阅读说明：本技术 热传导部件和电子设备 (Heat conduction member and electronic device ) 是由 黄昱博 王证都 于 2020-05-15 设计创作，主要内容包括：提供热传导部件和电子设备。壳体具有第1板和与第1板对置地配置的第2板,在空间中,在所述第1板和第2板中的至少任意一方形成有通过热源可接触部的槽部。(A heat conductive member and an electronic device are provided. The case has a 1 st plate and a 2 nd plate disposed to face the 1 st plate, and a groove portion which is contactable by a heat source is formed in at least one of the 1 st plate and the 2 nd plate in the space.)

1. A heat conductive member having a heat source contactable portion contactable with a heat source, wherein,

the heat conduction member has:

a housing having a space therein;

a core structure disposed in the space; and

a working fluid disposed in the space,

the housing has a 1 st plate and a 2 nd plate disposed opposite to the 1 st plate,

in the space, a groove portion that can be contacted by the heat source is formed in at least one of the 1 st plate and the 2 nd plate.

2. The heat conducting member according to claim 1,

the heat source contactable portion has a heat source contact portion that contacts the heat source,

the groove portion passes through the heat source contact portion.

3. The heat conducting member according to claim 2,

the groove portion extends in a direction away from the heat source contact portion.

4. A heat conductive member, comprising:

a housing having a space therein;

a core structure disposed in the space; and

a working fluid disposed in the space,

the housing has:

a heating unit that absorbs heat from the outside to the inside of the housing;

a cooling unit that is disposed separately from the heating unit and cools the heat; and

a 1 st plate and a 2 nd plate disposed to face the 1 st plate,

a groove portion is provided in at least one of the 1 st plate and the 2 nd plate in the space,

the groove portion extends from the heating portion toward the cooling portion.

5. The heat conducting member according to claim 4,

the groove portion passes through the heating portion and the cooling portion.

6. A heat conductive member, comprising:

a housing having a space therein;

a core structure disposed in the space; and

a working fluid disposed in the space,

the housing has a 1 st plate and a 2 nd plate disposed opposite to the 1 st plate,

at least one of the 1 st plate and the 2 nd plate has a groove portion.

7. The heat conducting member according to claim 6,

the housing extends in the direction of the long side,

the groove portion extends in the longitudinal direction.

8. The heat-conducting member according to claim 6 or 7,

the housing has:

a heating unit that absorbs heat from the outside to the inside of the housing on one side in the longitudinal direction; and

a cooling unit that cools the heat at the other side in the longitudinal direction,

the groove portion passes through the heating portion.

9. The heat conducting member according to claim 8,

the groove portion passes through the cooling portion.

10. The heat-conducting member according to claim 8 or 9,

the housing has:

a 1 st region extending from one side to the other side in the longitudinal direction; and

a 2 nd region extending from the other side in the longitudinal direction of the 1 st region in a direction intersecting the longitudinal direction,

the 1 st region has the heating portion,

the 2 nd region has the cooling portion,

the groove portion passes through at least the 1 st region of the 1 st region and the 2 nd region.

11. The heat-conducting member according to any one of claims 1 to 10,

the groove portion extends continuously.

12. The heat conducting member according to any one of claims 1 to 11,

the groove part is provided with a plurality of grooves,

the plurality of grooves are arranged in parallel with each other.

13. The heat-conducting member according to any one of claims 1 to 12,

the edge of the groove is in contact with the core structure,

the bottom of the groove is opposed to the core structure with a gap therebetween.

14. The heat conducting member according to any one of claims 1 to 13,

the heat conduction member has a pillar portion disposed in at least one of the 1 st plate and the 2 nd plate in the space and extending toward the other plate,

the column part is provided with a plurality of column parts,

the width of the groove portion in the short side direction is smaller than the shortest distance between the adjacent pillar portions.

15. The heat conducting member according to claim 14,

the groove portions have a depth smaller than a length of the pillar portions in a direction in which the 1 st plate and the 2 nd plate are arranged.

16. The heat conducting member according to claim 14,

the groove portions have a depth equal to or greater than a length of the pillar portions in a direction in which the 1 st plate and the 2 nd plate are arranged.

17. The heat conducting member according to any one of claims 1 to 16,

the 1 st plate and the 2 nd plate have the groove portion.

18. An electronic device having the heat conductive member as recited in any one of claims 1 to 17.

Technical Field

The invention relates to a heat conduction member and an electronic device.

Background

Conventionally, a steam chamber has: a container having a cavity formed by one plate-like body and the other plate-like body facing the one plate-like body; a working fluid sealed in the cavity; and a core structure housed in the cavity (see, for example, patent document 1).

