阅读说明：本技术 光伏组件、光伏组件的加工装置及加工工艺 (Photovoltaic module, processing device and processing technology of photovoltaic module ) 是由 张巧华 于 2021-08-13 设计创作，主要内容包括：本发明公开了一种光伏组件、光伏组件的加工装置及加工工艺,其中,加工装置,包括：电源装置,所述电源装置用于输出直流电流,所述电源装置上设有至少一组正负极；以及至少两根导电线,所述导电线用于连接电源装置和待处理组件,每根导电线分别与所述正负极连接；以及温感控制模组,用于检测待处理组件以及电源装置的温度,并根据检测的温度与设定温度进行对比从而对所述电源装置的电流进行调节；通过该加工装置能够让光伏组件在层压过程中进行电注入,同时在层压的过程中通过检测温度来对电源装置的电流进行调节,这样能够有效的解决层压过程中的衰减问题,同时也解决了光伏组件层压完冷却期间的衰减问题,消除高温暗态对异质结电池效率恶化的影响。(The invention discloses a photovoltaic module, a processing device of the photovoltaic module and a processing technology, wherein the processing device comprises: the power supply device is used for outputting direct current and is provided with at least one group of positive and negative electrodes; the electric leads are used for connecting a power supply device and a component to be processed, and each electric lead is respectively connected with the positive electrode and the negative electrode; the temperature sensing control module is used for detecting the temperatures of the component to be processed and the power supply device and comparing the detected temperature with a set temperature so as to adjust the current of the power supply device; can let photovoltaic module carry out the electricity injection at the lamination in-process through this processingequipment, come power supply unit's electric current to adjust through the detection temperature at the in-process of lamination simultaneously, can effectually solve the decay problem among the lamination like this, also solved the decay problem of photovoltaic module lamination completion during the cooling period simultaneously, eliminate the influence that high temperature dark state worsened heterojunction battery efficiency.)

1. A photovoltaic module's processingequipment which characterized in that includes:

the power supply device is used for outputting direct current and is provided with at least one group of positive and negative electrodes; and

the electric leads are used for connecting a power supply device and a component to be processed, and each electric lead is respectively connected with the positive electrode and the negative electrode; and

and the temperature sensing control module is used for detecting the temperature of the component to be processed and the power supply device and comparing the detected temperature with a set temperature so as to adjust the output current of the power supply device.

2. The processing device as claimed in claim 1, wherein the output voltage of the power supply device is 10-380V and the output current is 0.5-20A.

3. The processing apparatus according to claim 1, wherein: the set temperature of the temperature sensing control module is 40-320 ℃.

4. The processing apparatus as set forth in claim 1, further comprising: the heat insulation module is used for bearing and wrapping the power supply device, the conducting wire and the temperature sensing control module.

5. A processing method of a photovoltaic module is characterized by comprising the following steps:

connecting a plurality of solar cells in series and parallel to form a cell string;

laying component packaging materials on the upper part and the lower part of the battery string, forming a stacking object through calibration and positioning, and welding a component bus bar; the stacked object sequentially comprises front packaging glass, a packaging adhesive film, a silicon heterojunction solar cell string, a packaging adhesive film, a back plate or back packaging glass from bottom to top;

connecting positive and negative electrodes of the power supply device according to any one of claims 1 to 3 to bus bar lead-out lines;

putting the stacked object connected with the power supply into a laminating machine to finish a laminating process; in the laminating process, the laminating heating temperature is 40-320 ℃, the laminating time is 5-100min, and when the temperature sensing control module of any one of claims 1-3 detects that the temperature of the stacked object is not in the range, the power supply device is controlled to be powered off;

and unloading the power supply device, and continuously completing the subsequent assembly process of the photovoltaic module to form a finished photovoltaic module product.

6. The processing method according to claim 5, characterized in that: the solar cell includes, but is not limited to, a heterojunction solar cell, including a solar cell with an N-type substrate and a solar cell with a P-type substrate.

