阅读说明：本技术 一种抛光设备的智能化控制方法及系统 (Intelligent control method and system for polishing equipment ) 是由 许�鹏 于 2021-10-22 设计创作，主要内容包括：本发明公开了一种抛光设备的智能化控制方法及系统,获得第一尺寸信息；获得第一标准尺寸信息；获得第一抛光表面要求信息,将第一尺寸信息、第一标准尺寸信息和第一抛光表面要求信息输入抛光参数分配模型,获得第一参数分配结果；根据第一参数分配结果对粗抛光设备进行控制,获得第一粗抛光产品；获得第一粗抛光产品的第二尺寸信息；获得第一粗抛光产品的第一图像；根据第一图像和第二尺寸信息对第一参数分配结果进行调整,获得第二参数分配结果；通过第二参数分配结果进行精抛光设备参数控制。解决了现有技术中存在不能根据产品的具体参数信息和产品需求信息,智能化进行粗抛光和精抛光参数的联合智能化控制,导致抛光不良率升高的技术问题。(The invention discloses an intelligent control method and system of polishing equipment, which are used for obtaining first dimension information; obtaining first standard size information; obtaining first polishing surface requirement information, and inputting the first size information, the first standard size information and the first polishing surface requirement information into a polishing parameter distribution model to obtain a first parameter distribution result; controlling the rough polishing equipment according to the first parameter distribution result to obtain a first rough polishing product; obtaining second dimensional information of the first rough polishing product; obtaining a first image of a first rough polishing product; adjusting the first parameter distribution result according to the first image and the second size information to obtain a second parameter distribution result; and performing parameter control on the fine polishing equipment according to the second parameter distribution result. The technical problem that polishing reject ratio is increased due to the fact that combined intelligent control of rough polishing parameters and fine polishing parameters cannot be intelligently carried out according to specific parameter information and product demand information of products in the prior art is solved.)

1. An intelligent control method for a polishing apparatus, wherein the method is applied to an intelligent parameter control system, the system is connected with a first image acquisition device and a first size measurement device in a communication mode, and the method comprises the following steps:

obtaining first dimension information of a first product to be polished by the first dimension measuring device;

obtaining first standard size information;

obtaining first polishing surface requirement information, and using the first polishing surface requirement information as supervision data;

inputting the first dimension information, the first standard dimension information and the first polishing surface requirement information into a polishing parameter distribution model to obtain a first parameter distribution result;

controlling rough polishing equipment according to the first parameter distribution result, and processing the first product to be polished to obtain a first rough polishing product;

obtaining second dimensional information of the first rough polishing product by the first sizing device;

obtaining a first image of the first rough polishing product by the first image acquisition device;

adjusting the first parameter distribution result according to the first image and the second size information to obtain a second parameter distribution result;

performing parameter control of the finish polishing equipment according to the second parameter distribution result;

wherein the method further comprises:

constructing a rough polishing product comparison characteristic set;

comparing the characteristics of the first image through the rough polishing product characteristic comparison set to obtain a characteristic value of the first image;

obtaining a first preset characteristic value range, and judging whether the characteristic value is in the first preset characteristic value range or not;

when the characteristic value is not in the first preset characteristic value range, obtaining a second parameter distribution result through the characteristic value;

wherein the method further comprises:

obtaining a second image of the first product to be polished through the first image acquisition device;

obtaining a second preset characteristic value range according to the second image and the first parameter distribution result;

obtaining first characteristic difference value information according to the characteristic value and the second preset characteristic value range;

correcting the polishing parameter distribution model according to the first characteristic difference value information;

wherein the obtaining of the second parameter allocation result by the feature value when the feature value is not within the first predetermined feature value range further comprises:

taking the second size information as a first constraint parameter;

taking the second image as a second constraint parameter, and performing feasibility evaluation of finish polishing based on the first constraint parameter and the second constraint parameter to obtain a first feasibility evaluation result;

when the first feasibility assessment does not meet a first feasibility threshold, then forgoing further processing of the first rough polished product;

wherein the method further comprises:

obtaining a first comparison instruction, and performing feature comparison on the first image and the second image according to the first comparison instruction to obtain a first feature comparison result;

performing matching degree evaluation according to the first parameter distribution result and the first characteristic comparison result to obtain a first matching degree evaluation result;

and adjusting the rough polishing equipment according to the first matching degree evaluation result.

2. The method of claim 1, wherein the method further comprises:

obtaining polishing internal environment information of the rough polishing equipment;

constructing an influence parameter set of the polishing internal environment information;

obtaining a rough polishing influence coefficient according to the polishing internal environment information and the influence parameter set;

and cleaning the internal environment of the rough polishing equipment through the rough polishing influence coefficient and the first image.

3. The method of claim 1, wherein the method further comprises:

obtaining parameter control information of the rough polishing equipment and the fine polishing equipment and processed product information corresponding to the parameter control information;

taking the parameter control information and the processed product information as basic data, and inputting training data into the polishing parameter distribution model for training, wherein the training data comprises the first size information, the first standard size information, the first polishing surface requirement information and identification information for identifying a parameter distribution result;

and when the polishing parameter distribution model meets a first output threshold value, inputting the first size information, the first standard size information and the first polishing surface requirement information into the polishing parameter distribution model to obtain a first parameter distribution result.

