阅读说明：本技术 封装结构、印制电路板及电子设备 (Packaging structure, printed circuit board and electronic equipment ) 是由 叶峰 虞程华 于 2020-05-19 设计创作，主要内容包括：本发明公开了一种封装结构、印制电路板及电子设备,该封装结构包括基板、电子元件和焊盘组件,焊盘组件包括焊盘本体和导电本体,导电本体设于焊盘本体的外围,焊盘组件的阻抗等于预设阻抗Z-(0)；电子元件与焊盘本体电连接,焊盘本体与信号线连接；基板包括导电层和介质层,介质层包括第一介质层,导电层包括第一导电层；焊盘组件和信号线设于第一介质层的外表面,第一导电层设于第一介质层背离焊盘组件的一侧,第一介质层设有通孔,通孔的内表面设有导电膜,导电本体通过导电膜与第一导电层连接；导电层设有开口结构,焊盘本体在导电层的正投影位于开口结构内。本发明提出的封装结构有利于提升阻抗连续性,改善信号传输效果。(The invention discloses a packaging structure, a printed circuit board and electronic equipment, wherein the packaging structure comprises a substrate, an electronic element and a pad component, the pad component comprises a pad body and a conductive body, the conductive body is arranged on the periphery of the pad body, and the impedance of the pad component is equal to the preset impedance Z 0 (ii) a The electronic element is electrically connected with the bonding pad body, and the bonding pad body is connected with the signal wire; the substrate comprises a conducting layer and a dielectric layer, the dielectric layer comprises a first dielectric layer, and the conducting layer comprises a first conducting layer; the welding disc assembly and the signal wire are arranged on the outer surface of the first medium layer, the first conducting layer is arranged on one side of the first medium layer, which is far away from the welding disc assembly, the first medium layer is provided with a through hole, the inner surface of the through hole is provided with a conducting film, and the conducting body is connected with the first conducting layer through the conducting film; the conducting layer is provided with an opening structure, and the orthographic projection of the bonding pad body on the conducting layer is located in the opening structure. The packaging structure provided by the invention is beneficial to improving the impedance continuity and improving the signal transmissionAnd (5) effect.)

1. A package structure, comprising: the welding disc assembly comprises a welding disc body and a conductive body arranged opposite to the welding disc body, the conductive body is arranged on the periphery of the welding disc body, a space interval is formed between the conductive body and the welding disc body, and the impedance of the welding disc assembly is equal to the preset impedance Z₀；

The electronic element is electrically connected with the pad body, and the pad body is connected with the corresponding signal wire;

the substrate comprises conducting layers and dielectric layers, the dielectric layers are arranged between two adjacent conducting layers and comprise first dielectric layers, and the conducting layers comprise first conducting layers;

the bonding pad assembly and the signal wire are arranged on the outer surface of the first medium layer, the first conducting layer is arranged on one side, away from the bonding pad assembly, of the first medium layer, the first medium layer is provided with a through hole, a conducting film is arranged on the inner wall surface forming the through hole, and the conducting body is connected with the first conducting layer through the conducting film;

the conducting layer is provided with an opening structure, and the orthographic projection of the pad body on the conducting layer is located in the opening structure.

2. The package structure according to claim 1, wherein the conductive body is a strip structure, and an extending direction of the conductive body is parallel to an extending direction of the signal line;

the length of the conductive body is greater than or equal to the length of the pad body in the extending direction parallel to the signal line.

3. The package structure of claim 1, wherein the conductive body is a semi-enclosed structure;

the length of the conductive body is greater than or equal to that of the pad body in the extending direction parallel to the signal line;

in the extending direction perpendicular to the signal line, the minimum distance between the conductive body and the signal line is greater than a preset distance threshold.

4. The package structure according to any one of claims 1 to 3, wherein a first distance L is provided between an edge of the conductive body on a side close to the pad body and an edge of the pad body on the side close to the conductive body.