7. The processing method according to claim 5, characterized in that: the front surface packaging glass or the back surface packaging glass of the solar cell is one or more of tempered glass, semi-tempered glass or conventional glass, and the thickness of the front surface packaging glass or the back surface packaging glass is 0.2-4 mm.

8. The processing method according to claim 5, characterized in that: the series-parallel connection mode comprises one or more of welding, conductive adhesive bonding, conductive adhesive film bonding, smart wire and shingle series connection.

9. The processing method according to claim 5, characterized in that: the material of the packaging adhesive film comprises one or more of ethylene-vinyl acetate copolymer, ethylene-octene copolymer and thermoplastic polyolefin; the back plate is one or more of a white back plate, a black back plate or a transparent back plate.

10. A photovoltaic module, characterized by: the photovoltaic module is processed by the processing method of the photovoltaic module as claimed in any one of claims 5 to 9.

Technical Field

The invention relates to the field of photovoltaic modules, in particular to a photovoltaic module, a processing device of the photovoltaic module and a processing technology of the photovoltaic module.

Background

In the previous research, hydrogenated amorphous silicon (a-Si: H) is subject to light induced degradation due to the so-called Staebler-Wronski effect, which is believed to be closely related to the large amount of free hydrogen contained in the a-Si network. In the silicon heterojunction solar cell, the amorphous silicon layer contains a large number of hydrogen bonds and silicon dangling bonds, so that the function of passivating the crystalline silicon interface can be well played, and the open-circuit voltage (Voc) and the photoelectric conversion efficiency of the solar cell are improved. The highest temperature in the whole preparation process of the silicon heterojunction solar cell is less than 250 ℃, and the passivation effect of amorphous silicon can be damaged by the high temperature after deposition in the amorphous silicon layer, so that the conversion efficiency of the cell is reduced. However, recent studies have shown that light can enhance a-Si: passivation effect of H. According to our investigation results, reports on the influence of strong illumination on solar cells are few, and detailed research on commercial HJT solar cells is rare.

Along with the pursuit of high conversion efficiency of heterojunction cells by technicians in the industry, various efficiency improvement technologies are also successively proposed. Researches in two years show that under the condition that the temperature is lower than 280 ℃, the passivation effect of amorphous silicon can be improved by the strong illumination of the LED, and the conversion efficiency of the heterojunction battery is further improved. At present, mature LED equipment and technology exist, and the efficiency of the silicon heterojunction solar cell is improved. However, it has been found through a series of studies that this efficiency increase is attenuated when the dark state is heated. That is, improving the conversion efficiency at the battery end does not mean obtaining the optimum power after manufacturing the assembly. Throughout the entire process from production to assembly of a heterojunction cell, the attenuation of the cell is the most severe when the lamination process is performed in a laminator. Through repeated verification in batches, efficiency attenuation occurs when the heterojunction battery subjected to LED illumination efficiency improvement passes through a laminating machine, based on calculation of 166-sized battery pieces and 72-type components, when the attenuation amplitude is 0.15-0.65% (absolute value), the power of the components is affected by 2-10W, namely the power reduction amplitude is about 2%, and the large-amplitude attenuation is worthy of focus. The existing heterojunction laminating equipment in the market does not take the consideration of the problem, so that a plurality of defects exist in overcoming the problem of dark state attenuation, and the existing laminating machine structure does not take the consideration of the phenomenon, so that a scheme which is compatible with the existing equipment, simple in operation and easy to implement is urgently needed in the photovoltaic market to solve the problem of dark state attenuation of the battery.

The method for increasing the electric injection of the existing photovoltaic module processing technology is to arrange positive and negative conductive metal foils on high-temperature cloth of a conventional laminating machine, and arrange tool probes on a feeding platform and a vacuum pumping cavity of the conventional laminating machine and on a metal beam at the joint of the vacuum pumping cavity and a laminating cavity, so as to synchronously carry out electric injection treatment during lamination. This process takes into account the fact that the components are handled during lamination, and the handling is stopped after leaving the lamination chamber. One important issue that is ignored by the fabrication process is that the component is also experiencing "dark state high temperature" during cooling. We need not only to overcome the attenuation problem during lamination, but also pay more attention to the attenuation problem during the cooling period after the lamination of the assembly, and avoid the success loss of one step-short. The existing heterojunction laminating equipment in the market does not take the consideration of the problem, so that a plurality of defects exist in overcoming the problem of dark state attenuation, and the existing laminating machine structure does not take the consideration of the phenomenon, so that a scheme which is compatible with the existing equipment, simple in operation and easy to implement is urgently needed in the photovoltaic market to solve the problem of dark state attenuation of the battery.