4. An intelligent control system for a polishing apparatus, wherein the system comprises:

a first obtaining unit for obtaining first size information of a first product to be polished by a first size measuring device;

a second obtaining unit configured to obtain first standard size information;

a third obtaining unit configured to obtain first polishing surface requirement information and use the first polishing surface requirement information as supervision data;

a fourth obtaining unit, configured to input the first size information, the first standard size information, and the first polishing surface requirement information into a polishing parameter distribution model, and obtain a first parameter distribution result;

a fifth obtaining unit, configured to control a rough polishing apparatus according to the first parameter allocation result, and process the first product to be polished to obtain a first rough polishing product;

a sixth obtaining unit for obtaining second size information of the first rough polishing product by the first size measuring device;

a seventh obtaining unit for obtaining a first image of the first rough polishing product by a first image capturing device;

an eighth obtaining unit, configured to adjust the first parameter allocation result according to the first image and the second size information, and obtain a second parameter allocation result;

a first control unit for performing parameter control of the finish polishing apparatus by the second parameter distribution result;

the system further comprises:

the first construction unit is used for constructing a rough polishing product comparison feature set;

a ninth obtaining unit, configured to perform feature comparison on the first image through the rough polishing product feature comparison set to obtain a feature value of the first image;

a tenth obtaining unit, configured to obtain a first predetermined feature value range, and determine whether the feature value is within the first predetermined feature value range;

an eleventh obtaining unit configured to obtain the second parameter assignment result by the feature value when the feature value is not within the first predetermined feature value range;

a twelfth obtaining unit configured to obtain a second image of the first product to be polished by the first image capturing device;

a thirteenth obtaining unit configured to obtain a second predetermined feature value range from the second image and the first parameter assignment result;

a fourteenth obtaining unit configured to obtain first feature difference value information from the feature value and the second predetermined feature value range;

the first correction unit is used for correcting the polishing parameter distribution model according to the first characteristic difference information;

a fifteenth obtaining unit configured to use the second size information as a first constraint parameter;

a sixteenth obtaining unit, configured to perform, with the second image as a second constraint parameter, feasibility evaluation of finish polishing based on the first constraint parameter and the second constraint parameter, and obtain a first feasibility evaluation result;

a seventeenth obtaining unit for abandoning continued processing of the first rough polished product when the first feasibility evaluation result does not satisfy a first feasibility threshold;

a twentieth obtaining unit, configured to obtain a first comparison instruction, and perform feature comparison on the first image and the second image according to the first comparison instruction to obtain a first feature comparison result;

a twenty-first obtaining unit, configured to perform matching degree evaluation according to the first parameter allocation result and the first feature comparison result, and obtain a first matching degree evaluation result;

a first adjusting unit, configured to adjust the rough polishing apparatus according to the first matching degree evaluation result.

5. An intelligent control system for a polishing apparatus comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the steps of the method of any one of claims 1-3 when executing the program.

Technical Field

The invention relates to the field related to control and regulation systems, in particular to an intelligent control method and system for polishing equipment.

Background

Polishing refers to a processing method for reducing the roughness of the surface of a workpiece by using mechanical, chemical or electrochemical action to obtain a bright and flat surface, and essentially comprises the step of modifying the surface of the workpiece by using a polishing tool and abrasive particles or other polishing media to obtain a smooth surface or mirror surface gloss. Generally speaking, polishing is divided into two polishing forms of rough polishing and finish polishing, wherein the rough polishing mainly removes severe traces/defects on the surface of a product to be processed, generally speaking, a very large size needs to be removed, the finish polishing mainly performs subsequent surface treatment, generally, the very large size cannot be removed, and the surface of the product to be processed can be smoother and can present a mirror surface effect.

However, in the process of implementing the technical solution of the invention in the embodiments of the present application, the inventors of the present application find that the above-mentioned technology has at least the following technical problems:

the technical problem that polishing reject ratio is increased due to the fact that combined intelligent control of rough polishing parameters and fine polishing parameters cannot be intelligently carried out according to specific parameter information and product demand information of products in the prior art exists.

Disclosure of Invention

The embodiment of the application provides an intelligent control method and system for polishing equipment, and solves the technical problem that polishing reject ratio is increased due to the fact that combined intelligent control of rough polishing and finish polishing parameters cannot be intelligently performed according to specific parameter information and product demand information of a product in the prior art, achieves the technical effects of deeply combining the parameter information and the demand information of the product, performing intelligent parameter distribution of rough polishing and finish polishing, performing combined intelligent control of rough polishing and finish polishing, and improving polishing yield.

In view of the above problems, the embodiments of the present application provide an intelligent control method and system for a polishing apparatus.

In a first aspect, the present application provides a method for intelligently controlling a polishing apparatus, wherein the method is applied to an intelligent parameter control system, the system is connected with a first image acquisition device and a first dimension measurement device in communication, and the method comprises: obtaining first dimension information of a first product to be polished by the first dimension measuring device; obtaining first standard size information; obtaining first polishing surface requirement information, and using the polishing surface requirement information as supervision data; inputting the first dimension information, the first standard dimension information and the first polishing surface requirement information into a polishing parameter distribution model to obtain a first parameter distribution result; controlling rough polishing equipment according to the first parameter distribution result, and processing the first product to be polished to obtain a first rough polishing product; obtaining second dimensional information of the first rough polishing product by the first sizing device; obtaining a first image of the first rough polishing product by the first image acquisition device; adjusting the first parameter distribution result according to the first image and the second size information to obtain a second parameter distribution result; and controlling the parameters of the fine polishing equipment according to the second parameter distribution result.

