Environment-friendly soldering flux and preparation method thereof

文档序号:1839200 发布日期:2021-11-16 浏览:22次 中文

阅读说明:本技术 一种环保助焊剂及其制备方法 (Environment-friendly soldering flux and preparation method thereof ) 是由 钟炜 喻荣祥 张本汉 钟国锋 许永章 于 2021-08-27 设计创作,主要内容包括:本发明适用助焊剂技术领域,提供一种环保助焊剂及其制备方法,所述环保助焊剂按重量份计,包括以下的组分:复配活性物质2-4份、辅助剂4.2-5.8份、表面活性剂0.5-0.7份、去离子水88-92份;所述复配活性物质是通过有机胺对有机酸进行酸碱度调节,然后通过复配树脂进行包覆处理得到的,通过以聚丙烯酰胺和蔗糖酯作为表面活性剂,可有效的提高水的润湿性;同时具有良好的分散性和抗菌性,从而利于复配活性物质均匀的分散在体系中,利于焊接的使用;通过复配树脂进行包覆处理,可使得复配活性物质在常温下保持稳定,在高温下保持高活性;解决了现有免清洗助焊剂以水为溶剂,导致润湿性差的问题。(The invention is applicable to the technical field of soldering flux, and provides environment-friendly soldering flux and a preparation method thereof, wherein the environment-friendly soldering flux comprises the following components in parts by weight: 2-4 parts of compound active substance, 4.2-5.8 parts of auxiliary agent, 0.5-0.7 part of surfactant and 88-92 parts of deionized water; the compound active substance is obtained by adjusting the pH value of organic acid through organic amine and then coating through compound resin, and the wettability of water can be effectively improved by taking polyacrylamide and sucrose ester as surfactants; meanwhile, the antibacterial and water-soluble organic silicon compound has good dispersibility and antibacterial property, so that the compound active substance is uniformly dispersed in a system and is beneficial to welding; the compound active substance can be kept stable at normal temperature and high activity at high temperature by coating the compound resin; the problem of current no-clean scaling powder use water as the solvent, lead to the poor wettability is solved.)

1. The environment-friendly soldering flux is characterized by comprising the following components in parts by weight:

2-4 parts of compound active substance, 4.2-5.8 parts of auxiliary agent, 0.5-0.7 part of surfactant and 88-92 parts of deionized water;

the surfactant comprises polyacrylamide and sucrose ester;

the compound active substance is obtained by adjusting the pH value of organic acid through organic amine and then coating compound resin, wherein the compound resin is a mixture of acrylic resin and polyvinyl chloride resin.

2. The environment-friendly soldering flux as defined in claim 1, wherein the mass ratio of the acrylic resin to the polyvinyl chloride resin in the compound resin is 1.4-1.6: 1.

3. the environment-friendly flux according to claim 1, wherein the organic acid is one or two of succinic acid, glutaric acid, adipic acid and malic acid, and the organic amine is triethanolamine.

4. The environment-friendly soldering flux as claimed in claim 1, wherein the mass ratio of the organic acid to the organic amine to the compound resin is 2-4: 1-3: 8.

5. the environmental protection flux according to claim 1, wherein the auxiliary agent comprises a film forming agent, an antioxidant, a corrosion inhibitor and a thixotropic agent.

6. The environment-friendly flux according to claim 5, comprising the following components in parts by weight:

2-4 parts of compound active substance, 3-5 parts of film forming agent, 0.8-1 part of antioxidant, 0.1-0.3 part of corrosion inhibitor, 0.3-0.5 part of thixotropic agent, 0.5-0.7 part of surfactant and 88-92 parts of deionized water.

7. The environmentally friendly flux according to claim 6, wherein the antioxidant is one of ascorbic acid, p-diphenol, and catechol.

8. The environmental protection flux according to claim 6, wherein the thixotropic agent is one of organobentonite, hydrogenated castor oil and fumed silica.

9. The method for preparing the environmental-friendly soldering flux according to any one of claims 1 to 8, comprising the following steps of:

preparing a compound active substance;

adding the compound active substance, deionized water, the adjuvant and the surfactant with corresponding mass into a reaction container in sequence, stirring at 40-60 ℃, uniformly mixing, and filtering to obtain the environment-friendly soldering flux.