Disclosure of Invention

In order to solve the problems, the invention provides a device for solving the high-temperature dark state attenuation of a photovoltaic module and a processing technology of the photovoltaic module, and relates to a simple and efficient solution for solving the problem of efficiency attenuation caused by a module laminating technology and other high-temperature dark state conditions. Through introducing a specific device, eliminate the influence that high temperature dark state worsened to heterojunction battery efficiency, guarantee solar cell's conversion efficiency in furthest, still have the function of improving solar cell's conversion efficiency, solve because of welding and the degradation problem that the lamination high temperature brought to solar cell passivation effect and conversion efficiency to promote solar cell module's output, compare in other methods, this kind of mode can be realized on current equipment, have advantages such as compatibility height, battery efficiency height, energy consumption are few.

In order to achieve the above object, a first aspect of the present invention provides a processing apparatus for a photovoltaic module, comprising:

the power supply device is used for outputting direct current and is provided with at least one group of positive and negative electrodes; the electric leads are used for connecting a power supply device and a component to be processed, and each electric lead is respectively connected with the positive electrode and the negative electrode; and the temperature sensing control module is used for detecting the temperatures of the component to be processed and the power supply device and comparing the detected temperature with a set temperature so as to adjust the output current of the power supply device.

As a preferable technical scheme, the output voltage of the power supply device is 10-380V, and the output current is 0.5-20A.

As a preferable technical scheme, the set temperature of the temperature sensing control module is 40-320 ℃.

As a preferable aspect, the processing apparatus further includes: the heat insulation module is used for bearing and wrapping the power supply device, the conducting wire and the temperature sensing control module.

On the other hand, the invention also provides a processing method of the photovoltaic module, which is characterized by comprising the following steps:

connecting a plurality of solar cells in series and parallel to form a cell string;

laying component packaging materials on the upper part and the lower part of the battery string, forming a stacking object through calibration and positioning, and welding a component bus bar; the stacked object sequentially comprises front packaging glass, a packaging adhesive film, a silicon heterojunction solar cell string, a packaging adhesive film, a back plate or back packaging glass from bottom to top;

connecting the positive electrode and the negative electrode of a power supply device in the processing device to a bus bar lead-out wire;

putting the stacked object connected with the power supply into a laminating machine to finish a laminating process; in the laminating process, the laminating heating temperature is 40-320 ℃, the laminating time is 5-100min, and when the temperature sensing control module in the processing device detects that the temperature of the stacked object is not in the range, the power supply device is controlled to be powered off;

and unloading the power supply device, and continuously completing the subsequent assembly process of the photovoltaic module to form a finished photovoltaic module product.

As a preferred technical solution, the solar cell includes, but is not limited to, a heterojunction solar cell, including a solar cell with an N-type substrate and a solar cell with a P-type substrate.

According to a preferable technical scheme, the front side packaging glass or the back side packaging glass of the solar cell is one or more of tempered glass, semi-tempered glass or conventional glass, and the thickness of the front side packaging glass or the back side packaging glass is 0.2-4 mm.

As a preferable technical scheme, the series-parallel connection mode comprises one or more of welding, conductive adhesive bonding, conductive adhesive film bonding, smart and shingle series connection.

As a preferable technical scheme, the material of the packaging adhesive film comprises one or more of ethylene-vinyl acetate copolymer, ethylene-octene copolymer and thermoplastic polyolefin; the back plate is one or more of a white back plate, a black back plate or a transparent back plate.

In another aspect, the invention also provides a photovoltaic module, which is processed by the processing method of the photovoltaic module as claimed in any one of claims 5 to 9.