5. The package structure according to any one of claims 1 to 3, wherein an orthographic projection of the conductive body on the conductive layer is located outside the opening structure.

6. The package structure of any one of claims 1-3, wherein the conductive body comprises copper foil.

7. The package structure according to any one of claims 1 to 3, wherein an orthographic projection of the conductive body on the first conductive layer completely covers an orthographic projection of the via on the first conductive layer.

8. The package structure of any of claims 1-3, wherein the electronic component comprises an AC coupling capacitor.

9. A printed circuit board comprising the package structure of any one of claims 1-8.

10. An electronic device comprising the printed circuit board of claim 9.

Technical Field

The invention relates to the technical field of electronic devices, in particular to a packaging structure, a printed circuit board and electronic equipment.

Background

In a high-speed serial link system, in order to increase the noise tolerance of a circuit, an alternating current coupling capacitor is generally required to be connected to a signal input end and a signal output end, so that the anti-interference capability of a high-speed signal is improved.

In the high-speed link, the impedance of the signal transmission path is inversely related to the width of the signal line, and the larger the width of the signal line, the smaller the impedance of the signal transmission path. However, the width of the package pad of the ac coupling capacitor is much larger than the width of the signal line, and therefore, the pad impedance is smaller than the impedance of the signal line, which causes the problem of discontinuous impedance of the high-speed link at the pad, and the discontinuous impedance causes signal reflection distortion.

Disclosure of Invention

The invention provides a packaging structure, which solves the problem of discontinuous impedance of a high-speed link at a bonding pad, can realize quantitative control of the impedance of the bonding pad, and improves the signal transmission effect.

In a first aspect, an embodiment of the present invention provides a package structure, including: the welding disc assembly comprises a welding disc body and a conductive body arranged opposite to the welding disc body, the conductive body is arranged on the periphery of the welding disc body, a space interval is formed between the conductive body and the welding disc body, and the impedance of the welding disc assembly is equal to the preset impedance Z₀(ii) a The electronic element is electrically connected with the pad body, and the pad body is connected with the corresponding signal wire; the substrate comprises conducting layers and dielectric layers, the dielectric layers are arranged between two adjacent conducting layers and comprise first dielectric layers, and the conducting layers comprise first conducting layers; the bonding pad assembly and the signal wire are arranged on the outer surface of the first medium layer, the first conducting layer is arranged on one side, away from the bonding pad assembly, of the first medium layer, the first medium layer is provided with a through hole, a conducting film is arranged on the inner wall surface forming the through hole, and the conducting body is connected with the first conducting layer through the conducting film; the conducting layer is provided with an opening structure, and the orthographic projection of the pad body on the conducting layer is located in the opening structure.

Optionally, the conductive body is of a strip-shaped structure, and an extending direction of the conductive body is parallel to an extending direction of the signal line; the length of the conductive body is greater than or equal to the length of the pad body in the extending direction parallel to the signal line.

Optionally, the conductive body is in a semi-enclosed structure; the length of the conductive body is greater than or equal to that of the pad body in the extending direction parallel to the signal line; in the extending direction perpendicular to the signal line, the minimum distance between the conductive body and the signal line is greater than a preset distance threshold.

Optionally, a first distance L is provided between an edge of the conductive body on a side close to the pad body and an edge of the pad body on a side close to the conductive body.

Optionally, the conductive body comprises a copper foil.

Optionally, an orthographic projection of the conductive body on the first conductive layer completely covers an orthographic projection of the through hole on the first conductive layer.

Optionally, the electronic component comprises an ac coupling capacitor.

In a second aspect, an embodiment of the present invention further provides a printed circuit board, including the above package structure.

In a third aspect, an embodiment of the present invention further provides an electronic device, including the printed circuit board.