Technical Field

The invention belongs to the technical field of soldering flux, and particularly relates to environment-friendly soldering flux and a preparation method thereof.

Background

The soldering flux is an auxiliary material for ensuring successful soldering, and is used for reducing the surface tension of the soldered material and removing oxides on the surface of the soldered material and the solder. At present, a soldering flux used in a welding process mainly comprises additives such as rosin, resin, halide activator and the like, residues are easy to exist after the soldering of the soldering flux, so that the problems of reduction of electrical insulating property of a soldered product and the like are easily caused after the soldering, the soldering flux needs to be cleaned after the soldering flux is used, the labor and the production cost are increased, and meanwhile, a cleaning agent for cleaning is not beneficial to environmental protection.

The existing cleaning-free soldering flux has the main raw materials of organic solvents and the like, and has less residues and no corrosion after welding. The traditional cleaning-free soldering flux usually takes alcohols as a solvent, the alcohols are volatile and flammable, and potential safety hazards are easy to occur and the cleaning-free soldering flux is not environment-friendly in the spraying process. At present, deionized water is used for replacing alcohols as a solvent, but the surface tension of water is large, so that the wettability of the water is poor, and the welding is not facilitated.

Disclosure of Invention

The invention aims to provide an environment-friendly soldering flux and a preparation method thereof, so as to solve the problems in the background technology.

In order to achieve the purpose, the invention provides an environment-friendly soldering flux which comprises the following components in parts by weight:

2-4 parts of compound active substance, 4.2-5.8 parts of auxiliary agent, 0.5-0.7 part of surfactant and 88-92 parts of deionized water;

the surfactant comprises polyacrylamide and sucrose ester;

the compound active substance is obtained by adjusting the pH value of organic acid through organic amine and then coating compound resin, wherein the compound resin is a mixture of acrylic resin and polyvinyl chloride resin.

As a further scheme of the invention: the mass ratio of the acrylic resin to the polyvinyl chloride resin in the compound resin is 1.4-1.6: 1.

as a further scheme of the invention: the organic acid is one or two of succinic acid, glutaric acid, adipic acid and malic acid, and the organic amine is triethanolamine.

As a further scheme of the invention: the mass ratio of the organic acid to the organic amine to the compound resin is 2-4: 1-3: 8.

as a further scheme of the invention: the auxiliary agent comprises a film forming agent, an antioxidant, a corrosion inhibitor and a thixotropic agent.

As a further scheme of the invention: the adhesive comprises the following components in parts by weight:

2-4 parts of compound active substance, 3-5 parts of film forming agent, 0.8-1 part of antioxidant, 0.1-0.3 part of corrosion inhibitor, 0.3-0.5 part of thixotropic agent, 0.5-0.7 part of surfactant and 88-92 parts of deionized water.

As a further scheme of the invention: the antioxidant is one of ascorbic acid, p-diphenol and catechol.

As a further scheme of the invention: the thixotropic agent is one of organic bentonite, hydrogenated castor oil and fumed silica.

The preparation method of the environment-friendly soldering flux comprises the following steps:

preparing a compound active substance;

adding the compound active substance, deionized water, the adjuvant and the surfactant with corresponding mass into a reaction container in sequence, stirring at 40-60 ℃, uniformly mixing, and filtering to obtain the environment-friendly soldering flux.

In summary, due to the adoption of the technical scheme, the method has the following beneficial effects:

the invention provides an environment-friendly soldering flux and a preparation method thereof, the environment-friendly soldering flux is environment-friendly, is clean after welding, has no residue and is free from cleaning, and the preparation method is simple and the production cost is low; the environmental-friendly soldering flux disclosed by the invention takes polyacrylamide and sucrose ester as surfactants, and because the polyacrylamide molecular chain contains carboxyl, the environmental-friendly soldering flux has the effect of reducing surface tension and is beneficial to improving the wettability of water; the solid in the system is uniformly dispersed and can be stabilized, the molecular chain of the sucrose ester contains OH groups, the sucrose ester has hydrophilicity, can effectively reduce the surface activity of water, and has good dispersibility and antibacterial property, so that the compounded active substance is uniformly dispersed in the system; the compound active substance can reduce corrosivity by carrying out acid-base regulation on organic acid through organic amine, and a product generated by the organic acid and the organic amine can be decomposed into the original organic acid and the original organic amine during welding, so that the activity can be fully exerted; the complex active substance can be kept stable at normal temperature and high activity at high temperature by coating the complex resin, and the complex resin is beneficial to use.

