; attaching a base material to the substrate in a hot pressing mode; processing two electrodes on the surface of the high-temperature alloy film far away from the substrate; the two electrodes are arranged in an axisymmetric manner along the central axis of the high-temperature alloy film, and the two electrodes are respectively electrically connected with the high-temperature alloy film. The high-temperature alloy film and the defogging heating film which are formed by processing can be used at the temperature lower than 120 ℃ for a long time, the occupied space is small, the weight is light, the thickness is extremely thin and is generally lower than 0.2mm, and meanwhile, the bending resistance is high; the problems of poor aging resistance, high power consumption and metal layer cracking caused by thermal expansion of common conductive materials in the prior art can be solved.)

1. The preparation method of the novel demisting heating film is characterized by comprising the following steps:

providing a base material and a substrate;

sputtering a tungsten-titanium alloy target material on a base material to form a transparent high-temperature alloy film;

attaching a base material to the substrate in a hot pressing mode;

processing two electrodes on the surface of the high-temperature alloy film far away from the substrate;

the two electrodes are arranged in an axisymmetric manner along the central axis of the high-temperature alloy film, and the two electrodes are respectively electrically connected with the high-temperature alloy film.

2. The method of claim 1, wherein the substrate is a transparent optical substrate.

3. The method for producing a novel defogging heating film according to claim 2, wherein: the substrate is one or a combination of a plurality of PET films, TAC films and acrylic acid films.

4. The method for manufacturing a novel defogging heating film according to claim 1, wherein the thickness of the superalloy film is 0.05 μm to 0.125 μm.

5. The method for manufacturing a novel defogging heating film according to claim 4, wherein the thickness of the high temperature alloy film is 0.108 μm.

6. The method for preparing a novel defogging heating film according to claim 1, wherein the hot-pressing ambient temperature is 120 ℃ to 150 ℃ during the hot-pressing.

7. The method for producing a novel defogging heating film according to claim 1, wherein a hot pressing pressure is 8 to 12MPa during the hot pressing.

8. The method of claim 1, wherein the superalloy film is drawn by a draw roll during the hot pressing process, such that the superalloy film moves above or below the substrate for hot pressing.

9. The method as claimed in claim 8, wherein the size of the drawing roll is 6 inches, and the rotation speed of the drawing roll is 0.8-4 r/min.

10. A defogging heating film, which is produced by the method for producing a novel defogging heating film according to any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of optical heating devices, in particular to a novel demisting heating film and a preparation method thereof.

Background

At present, the types of heating films are generally classified into a transfer ink type, a carbon fiber type, a wire type, and a polymer conductive material type. The heating material of the transfer printing ink type electric heating film is generally graphite, metal powder and metal oxide, and the defect of the transfer printing ink type electric heating film is that the heat conduction efficiency is general. The heating material of the carbon fiber type electric heating film is generally carbon fiber, and the carbon fiber type electric heating film starts to be oxidized and lose weight in air at 350 ℃, so that the resistivity is changed, the electric heating performance is unstable, and even danger is brought. The heating material of the metal-based electrothermal film is a pure metal or metal alloy material, mainly adopts copper, nickel, copper-nickel and iron-chromium-aluminum, is easy to generate high electromagnetic radiation, is easy to age, has high energy consumption and small heating area. The heating material of the polymer conductive material type electric heating film is mainly conductive polymer, and the heat conduction efficiency is low. The traditional materials have poor comprehensive performance when preparing a heating film with high heat conduction efficiency and high transparency.

The silver nanowire has not only unique optical characteristics of high transparency but also high electrical conductivity and thermal conductivity, and is also used for processing a transparent heating film, but because silver is easily oxidized to become black and is polymerized and broken after being used for a certain time, the stability of a formed conductive network cannot be ensured, and the transparency is low. Therefore, a new heating layer needs to be designed to achieve both transparency and durability.

Disclosure of Invention

In order to overcome at least part of defects in the prior art, the invention provides a novel demisting heating film preparation method and a demisting heating film, so that the comprehensive heating performance of a heating layer can be improved by utilizing a new material.

The embodiment of the invention provides a preparation method of a novel demisting heating film, which comprises the following steps:

providing a base material and a substrate;

sputtering a tungsten-titanium alloy target material on a base material to form a transparent high-temperature alloy film;

attaching a base material to the substrate in a hot pressing mode;

processing two electrodes on the surface of the high-temperature alloy film far away from the substrate;

the two electrodes are arranged in an axisymmetric manner along the central axis of the high-temperature alloy film, and the two electrodes are respectively electrically connected with the high-temperature alloy film.

Further, the substrate is a transparent optical substrate.

Further, the substrate is one or a combination of more of a PET film, a TAC film and an acrylic film.