The electronic equipment provided by the embodiment of the invention is provided with the packaging structure, the packaging structure is provided with the conductive body around the pad body, the conductive layer is provided with the opening structure in the area corresponding to the pad body, when an alternating current signal flows through the pad body, the conductive body provides a backflow path for the signal so as to increase the impedance of the pad assembly, the problem of discontinuous impedance of a high-speed link at the pad is solved, the pad impedance can be accurately controlled by adjusting the distance between the conductive body and the pad body, the impedance continuity is favorably improved, and the signal transmission effect is improved.

Drawings

Fig. 1 is a schematic cross-sectional view of a package structure according to an embodiment of the invention;

fig. 2 is a schematic top view of a package structure according to an embodiment of the invention;

FIG. 3 is a schematic structural diagram of a pad assembly according to an embodiment of the invention;

FIG. 4 is a schematic diagram of another bond pad assembly in accordance with an embodiment of the present invention;

FIG. 5 is a schematic diagram of a printed circuit board according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

Fig. 1 is a schematic cross-sectional view of a package structure according to an embodiment of the invention. Fig. 2 is a schematic top view of a package structure according to an embodiment of the invention. The present embodiment is applicable to an application scenario in which the package pad impedance in the ac link is precisely adjusted, where the signal line 140 is used for transmitting an ac electrical signal.

As shown in fig. 1, a package structure 01 provided in an embodiment of the present invention includes: a substrate 110, an electronic component 120, and a pad assembly 130.

Referring to fig. 1 and 2 in combination, the pad assembly 130 includes a plurality of pad bodies 301 and a conductive body 302 disposed opposite to the pad bodies 301, the conductive body 302 is disposed at the periphery of the pad bodies 301, a space is disposed between the conductive body 302 and the pad bodies 301, and the space between the conductive body 302 and the pad bodies 301 is adjusted to make the impedance of the pad assembly 130 equal to the preset impedance Z₀(ii) a The electronic element 120 is welded on the pad body 301 and electrically connected with the pad body 301, and the pad body 301 is connected with the corresponding signal wire 140; the substrate 110 comprises conductive layers 101 and dielectric layers 102, the conductive layers 101 and the dielectric layers 102 are arranged at intervals in a laminated mode, the dielectric layers 102 are arranged between two adjacent conductive layers 101, each dielectric layer 102 comprises a first dielectric layer M01, and the first dielectric layer M01 and the top layer or the bottom layer of the substrate 110Adjacently, the top layer or the bottom layer of the substrate 110 is a conductive layer, the top layer or the bottom layer of the substrate 110 can be used for arranging signal lines, and the conductive layer includes a first conductive layer L01; the pad assembly 130 and the signal line 140 are arranged on the outer surface of the first medium layer M01, the first conducting layer L01 is arranged on one side of the first medium layer M01 away from the pad assembly 130, the first medium layer M01 is provided with a through hole 103, the inner wall surface forming the through hole 103 is provided with a conducting film 104, and the conducting body 302 is connected with the first conducting layer L01 through the conducting film 104; the conductive layer 101 is provided with an opening structure 105, and the orthographic projection of the pad body 301 on the conductive layer 101 is positioned in the opening structure 105.

The pad assembly 130 and the signal line 140 are disposed on the same layer, for example, the pad assembly 130 and the signal line 140 may be disposed on the top layer or the bottom layer of the substrate 110, and the pad body 301, the conductive body 302 and the signal line 140 are all made of conductive materials laid on the outer surface of the first dielectric layer M01.

Among them, the pad assembly 130 and the signal line 140 may be disposed on the top layer or the bottom layer of the substrate 110. If the pad assembly 130 and the signal line 140 are disposed on the top layer of the substrate 110, the outer surface of the first dielectric layer M01 is the top surface of the first dielectric layer M01; if the pad assembly 130 and the signal line 140 are disposed on the bottom layer of the substrate 110, the outer surface of the first dielectric layer M01 is the bottom surface of the first dielectric layer M01.

Alternatively, the conductive body 302 may include a copper foil. Of course, on the premise that the conductivity of the conductive body 302 is not changed, the conductive body 302 may also be made of other conductive materials, which is not limited thereto.

