阅读说明：本技术 一种用于颅内压力测定的压力传感器及颅内压力检测系统 (Pressure sensor for intracranial pressure measurement and intracranial pressure detection system ) 是由 高仁伟 郝兆煜 乜雷 于 2020-05-20 设计创作，主要内容包括：本发明提供一种用于颅内压力测定的压力传感器,压力芯片封装于封装装置中,压力传导层的外露面与封装装置的表面齐平或高于封装装置的表面,可置于颅骨与硬膜之间或硬膜与蛛网膜之间对颅内压力进行测定,不进入脑实质或者脑室,对患者损伤小,降低因产品使用引起的风险。(The invention provides a pressure sensor for measuring intracranial pressure, wherein a pressure chip is packaged in a packaging device, the exposed surface of a pressure conducting layer is flush with the surface of the packaging device or higher than the surface of the packaging device, and the pressure conducting layer can be placed between a skull and a dura mater or between the dura mater and a arachnoid membrane to measure the intracranial pressure, does not enter into the brain parenchyma or a brain ventricle, has small damage to a patient and reduces the risk caused by product use.)

1. A pressure sensor for intracranial pressure measurement, the pressure sensor comprising a circuit board, a pressure chip, a pressure conducting layer, an encapsulation device, and a pressure signal conducting wire;

the pressure chip is arranged on the circuit board, the pressure signal transmission line is connected with the circuit board, and the pressure chip converts the sensed intracranial pressure into an electric signal to be transmitted through the circuit board and the pressure signal transmission line;

the packaging device is provided with an inwards concave cavity, and the pressure chip and the circuit board are packaged in the cavity;

the pressure conduction layer comprises an exposed surface and a pressure chip contact surface, wherein the exposed surface is used for sensing intracranial pressure, and the pressure chip contact surface is in contact with the pressure chip and transmits the intracranial pressure sensed by the exposed surface to the pressure chip;

the exposed surface of the pressure conducting layer is flush with or higher than the surface of the packaging device.

2. A pressure sensor for intracranial pressure measurement as recited in claim 1, wherein the pressure conductive layer is a protective coating of the pressure chip.

3. The pressure sensor for intracranial pressure measurement as recited in claim 1, wherein the pressure conductive layer is composed of a protective coating layer of the pressure chip and a pressure conductive adhesive layer covering the protective coating layer.

4. A pressure sensor for intracranial pressure measurement as recited in claim 1, wherein the pressure sensor comprises an anti-rotation device.

5. A pressure sensor for intracranial pressure measurement as claimed in claim 4, wherein the anti-rotation device is removably or fixedly disposed on the packaging device.

6. A pressure sensor for intracranial pressure measurement as claimed in claim 5, wherein the anti-rotation device is a flat wing parallel to the pressure-sensing contact surface.

7. A pressure sensor for intracranial pressure determination as recited in claim 1, wherein the pressure sensor further comprises a temperature sensor and a temperature signal transmission line; the temperature sensor is arranged on the circuit board, and the temperature signal conducting wire is connected with the circuit board; the temperature sensor is used for measuring intracranial temperature.

8. A pressure sensor for intracranial pressure measurement as recited in claim 1, wherein the pressure sensor is used to measure intracranial pressure between the skull and the dura mater or between the dura mater and the arachnoid mater.

9. An intracranial pressure monitoring system, comprising the pressure sensor of any one of claims 1-8, a signal processing system, and a signal display system, wherein the signal processing system receives the intracranial pressure signal from the pressure sensor, processes the signal, converts the signal into a digital signal, and displays the digital signal by the signal display system.

10. The intracranial pressure monitoring system as recited in claim 9, wherein the signal processing system corrects the intracranial pressure signal based on the intracranial temperature signal from the pressure sensor.

Technical Field

The invention belongs to the field of medical instruments, and particularly relates to a pressure sensor for intracranial pressure measurement and an intracranial pressure detection system.