In another aspect, the present application also provides an intelligent control system of a polishing apparatus, the system comprising: a first obtaining unit for obtaining first size information of a first product to be polished by a first size measuring device; a second obtaining unit configured to obtain first standard size information; a third obtaining unit configured to obtain first polishing surface requirement information and use the polishing surface requirement information as supervision data; a fourth obtaining unit, configured to input the first size information, the first standard size information, and the first polishing surface requirement information into a polishing parameter distribution model, and obtain a first parameter distribution result; a fifth obtaining unit, configured to control a rough polishing apparatus according to the first parameter allocation result, and process the first product to be polished to obtain a first rough polishing product; a sixth obtaining unit for obtaining second size information of the first rough polishing product by the first size measuring device; a seventh obtaining unit for obtaining a first image of the first rough polishing product by a first image capturing device; an eighth obtaining unit, configured to adjust the first parameter allocation result according to the first image and the second size information, and obtain a second parameter allocation result; a first control unit for performing parameter control of the finish polishing apparatus by the second parameter distribution result.

In a third aspect, the present invention provides an intelligent control system for a polishing apparatus comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the steps of the method of the first aspect when executing the program.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

the first dimension information of the first product to be polished is obtained by the first dimension measuring device; obtaining first standard size information; obtaining first polishing surface requirement information, and using the polishing surface requirement information as supervision data; inputting the first dimension information, the first standard dimension information and the first polishing surface requirement information into a polishing parameter distribution model to obtain a first parameter distribution result; controlling rough polishing equipment according to the first parameter distribution result, and processing the first product to be polished to obtain a first rough polishing product; obtaining second dimensional information of the first rough polishing product by the first sizing device; obtaining a first image of the first rough polishing product by the first image acquisition device; adjusting the first parameter distribution result according to the first image and the second size information to obtain a second parameter distribution result; and controlling the parameters of the fine polishing equipment according to the second parameter distribution result. The polishing size is analyzed by measuring the basic information side of the product and acquiring the standard information, and intelligent parameter distribution is carried out on the parameters of the fine polishing and the rough polishing through a polishing parameter distribution model, so that the parameter control of the rough polishing and the fine polishing is more intelligent, the parameter distribution of the intelligent rough polishing and the fine polishing is further achieved by deeply combining the product parameter information and the demand information, the combined intelligent control of the rough polishing and the fine polishing is carried out, and the technical effect of improving the polishing yield is improved.

The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.

Drawings

Fig. 1 is a schematic flow chart illustrating an intelligent control method for a polishing apparatus according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a process for obtaining a second parameter distribution result according to an embodiment of the present invention;

fig. 3 is a schematic flowchart of a polishing parameter distribution model modification process performed by the intelligent control method of a polishing apparatus according to the embodiment of the present invention;

FIG. 4 is a schematic flow chart illustrating feasibility assessment of an intelligent control method of a polishing apparatus according to an embodiment of the present disclosure;

FIG. 5 is a schematic flowchart illustrating an internal environment cleaning process of an intelligent control method for a polishing apparatus according to an embodiment of the present invention;

FIG. 6 is a schematic flow chart illustrating the matching degree evaluation of the intelligent control method of the polishing apparatus according to the embodiment of the present invention;

FIG. 7 is a schematic flowchart illustrating a polishing parameter distribution model of an intelligent control method for a polishing apparatus according to an embodiment of the present invention;

FIG. 8 is a schematic structural diagram of an intelligent control system of a polishing apparatus according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of an exemplary electronic device according to an embodiment of the present application.

Description of reference numerals: a first obtaining unit 11, a second obtaining unit 12, a third obtaining unit 13, a fourth obtaining unit 14, a fifth obtaining unit 15, a sixth obtaining unit 16, a seventh obtaining unit 17, an eighth obtaining unit 18, a first control unit 19, an electronic device 50, a processor 51, a memory 52, an input device 53, and an output device 54.

Detailed Description

The embodiment of the application provides an intelligent control method and system for polishing equipment, and solves the technical problem that polishing reject ratio is increased due to the fact that combined intelligent control of rough polishing and finish polishing parameters cannot be intelligently performed according to specific parameter information and product demand information of a product in the prior art, achieves the technical effects of deeply combining the parameter information and the demand information of the product, performing intelligent parameter distribution of rough polishing and finish polishing, performing combined intelligent control of rough polishing and finish polishing, and improving polishing yield. Embodiments of the present application are described below with reference to the accompanying drawings. As can be known to those skilled in the art, with the development of technology and the emergence of new scenarios, the technical solution provided in the embodiments of the present application is also applicable to similar technical problems.

The terms "first," "second," and the like in the description and in the claims of the present application and in the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and are merely descriptive of the various embodiments of the application and how objects of the same nature can be distinguished. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Polishing refers to a processing method for reducing the roughness of the surface of a workpiece by using mechanical, chemical or electrochemical action to obtain a bright and flat surface, and essentially comprises the step of modifying the surface of the workpiece by using a polishing tool and abrasive particles or other polishing media to obtain a smooth surface or mirror surface gloss. Generally speaking, polishing is divided into two polishing forms of rough polishing and finish polishing, wherein the rough polishing mainly removes severe traces/defects on the surface of a product to be processed, generally speaking, a very large size needs to be removed, the finish polishing mainly performs subsequent surface treatment, generally, the very large size cannot be removed, and the surface of the product to be processed can be smoother and can present a mirror surface effect. The technical problem that polishing reject ratio is increased due to the fact that combined intelligent control of rough polishing parameters and fine polishing parameters cannot be intelligently carried out according to specific parameter information and product demand information of products in the prior art exists.