Compared with the prior art, the invention has the beneficial effects that:

1. the photovoltaic assembly carries out electric injection in the laminating process, and simultaneously adjusts the output current of the power supply device by detecting the temperature in the laminating process, so that the attenuation problem in the laminating process can be effectively solved, the attenuation problem of the photovoltaic assembly during the cooling after lamination is finished is also solved, the influence of a high-temperature dark state on the efficiency deterioration of the heterojunction battery is eliminated, the power of the assembly is improved, the existing data show that after the power supply device is used, the power gain of the assembly is 1.5-9W, and the income is very considerable.

2. The power supply device provided by the invention is convenient to install and use on the existing machine, when the power supply device is an external power supply, the current output is stable, and the power can be improved through simple modification; when power supply unit is for dismantling, portable, small portable equipment, can lug connection on the subassembly, along with the subassembly removes, on the basis that does not change the original design of lamination equipment, promote subassembly power by a wide margin, maneuverability is strong, easy operation is fit for direct leading-in batches.

3. After the device and the technology provided by the invention are adopted to process the assembly, the poor recombination of impurities and defects in the base material can be effectively inhibited, and the attenuation condition caused by defect recombination in the subsequent use process is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a solar cell according to an embodiment of the present invention;

fig. 2 is a schematic view of a solar module according to an embodiment of the present invention;

fig. 3 is a schematic view of a solar module according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a power supply device connected to a solar module according to an embodiment of the present invention;

fig. 5 is a schematic diagram of a power supply device connected to a solar module according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The embodiment firstly provides a processing device of a photovoltaic module, which comprises a power module, a conductive wire, a heat insulation module, a temperature sensing control module and the like.

The power supply module can output direct current, the voltage is controlled to be 10-380V, the output current is 0.5-20A, and as shown in fig. 4, three groups of positive and negative electrodes are arranged on the power supply module; the anode and the cathode can be connected with 1-10 assemblies to be processed, and the processing assemblies can be stacked or tiled;

it should be noted that the power module mentioned in the present invention may be an external power supply of the machine, and may also be an independent current output device; in this embodiment, the power module employs an external power source.

The electric lead is used for connecting the power supply module and the component to be processed, and a closed loop is formed between the power supply module and the component to be processed after the connection through the electric lead; the power module can be connected with at least two conductive wires, and similarly, the power module can form at least one power module-to-be-processed component loop;

the heat insulation and preservation module is used for bearing and wrapping the power supply module, the conducting wire and the temperature sensing control module, and ensures that a power supply and other devices are not damaged under the conditions of vacuum, high temperature and pressure; in the embodiment, the heat insulation module is made of heat insulation materials, and the specific structure and shape can be determined by actual requirements, such as polystyrene, SiO2 aerogel, floating beads and the like.

The temperature sensing control module can accurately detect the temperature of the assembly and the power supply module, and on one hand, the power is cut off when the temperature is higher than a set high temperature state, so that the purpose of protecting the power supply device is achieved, and the use safety is ensured; on the other hand, the power is automatically cut off under the condition of being lower than the set temperature, so that the invalid output is reduced, and the service life of the device is prolonged; by introducing the temperature sensing control module, the power-on and power-off conditions can be set, so that the whole process becomes controllable and efficient, and the continuous dark-state high-temperature environment in the laminator can be well coped with. As long as the processing method for controlling the power supply and the components to be powered on or off or adjusting the output current through temperature sensing is involved, the protection scope of the patent shall be regarded; for example, in this embodiment, the temperature sensing control module may adopt a conventional temperature controller on the market, and the current adjustment may be performed by a current regulator, or may be implemented by a low-cost design of a temperature sensor, a single chip, and a relay.

The following introduces a processing technology of the photovoltaic module, which is a method for processing the photovoltaic module by using the processing device.