Background

The cranial cavity contains three contents of brain tissue, cerebrospinal fluid and blood, and when the cranial sutures of children are closed or adults, the volume of the cranial cavity is fixed and constant and is about 1400-1500 ml. The pressure generated by the above three contents in the cranial cavity on the wall of the cranial cavity is called intracranial pressure (ICP), also called cerebral pressure. The intracranial pressure increase (increased intracranial pressure) is a common clinical pathological syndrome in neurosurgery, is a common symptom of craniocerebral injury, brain tumor, cerebral hemorrhage, hydrocephalus, intracranial inflammation and the like, and the intracranial pressure is continuously 2.0kPa (200 mmH) due to the fact that the volume of cranial cavity contents is increased by the disease₂0) The above, resulting in the corresponding syndromeReferred to as increased intracranial pressure. The increased intracranial pressure can cause the crisis of cerebral hernia, and can lead patients to die due to exhaustion of respiratory circulation, so the method is very important for timely measuring the intracranial pressure of the patients with the symptoms of increased intracranial pressure.

The pressure sensor mainly adopts a pressure chip probe and a gas bag probe to measure the intracranial pressure at present, wherein the gas bag probe measures indirectly, the intracranial pressure is transmitted to the air in a gas bag of the pressure sensor through a gas bag thin wall and then is converted into an electronic signal by the pressure sensor, the method measures data inaccurately, the pressure chip probe is provided with an electric signal chip probe and an optical signal chip probe, the optical signal chip probe adopts optical fiber for conduction, the bending cannot be realized due to material limitation, so the mode mainly adopted at present is the electric signal pressure chip probe pressure sensor, and the existing electric signal pressure chip can only be used for measuring the pressure in a brain room or brain parenchyma due to the design reason and easily causes damage to a patient.

Disclosure of Invention

In order to overcome the problems of the prior pressure sensor for intracranial pressure measurement mentioned in the background art, the invention provides a pressure sensor for intracranial pressure measurement, which comprises the following scheme:

a pressure sensor for intracranial pressure determination, the pressure sensor comprising a circuit board, a pressure chip, a pressure conducting layer, an encapsulation device, and a pressure signal conducting wire;

the pressure chip is arranged on the circuit board, the pressure signal transmission line is connected with the circuit board, and the pressure chip converts the sensed intracranial pressure into an electric signal to be transmitted through the circuit board and the pressure signal transmission line;

the packaging device is provided with an inwards concave cavity, and the pressure chip and the circuit board are packaged in the cavity;

the pressure conduction layer comprises an exposed surface and a pressure chip contact surface, wherein the exposed surface is used for sensing intracranial pressure, and the pressure chip contact surface is in contact with the pressure chip and transmits the intracranial pressure sensed by the exposed surface to the pressure chip;

the exposed surface of the pressure conducting layer is flush with or higher than the surface of the packaging device.

Optionally, the pressure conducting layer is a protective coating of the pressure chip.

Optionally, the pressure conduction layer is composed of a protective coating of the pressure chip and a pressure conduction glue layer covering the protective coating.

Optionally, the pressure sensor comprises an anti-rotation device.

Optionally, the anti-rotation device is detachably or fixedly arranged on the packaging device.

Optionally, the anti-rotation device is a flat wing plate parallel to the pressure-sensitive contact surface.

Optionally, the pressure sensor further comprises a temperature sensor and a temperature signal conducting wire; the temperature sensor is arranged on the circuit board, and the temperature signal conducting wire is connected with the circuit board; the temperature sensor is used for measuring intracranial temperature.

Optionally, the pressure sensor is used for measuring intracranial pressure between the skull and the dura mater or between the dura mater and the arachnoid mater.

An intracranial pressure monitoring system comprising the pressure sensor of any one of claims 1-8, a signal processing system, and a signal display system, wherein the signal processing system receives the intracranial pressure signal from the pressure sensor, processes the signal, converts the signal into a digital signal, and displays the digital signal by the signal display system.

Optionally, the signal processing system corrects the intracranial pressure signal according to the intracranial temperature signal from the pressure sensor.

Compared with the prior art, the scheme of the invention has the advantages that the pressure chip is packaged in the packaging device, the exposed surface of the pressure conducting layer is flush with or higher than the surface of the packaging device, the pressure conducting layer can be placed between the skull and the dura mater or between the dura mater and the arachnoid membrane to measure the intracranial pressure, the pressure conducting layer does not enter the brain parenchyma or the brain ventricle, the damage to a patient is small, and the risk caused by product use is reduced.