In view of the above technical problems, the technical solution provided by the present application has the following general idea:

the embodiment of the application provides an intelligent control method of polishing equipment, wherein the method is applied to an intelligent parameter control system which is in communication connection with a first image acquisition device and a first size measurement device, and the method comprises the following steps: obtaining first dimension information of a first product to be polished by the first dimension measuring device; obtaining first standard size information; obtaining first polishing surface requirement information, and using the polishing surface requirement information as supervision data; inputting the first dimension information, the first standard dimension information and the first polishing surface requirement information into a polishing parameter distribution model to obtain a first parameter distribution result; controlling rough polishing equipment according to the first parameter distribution result, and processing the first product to be polished to obtain a first rough polishing product; obtaining second dimensional information of the first rough polishing product by the first sizing device; obtaining a first image of the first rough polishing product by the first image acquisition device; adjusting the first parameter distribution result according to the first image and the second size information to obtain a second parameter distribution result; and controlling the parameters of the fine polishing equipment according to the second parameter distribution result.

Having thus described the general principles of the present application, various non-limiting embodiments thereof will now be described in detail with reference to the accompanying drawings.

Example one

As shown in fig. 1, an embodiment of the present application provides an intelligent control method for a polishing apparatus, wherein the method is applied to an intelligent parameter control system, the system is connected to a first image acquisition device and a first dimension measurement device in communication, and the method includes:

step S100: obtaining first dimension information of a first product to be polished by the first dimension measuring device;

specifically, the intelligent parameter control system is a system for performing combined intelligent distribution of rough polishing parameters and fine polishing parameters, the first image acquisition device is an apparatus capable of performing image acquisition, generally speaking, the apparatus is an optical image capturing instrument such as a CCD camera, the first dimension measurement device is a device capable of performing dimension measurement, the first dimension measurement device may be a height gauge, a caliper, a three-coordinate measuring instrument, or the like, according to difficulty, accuracy requirements, or the like of a measured dimension, and the first image acquisition device and the first dimension measurement device are communicatively connected and can perform mutual information interaction. The first product to be polished is a product to be subjected to a polishing process, and the first dimension measurement device measures the dimension of the first product to be polished to obtain first dimension information. Further, the dimension measurement is a polishing influence dimension measurement on the product to be polished, that is, the first dimension information is dimension information of the polishing influence of the first product to be polished. And through the determination of the first dimension information, providing basic data for supporting the intelligent distribution of parameters for subsequent polishing.

Step S200: obtaining first standard size information;

step S300: obtaining first polishing surface requirement information, and using the first polishing surface requirement information as supervision data;

specifically, the first standard size information is engineering standard size information that flows from the first product to be polished to the polishing process after the first product to be polished is processed before polishing, and generally speaking, the first standard size information is a certain size range, and the first standard size information includes a reserved machining allowance for the polishing process. The first polished surface requirement information is product requirement information of the first product to be polished after the polishing process, and in general, the surface requirement is a requirement for information on the smoothness of the polished surface, the number of scratches, the size of scratches, and the like. The first polishing surface requirement information is used as supervision data. And basic data support is provided for the subsequent determination and intelligent distribution of polishing parameters through the acquisition of the first standard size information and the first polishing surface requirement information.

Step S400: inputting the first dimension information, the first standard dimension information and the first polishing surface requirement information into a polishing parameter distribution model to obtain a first parameter distribution result;

specifically, the polishing parameter distribution model is an intelligent parameter distribution model obtained by training a large number of rough polishing devices and fine polishing devices of the same model by using the processing parameters and the processing information as basic data, using the first size information, the first standard size information and the first polishing surface requirement information as training data, and using an identification parameter distribution result as supervision data. And through the intelligent training of the polishing parameter distribution model, when the training output result of the model tends to be stable, finishing the training, and inputting the first size information, the first standard size information and the first polishing surface requirement information into the polishing parameter distribution model to obtain a first parameter distribution result. The parameters are intelligently distributed through the polishing parameter distribution model, so that the first parameter distribution result is more intelligent and accurate, the size and the polishing effect are considered, and the technical effect of improving the polishing yield of products is achieved.

Step S500: controlling rough polishing equipment according to the first parameter distribution result, and processing the first product to be polished to obtain a first rough polishing product;

step S600: obtaining second dimensional information of the first rough polishing product by the first sizing device;

specifically, the rough polishing equipment is controlled according to the distribution parameter of rough polishing in the first parameter distribution result, and the first product to be polished is subjected to rough polishing based on the first distribution parameter to obtain a first rough polishing product. And carrying out size measurement on the roughly polished product through the first size measurement device to obtain second size information of the first roughly polished product, wherein the measured size is a polishing influence size, and the related information of the second size of the first roughly polished product is obtained. Through the acquisition of the second dimension information, the parameter accurate information of the rough polishing equipment can be evaluated, the processing parameter of the fine polishing can be checked and determined again, the subsequent processing of the first rough polishing product is more accurate, the actual error of the rough polishing equipment is more accurately determined, the subsequent processing of the product through the rough polishing equipment is more accurate, and the technical effect of improving the overall yield is achieved.