Example 1

The embodiment relates to a processing method of a photovoltaic module, which comprises the following steps:

1) first, a heterojunction solar cell is prepared

A166-size N-type monocrystalline silicon wafer is used as a substrate to prepare a back-emitting heterojunction solar cell, the front surface is N-type, the back surface is p-type, and the front surface and the back surface of light incidence are sequentially as follows: the solar cell comprises a front metal grid line electrode, a Transparent Conductive Oxide (TCO) layer, an N-type amorphous silicon layer (N-Si: H), an intrinsic amorphous silicon layer (i-Si: H), N-type crystalline silicon (c-Si), an intrinsic amorphous silicon layer (i-Si: H), a P-type amorphous silicon layer (P-Si: H), a Transparent Conductive Oxide (TCO) layer and a back metal grid line electrode, and the cell structure is shown in figure 1. And performing light injection treatment on the obtained silicon heterojunction solar cell, wherein the step can improve the conversion efficiency of the cell.

2) The silicon heterojunction solar cell is connected in series and in parallel to form a silicon heterojunction solar cell string: and cutting the heterojunction solar cell into half pieces, and performing welding series-parallel connection, wherein the welding can adopt manual welding or infrared machine welding, the heating temperature of a welding bottom plate is 150-160 ℃, the welding temperature is 230 ℃, and the time is 2-5 s. The metal solder strip can be a conventional tin-lead solder strip, and can also be a low-temperature alloy coating solder strip made of tin-lead , tin silver, tin and the like, and the shape of the solder strip is round, flat and triangular, but is not limited to the shape of the solder strip. Preferably, the battery is welded by an infrared lamp tube machine, the heating temperature of a welding bottom plate is 150 ℃, the welding temperature is 200 ℃, the time is 2s, and the adopted welding strip is a welding strip with a copper strip coated with tin-lead low-temperature alloy;

3) laying component packaging materials to form a stack, as shown in fig. 2, wherein the stack is formed by front packaging glass, a packaging adhesive film, a silicon heterojunction solar cell string, a packaging adhesive film, a back plate or back packaging glass from bottom to top; and paving front packaging glass and packaging adhesive films, positioning and placing the silicon heterojunction solar cell strings on the packaging adhesive films, and performing series-parallel connection on the cell strings by adopting bus bars, wherein three groups of bus bars are provided. And then sequentially laying an encapsulation adhesive film and a back plate or back surface encapsulation glass on the silicon heterojunction solar cell string. The front surface packaging glass or the back surface packaging glass is tempered glass, semi-tempered glass or conventional glass, the thickness of the front surface packaging glass or the back surface packaging glass is 0.2-0.4mm, and the glass can have the embossing lock film ultra-white characteristic or not; the material of the packaging adhesive film comprises at least one of ethylene vinyl acetate copolymer (EVA), ethylene-octene copolymer (POE) and thermoplastic polyolefin light (TPO); the back plate is a white back plate, a black back plate or a transparent back plate;

4) in order to solve the attenuation problem caused by the continuous dark state high-temperature environment in the laminator, the positive electrode and the negative electrode of the power supply device are respectively connected to three groups of bus bar lead-out wires, and as shown in fig. 4, the output current of the power supply device is set to be 8A; setting the power-off temperature to 65 ℃;

5) putting the stacked object connected with the power supply into a laminating machine to finish a laminating process; the laminating temperature is controlled at 150 ℃; vacuumizing the upper vacuum chamber and the lower vacuum chamber for 8 min; inflating the upper vacuum chamber, keeping the lower vacuum chamber in a vacuum state, keeping the upper vacuum chamber at a pressure difference of 50KPa to the lower vacuum chamber, and laminating for 30 min; vacuumizing the upper vacuum chamber, and inflating the lower vacuum chamber to atmospheric pressure;

6) taking out the laminated part, and automatically powering off the power supply device when the temperature of the assembly is reduced to a set power-off temperature; and unloading the power supply device, and continuing to finish the subsequent assembly process of the heterojunction assembly to form a finished product of the heterojunction assembly.

