阅读说明：本技术 一种散热装置 (Heat radiator ) 是由 牟永斌 赵秀红 于 2020-05-22 设计创作，主要内容包括：本发明公开了一种散热装置,包括壳体、管体及充注管。壳体包括盖板和底板,盖板和底板结合,构成一中空的腔室。腔室内有毛细组织,该毛细组织包括本部和余部,毛细组织的本部固定于底板上。盖板上有若干第一开孔及与第一开孔数量相等的第二开孔,第一开孔处覆盖有毛细组织的余部,第二开孔处无毛细组织的余部,从而使第二开孔与腔室贯穿。管体的数量与第一开孔的数量相等,该管体具有两端口,分别连通一第一开孔和一第二开孔。本发明散热装置具有散热能力大,散热效率高,简单可靠的优点。(The invention discloses a heat dissipation device which comprises a shell, a pipe body and a filling pipe. The housing includes a cover plate and a base plate which are combined to form a hollow chamber. The cavity is internally provided with a capillary tissue, the capillary tissue comprises a main part and a rest part, and the main part of the capillary tissue is fixed on the bottom plate. The cover plate is provided with a plurality of first openings and second openings, the number of the second openings is equal to that of the first openings, the first openings are covered with the rest parts of capillary tissues, and the second openings are free of the rest parts of the capillary tissues, so that the second openings penetrate through the cavity. The quantity of body equals with the quantity of first trompil, and this body has two ports, communicates a first trompil and a second trompil respectively. The heat dissipation device has the advantages of high heat dissipation capacity, high heat dissipation efficiency, simplicity and reliability.)

1. A heat dissipating device, comprising:

the shell comprises a cover plate and a bottom plate, wherein the cover plate is combined with the bottom plate, and a cavity is formed inside the cover plate;

the capillary tissue is positioned in the cavity, the main part of the capillary tissue is fixed on the bottom plate, and a plurality of remaining parts extending towards the cover plate are arranged on the capillary tissue;

the cover plate is provided with a plurality of first openings and a plurality of second openings, the number of the second openings is equal to that of the first openings, the first openings are covered with the rest parts of the capillary tissues, and the second openings are not provided with the rest parts of the capillary tissues, so that the second openings and the cavity are penetrated;

the number of the pipe bodies is equal to that of the first holes, and the pipe bodies are provided with two ports which are respectively communicated with the first holes and the second holes on the cover plate;

and one end of the filling pipe is closed, the other end of the filling pipe is communicated with the cavity, and the communication port can be positioned at any position of the shell.

2. The heat dissipating device of claim 1, wherein:

the capillary structure is a composite structure of any one or more of a silk screen, a foamed metal, a metal felt, a fiber bundle or a powder porous structure.

3. The heat dissipating device of claim 1, wherein:

the remaining part of the capillary structure at the first opening has an extension part of the capillary structure extending into the tube body.

4. The heat dissipating device of claim 1, wherein:

the surface of the cover plate on the cavity chamber side is provided with grooves, the shapes of the grooves are not limited, and at least part of the grooves are in contact with or connected with the rest parts of the capillary tissues.

5. The heat dissipating device of claim 1, wherein:

the inner surface of the pipe body is smooth or has a micro-rib structure.

6. The heat dissipating device of claim 1, wherein:

the pipe body is a round pipe or a flat pipe or a micro-channel pipe or a pipe body with a part of the round pipe as the flat pipe.

7. The heat dissipating device of claim 1, wherein:

the body is inside to be close to first trompil side, still has the bar body, the bar body with the remaining contact of capillary tissue or connection. The strip-shaped body is of a solid structure or a capillary structure or the combination of the solid structure and the capillary structure.

8. The heat dissipating device of claim 1, wherein:

the outer surface of the tube body is laid with a first radiating fin group, and the first radiating fin group is one group or a plurality of groups of fins.

9. The heat dissipating device of claim 1, wherein:

fins or a second radiating fin group are arranged on the outer surface of the cover plate.

10. The heat dissipating device of claim 1, wherein:

and a support body is arranged in the cavity and is connected with the cover plate and the bottom plate.

Technical Field

The invention belongs to the technical field of heat dissipation, and relates to a heat dissipation device for power electronic equipment.