Step S700: obtaining a first image of the first rough polishing product by the first image acquisition device;

step S800: adjusting the first parameter distribution result according to the first image and the second size information to obtain a second parameter distribution result;

step S900: and controlling the parameters of the fine polishing equipment according to the second parameter distribution result.

Specifically, the first image capturing device is a device capable of performing high-definition image capturing, such as a CCD camera, and acquires the first image by capturing an image of the first rough polishing product by the first image capturing device, wherein the first image reflects a polishing effect of the first rough polishing product, that is, a rough polishing trace of the rough polishing product, a machining process generated during the machining process, a trace of the rough polishing unprocessed by the cutting trace, and the like, by performing feature recognition on the first image, information such as the number, depth, size, and the like of the cutting trace/polishing trace is acquired according to a feature recognition result, and based on the information such as the number, depth, size, and the like of the cutting trace/polishing trace and the second dimension information, parameter distribution adjustment is performed on the finish polishing, that is, the first parameter distribution result is adjusted, and obtaining a second parameter distribution result. And performing parameter control of the finish polishing equipment according to the second parameter distribution result. The polishing size is analyzed by measuring the basic information side of the product and acquiring the standard information, and intelligent parameter distribution is carried out on the parameters of the fine polishing and the rough polishing through a polishing parameter distribution model, so that the parameter control of the rough polishing and the fine polishing is more intelligent, the parameter distribution of the intelligent rough polishing and the fine polishing is further achieved by deeply combining the product parameter information and the demand information, the combined intelligent control of the rough polishing and the fine polishing is carried out, and the technical effect of improving the polishing yield is improved.

Further, as shown in fig. 2, step S800 in the embodiment of the present application further includes:

step S810: constructing a rough polishing product comparison characteristic set;

step S820: comparing the characteristics of the first image through the rough polishing product characteristic comparison set to obtain a characteristic value of the first image;

step S830: obtaining a first preset characteristic value range, and judging whether the characteristic value is in the first preset characteristic value range or not;

step S840: and when the characteristic value is not in the first preset characteristic value range, obtaining the second parameter distribution result through the characteristic value.

Specifically, the rough polishing product comparison feature set is to perform image acquisition on a rough polishing product, perform feature acquisition on a polished surface of the rough polishing product based on basic data of the image acquisition, assign feature values to features with different finish polishing processing difficulties according to different information such as feature forms, sizes, depths and the like, construct the rough polishing product comparison feature set according to the feature and the feature value information, perform feature comparison on the first image through the rough polishing product comparison feature set, obtain the feature value of the first image according to feature similarity and feature value information corresponding to similar features, determine whether the feature value of the first image is within a first predetermined feature value range according to preset feature value ranges set by comprehensive dimensional considerations such as finish polishing processing capability, processing cost and the like, when the characteristic value is within the first predetermined characteristic value range, the first rough polishing product is difficult to process through fine polishing, the rough polishing product cannot be directly subjected to fine polishing, if the size of the first rough polishing product allows, the first rough polishing product is subjected to rough polishing again, and if the size does not allow, the first rough polishing product is abandoned. And when the characteristic value is not in the first preset characteristic value range, obtaining a second parameter distribution result through the characteristic value, namely configuring the technological parameters of finish polishing according to the left characteristics of rough polishing to obtain the second parameter distribution result, and performing finish polishing treatment based on the second parameter distribution result. Through the characteristic comparison and the characteristic value analysis of the rough polishing product, the second parameter distribution result is more accurate and reasonable, and the technical effect of improving the polishing yield is achieved.

Further, as shown in fig. 3, step S850 in this embodiment of the present application further includes:

step S851: obtaining a second image of the first product to be polished through the first image acquisition device;

step S852: obtaining a second preset characteristic value range according to the second image and the first parameter distribution result;

step S853: obtaining first characteristic difference value information according to the characteristic value and the second preset characteristic value range;

step S854: and correcting the polishing parameter distribution model according to the first characteristic difference information.

Specifically, the first image acquisition device acquires an image of the first product to be polished before polishing to obtain the second image, wherein the image acquired part is still a polishing part, rough polishing processing of the parameter is determined according to the second image and the first parameter distribution result, a feature value range which the first product to be polished should reach, namely the second predetermined feature value range, first feature difference information is obtained based on the second predetermined feature value range and the feature value, wherein the first feature difference information reflects a processing error of the rough polishing product, and parameter correction is performed on a part of the rough polishing parameter distribution model which performs parameter distribution processing based on the first feature difference information, so that subsequent parameter distribution processing performed by the parameter distribution model is more accurate, thereby achieving the technical effects of improving the processing effect and the processing precision of rough polishing and further improving the product yield.

Further, as shown in fig. 4, when the eigenvalue is not within the first predetermined eigenvalue range, the step S840 of the embodiment of the present application further includes:

step S841: taking the second size information as a first constraint parameter;

step S842: taking the second image as a second constraint parameter, and performing feasibility evaluation of finish polishing based on the first constraint parameter and the second constraint parameter to obtain a first feasibility evaluation result;

step S843: when the first feasibility assessment does not meet a first feasibility threshold, then discontinuing processing of the first rough polishing product.