When the vapor chamber receives heat from the heating element, the liquid-phase working fluid sealed in the hollow portion changes from a liquid phase to a gas phase in the heat receiving portion, and the gas-phase working fluid after the phase change flows through the vapor flow path and moves from the heat receiving portion to the heat radiating portion of the vapor chamber. The working fluid in the gas phase that moves from the heat receiving unit to the heat radiating unit releases latent heat in the heat radiating unit, thereby changing from the gas phase to the liquid phase. The latent heat released by the heat dissipating portion is further released to the external environment of the vapor chamber. The working fluid that changes from the gas phase to the liquid phase in the heat radiating portion flows back from the heat radiating portion to the heat receiving portion by the capillary force of the core structure.

Patent document 1: japanese patent laid-open No. 2019-82264

In a conventional vapor chamber, for example, a core structure holds an operating fluid, and the operating fluid that changes from a gas phase to a liquid phase in a heat radiating portion flows back from the heat radiating portion to a heat receiving portion. That is, the core structure has a plurality of functions of holding the working fluid and transporting the working fluid from the heat radiating portion to the heat receiving portion. Therefore, it may be difficult to sufficiently ensure both the functions of holding the working fluid and conveying the working fluid from the heat radiating portion to the heat receiving portion in the core structure.

Disclosure of Invention

Accordingly, an object of the present invention is to provide a heat conduction member in which the functions of holding and transporting the working fluid are relatively improved.

An exemplary heat conduction member of the present invention has a heat source contactable portion contactable with a heat source, and includes: a housing having a space therein; a core structure disposed in the space; and a working fluid disposed in the space, wherein the housing includes a 1 st plate and a 2 nd plate disposed to face the 1 st plate, and a groove portion contactable with the heat source is formed in at least one of the 1 st plate and the 2 nd plate in the space.

An exemplary heat conduction member of the present invention includes: a housing having a space therein; a core structure disposed in the space; and a working fluid disposed in the space, the housing having: a heating unit that absorbs heat from the outside to the inside of the housing; a cooling unit that is disposed separately from the heating unit and cools heat; and a 1 st plate and a 2 nd plate disposed to face the 1 st plate, wherein at least one of the 1 st plate and the 2 nd plate has a groove portion in the space, and the groove portion extends from the heating portion toward the cooling portion.

An exemplary heat conduction member of the present invention includes: a housing having a space therein; a core structure disposed in the space; and a working fluid disposed in the space, wherein the housing includes a 1 st plate and a 2 nd plate disposed to face the 1 st plate, and at least one of the 1 st plate and the 2 nd plate includes a groove.

An exemplary electronic device of the present invention has a heat conductive member.

According to the heat conduction member of the present invention, the functions of holding the working fluid and feeding the working fluid to the heat source contactable portion can be relatively improved.

According to the heat conductive member of the present invention, the functions of holding the working fluid and transporting the working fluid from the heat radiating portion to the heat receiving portion can be relatively improved.

According to the electronic device of the present invention, it is possible to provide the heat conductive member which relatively improves the functions of holding the working fluid and transporting the working fluid from the heat radiating portion to the heat receiving portion.

Drawings

FIG. 1 is a sectional view of a heat conductive member of the present invention.

Fig. 2 is a plan view schematically showing the heat source contactable portion, the heat source contact portion, and the groove portion.

Fig. 3 is a plan view schematically showing the heating unit, the cooling unit, and the groove unit.

FIG. 4 is a top view of another embodiment of a thermally conductive member.

Fig. 5 is a schematic view showing a distance between adjacent pillar portions and a width of a groove portion.

Fig. 6 is an enlarged view of a part of the groove and the pillar.

Fig. 7 is a schematic view showing an electronic apparatus having a heat conductive member.

Description of the reference symbols

1: a 1 st plate; 2: a 2 nd plate; 3: a pillar portion; 4: a core structure; 5: a heat source contactable portion; 6: a heat source contact portion; 7: a groove part; 8A: region 1; 9A: a 2 nd region; 10: an electronic device; 100. 100A: a heat conductive member; 101: a housing; 102: a space; 103: a heating section; 104: a cooling section; ht: a heat source.

Detailed Description

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this specification, the heat conduction member 100 has a rectangular shape in a plan view, and the 1 st plate 1 and the 2 nd plate 2 are overlapped in the gravity direction. The direction in which the 1 st plate 1 and the 2 nd plate 2 overlap is defined as the Z direction. In this specification, the direction in which the 1 st plate 1 is disposed is defined as an upper side, and the direction in which the 2 nd plate 2 is disposed is defined as a lower side. The short-side direction when the heat conductive member is viewed from the Z direction is defined as the X direction, and the long-side direction is defined as the Y direction. The above-mentioned designations of the directions are used for the purpose of explanation, and the positional relationship and the directions of the heat conduction member 100 in the use state are not limited. In addition, "parallel" in the present specification includes "substantially parallel".

< Heat conduction Member >

The heat conduction member 100 will be described with reference to fig. 1. Fig. 1 is a sectional view of the heat conductive member 100 of the present invention taken along the Y direction. The heat conduction member 100 can contact the heat source Ht, and contact the heat source Ht to conduct heat from the heat source Ht, thereby lowering the temperature of the heating element Ht. That is, the heat conductive member 100 is used as a heat dissipation member.