Detailed Description

Example 1

Preparing a compound active substance: the mass ratio of the organic acid to the triethanolamine to the compound resin is 2: 1: mixing the succinic acid and the malic acid to ensure that the mass ratio of the succinic acid to the malic acid is 1: 1, then adding water with the same weight as the triethanolamine, uniformly stirring at 50 ℃, stirring for 40min, then adding a mixture of acrylic resin and polyvinyl chloride resin, wherein the mass ratio of the acrylic resin to the polyvinyl chloride resin is 1.4: 1, raising the temperature to 80 ℃, fully stirring for 5 hours, then cooling and stirring for 3 hours, filtering, then drying, crushing and grinding, and sieving with a 200-mesh sieve to obtain the compound active substance.

Weighing raw materials in corresponding weight: 20g of compound active substance, 30g of film forming agent, 8g of antioxidant, 1g of corrosion inhibitor, 3g of thixotropic agent, 5g of surfactant and 880g of deionized water; the film forming agent is polyoxyethylene, the antioxidant is ascorbic acid, the corrosion inhibitor is benzotriazole, and the thixotropic agent is organic bentonite; the surfactant is a mixture of polyacrylamide and sucrose ester, and the mass ratio of the polyacrylamide to the sucrose ester is 1.4: 1.

adding the compound active substance, the deionized water, the adjuvant and the surfactant with corresponding mass into a reaction container in sequence, stirring at 40 ℃, uniformly mixing until the compound active substance, the deionized water, the adjuvant and the surfactant are completely dissolved, and then filtering to obtain the environment-friendly soldering flux.

Example 2

Preparing a compound active substance: the mass ratio of the organic acid to the triethanolamine to the compound resin is 2: 1: mixing the succinic acid and the malic acid to ensure that the mass ratio of the succinic acid to the malic acid is 1: 1, then adding water with the same weight as the triethanolamine, uniformly stirring at 50 ℃, stirring for 40min, then adding a mixture of acrylic resin and polyvinyl chloride resin, wherein the mass ratio of the acrylic resin to the polyvinyl chloride resin is 1.4: 1, raising the temperature to 80 ℃, fully stirring for 5 hours, then cooling and stirring for 3 hours, filtering, then drying, crushing and grinding, and sieving with a 200-mesh sieve to obtain the compound active substance.

Weighing raw materials in corresponding weight: 25g of compound active substance, 35g of film forming agent, 8.5g of antioxidant, 1.5g of corrosion inhibitor, 3.5g of thixotropic agent, 5.5g of surfactant and 890g of deionized water; the film forming agent is polyoxyethylene, the antioxidant is ascorbic acid, the corrosion inhibitor is benzotriazole, and the thixotropic agent is organic bentonite; the surfactant is a mixture of polyacrylamide and sucrose ester, and the mass ratio of the polyacrylamide to the sucrose ester is 1.4: 1.

adding the compound active substance, the deionized water, the adjuvant and the surfactant with corresponding mass into a reaction container in sequence, stirring at 40 ℃, uniformly mixing until the compound active substance, the deionized water, the adjuvant and the surfactant are completely dissolved, and then filtering to obtain the environment-friendly soldering flux.

Example 3

Preparing a compound active substance: the mass ratio of the organic acid to the triethanolamine to the compound resin is 2: 1: mixing the succinic acid and the malic acid to ensure that the mass ratio of the succinic acid to the malic acid is 1: 1, then adding water with the same weight as the triethanolamine, uniformly stirring at 55 ℃, stirring for 50min, then adding a mixture of acrylic resin and polyvinyl chloride resin, wherein the mass ratio of the acrylic resin to the polyvinyl chloride resin is 1.4: 1, raising the temperature to 80 ℃, fully stirring for 5.5 hours, then cooling and stirring for 3.5 hours, filtering, then drying, crushing and grinding, and sieving with a 200-mesh sieve to obtain the compound active substance.