In this embodiment, a copper foil may be used as the conductive body 302, the copper foil may be the same as the conductive material of the conductive layer 101 and the conductive material of the signal line 140, and the thickness of the conductive body 302, the thickness of the pad body 301, and the thickness of the signal line 140 may be consistent in a Z direction perpendicular to the substrate 110, for example, the thickness may be T, which is beneficial to improving the uniformity of the conductive material in the signal transmission link.

Illustratively, a layer of copper foil may be laid on the outer surface of the first dielectric layer M01, and the patterned copper foil corresponding to the pad body 301, the conductive body 302 and the signal line 140 is remained by etching technology. The etched patterned copper foil shown in fig. 2 includes four pad bodies 301, four signal lines 140, and a conductive body 302 disposed on the periphery of the pad body 301, wherein the pad body 301 is connected between a signal input end and a signal output end of an ac link through the signal lines 140, and a first distance L is provided between an edge of one side of the conductive body 302 close to the pad body 301 and an edge of one side of the pad body 301 close to the conductive body 302.

Referring to fig. 1 and fig. 2, the conductive layer 101 has an opening 105, the pad body 301 is located in the opening 105 at an orthogonal projection of the conductive layer 101, the opening 105 does not have a conductive material, that is, the opening 105 is formed in a region of the conductive layer 101 corresponding to the pad body 301 to form a hollow, and the conductive layer 101 cannot form a reflow path in the region corresponding to the pad body 301. When the signal line 140 at the input end of the electronic component 120 transmits an ac electrical signal to the pad body 301, the conductive body 302 disposed at the periphery of the pad body 301 generates an induced electrical signal, which is transmitted to the first conductive layer L01 through the conductive film 104, and a return path is formed through the conductive film 104 disposed at the output end of the electronic component 120, the conductive body 302, the pad body 301, and the signal line 140.

In this embodiment, the pad body 301 has a trace impedance, the impedance of the pad assembly 130 is determined by the differential impedance between the conductive body 302 and the pad body 301, and the impedance of the pad assembly 130 can be precisely controlled by adjusting the parameter of the first distance L, so that the impedance of the pad assembly 130 is equal to the preset impedance Z₀。

Alternatively, referring to fig. 1, the orthographic projection of the conductive body 302 on the conductive layer 101 is located outside the opening structure 105, that is, the area of the opening structure 105 may be set to be approximately equal to the area of the pad body 301, so that the conductive layer 101 has the conductive material at the region corresponding to the conductive body 302, which is beneficial to achieve reliable electrical connection between the conductive body 302 and the first conductive layer L01.

Alternatively, as shown in fig. 1, the orthographic projection of the conductive body 302 on the first conductive layer L01 completely covers the orthographic projection of the via 103 on the first conductive layer L01.

As shown in fig. 1, the through hole 103 is disposed in the first dielectric layer M01 in the region corresponding to the conductive body 302, and if the conductive body 302 is disposed on the top layer, the through hole 103 in the first dielectric layer M01 is located right below the conductive body 302; if the conductive body 302 is disposed at the bottom layer, the through hole 103 in the first dielectric layer M01 is located right above the conductive body 302, the cross-sectional area of the through hole 103 may be set to be smaller than or equal to the bottom area of the conductive body 302, and the conductive body 302 sufficiently contacts the conductive film 104 disposed on the inner surface of the through hole 103, so that the conductive body 302 is electrically connected to the first conductive layer L01 through the conductive film 104.

Therefore, in the packaging structure provided by the embodiment of the invention, the conductive body is arranged around the pad body provided with the electronic element, and the conductive layer is provided with the hollow parts in the area corresponding to the pad body, so that when an alternating current signal flows through the pad body, the conductive body provides a backflow path for signal transmission, the impedance of the pad assembly is increased, the problem of discontinuous impedance of a high-speed link at the pad is solved, the pad impedance can be quantitatively controlled by adjusting the distance between the conductive body and the pad body, the influence of the arrangement of the electronic element on the impedance continuity is favorably reduced, and the signal transmission effect is improved.