Specifically, the actual polishing allowance reserved for finish polishing of the first rough polishing product is obtained according to the second dimension information and the first standard dimension information, the second dimension information is used as a first constraint parameter, the dimension to be polished of the first product to be polished is estimated according to the feature information of each feature in the second image, namely, the second image is used as a second constraint parameter, the evaluation is performed according to the matching degree of the first constraint parameter and the second constraint parameter, namely, the matching degree of the actual polishing allowance and the dimension to be polished is evaluated, the feasibility evaluation result is obtained according to the evaluation result of the matching degree, a feasibility threshold, namely, the first feasibility threshold is preset, whether the feasibility evaluation result meets the first feasibility threshold is judged, when the feasibility evaluation result fails to meet the first feasibility threshold, it is indicated that the first rough polishing product is subjected to the finish polishing treatment again, and the requirement is hardly met, and the continuous processing of the first rough polishing product is abandoned, so that the loss is reduced.

Further, as shown in fig. 5, step S1000 in the embodiment of the present application further includes:

step S1010: obtaining polishing internal environment information of the rough polishing equipment;

step S1020: constructing an influence parameter set of the polishing internal environment information;

step S1030: obtaining a rough polishing influence coefficient according to the polishing internal environment information and the influence parameter set;

step S1040: and cleaning the internal environment of the rough polishing equipment through the rough polishing influence coefficient and the first image.

Specifically, the environment information in polishing is the internal environment information of the rough polishing device, that is, the environment information mainly includes the air, dust, fiber, temperature, humidity and the like in the rough polishing device, and the environment information in polishing is obtained by measuring the temperature, humidity, fiber density, dust concentration and the like of the rough polishing device. And obtaining parameter information of polishing possibly influenced by the internal environment information, namely the influence parameter set according to the internal environment information of the polishing. And evaluating the influence degree of the polishing by the polishing internal environment information and the influence parameter set to obtain the rough polishing influence coefficient. And evaluating whether the rough polishing equipment needs to clean the internal environment or not through the rough polishing influence coefficient and the rough polished product image, and cleaning the internal environment based on the evaluation result. Through the supervision of the internal environment of the rough polishing equipment, the product image and the internal environment of the polished product establish a supervision corresponding relation, and the timing cleaning of the internal environment is judged through the processing information of the product, so that the cleaning of the internal environment is more timely and accurate, and the technical effect of improving the product yield is achieved.

Further, as shown in fig. 6, the embodiment of the present application further includes:

step S855: obtaining a first comparison instruction, and performing feature comparison on the first image and the second image according to the first comparison instruction to obtain a first feature comparison result;

step S856: performing matching degree evaluation according to the first parameter distribution result and the first characteristic comparison result to obtain a first matching degree evaluation result;

step S857: and adjusting the rough polishing equipment according to the first matching degree evaluation result.

Specifically, the first comparison instruction is an instruction for performing characteristic comparison before and after rough polishing on the first product to be polished, according to the acquired first image and the acquired second image, the first image and the second image are subjected to image characteristic comparison to obtain a first characteristic comparison result, and a first parameter distribution result is obtained. And comparing the expected parameter achievement target with the actual condition according to the parameter setting information and the actual working result in the rough polishing equipment to obtain a first matching degree evaluation result, and adjusting the corresponding relation between the parameters and the effect in the rough polishing equipment according to the first matching degree evaluation result, so that the subsequent rough polishing treatment of the rough polishing equipment is more accurate, and the technical effect of improving the product yield is achieved.

Further, as shown in fig. 7, step S1100 in the embodiment of the present application further includes:

step S1110: obtaining parameter control information of the rough polishing equipment and the fine polishing equipment and processed product information corresponding to the parameter control information;

step S1120: taking the parameter control information and the processed product information as basic data, and inputting training data into the polishing parameter distribution model for training, wherein the training data comprises the first size information, the first standard size information, the first polishing surface requirement information and identification information for identifying a parameter distribution result;

step S1130: and when the polishing parameter distribution model meets a first output threshold value, inputting the first size information, the first standard size information and the first polishing surface requirement information into the polishing parameter distribution model to obtain a first parameter distribution result.

Specifically, parameter acquisition is performed on the rough polishing device and the finish polishing device, that is, control parameters of finish polishing and rough polishing and corresponding processed product information under the control parameters are acquired, the parameter control information and the processed product information are used as basic data, training data is input into the polishing parameter distribution model for training, wherein the training data comprises the first size information, the first standard size information, the first polishing surface requirement information and identification information identifying a parameter distribution result, and after the polishing parameter distribution model is trained to a convergence state through the training data, parameter distribution processing can be performed through the polishing parameter distribution model. And the standard for marking the convergence state is a first output threshold value, and when the output result of the polishing parameter distribution model meets the first output threshold value, the first size information, the first standard size information and the first polishing surface requirement information are input into the polishing parameter distribution model to obtain a first parameter distribution result. Through the training of the polishing parameter distribution model, the polishing parameter distribution model can carry out more intelligent and accurate parameter distribution, so that the control of rough and fine polishing is more accurate, and the technical effect of improving the polishing yield of products is further achieved.