The heat conduction member 100 includes a case 101, a core structure 4, a working fluid (not shown), and a heat source contactable portion 5.

The case 101 extends in the longitudinal direction, and has a space 102 inside the case 101. The core structure 4 and the column portion 3 are disposed in the space 102. The space 102 is sealed, and the working fluid is sealed in the space 102. That is, the heat conduction member 100 has a case 101 in which the working fluid is sealed.

< heating part >

< Cooling part >

The heating unit 103 and the cooling unit 104 will be described with reference to fig. 3. Fig. 3 is a plan view schematically showing the heating unit 103, the cooling unit 104, and the groove 7. The heating unit 103 and the cooling unit 104 are regions provided in the housing 101, but are indicated by solid lines for convenience. The positions of the heating unit 103 and the cooling unit 104 are illustrated, and are not limited to fig. 3. The housing 101 has a heating section 103 and a cooling section 104. As shown in fig. 3, one side in the longitudinal direction (Y direction) of the case 101 is a heating portion 103 heated by heat from the heat source Ht, and the other side is a cooling portion 104. The cooling unit 104 is disposed separately from the heating unit 103, and cools heat from the heat source Ht. The heating element Ht contacts the lower surface of the heating unit 103 in the Z direction. The heat of the heating element Ht is transferred to the cooling portion 104 of the heat conductive member 100. In other words, the heating portion 103 absorbs heat from the outside to the inside of the housing 101. Then, the heat from the heating element Ht inside the case 101 heats and evaporates the working fluid. The evaporated working fluid (not shown) is condensed to return to a liquid by transferring heat to the casing 101 by the cooling unit 104, and is heated again by the heating unit 103 to be evaporated. By repeating the above operations, the heat of the heating element Ht is conducted to the heat conducting member 100, and the heating element Ht is cooled.

In the present embodiment, the cooling unit 104 is in direct contact with the heat source Ht, but may be in indirect contact with a member that transfers heat from the heat source Ht, such as silicone (not shown).

< contactable part of heat source >

The heat-source contactable portion 5 will be described with reference to fig. 2. Fig. 2 is a plan view schematically showing the heat source contactable portion 5. The heat-source contactable portion 5 is a region provided in the housing 101, but is indicated by a solid line for convenience. The position of the heat-source contactable portion 5 is illustrated, and is not limited to fig. 2. The heat-source contactable portion 5 is a range in the casing 101 in which the heat source Ht can be contacted. Specifically, the heat-source contactable portion 5 is a range facing the heat source Ht in the Z direction. The heat-source contactable portion 5 may be provided at any position of the casing 101 as long as it can face the heat source Ht.

< Heat Source contact >

The heat source contact portion 6 will be described with reference to fig. 2. Fig. 2 is a plan view schematically showing the heat source contact portion 6. The heat source contact portion 6 is a region provided in the casing 101, but is indicated by a solid line for convenience. The position of the heat source contact portion 6 is illustrated by way of example and is not limited to fig. 2. The heat source contactable portion 5 has a heat source contacting portion 6. The heat source contact portion 6 is a range in which the heat source Ht is in direct or indirect contact. The heat source contact portion 6 may be provided at any position of the casing 101 as long as it is in contact with the heat source Ht. In the present embodiment, the heat source Ht is in direct contact with the heat source contact portion 6, but may be in indirect contact via a member that transfers heat, such as silicone (not shown).

< working fluid >

In the heat conduction member 100 of the present embodiment, water is used as the working fluid (not shown), but the present invention is not limited thereto. Examples thereof include alcohol compounds, alternative freons, hydrocarbon compounds, fluorinated hydrocarbon compounds, diol compounds, and the like. As the working fluid, a substance that is evaporated (vaporized) by heat from the heating element Ht in the heating unit 103 and condensed (liquefied) by heat transfer to the case 101 in the cooling unit 104 can be widely used.

The heat conduction member 100 will be described in more detail. In the heat conduction member 100, the 1 st plate 1 and the 2 nd plate 2 are overlapped in the Z direction, and outer edge portions in the X direction and the Y direction are joined. The case 101 is formed by joining the 1 st plate 1 and the 2 nd plate 2. That is, the housing 101 includes the 1 st plate 1 and the 2 nd plate 2 disposed to face the 1 st plate 1.

< 1 st plate >

The 1 st plate 1 is a copper plate. However, the material of the 1 st plate 1 is not limited to copper. As the material of the 1 st plate 1, for example, a metal having a strength of a certain level or more and a thermal conductivity of a certain level or more, such as copper alloy, aluminum, and aluminum alloy, can be widely used.

The 1 st plate 1 has a rectangular shape with the Y direction being the longitudinal direction when viewed from the Z direction. The 1 st plate 1 has a 1 st plate recess 11 and a 1 st plate joint 12. The 1 st plate recess 11 is formed in the Z-direction upper surface of the 1 st plate 1, and is recessed downward in the Z-direction from the upper surface of the 1 st plate 1. The 1 st plate recess 11 has a bottom surface portion on the bottom surface. A core structure 4 described later is disposed on the upper portion of the bottom surface portion in the Z direction.