Weighing raw materials in corresponding weight: 30g of compound active substance, 40g of film forming agent, 9g of antioxidant, 2g of corrosion inhibitor, 4g of thixotropic agent, 6g of surfactant and 900g of deionized water; the film forming agent is polyoxyethylene, the antioxidant is ascorbic acid, the corrosion inhibitor is benzotriazole, and the thixotropic agent is organic bentonite; the surfactant is a mixture of polyacrylamide and sucrose ester, and the mass ratio of the polyacrylamide to the sucrose ester is 1.4: 1.

adding the compound active substance, deionized water, the adjuvant and the surfactant with corresponding mass into a reaction container in sequence, stirring at 50 ℃, uniformly mixing until the compound active substance, the deionized water, the adjuvant and the surfactant are completely dissolved, and then filtering to obtain the environment-friendly soldering flux.

Example 4

Preparing a compound active substance: the mass ratio of the organic acid to the triethanolamine to the compound resin is 2: 1: mixing the succinic acid and the malic acid to ensure that the mass ratio of the succinic acid to the malic acid is 1: 1, then adding water with the same weight as the triethanolamine, uniformly stirring at 55 ℃, stirring for 50min, then adding a mixture of acrylic resin and polyvinyl chloride resin, wherein the mass ratio of the acrylic resin to the polyvinyl chloride resin is 1.4: 1, raising the temperature to 80 ℃, fully stirring for 5.5 hours, then cooling and stirring for 3.5 hours, filtering, then drying, crushing and grinding, and sieving with a 200-mesh sieve to obtain the compound active substance.

Weighing raw materials in corresponding weight: 35g of compound active substance, 45g of film forming agent, 9.5g of antioxidant, 2.5g of corrosion inhibitor, 4.5g of thixotropic agent, 6.5g of surfactant and 910g of deionized water; the film forming agent is polyoxyethylene, the antioxidant is ascorbic acid, the corrosion inhibitor is benzotriazole, and the thixotropic agent is organic bentonite; the surfactant is a mixture of polyacrylamide and sucrose ester, and the mass ratio of the polyacrylamide to the sucrose ester is 1.4: 1.

adding the compound active substance, deionized water, the adjuvant and the surfactant with corresponding mass into a reaction container in sequence, stirring at 50 ℃, uniformly mixing until the compound active substance, the deionized water, the adjuvant and the surfactant are completely dissolved, and then filtering to obtain the environment-friendly soldering flux.

Example 5

Preparing a compound active substance: the mass ratio of the organic acid to the triethanolamine to the compound resin is 2: 1: mixing the succinic acid and the malic acid to ensure that the mass ratio of the succinic acid to the malic acid is 1: 1, then adding water with the same weight as the triethanolamine, uniformly stirring at 60 ℃, stirring for 60min, then adding a mixture of acrylic resin and polyvinyl chloride resin, wherein the mass ratio of the acrylic resin to the polyvinyl chloride resin is 1.6: 1, raising the temperature to 80 ℃, fully stirring for 6 hours, then cooling and stirring for 4 hours, filtering, then drying, crushing and grinding, and sieving with a 200-mesh sieve to obtain the compound active substance.

Weighing raw materials in corresponding weight: 40g of compound active substance, 50g of film forming agent, 10g of antioxidant, 3g of corrosion inhibitor, 5g of thixotropic agent, 7g of surfactant and 920g of deionized water; the film forming agent is polyoxyethylene, the antioxidant is ascorbic acid, the corrosion inhibitor is benzotriazole, and the thixotropic agent is organic bentonite; the surfactant is a mixture of polyacrylamide and sucrose ester, and the mass ratio of the polyacrylamide to the sucrose ester is 1.4: 1.

adding the compound active substance, the deionized water, the adjuvant and the surfactant with corresponding mass into a reaction container in sequence, stirring at 60 ℃, uniformly mixing until the compound active substance, the deionized water, the adjuvant and the surfactant are completely dissolved, and then filtering to obtain the environment-friendly soldering flux.