Illustratively, embodiments of the present invention provide two specific embodiments of a pad assembly.

Fig. 3 is a schematic structural diagram of a pad assembly according to an embodiment of the present invention. Fig. 4 is a schematic diagram of another pad assembly in accordance with an embodiment of the present invention.

Alternatively, as shown in fig. 3 and 4, the conductive body 302 is disposed on the periphery of the pad body 301, and a first distance L is provided between an edge of the conductive body 302 on a side close to the pad body 301 and an edge of the pad body 301 on the side close to the conductive body 302.

The conductive body 302 and the pad body 301 are disposed opposite to each other, and a first distance L is provided between the conductive body 302 and the pad body 301, so that when an ac signal flows through the pad body 301, the conductive body 302 can generate an induced electrical signal, and the conductive body 302 and the signal line 140 are spatially disposed at an interval, for example, the interval between the conductive body 302 and the signal line 140 can be set to be greater than the first distance L, thereby avoiding a short circuit risk caused by contact between the conductive body 302 and the signal line 140.

Example one

The bonding pad assembly provided by the first embodiment of the invention comprises a conductive body in a strip-shaped structure.

Alternatively, as shown in fig. 3, the conductive body 302 has a strip structure, and the extending direction of the conductive body 302 is parallel to the extending direction of the signal line 140; in the extending direction X parallel to the signal line 140, the length L10 of the conductive body 302 is equal to or greater than the length L20 of the pad body 301.

In the embodiment, as shown in fig. 3, an extending direction parallel to the signal line 140 is defined as an X direction, and a direction perpendicular to the signal line 140 is defined as a Y direction, in the Y direction, the extending direction of the conductive body 302 is parallel to the X direction, the pad body 301 has a rectangular structure, the signal line 140 is connected to a vertex of the pad body 301, and an edge of the signal line 140 on a side away from the conductive body 302 is aligned with an edge of the pad body 301 on a side away from the conductive body 302. In the extending direction X parallel to the signal line 140, the length L10 of the conductive body 302 is greater than or equal to the length L20 of the pad body 301, so that when an ac signal flows through the pad body 301, the conductive body 302 can induce to generate an electrical signal, and a return path is provided for electrical signal transmission by the conductive body 302, which is beneficial to improving the signal transmission capability between the conductive body 302 and the pad body 301.

Illustratively, the conductive body 302 includes a first strip-shaped conductive body and a second strip-shaped conductive body, the first strip-shaped conductive body and the second strip-shaped conductive body are symmetrically arranged at two sides of the combination of the plurality of pad bodies 301, and the extending directions of the first strip-shaped conductive body and the second strip-shaped conductive body are parallel to the extending direction of the signal line 140; the lengths of the first and second strip-shaped conductive bodies are equal to or greater than the length of the pad body 301 in the extending direction X parallel to the signal line 140. Of course, the first and second strip-shaped conductive bodies may have different lengths in the extending direction X parallel to the signal line 140, which is not limited.

Example two

The bonding pad assembly provided by the second embodiment of the invention comprises a conductive body in a semi-surrounding structure.

Alternatively, as shown in fig. 2 and 4, the conductive body 302 has a half-enclosed structure, and the conductive body 302 has a first conductive part 3021 parallel to the extending direction X of the signal line 140 and a second conductive part 3022 perpendicular to the extending direction of the signal line 140; a length L10 of the conductive body 302 is equal to or greater than a length L20 of the pad body 301 in the direction parallel to the extending direction X of the signal line 140; in the extending direction perpendicular to the signal line 140, the minimum distance L30 between the conductive body 302 and the signal line 140 is greater than a predetermined distance threshold, wherein the minimum distance L30 between the conductive body 302 and the signal line 140 is the distance between the second conductive part 3022 and the signal line 140.