In the 1 st plate 1, the 1 st plate joint 12 surrounds the outside of the 1 st plate recess 11. The 1 st panel joint 12 is continuous along the outer edge of the 1 st panel 1.

A 2 nd plate joint 22, which will be described later, of the 2 nd plate 2 is joined to the 1 st joint 12. The joining method of the 1 st joining part 12 and the 2 nd plate joining part 22 will be described later.

< core Structure >

As shown in fig. 1, the 1 st plate 1 has a core structure 4. That is, the 1 st plate 1 has the core structure 4 disposed at a position facing the 2 nd plate 2. The core structure 4 is disposed on the 1 st plate 1 and is housed in the space 102 of the case 101. To explain further, the core structure 4 is disposed above the bottom surface of the 1 st plate recess 11. The working fluid is absorbed in the core structure 4. The working fluid adsorbed on the core structure 4 is transported by capillary action. By using the core structure 4, the condensed working fluid can be quickly transported by utilizing the capillary phenomenon. This can improve the heat conduction efficiency of the heat conduction member 100. The core structure 4 may be a porous body such as a wire, a mesh, a nonwoven fabric, or a sintered body. Further, the core structure 4 and the 1 st plate 1 may be formed of one member. For example, the 1 st plate may be formed by etching. Further, the method is not limited to etching, and a method of cutting a plate or melting a plate by a chemical or physical method can be widely used.

< 2 nd plate >

The 2 nd plate 2 is a copper plate. However, the present invention is not limited thereto. As a material of the 2 nd plate 2, for example, a metal having a strength of a certain level or more and a thermal conductivity of a certain level or more, such as aluminum or an aluminum alloy, can be used.

The 2 nd plate 2 has a rectangular shape with the Y direction being the longitudinal direction when viewed from the Z direction. The 2 nd plate 2 has a 2 nd plate recess 21 and a 2 nd plate engaging portion 22. The 2 nd plate recess 21 is recessed upward in the Z direction from the inner surface of the 2 nd plate, and faces the 1 st plate recess 11 in the Z direction. By facing the 1 st plate recess 11 and the 2 nd plate recess 21, the space 102 inside the housing 101 can be secured. The 2 nd plate engaging portion 22 is formed along the outer edge of the 2 nd plate and engages with the 1 st plate engaging portion 12. This allows the 1 st plate 1 and the 2 nd plate 2 to be joined to seal the space 102 inside the case. For example, a method of bonding the 1 st plate 1 and the 2 nd plate 2 by applying heat and pressure, a method of bonding by using an adhesive, and the like can be widely used.

As shown in fig. 1, when viewed in the Z direction, the 1 st plate 1 and the 2 nd plate 2 have a rectangular shape having the same size or one larger than the other. At this time, the outer edge of the 1 st plate 1 overlaps the outer edge of the 2 nd plate 2 in the Z direction. The 1 st plate 1 may be larger than the 2 nd plate 2. In this case, the outer edge of the 2 nd plate 2 is disposed inside the outer edge of the 1 st plate 1 when viewed from the Z direction. In the present embodiment, the 1 st plate 1 and the 2 nd plate 2 have a rectangular shape when viewed from the Z direction, but the present invention is not limited thereto, and may have other shapes such as a square shape.

< pillar part >

The pillar portion 3 will be described with reference to fig. 1 and 5. Fig. 5 is a plan view showing a part of the plurality of column parts 3 and the plurality of groove parts 7. The case 101 has a plurality of column portions 3 extending in the vertical direction and supporting the 1 st plate 1 and the 2 nd plate 2. As shown in fig. 1, in the heat conduction member 100, the column portion 3 is disposed inside the space 102. As shown in fig. 5, the plurality of pillar portions 3 are arranged at equal intervals in the X direction and the Y direction, respectively. That is, the plurality of column parts 3 are arranged at equal intervals in the X direction. The plurality of pillar portions 3 are also arranged at equal intervals in the Y direction. In the heat conduction member 100, the arrangement interval in the X direction and the arrangement interval in the Y direction of the plurality of column parts 3 are the same length. Therefore, both the arrangement interval in the X direction and the arrangement interval in the Y direction of the plurality of pillar portions 3 are set to the arrangement pitch P1. That is, among the plurality of pillar portions 3, the pillar portions 3 are arranged at equal arrangement intervals. The X-direction interval and the Y-direction interval are the same, but the X-direction interval and the Y-direction interval are not limited to this, and may be different intervals.