Further, the thickness of the superalloy film is 0.05 μm to 0.125 μm.

Further, the thickness of the superalloy film is 0.108 μm.

Further, in the hot pressing process, the environment temperature of the hot pressing is 120-150 ℃.

Further, in the hot pressing process, the hot pressing pressure is 8-12 MPa.

Further, in the hot pressing process, the high-temperature alloy film is drawn by a drawing roller, so that the high-temperature alloy film moves to the position above or below the substrate for hot pressing.

Further, the size of the drawing roller is 6 inches, and the rotating speed of the drawing roller is 0.8-4 r/min.

The invention also relates to a demisting heating film which is prepared by the preparation method of the novel demisting heating film.

The invention has the advantages that: because tungsten has the properties of high melting point, high strength, low thermal expansion coefficient and the like, and the tungsten-titanium alloy has low resistance coefficient, good thermal stability and oxidation resistance, the high-temperature alloy film and the defogging heating film which are formed by processing can be used at the temperature lower than 120 ℃ for a long time, the occupied space is small, the weight is light, the thickness is extremely thin and is generally lower than 0.2mm, and meanwhile, the bending resistance is high;

the problems of poor aging resistance, high power consumption and metal layer cracking caused by thermal expansion of common conductive materials in the prior art can be solved.

In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of the steps of the method for preparing the novel defogging heating film according to the present invention.

Fig. 2 is a schematic view of the structure of the defogging heating film according to the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, a method for preparing a novel defogging heating film in a preferred embodiment of the present invention includes the following steps:

providing a base material and a substrate;

sputtering a tungsten-titanium alloy target material on a base material to form a transparent high-temperature alloy film;

attaching a base material to the substrate in a hot pressing mode;

processing two electrodes on the surface of the high-temperature alloy film far away from the substrate;

the two electrodes are arranged in an axisymmetric manner along the central axis of the high-temperature alloy film, and the two electrodes are respectively electrically connected with the high-temperature alloy film.

In the above embodiments, the substrate is a transparent optical substrate.

In the above embodiments, the substrate is one or a combination of PET film, TAC film and acrylic film.

In the above embodiments, the thickness of the superalloy film is 0.05 μm to 0.125 μm. In the practical implementation process, in order to ensure the rigidity and the conductivity of the high-temperature alloy film, the processing thickness of the high-temperature alloy film is 0.108 μm. However, in other embodiments, the thickness of the superalloy film may also be set to 0.05 μm, 0.08 μm, 0.1 μm, 0.12 μm, or the like.

In the above examples, the ambient temperature of the hot pressing was 120 ℃ to 150 ℃ during the hot pressing. In practical implementation, the hot pressing temperature is 130 ℃. The specific temperature is adjusted according to the thickness of the high-temperature alloy film, and if the thickness of the high-temperature alloy film is thinner, the lower hot pressing temperature is adopted, such as 120 ℃; if the thickness of the superalloy film is relatively thick, a relatively high hot pressing temperature, such as 150 deg.C, is used.

In the above examples, the hot pressing pressure was 8 to 12MPa during the hot pressing. In practical implementation, the hot pressing pressure is 10 MPa. The specific temperature is adjusted according to the thickness of the high-temperature alloy film, and if the thickness of the high-temperature alloy film is thinner, lower hot-pressing pressure is adopted, such as 8 MPa; if the thickness of the superalloy film is relatively thick, a relatively high hot pressing pressure, such as 12MPa, is used.

In the above embodiment, during the hot pressing, the superalloy film is drawn by the drawing roller, so that the superalloy film moves above or below the substrate for hot pressing. The high-pressure alloy film and the substrate are connected with each other in a roll-to-roll pressing mode, and the structural strength and the processing efficiency of the demisting heating film can be improved.

In the above example, the pull rolls were 6 inches in size and rotated at a speed of 0.8 to 4 r/min.

Referring to fig. 2, the invention also relates to a defogging heating film prepared by the preparation method of the novel defogging heating film. The prepared demisting heating film sequentially comprises a high-temperature alloy film, a base material and a substrate. At least 2 electrodes are processed on the high-temperature alloy film.

The invention has the advantages that: because tungsten has the properties of high melting point, high strength, low thermal expansion coefficient and the like, the tungsten-titanium alloy has low resistance coefficient, good thermal stability and oxidation resistance, so that the high-temperature alloy film and the demisting heating film formed by processing can be used at the temperature lower than 120 ℃ for a long time, the occupied space is small, the weight is light, the thickness is extremely thin and is generally lower than 0.2mm, and meanwhile, the bending resistance is high. The problems of poor aging resistance, high power consumption and metal layer cracking caused by thermal expansion of common conductive materials in the prior art can be solved.

The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.