Specifically, as shown in fig. 2 and 4, the pad body 301 may have a rectangular structure defining an extending direction parallel to the signal line 140 as an X direction and a direction perpendicular to the signal line 140 as a Y direction, and the pad body 301 has a second width W in the Y direction₂. The conductive body 302 may be a C-like half-surrounded structure, the pad body 301 is disposed in the C-like half-surrounded structure, the pad body 301 has a first edge a1 and a second edge a2 that are orthogonal to each other, and the first edge a1 of the pad body 301 is parallel to the extending direction of the signal line 140. The extending direction of the first conductive part 3021 of the conductive body 302 is parallel to the first edge of the pad body 301, the first distance L is between the first conductive part 3021 and the first edge a1 of the pad body 301, the extending direction of the second conductive part 3022 of the conductive body 302 is parallel to the second edge a2 of the pad body 301, the first distance L is between the second conductive part 3022 and the second edge a2 of the pad body 301, and the minimum distance L30 between the conductive body 302 and the signal line 140 (i.e., the distance between the second conductive part 3022 and the signal line 140) is greater than a preset distance threshold, for example, the preset distance threshold may be greater than a preset distance thresholdThe value of (2) is beneficial to avoiding signal interference between the conductive body 302 and the signal line 140, improving the signal transmission capability between the conductive body 302 and the pad body 301, and avoiding the risk of short circuit caused by the contact between the conductive body 302 and the signal line 140.

Illustratively, as shown in FIG. 2, is electrically conductiveThe body 302 may be a C-like semi-enclosed structure, the conductive body 302 includes a first C-type conductive body and a second C-type conductive body, the first C-type conductive body and the second C-type conductive body are mirror-symmetrically disposed outside the pad body 301, the first C-type conductive body and the second C-type conductive body form an enclosed region having an opening, the pad body 301 is disposed in the enclosed region, and the signal line 140 penetrates through the opening of the enclosed region. In the extending direction parallel to the signal line 140, the length L10 of the first C-shaped conductive body and the second C-shaped conductive body is greater than or equal to the length L20 of the pad body 301, so as to improve the signal transmission capability between the conductive body 302 and the pad body 301; in the extending direction perpendicular to the signal line 140, the minimum distance L30 between the conductive body 302 and the signal line 140 (i.e. the distance between the second conductive part 3022 and the signal line 140) is greater than a predetermined distance threshold, for example, the predetermined distance threshold may be greater thanThe value of (2) is beneficial to avoiding signal interference between the conductive body 302 and the signal line 140, improving the signal transmission capability between the conductive body 302 and the pad body 301, and avoiding the risk of short circuit caused by the contact between the conductive body 302 and the signal line 140.

Referring to fig. 2 to 4 in combination, the first spacing L between the conductive body 302 and the pad body 301 satisfies the formula one as shown below,

wherein Z is₀Denotes a preset impedance, Z denotes an impedance of the pad body 301, and D denotes a pitch between the two signal lines 140.

As shown in fig. 2 to 4, the extending direction parallel to the signal lines 140 is defined as X direction, the direction perpendicular to the signal lines 140 is defined as Y direction, in the Y direction, the distance between the two pad bodies 301 is equal to the distance D between the two signal lines 140, and the signal lines 140 have a first width W₁The pad body 301 has a second width W₂In the Z direction perpendicular to the substrate 110, the bonding padThe body 301 has a thickness T, and the above parameters are substituted into the formula two shown below, the impedance Z of the pad body 301 is calculated,

wherein E is_rDenotes the dielectric constant of the dielectric layer 102, H denotes the thickness of the dielectric layer 102, W₂Denotes the width of the pad body 301 in the Y direction, and T denotes the thickness of the pad body 301 in the Z direction.

Specifically, in the process of manufacturing the package structure, after the dielectric layer 102 is determined, the dielectric constant E of the dielectric layer 102 may be obtained by a table lookup method_rAnd the thickness H of the dielectric layer 102, the width W of the pad body 301 in the Y direction can be obtained by a measurement method₂And the thickness T of the pad body 301 in the Z direction, substituting the parameters into a formula II, and calculating to obtain the impedance Z of the pad body 301.