The column portion 3 has a columnar shape extending in the Z direction, for example. The upper end of the column portion 3 in the Z direction is disposed on the lower surface of the 2 nd plate 2 in the Z direction. The lower end of the pillar 3 is in direct or indirect contact with the upper surface of the 1 st plate 1. The plurality of column parts 3 suppress deformation of the pressure difference between the inside and outside of the space 102 of the case 101 by bringing the lower end parts of the column parts 3 into direct or indirect contact with the upper surface of the 1 st plate 1. In detail, the deformation of the 1 st plate 1 and the 2 nd plate 2 can be suppressed. Further, by suppressing the deformation of the 1 st plate 1 and the 2 nd plate 2, the movement of the working fluid at the outer edge portion of the space 102 and the evaporated working fluid can be made less likely to be inhibited, and the decrease in heat conduction efficiency can be suppressed.

In the present embodiment, the lower end of the pillar portion 3 contacts the 1 st plate 1 via the core structure 4. In other words, the lower end of the pillar portion 3 is in contact with the upper end of the core structure 4. The lower end of the pillar portion 3 contacts the upper end of the core structure 4, whereby the core structure 4 is prevented from floating upward in the Z direction.

In the present embodiment, the pillar portion 3 and the 2 nd plate 2 are formed of one member. This makes it possible to collectively manufacture a plurality of pillar portions 3 by, for example, etching, and thus facilitates manufacturing. The method for manufacturing the 2 nd plate 2 is not limited to etching, and a method in which the plate is cut or melted by a chemical or physical method and the pillar portion 3 and the 2 nd plate 2 are formed as one member can be widely used. The column part 3 may be a different member from the 2 nd plate 2, instead of being a single member.

In the present embodiment, the pillar portion 3 has a cylindrical shape. However, the shape is not limited to a cylindrical shape. For example, the cross-sectional shape cut by a plane perpendicular to the Z direction may be, for example, an ellipse or a polygon, in addition to a circle. Further, the shape may be tapered upward or downward in the Z direction. Further, the end portion on one side in the Z direction may be curved such as a semispherical surface. Further, the member may be a plate-like member extending in the X direction or the Y direction. For example, in the case of a plate-like member extending in the X direction, the plate-like member may be arranged at equal intervals in the Y direction, and in the case of a plate-like member extending in the Y direction, the plate-like member may be arranged at equal intervals in the X direction.

< groove part >

The case 101 has a groove 7 opening in the direction in which the core structure 4 is provided. Specifically, at least one of the 1 st plate 1 and the 2 nd plate 2 has the groove 7 in the internal space 102. The groove portion 7 is recessed in the Z direction. The groove portion 7 may have a cross-sectional shape, which is a cross-section taken along a plane perpendicular to the Z direction, such as an ellipse or a polygon, in addition to a circle. Further, the shape may be tapered upward or downward in the Z direction. The tank 7 can hold and convey the condensed working fluid.

The housing 101 has: a heating unit 103 that absorbs heat from the outside to the inside of the housing 101 on one side in the longitudinal direction; and a cooling section 104 that cools the heat at the other side in the longitudinal direction, and the groove section 7 extends in the longitudinal direction and passes through the heating section 103 and the cooling section 104. The casing 101 extending in the longitudinal direction has a longer refrigerant transport distance than the circular or square casing 101. The refrigerant can be sent from one side to the other side in the case 101 extending in the longitudinal direction.

The 1 st and 2 nd plates 1, 2 have groove portions 7. That is, the groove 7 is preferably provided in both the 1 st plate 1 and the 2 nd plate 2. In other words, the housing 101 has the 1 st plate groove 71 and the 2 nd plate groove 72 described later. By providing both the 1 st plate groove portion 71 and the 2 nd plate groove portion 72 in the housing 101, a larger amount of the working fluid can be held, and the function of returning the working fluid can be relatively improved.

For convenience, the groove portion of the 1 st plate 1 is referred to as a 1 st plate groove portion 71, and the groove portion of the 2 nd plate 2 is referred to as a 2 nd plate groove portion 72. The positional relationship between the groove and the core structure 4 and the positional relationship between the groove and the pillar 3 will be described later.

< groove part of the 1 st plate >

The 1 st plate 1 has a 1 st plate groove portion 71. The 1 st plate groove portion 71 is recessed downward in the Z direction of the 1 st plate 1. Specifically, the 1 st plate 1 is recessed downward in the Z direction from the upper surface thereof, and is opened to face the lower surface of the core structure 4. Thus, the condensed working fluid can be retained in the 1 st plate groove 71, and therefore, a large amount of working fluid can be secured in the space 102 disposed inside the casing 101.

< 2 nd plate groove >

The 2 nd plate 2 has a 2 nd plate groove portion 72. The 2 nd plate groove portion 72 is recessed upward in the Z direction of the 2 nd plate 2. Specifically, the second plate 2 is recessed upward in the Z direction from the lower surface thereof, and is opened to face the upper surface of the core structure 4. Thus, the condensed working fluid can be held in the 2 nd-plate groove portion 72, and therefore, a large amount of the working fluid can be secured in the space 102 disposed inside the casing 101.