Drawings

FIG. 1 is a schematic diagram of a pressure sensor for intracranial pressure measurement, according to an embodiment of the present invention;

FIG. 2 is a top view of a schematic diagram of the pressure sensor configuration for intracranial pressure measurement in accordance with the embodiment of FIG. 1;

FIG. 3 is a schematic diagram of a pressure sensor configuration for intracranial pressure measurement according to another embodiment of the present invention.

Detailed Description

In order to make the features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Referring to fig. 1 and 2, a pressure sensor for intracranial pressure measurement according to an embodiment of the present invention includes a circuit board 11, a pressure chip 12, a pressure conductive layer 13, an encapsulation device 14, and a pressure signal conductive wire 15;

the pressure chip 12 is mounted on the circuit board 11, the pressure signal transmission line 15 is connected to the circuit board 11, and the pressure chip 12 converts the sensed intracranial pressure into an electrical signal to be transmitted through the circuit board 11 and the pressure signal transmission line 15;

the packaging device 14 is provided with a concave cavity 17, and the pressure chip 12 and the circuit board 11 are packaged in the cavity 17;

the pressure conducting layer 13 comprises an exposed surface 18 and a pressure chip contact surface 19, wherein the exposed surface 18 is used for sensing intracranial pressure, and the pressure chip contact surface 19 is in contact with the pressure chip 12 and transmits the intracranial pressure sensed by the exposed surface 18 to the pressure chip 12;

the exposed face 18 of the pressure conducting layer is flush with or higher than the surface 22 of the encapsulation means.

In the pressure sensor for intracranial pressure measurement according to embodiments of the present invention, in some embodiments, the packaging device 14 is made of stainless steel or titanium alloy.

In some embodiments, the pressure chip 12 and the circuit board 11 are encapsulated in the cavity 17 by using silica gel.

In embodiments of the present invention, the pressure sensor for intracranial pressure measurement, in some embodiments, the cavity 17 has a depth of 80-200 um.

In some embodiments of the pressure sensor for intracranial pressure measurement according to embodiments of the present invention, the top end of the encapsulation device 14 is a circular arc top, and is coated with a silicone layer, so as to prevent injury when being inserted into a cranial portion.

In the pressure sensor for intracranial pressure measurement according to the embodiments of the present invention, in some embodiments, the pressure chip 12 is mounted on the circuit board 11 by soldering, the pressure signal conducting wire 15 is connected to the circuit board 11 by soldering, in other embodiments, the pressure chip 12 is connected to the circuit board 11, and the pressure signal conducting wire 15 is connected to the circuit board 11 by other methods, as long as it is ensured that the intracranial pressure sensed by the pressure chip 12 is converted into an electrical signal which can be transmitted through the circuit board 11 and the pressure signal conducting wire 15.

In the pressure sensor for intracranial pressure measurement according to the embodiment of the present invention, the circuit board 11 is used for conducting an electrical signal, and the circuit board 11 is not particularly required in the present invention, and for example, a common micro circuit board may be used.

In the pressure sensor for intracranial pressure measurement according to an embodiment of the present invention, the pressure chip 12 can sense pressure and convert a sensed pressure signal into an electrical signal, and may be, for example, a full-bridge or half-bridge piezoresistive pressure sensing chip.

In some embodiments, the pressure conducting layer 13 includes a protective coating 131 of the pressure chip and a pressure conducting adhesive layer 132 covering the protective coating 131, and the exposed surface 18 is an exposed surface of the pressure conducting adhesive layer 132; in other embodiments, the pressure conducting layer 13 is a protective coating of the pressure chip, that is, the protective coating 131 does not have the pressure conducting adhesive layer 132, and the exposed surface is an exposed surface of the protective coating 131. In the specific implementation of the present invention, the protective coating 131 may be made of silica gel, the thickness of the protective coating 131 is 10-50um, the pressure conduction adhesive layer 132 may be made of silica gel, so as to facilitate pressure conduction, the hardness of the silica gel of the pressure conduction adhesive layer 132 is greater than that of the silica gel of the protective coating 131, and the thickness of the pressure conduction adhesive layer 132 is 10-50 um.