Further, the preset impedance Z is determined according to the impedance requirement of the signal transmission link₀Typically, the preset impedance Z₀And may be 100 ohms or 50 ohms. The distance D between the two signal lines 140 is obtained by a measurement method, and the impedance Z is preset₀The impedance Z of the pad body 301 and the distance D between the two signal lines 140 are substituted into the formula one, and the value of the first distance L between the conductive body 302 and the pad body 301 is obtained through calculation.

Optionally, the electronic component 120 may include an ac coupling capacitor.

In the present embodiment, as shown in fig. 2, the pad assembly 130 includes four pad bodies 301, and the pins of the ac coupling capacitor are soldered to the pad bodies 301.

Illustratively, as shown in fig. 2, the pad body 301 for bonding the ac coupling capacitor has a rectangular structure defining an extending direction parallel to the signal line 140 as an X direction and a direction perpendicular to the signal line 140 as a Y direction, and the second width W of the pad body 301 in the Y direction₂May be 22mil, the distance D between the two pad bodies 301 is equal to the distance between the two signal lines 140, and D may be 18mil, perpendicular to the substrate 110In the Z direction, the thickness T of the pad body 301 may be 1.6mil, the thickness H of the dielectric layer 102 may be 4.3mil, and W may be₂22mil, 18mil, 1.6mil, 4.3mil, and E_rSubstituting equation two, it is calculated that the impedance Z at the pad body 301 is equal to 47.41 ohms when the conductive body 302 is not provided.

The conductive body 302 is configured according to the wiring structure described above, if the predetermined impedance Z of the signal transmission link is known₀The distance D between the two signal lines 140 is obtained by measurement, Z is 100 ohms₀The first distance L between the conductive body 302 and the pad body 301 is 6mil, which is calculated by substituting the distance D into the formula one and the Z is 47.41 ohm.

Therefore, in the embodiment of the invention, the conductive body can be arranged around the pad body 301 welded with the alternating-current coupling capacitor, and the distance between the conductive body and the pad body is adjusted according to the preset impedance of the signal transmission link, so that the pad impedance can be quantitatively controlled, the influence of the arrangement of the alternating-current coupling capacitor on the continuity of the link impedance can be reduced, and the signal transmission effect can be improved.

The embodiment of the invention also provides the printed circuit board. Fig. 5 is a schematic structural diagram of a printed circuit board according to an embodiment of the invention. As shown in fig. 5, the printed circuit board 02 includes the above-described package structure 01.

The printed circuit board provided by the embodiment of the invention is provided with the packaging structure, the packaging structure is characterized in that the conductive body is arranged around the pad body, the conductive layer is provided with the hollow parts in the area corresponding to the pad body, when an alternating current signal flows through the pad body, the conductive body provides a backflow path for signal transmission, differential impedance exists between the conductive body and the pad body, the impedance of the pad component is increased, the problem of discontinuous impedance of a high-speed link at the pad is solved, the pad impedance can be accurately controlled by adjusting the distance between the conductive body and the pad body, the continuity of line impedance in the printed circuit board is favorably improved, and the signal transmission effect is improved.

The embodiment of the invention also provides the electronic equipment. Fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. As shown in fig. 6, the electronic device 03 includes the printed circuit board 02 described above.

The electronic equipment provided by the embodiment of the invention is provided with the packaging structure, the packaging structure is characterized in that the conductive body is arranged around the pad body, the conductive layer is provided with the hollow parts in the area corresponding to the pad body, when an alternating current signal flows through the pad body, the conductive body provides a backflow path for signal transmission, the impedance of the pad assembly is increased, the problem of discontinuous impedance of a high-speed link at the pad is solved, the pad impedance can be accurately controlled by adjusting the distance between the conductive body and the pad body, the improvement of the continuity of line impedance in the electronic equipment is facilitated, and the signal transmission effect is improved.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.