The groove portion 7 can contact the portion 5 by a heat source. This enables the working fluid to be fed to the heat source contactable portion 5. Therefore, the heat source Ht can be directly or indirectly cooled by feeding the working fluid to the heat source contactable portion 5. The working fluid moves not only through the core structure 4 but also through the grooves 7 to the heat source contactable portion 5. That is, the function of holding a large amount of the working fluid in the groove portion 7 and conveying the working fluid to the heat source contactable portion 5 can be improved.

Preferably, the groove 7 passes through the heat source contact portion 6. By passing the groove portion 7 through the heat source contact portion 6, the working fluid can be fed to the heat source contact portion 6, and the heat source Ht can be directly cooled. The working fluid moves not only through the core structure 4 but also through the grooves 7 to the heat source contact portion 6. That is, the function of holding a large amount of the working fluid in the groove portion 7 and conveying the working fluid to the heat source contact portion 6 can be improved. Further, by extending the groove portion 7 in a direction away from the heat source contact portion 6, a large amount of the working fluid can be retained in the groove portion 7, and the function of conveying the working fluid to the heat source contact portion 6 can be further improved.

In the present embodiment, the groove portion 7 extends from the heating portion 103 toward the cooling portion 104. Specifically, the groove portion 7 passes through the heating portion 103 and the cooling portion 104. The working fluid condensed by the cooling unit 104 can be transported to the heating unit 103 that absorbs heat emitted from the heat source Ht. Specifically, the vapor of the evaporated working fluid is condensed in the cooling unit 104 and returned to the liquid working fluid. The liquid working fluid is delivered from the cooling unit 104 to the heating unit 103 through not only the core structure 4 but also the groove 7. This can improve the function of conveying the working fluid from the cooling unit 104 to the heating unit 103.

In the heating portion 103, the groove portion 7 is preferably disposed at a portion where the temperature of the heat source Ht is highest, but is not limited thereto. The groove portion 7 is preferably continuous from the heating portion 103 to the cooling portion 104 without interruption. By making the groove portions 7 continuous, the working fluid fed from the cooling portion 104 to the heating portion 103 can be suppressed from flowing from the portion of the groove portions 7 that is interrupted to a portion other than the heating portion 103.

Next, the positional relationship between the groove portions and the core structure 4 will be described. For convenience, the positional relationship will be described using the 1 st plate groove portion 71 and the core structure 4.

The 1 st plate groove portion 71 has a 1 st edge portion 711 and a 1 st groove bottom portion 712. The 1 st edge 711 is disposed at an end of an opening that opens toward the lower surface of the core structure 4. The 1 st groove bottom 712 is a bottom surface of the 1 st plate groove 71 and is located below the 1 st edge 711 in the Z direction. In the present embodiment, the 1 st groove bottom 712 overlaps the opening when viewed from the Z direction. More specifically, the 1 st plate groove portion 71 extends from the 1 st edge portion 711 toward the 1 st groove bottom portion 712 in parallel to the Z direction.

The 1 st edge 711 of the 1 st plate groove 71 is in contact with the core structure 4, and the 1 st groove bottom 712 of the 1 st plate groove 71 is opposed to the lower surface of the core structure 4 in the Z direction with a gap therebetween. This allows the groove space K to be formed by the 1 st plate groove portion 71 and the core structure 4. In other words, the opening of the 1 st plate groove 71 is covered with the lower surface of the core structure 4. That is, the groove space K is a space surrounded by the 1 st groove bottom 712, the inner surface of the 1 st groove 71, and the core structure 4.

The tank space K can hold and convey the working fluid. In the groove space K, the opening of the 1 st plate groove 71 is covered with the lower surface of the core structure 4, so that the working fluid can be efficiently moved without leaking upward in the Z direction. Further, the 1 st edge 711 of the 1 st plate groove 71 is preferably in contact with the core structure 4, but may not be in contact, and the distance between the 1 st edge 711 of the 1 st plate groove 71 and the core structure 4 may be short. For example, the gap between the 1 st edge 711 of the 1 st plate groove 71 and the core structure 4 may be narrower than the gap between the lower end in the Z direction of the pillar portion 3 and the upper surface of the core structure 4. The 1 st edge 711 of the 1 st plate groove 71 may come into contact with the core structure 4, thereby affecting the function of conveying the working fluid in the core structure 4. Therefore, by not bringing the 1 st edge 711 of the 1 st plate groove 71 into contact with the core structure 4, the groove space K can be secured wide while suppressing the influence on the function of conveying the working fluid of the core structure 4.

< relationship between groove part and pillar part >

Next, the relationship between the groove portion 7 and the pillar portion 3 will be described with reference to fig. 5 and 6. Fig. 6 is an enlarged view of the 2 nd plate groove portion 72 and the pillar portion 3 taken along the X direction and enlarged in the broken line portion of fig. 1. For convenience, the positional relationship between the groove portions and the column portions will be described using the 2 nd plate groove portions 72 and the column portions 3.