Example 6

Compared with the example 3, the preparation method of the present example is the same, and part of the data are different, wherein the difference is that the mass ratio of the organic acid, the triethanolamine and the compound resin is 3: 2: 8.

example 7

Compared with the example 3, the preparation method of the present example is the same, and part of the data are different, wherein the difference is that the mass ratio of the organic acid, the triethanolamine and the compound resin is 4: 3: 8.

example 8

The preparation method of the present example is the same as that of example 3, and the data is partially different, except that the mass ratio between the polyacrylamide and the sucrose ester is 1.45: 1.

example 9

The preparation method of the present example is the same as that of example 3, and the data is partially different, except that the mass ratio between the polyacrylamide and the sucrose ester is 1.5: 1.

example 10

The preparation method of the present example is the same as that of example 3, and the data is partially different, except that the mass ratio between the polyacrylamide and the sucrose ester is 1.55: 1.

example 11

The preparation method of the present example is the same as that of example 3, and the data is partially different, except that the mass ratio between the polyacrylamide and the sucrose ester is 1.6: 1.

example 12

In this example, the preparation method is the same as that in example 9, and part of the raw materials are different from each other, except that the organic acid is succinic acid.

Example 13

In this example, the preparation method is the same as that of example 9, and a part of raw materials are different from each other, except that the organic acid is glutaric acid.

Example 14

Compared with the example 9, the preparation method of the present example is the same, and some raw materials are different, except that the organic acid is a mixture between glutaric acid and malic acid, and the mass ratio between the glutaric acid and the malic acid is 1: 1.

example 15

In this embodiment, the preparation method is the same as that of embodiment 9, and some raw materials are different, except that the antioxidant is p-diphenol.

Example 16

In this embodiment, the preparation method is the same as that in embodiment 9, and some raw materials are different, except that the antioxidant is catechol.

Example 17

This example was prepared in the same manner as example 9, but with a different starting material, in that the thixotropic agent was hydrogenated castor oil.

Example 18

This example was conducted in the same manner as example 9 except that the thixotropic agent was fumed silica, and part of the starting materials were different.

Comparative example 1

Compared with the embodiment 9, the compound active substance in the comparative example is not subjected to compound treatment, the compound active substance is a mixture of succinic acid and malic acid, and the mass ratio of the succinic acid to the malic acid is 1: 1; the remaining steps were the same as in the preparation of example 9.

Comparative example 2

The preparation method of the comparative example is the same as that of the example 9, and the surfactant in the comparative example is not added with polyacrylamide, but only sucrose ester.

Comparative example 3

The preparation method of the comparative example is the same as that of the example 9, and the surfactant in the comparative example is not added with sucrose ester, but only polyacrylamide.

Comparative example 4

This comparative example was prepared in the same manner as example 9, and no surfactant was added.

Performance testing

The performance of the flux prepared in the above examples and comparative examples was tested, and the results are shown in table 1.

TABLE 1

In summary, the following steps: the invention provides an environment-friendly soldering flux and a preparation method thereof, wherein the environment-friendly soldering flux takes polyacrylamide and sucrose ester as surfactants, and because the polyacrylamide molecular chain contains carboxyl, the environment-friendly soldering flux has the function of reducing surface tension and is beneficial to improving the wettability of water; the solid in the system is uniformly dispersed and can be stabilized, the molecular chain of the sucrose ester contains OH groups, the sucrose ester has hydrophilicity, can effectively reduce the surface activity of water, and has good dispersibility and antibacterial property, so that the compounded active substance is uniformly dispersed in the system; the compound active substance can reduce corrosivity by carrying out acid-base regulation on organic acid through organic amine, and a product generated by the organic acid and the organic amine can be decomposed into the original organic acid and the original organic amine during welding, so that the activity can be fully exerted; the complex active substance can be kept stable at normal temperature and high activity at high temperature by coating the complex resin, and the complex resin is beneficial to use.

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