In summary, the intelligent control method and system for polishing equipment provided by the embodiment of the application have the following technical effects:

1. the first dimension information of the first product to be polished is obtained by the first dimension measuring device; obtaining first standard size information; obtaining first polishing surface requirement information, and using the polishing surface requirement information as supervision data; inputting the first dimension information, the first standard dimension information and the first polishing surface requirement information into a polishing parameter distribution model to obtain a first parameter distribution result; controlling rough polishing equipment according to the first parameter distribution result, and processing the first product to be polished to obtain a first rough polishing product; obtaining second dimensional information of the first rough polishing product by the first sizing device; obtaining a first image of the first rough polishing product by the first image acquisition device; adjusting the first parameter distribution result according to the first image and the second size information to obtain a second parameter distribution result; and controlling the parameters of the fine polishing equipment according to the second parameter distribution result. The polishing size is analyzed by measuring the basic information side of the product and acquiring the standard information, and intelligent parameter distribution is carried out on the parameters of the fine polishing and the rough polishing through a polishing parameter distribution model, so that the parameter control of the rough polishing and the fine polishing is more intelligent, the parameter distribution of the intelligent rough polishing and the fine polishing is further achieved by deeply combining the product parameter information and the demand information, the combined intelligent control of the rough polishing and the fine polishing is carried out, and the technical effect of improving the polishing yield is improved.

2. Due to the adoption of the mode of comparing the characteristics of the rough polishing product and analyzing the characteristic value, the second parameter distribution result is more accurate and reasonable, and the technical effect of improving the polishing yield is further achieved.

3. Due to the fact that the mode that parameters of the part, which is used for carrying out parameter distribution processing on rough polishing, of the polishing parameter distribution model are corrected based on the first characteristic difference information is adopted, the subsequent parameter distribution processing of the parameter distribution model is more accurate, the rough polishing processing effect and the rough polishing processing precision are improved, and the technical effect of improving the product yield is achieved.

4. Due to the fact that the mode of judging the timing cleaning of the inner environment through the processing information of the product is adopted, the cleaning of the inner environment is more timely and accurate, and the technical effect of improving the yield of the product is achieved.

Example two

Based on the same inventive concept as the intelligent control method of the polishing apparatus in the previous embodiment, the present invention also provides an intelligent control system of the polishing apparatus, as shown in fig. 8, the system comprising:

a first obtaining unit 11, the first obtaining unit 11 being configured to obtain first dimension information of a first product to be polished by a first dimension measuring device;

a second obtaining unit 12, the second obtaining unit 12 being configured to obtain the first standard size information;

a third obtaining unit 13, the third obtaining unit 13 being configured to obtain first polishing surface requirement information, and to use the first polishing surface requirement information as supervision data;

a fourth obtaining unit 14, wherein the fourth obtaining unit 14 is configured to input the first size information, the first standard size information, and the first polishing surface requirement information into a polishing parameter distribution model, so as to obtain a first parameter distribution result;

a fifth obtaining unit 15, where the fifth obtaining unit 15 is configured to control the rough polishing apparatus according to the first parameter distribution result, and process the first product to be polished to obtain a first rough polishing product;

a sixth obtaining unit 16, the sixth obtaining unit 16 being configured to obtain second size information of the first rough polishing product by the first sizing device;

a seventh obtaining unit 17, wherein the seventh obtaining unit 17 is configured to obtain a first image of the first rough polishing product through a first image capturing device;

an eighth obtaining unit 18, where the eighth obtaining unit 18 is configured to adjust the first parameter allocation result according to the first image and the second size information, and obtain a second parameter allocation result;

a first control unit 19, wherein the first control unit 19 is used for controlling the parameters of the fine polishing device according to the second parameter distribution result.

Further, the system further comprises:

the first construction unit is used for constructing a rough polishing product comparison feature set;

a ninth obtaining unit, configured to perform feature comparison on the first image through the rough polishing product feature comparison set to obtain a feature value of the first image;

a tenth obtaining unit, configured to obtain a first predetermined feature value range, and determine whether the feature value is within the first predetermined feature value range;

an eleventh obtaining unit configured to obtain the second parameter assignment result by the feature value when the feature value is not within the first predetermined feature value range.

Further, the system further comprises:

a twelfth obtaining unit configured to obtain a second image of the first product to be polished by the first image capturing device;

a thirteenth obtaining unit configured to obtain a second predetermined feature value range from the second image and the first parameter assignment result;

a fourteenth obtaining unit configured to obtain first feature difference value information from the feature value and the second predetermined feature value range;

and the first correction unit is used for correcting the polishing parameter distribution model according to the first characteristic difference information.

Further, the system further comprises:

a fifteenth obtaining unit configured to use the second size information as a first constraint parameter;

a sixteenth obtaining unit, configured to perform, with the second image as a second constraint parameter, feasibility evaluation of finish polishing based on the first constraint parameter and the second constraint parameter, and obtain a first feasibility evaluation result;

a seventeenth obtaining unit for abandoning the further processing of the first rough polished product when the first feasibility evaluation result does not satisfy the first feasibility threshold.

Further, the system further comprises:

an eighteenth obtaining unit configured to obtain polishing internal environment information of the rough polishing apparatus;

a second construction unit for constructing a set of influence parameters of the environmental information within polishing;

a nineteenth obtaining unit, configured to obtain a rough polishing influence coefficient according to the polishing internal environment information and the influence parameter set;

and the first cleaning unit is used for cleaning the internal environment of the rough polishing equipment through the rough polishing influence coefficient and the first image.

Further, the system further comprises:

a twentieth obtaining unit, configured to obtain a first comparison instruction, and perform feature comparison on the first image and the second image according to the first comparison instruction to obtain a first feature comparison result;

a twenty-first obtaining unit, configured to perform matching degree evaluation according to the first parameter allocation result and the first feature comparison result, and obtain a first matching degree evaluation result;

a first adjusting unit, configured to adjust the rough polishing apparatus according to the first matching degree evaluation result.