The width L3 in the short side direction (width in the X direction) of the 2 nd plate groove portion 72 is smaller than the shortest distance between adjacent pillar portions 3. The width of the 2 nd plate groove portion 72 in the short side direction is the narrowest portion in the short side direction of the 2 nd plate groove portion 72. That is, the width of the 2 nd plate groove portion 72 in the short side direction is narrower than the arrangement pitch P1. Thus, the width of the 2 nd plate groove portion 72 in the short side direction can be narrowed, and therefore the working fluid in the 2 nd plate groove portion 72 is held by the side surfaces of the 2 nd plate groove portion 72, and stays in the 2 nd plate groove portion 72. Therefore, the working fluid held in the 2 nd plate groove portion 72 can be suppressed from leaking to the outside of the 2 nd plate groove portion 72.

The 2 nd plate slot portion 72 has a 2 nd edge portion 721 and a 2 nd slot bottom portion 722. The 2 nd edge portion 721 is disposed at an end of an opening portion that opens toward the upper surface of the core structure 4. The 2 nd groove bottom 722 is the upper surface of the 2 nd plate groove 72, and is located above the 2 nd edge 721 in the Z direction. In the present embodiment, the 2 nd groove bottom 722 overlaps with the opening of the 2 nd plate groove 72 when viewed from the Z direction. More specifically, the 2 nd plate groove portion 72 extends from the 2 nd edge portion 721 toward the 2 nd groove bottom portion 722 in parallel with the Z direction.

As shown in fig. 6, the length from the lower surface of the 2 nd plate 2 to the Z-direction lower end of the pillar portion 3 in the internal space 102 is L1. L1 is the shortest distance from the lower surface of the 2 nd plate 2 to the Z-direction lower end of the pillar portion 3. L1 indicates the length of the pillar portion 3 in the Z direction. The length in the Z direction between the 2 nd edge portion 721 and the 2 nd groove bottom portion 722 of the 2 nd plate groove portion 72 is L2. L2 is the shortest distance between the 2 nd edge 721 and the 2 nd groove bottom 722 of the 2 nd plate groove 72. L2 refers to the depth of the so-called 2 nd plate groove portion 72.

In the present embodiment, L2 is smaller than L1. That is, the depth of the 2 nd plate groove portion 72 is smaller than the length of the pillar portion 3 in the direction (Z direction) in which the 1 st plate 1 and the 2 nd plate 2 are arranged. By making the depth of the 2 nd plate groove portion 72 shorter than the pillar portion 3, the volume reduction of the 2 nd plate 2 can be suppressed. Therefore, the heat capacity of the 2 nd plate 2 can be ensured.

L2 and L1 may be equal, and L2 may be larger than L1. That is, the depth of the 2 nd plate groove portion 72 is the same as or greater than the length of the pillar portion 3 in the direction (Z direction) in which the 1 st plate 1 and the 2 nd plate 2 are arranged. By making the depth of the 2 nd plate groove portion 72 the same as or larger than the length of the pillar portion 3, a large amount of the working fluid can be secured in the 2 nd plate groove portion 72.

< other embodiments >

Fig. 4 is a plan view of a heat conduction member 100A according to another embodiment of the present invention. Although the 1 st region 8A and the 2 nd region 9A which will be described later are regions provided in the housing, they are indicated by solid lines and groove portions by broken lines for convenience. For convenience of explanation, the same reference numerals are given to the same parts as those of the above-described embodiment of the present invention.

The housing 101A includes: a heating unit 103A that absorbs heat from the outside to the inside of the case 101A on one side in the longitudinal direction; and a cooling section 104A that cools the heat at the other side in the longitudinal direction, and the groove section 7A extends in the longitudinal direction and passes through the heating section 103A and the cooling section 104A. The casing 101A extending in the longitudinal direction has a longer refrigerant transport distance than a circular or square casing. In the case extending in the longitudinal direction, the refrigerant can be sent from one side to the other side.

The case 101A has a 1 st region 8A extending from one side to the other side in the longitudinal direction. The 1 st region 8A is a region from one end to the other end of the case 101A in the longitudinal direction. The case 101A has a 2 nd region 9A extending from the other side in the longitudinal direction of the 1 st region 8A in a direction intersecting the longitudinal direction. The 1 st region 8A is opposed to the heat source in the Z direction. In other words, the 1 st region 8A has the heating portion 103A. The 2 nd region 9A extends from the other end in the longitudinal direction in a direction intersecting the longitudinal direction, and includes a cooling portion 104A. In another embodiment, the groove portion 7A passes through at least the 1 st region 8A of the 1 st region 8A and the 2 nd region 9A. This enables the working fluid to be transported also to the heat conductive member 100A extending in the longitudinal direction and the direction intersecting the longitudinal direction.

As shown in fig. 4, in the other embodiment, the 1 st region 8A and the 2 nd region 9A intersect each other in the vertical direction, but the present invention is not limited thereto.