The pressure sensor for intracranial pressure measurement according to embodiments of the present invention is prone to cause positional dislocation of the pressure sensor due to fluctuation of intracranial pressure, thereby affecting accuracy of pressure measurement, and in some embodiments, as shown in fig. 3, the pressure sensor includes an anti-rotation device 21. In some embodiments, the anti-rotation device 21 is a flat wing plate integrally formed with the packaging device on both sides of the packaging device, and in some embodiments, the anti-rotation device 21 is a detachable flat wing plate on both sides of the packaging device, and the flat wing plate can be rectangular, trapezoidal, semicircular, fan-shaped, and the like.

The inventor of the present invention has found through research that temperature changes in the cranium can affect the pressure signal, that is, the pressure value sensed by the pressure chip and the real pressure value can deviate at different temperatures, so that, in some embodiments, as shown in fig. 2, the pressure sensor further includes a temperature sensor 20 and a temperature signal transmission line 16; the temperature sensor 20 is mounted on the circuit board 11, and the temperature signal conducting wire 16 is connected with the circuit board 11; the temperature sensor 20 is used to measure intracranial temperature, so that the pressure signal obtained by the pressure chip 12 can be corrected according to the intracranial temperature change measured by the temperature sensor 20. In some embodiments, the temperature sensor 20 is mounted on the circuit board 11 by soldering, the temperature signal conducting wire 15 is connected to the circuit board 11 by soldering, in other embodiments, the temperature sensor 20 is connected to the circuit board 11, and the temperature signal conducting wire 15 is connected to the circuit board 11 by other methods, as long as it is ensured that the intracranial temperature sensed by the temperature sensor 20 is converted into an electrical signal which can be transmitted through the circuit board 11 and the temperature signal conducting wire 15.

The pressure sensor for intracranial pressure measurement of the embodiment of the invention is used for measuring the intracranial pressure between the skull and the dura mater or between the dura mater and the arachnoid mater.

When an intracranial pressure test is performed, in some embodiments, the pressure sensor is placed between a skull and a dura mater, wherein an exposed surface 18 of a pressure conducting layer 13 of the pressure sensor is close to the dura mater, intracranial pressure is conducted to the exposed surface 18 of the pressure conducting layer 13 through the dura mater, then the intracranial pressure is conducted to a pressure chip 12 through the pressure conducting layer 13, and then the pressure chip 12 senses a pressure signal and converts the pressure signal into an electric signal to be output through a circuit board 11 and a pressure signal conducting wire 15; in some embodiments, the pressure sensor is placed between the dura mater and the arachnoid membrane, wherein the exposed surface 18 of the pressure conducting layer 13 of the pressure sensor is close to the arachnoid membrane, intracranial pressure is conducted from the arachnoid membrane to the exposed surface 18 of the pressure conducting layer 13, and then conducted from the pressure conducting layer 13 to the pressure chip 12, and then the pressure chip 12 senses the pressure signal and converts the pressure signal into an electrical signal to be output via the circuit board 11 and the pressure signal conducting wire 15.

The specific implementation mode of the present invention further provides an intracranial pressure monitoring system, which includes the above pressure sensor, a signal processing system and a signal display system, wherein the signal processing system receives an intracranial pressure signal from the pressure sensor, processes the signal into a digital signal, and displays the digital signal by the signal display system, that is, the pressure signal conducting line 15 is connected to the signal processing system, outputs an intracranial pressure electrical signal sensed and converted by the pressure chip to the signal processing system, and the signal processing system processes the signal into the digital signal and displays the digital signal by the signal display system. In some embodiments, the signal processing system is connected to the temperature signal conducting wire 15, the temperature signal conducting wire 15 senses and converts the temperature sensor 20 of the pressure sensor into an intracranial temperature signal and outputs the intracranial temperature signal to the signal processing system, and the signal processing system performs correction processing on the intracranial pressure signal according to the received intracranial temperature signal.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.