Further, the system further comprises:

a twenty-second obtaining unit, configured to obtain parameter control information of the rough polishing apparatus and the finish polishing apparatus and processed product information corresponding to the parameter control information;

a first training unit configured to input training data into the polishing parameter assignment model for training, with the parameter control information and the processed product information as basic data, wherein the training data includes the first size information, the first standard size information, the first polishing surface requirement information, and identification information that identifies a parameter assignment result;

a twenty-third obtaining unit configured to input the first size information, the first standard size information, and the first polishing surface requirement information into the polishing parameter distribution model when the polishing parameter distribution model satisfies a first output threshold, and obtain the first parameter distribution result.

Various modifications and specific examples of the intelligent control method for a polishing apparatus in the first embodiment of fig. 1 are also applicable to the intelligent control system for a polishing apparatus in this embodiment, and the implementation method of the intelligent control system for a polishing apparatus in this embodiment is clear to those skilled in the art from the foregoing detailed description of the intelligent control method for a polishing apparatus, so for the sake of brevity of description, detailed description is omitted here.

The electronic apparatus of the embodiment of the present application is described below with reference to fig. 9.

Fig. 9 illustrates a schematic structural diagram of an electronic device according to an embodiment of the present application.

Based on the inventive concept of the intelligent control method of the polishing apparatus in the foregoing embodiments, the present invention also provides an intelligent control system of the polishing apparatus, and hereinafter, an electronic apparatus according to an embodiment of the present application is described with reference to fig. 9. The electronic device may be a removable device itself or a stand-alone device independent thereof, on which a computer program is stored which, when being executed by a processor, carries out the steps of any of the methods as described hereinbefore.

As shown in fig. 9, the electronic device 50 includes one or more processors 51 and a memory 52.

The processor 51 may be a Central Processing Unit (CPU) or other form of processing unit having data processing capabilities and/or instruction execution capabilities, and may control other components in the electronic device 50 to perform desired functions.

The memory 52 may include one or more computer program products that may include various forms of computer-readable storage media, such as volatile memory and/or non-volatile memory. The volatile memory may include, for example, Random Access Memory (RAM), cache memory (cache), and/or the like. The non-volatile memory may include, for example, Read Only Memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage medium and executed by the processor 51 to implement the methods of the various embodiments of the application described above and/or other desired functions.

In one example, the electronic device 50 may further include: an input device 53 and an output device 54, which are interconnected by a bus system and/or other form of connection mechanism (not shown).

The embodiment of the invention provides an intelligent control method of polishing equipment, wherein the method is applied to an intelligent parameter control system, the system is in communication connection with a first image acquisition device and a first size measurement device, and the method comprises the following steps: obtaining first dimension information of a first product to be polished by the first dimension measuring device; obtaining first standard size information; obtaining first polishing surface requirement information, and using the polishing surface requirement information as supervision data; inputting the first dimension information, the first standard dimension information and the first polishing surface requirement information into a polishing parameter distribution model to obtain a first parameter distribution result; controlling rough polishing equipment according to the first parameter distribution result, and processing the first product to be polished to obtain a first rough polishing product; obtaining second dimensional information of the first rough polishing product by the first sizing device; obtaining a first image of the first rough polishing product by the first image acquisition device; adjusting the first parameter distribution result according to the first image and the second size information to obtain a second parameter distribution result; and controlling the parameters of the fine polishing equipment according to the second parameter distribution result. The technical problem that polishing reject ratio is increased due to the fact that combined intelligent control of rough polishing parameters and finish polishing parameters cannot be intelligently conducted according to specific parameter information and product demand information of products in the prior art is solved, and the technical effects that parameter distribution of intelligent rough polishing and finish polishing is conducted by deeply combining the product parameter information and the demand information, combined intelligent control of rough polishing and finish polishing is conducted, and polishing yield is improved are achieved.

Through the above description of the embodiments, those skilled in the art will clearly understand that the present application can be implemented by software plus necessary general-purpose hardware, and certainly can also be implemented by special-purpose hardware including special-purpose integrated circuits, special-purpose CPUs, special-purpose memories, special-purpose components and the like. Generally, functions performed by computer programs can be easily implemented by corresponding hardware, and specific hardware structures for implementing the same functions may be various, such as analog circuits, digital circuits, or dedicated circuits. However, for the present application, the implementation of a software program is more preferable. Based on such understanding, the technical solutions of the present application may be substantially embodied in the form of a software product, which is stored in a readable storage medium, such as a floppy disk, a usb disk, a removable hard disk, a ROM, a RAM, a magnetic disk, or an optical disk of a computer, and includes several instructions for causing a computer device to execute the method according to the embodiments of the present application.

In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product.

The computer program product includes one or more computer instructions. When loaded and executed on a computer, cause the processes or functions described in accordance with the embodiments of the application to occur, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored on or transmitted from a computer-readable storage medium to another computer-readable storage medium, which may be magnetic (e.g., floppy disks, hard disks, tapes), optical (e.g., DVDs), or semiconductor (e.g., Solid State Disks (SSDs)), among others.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

Additionally, the terms "system" and "network" are often used interchangeably herein. The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be understood that in the embodiment of the present application, "B corresponding to a" means that B is associated with a, from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may be determined from a and/or other information.

Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the examples described in connection with the embodiments disclosed herein may be embodied in electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described in a functional general in the foregoing description for the purpose of illustrating clearly the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In short, the above description is only a preferred embodiment of the present disclosure, and is not intended to limit the scope of the present disclosure. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.