< Others >

As described above, it is preferable that the groove portion 7 is provided in plural and continuous without interruption. In the arrangement direction of the groove portions 7, a surface connecting edge portions of adjacent groove portions 7 may be in direct or indirect contact with at least one of the 1 st plate 1 and the 2 nd plate 2 in the Z direction. The surfaces connecting the edge portions of the adjacent groove portions 7 are in direct or indirect contact with at least one of the 1 st plate 1 and the 2 nd plate 2, thereby suppressing deformation due to a pressure difference between the inside and the outside of the space 102 of the case 101. In detail, the deformation of the 1 st plate 1 and the 2 nd plate 2 can be further suppressed. The surface connecting the edge portions of the adjacent groove portions 7 may be in contact with at least one of the 1 st plate 1 and the 2 nd plate 2 via the core structure 4 in the Z direction.

In the present embodiment, the plurality of grooves 7 are arranged in parallel in the short-side direction (X direction) and extend in the long-side direction (Y direction). However, it may extend radially from the center of the housing, for example, toward the outer periphery of the housing 101.

The groove portion 7 may be provided with portions having different widths in the short direction (X direction) in the longitudinal direction (Y direction). For example, the width of the groove portion 7 in the short direction (X direction) passing through the heat source contactable portion 5 may be wider than the width of the groove portion not passing through the heat source contactable portion 5. By widening the width of the groove 7, a large amount of the working fluid can be held. In particular, it is preferable to widen the width of the groove 7 at a portion that absorbs heat from the outside to the inside of the case 101. The above description has been given taking the heat-source contactable portion 5 as an example, but similar effects are exhibited also in the heat-source contact portion 6 and the heating portion 103.

The groove portion 7 may be provided with portions having different widths in the short direction (X direction) in the longitudinal direction (Y direction). For example, the width of the groove portion 7 in the short direction (X direction) passing through the heat source contactable portion 5 may be wider than the width of the groove portion not passing through the heat source contactable portion 5. By widening the width of the groove 7, the amount of the retained working fluid can be increased. In particular, it is preferable to widen the width of the groove 7 at a portion that absorbs heat from the outside to the inside of the case 101. The above description has been given taking the heat-source contactable portion 5 as an example, but similar effects are exhibited also in the heat-source contact portion 6 and the heating portion 103.

The width in the short direction (X direction) of the groove 7 may be continuously changed from one side to the other side in the longitudinal direction (Y direction). Further, the width of the groove portion 7 in the short side direction (X direction) may be irregularly changed from one side to the other side.

The heat conduction member of the present invention is a so-called vapor chamber that conducts heat of a heat generating body Ht by utilizing a change in state of the working fluid sealed in the space 102, that is, evaporation by heating and condensation by cooling.

Examples of the heat generating element Ht include, but are not limited to, an integrated circuit such as a CPU, MPU, or memory, and a device having a rotating body such as a hard disk or an optical disk. A heat conductive member can be widely used for heat dissipation of a device that generates heat in accordance with an operation.

Fig. 7 is a plan view of the electronic device 10 as an example of use of the heat conductive members 100 and 100A of the present invention, and the heat conductive members 100 and 100A are shown by solid lines for convenience. The shapes and the positions of the heat conduction members 100 and 100A are exemplified.

The electronic device 10 has a housing 13. The housing 13 has a space therein, for example. The electronic device 10 has heat conductive members 100, 100A. Specifically, heat conductive members 100 and 100A are disposed inside the case 13. Therefore, the electronic device 10 having the heat conductive member 100, 100A in which the functions of holding the operating liquid and circulating the operating liquid are relatively improved can be provided. Examples of the electronic device 10 include a smartphone, a tablet PC, a personal computer, and the like, but are not limited thereto.

In the present invention, the heat conductive members 100 and 100A may be used so that the Y direction coincides with the gravitational direction. For example, when the heat-source contactable portion 5 is disposed so as to be located upward in the direction of gravity, the working fluid attempts to move downward in the direction of gravity based on the gravity, and therefore the capillary phenomenon of the core structure 4 is reduced, and the function of conveying the refrigerant upward in the direction of gravity is reduced. By providing the groove portions 7, even when the function of the core structure 4 is reduced, the refrigerant can be fed to the heat source contactable portion 5 through the groove portions 7. That is, even if the heat-source contactable portion 5 is disposed so as to face upward in the gravity direction, the performance degradation of the heat conduction members 100, 100A can be suppressed. In the above description, the heat-source-contactable portion 5 is described as an example, but the same effect is obtained when the heating portion 103 is disposed so as to be located upward in the direction of gravity and the cooling portion 104 is disposed so as to be located downward in the direction of gravity. Further, the effect is obtained not only when the Y direction and the gravity direction completely coincide with each other, but also when, for example, the heating section 103 is located above the cooling section 104 in the gravity direction.

The embodiments of the present invention have been described above, but the present invention is not limited to the above. In addition, the embodiments of the present invention can be variously modified as long as they do not depart from the gist of the invention.