7) The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

Example 2

The present embodiment relates to a method for processing a photovoltaic module, and is different from embodiment 1 in that, in step 1), the heterojunction solar cell is not subjected to a light injection process. The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

Example 3

The difference between this embodiment and embodiment 1 is that, in step 2), the heterojunction solar cell is not sliced, and the module is formed by series welding the whole cell, and the shape of the module is as shown in fig. 3. The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

Example 4

The present embodiment is different from embodiment 1 in that, in step 4), there is one set of bus bar outgoing lines of the heterojunction solar cell module stack layer, and one set of positive and negative electrodes of the power supply device are connected to one set of bus bar outgoing lines, as shown in fig. 5. The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

Example 5

This embodiment is different from embodiment 1 in that the output current of the power supply device is set to 10A in step 4). The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

Example 6

This embodiment is different from embodiment 1 in that the power-off temperature of the power supply device is set to 60 ℃ in step 4). The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

Example 7

The difference between this embodiment and embodiment 1 is that the power supply device used is an external power supply fixed on the laminator, and the positive and negative electrodes of the power supply device are respectively connected to the three sets of bus bar lead-out wires through conductive wires. The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

Comparative example 1

In the present comparative example, a heterojunction battery and an efficiency stage consistent with those of example 1 were selected, and the assembly was prepared without being processed by the power supply device described in this patent, and the specific assembly preparation method was:

1) first, a heterojunction solar cell is prepared

A166-size N-type monocrystalline silicon wafer is used as a substrate to prepare a back-emitting heterojunction solar cell, the front surface is N-type, the back surface is p-type, and the front surface and the back surface of light incidence are sequentially as follows: the solar cell comprises a front metal grid line electrode, a Transparent Conductive Oxide (TCO) layer, an N-type amorphous silicon layer (N-Si: H), an intrinsic amorphous silicon layer (i-Si: H), N-type crystalline silicon (c-Si), an intrinsic amorphous silicon layer (i-Si: H), a P-type amorphous silicon layer (P-Si: H), a Transparent Conductive Oxide (TCO) layer and a back metal grid line electrode, and the cell structure is shown in figure 1. And performing light injection treatment on the obtained silicon heterojunction solar cell, wherein the step can improve the conversion efficiency of the cell.

2) The silicon heterojunction solar cell is connected in series and in parallel to form a silicon heterojunction solar cell string: and cutting the heterojunction solar cell into half pieces, and performing welding series-parallel connection, wherein the welding can adopt manual welding or infrared machine welding, the heating temperature of a welding bottom plate is 150-160 ℃, the welding temperature is 230 ℃, and the time is 2-5 s. The metal solder strip can be a conventional tin-lead solder strip, and can also be a low-temperature alloy coating solder strip made of tin-lead , tin silver, tin and the like, and the shape of the solder strip is round, flat and triangular, but is not limited to the shape of the solder strip. Preferably, the battery is welded by an infrared lamp tube machine, the heating temperature of a welding bottom plate is 150 ℃, the welding temperature is 200 ℃, the time is 2s, and the adopted welding strip is a welding strip with a copper strip coated with tin-lead low-temperature alloy;

3) laying component packaging materials to form a stack, as shown in fig. 2, wherein the stack is formed by front packaging glass, a packaging adhesive film, a silicon heterojunction solar cell string, a packaging adhesive film, a back plate or back packaging glass from bottom to top; and paving front packaging glass and packaging adhesive films, positioning and placing the silicon heterojunction solar cell strings on the packaging adhesive films, and performing series-parallel connection on the cell strings by adopting bus bars, wherein three groups of bus bars are provided. And then sequentially laying an encapsulation adhesive film and a back plate or back surface encapsulation glass on the silicon heterojunction solar cell string. The front surface packaging glass or the back surface packaging glass is tempered glass, semi-tempered glass or conventional glass, the thickness of the front surface packaging glass or the back surface packaging glass is 0.2-0.4mm, and the glass can have the embossing lock film ultra-white characteristic or not; the material of the packaging adhesive film comprises at least one of ethylene vinyl acetate copolymer (EVA), ethylene-octene copolymer (POE) and thermoplastic polyolefin light (TPO); the back plate is a white back plate, a black back plate or a transparent back plate;

4) putting the stacked object into a laminating machine to finish a laminating process; the laminating temperature is controlled at 150 ℃; vacuumizing the upper vacuum chamber and the lower vacuum chamber for 8 min; inflating the upper vacuum chamber, keeping the lower vacuum chamber in a vacuum state, keeping the upper vacuum chamber at a pressure difference of 50KPa to the lower vacuum chamber, and laminating for 30 min; vacuumizing the upper vacuum chamber, and inflating the lower vacuum chamber to atmospheric pressure;

5) and taking out the laminated part, and continuing to finish the subsequent assembly process of the heterojunction assembly to form a finished product of the heterojunction assembly.

6) The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

Comparative example 2

This comparative example is for the purpose of demonstrating the necessity of the temperature control module, and is different from example 1 in that, in step 6), the power supply device is powered off and unloaded immediately after the laminate is taken out, and the heterojunction assembly is continued to complete the subsequent assembly process to form a finished heterojunction assembly. The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

Comparative example 3

The difference between the comparative example and the comparative example 1 is that in the step 2), the heterojunction solar cell is not sliced, and the heterojunction solar cell is subjected to series welding through the whole cell, and the appearance of the module is shown in fig. 3. The 5 modules were processed according to this process, and the power data was measured for the resulting modules, and the data obtained by the experimental measurements are shown in table 1.

TABLE 1

Table 1 shows the power data of the corresponding modules of examples 1-7 and comparative examples 1-3. Shown in table 1: PM is the power (W) of the component, Voc is the open circuit voltage (V), Vpm is the maximum operating voltage (V), Isc is the short circuit current (mA), Ipm is the maximum operating voltage (V), and FF is the fill factor (%) of the component. As can be seen from the test data, the average power of the components of examples 1-2 and 4-7 can be increased by about 5W compared with that of comparative group 1, mainly from the significant increase of Voc and FF. Example 3 also has the advantage of power boost compared to comparative group 3. Comparative group 2 in comparison with comparative group 1, a power supply connection was added during lamination of the stack, but in the absence of the temperature control module of the example, the laminate in comparative group 2 was discharged immediately after exiting the laminator (when the laminate had a temperature of 70-100 c). From the test data, the power of the components of the comparison group 2 is close to that of the comparison group 1, and the effects of attenuation prevention and power improvement are not achieved, that is, only the power supply is connected, but the temperature control module is not connected for current control during cooling, so that the problem of low light intensity/dark state attenuation of the heterojunction battery component under the high-temperature condition cannot be solved, and the necessity of the temperature control module in the invention is verified. That is to say, the device and the preparation method of the heterojunction battery assembly provided by the invention can eliminate the influence of a high-temperature dark state on the efficiency deterioration of the heterojunction battery, realize the power improvement of the assembly and have considerable benefits.

In addition, this embodiment further provides a photovoltaic module, which is prepared by any one of the above embodiments 1 to 7, and since the specific structure and processing method of the photovoltaic module have been described in detail in the above embodiments, detailed description thereof is omitted here.

In summary, the invention provides a photovoltaic module, a processing device of the photovoltaic module and a processing technology, which can not only solve the problem of low light intensity/dark state attenuation of the heterojunction battery module under high temperature conditions to the maximum extent, but also realize the power improvement of the module, and simultaneously reduce the attenuation caused by defect recombination in the subsequent use process. As can be seen from the above embodiments, after the power supply device is used, the power gain of the component is obvious, and the benefit is considerable. The device provided by the invention has the characteristics of low investment, high return, strong compatibility and high reliability. The device for improving the power of the heterojunction module and the method for preparing the photovoltaic module by the device are not only suitable for the heterojunction battery module, but also suitable for other photovoltaic products such as heterojunction-IBC structure battery modules, IBC, TOPCON, PERC and the like.

It should be noted that the numerous details included in the above description are merely exemplary of the invention and are not limiting of the invention. In other embodiments of the invention, the method may have more, fewer, or different steps, and the order, inclusion, function, etc. of the steps may be different from that described and illustrated.