Background

The air-cooled heat dissipation device has the advantages of simplicity, reliability, low price and the like, and is widely applied to the field of power electronic heat dissipation. However, with the rapid development of industries such as big data, AI, internet of things and the like, the power consumption of a hardware integrated circuit is larger and larger, and the heating value and the heat flux density are also larger and larger. The heat dissipation capability of the conventional air-cooled heat dissipation devices such as heat pipe radiators and temperature-equalizing plates is increasingly difficult to meet. The heat pipe has small heat transfer capacity and small effective contact area with the heat source. The effective contact area of the vapor chamber and a heat source is large, but the condensation area is difficult to expand, so that the heat dissipation capacity is limited. The industry also has the condition of combining the temperature-uniforming plate and the heat pipe together for use, but the process is difficult, and because the liquid working medium in the heat pipe flows back by means of gravity and flows in the opposite direction to the vapor working medium, the liquid film is gathered on the pipe wall of the heat pipe, and the heat exchange efficiency is poor. Therefore, a more efficient and reliable heat dissipation device is needed in the electronic device.

Disclosure of Invention

In order to solve the problem of difficult heat dissipation of the current power electronic equipment, the invention provides a heat dissipation device which can overcome the technical defects of a temperature equalizing plate and a heat pipe, has the advantages of high heat dissipation capacity, high efficiency, small volume, convenient use and the like, inherits the advantages of simplicity, reliability and low price of an air cooling heat dissipation device, and provides a more advanced solution for the increasingly severe heat dissipation problem of power electronic products.

The invention adopts the following technical scheme:

a heat dissipating device, comprising:

the shell comprises a cover plate and a bottom plate, wherein the cover plate is combined with the bottom plate, and a cavity is formed inside the cover plate;

the capillary tissue is positioned in the cavity, the main part of the capillary tissue is fixed on the bottom plate, and a plurality of remaining parts extending towards the cover plate are arranged on the capillary tissue;

the cover plate is provided with a plurality of first openings and a plurality of second openings, the number of the second openings is equal to that of the first openings, the first openings are covered with the rest parts of the capillary tissues, and the second openings are not provided with the rest parts of the capillary tissues, so that the second openings and the cavity are penetrated;

the number of the pipe bodies is equal to that of the first holes, and the pipe bodies are provided with two ports which are respectively communicated with the first holes and the second holes on the cover plate;

and one end of the filling pipe is closed, the other end of the filling pipe is communicated with the cavity, and the communication port can be positioned at any position of the shell.

Optionally, the capillary structure is a composite structure of any one or more of a mesh or a metal foam or a metal felt or a fiber bundle or a powder porous structure.

Optionally, the remaining part of the capillary tissue at the first aperture has an extension of the capillary tissue extending into the tube there.

Optionally, the surface of the cover plate on the chamber side is provided with grooves, the shape of the grooves is not limited, and at least part of the grooves are in contact with or connected with the rest of the capillary tissue.

Optionally, the inner surface of the pipe body is smooth or has a micro-rib structure.

Optionally, the tube body is a circular tube or a flat tube or a microchannel tube or a tube body with a part of a circular tube as a flat tube.

Optionally, the tube body is internally provided with a strip-shaped body close to the first opening side, and the strip-shaped body is in contact with or connected with the rest of the capillary tissue. The strip-shaped body is of a solid structure or a capillary structure or the combination of the solid structure and the capillary structure.

Optionally, the outer surface of the tube body is laid with a first heat dissipation fin group, and the first heat dissipation fin group is one or more groups of fins.

Optionally, fins or a second heat dissipation fin set is disposed on an outer surface of the cover plate.

Optionally, there is a support body in the chamber, the support body connects the cover plate and the bottom plate.

In summary, compared with the heat pipe, the heat dissipation device of the present invention has a larger effective contact area with the heat source. Compared with a temperature equalizing plate, the condensing area is expanded. And the flowing directions of the vapor working medium and the liquid working medium in the tube body are consistent, so that the problems of large liquid film thickness and poor condensation heat exchange efficiency caused by the gathering of the liquid working medium on the inner wall of the tube body are avoided.

Drawings

FIG. 1 is a schematic external view of a heat dissipation device according to a first embodiment of the present invention;

FIG. 2 is a cross-sectional view of a first embodiment of a heat dissipation device of the present invention;

FIG. 2a is a cross-sectional view of a tube body of a first embodiment of a heat dissipation device of the present invention;

FIG. 3 is a cross-sectional view of a second embodiment of a heat dissipation device of the present invention;

fig. 4 is a perspective view of a heat dissipation device according to a third embodiment of the present invention;

in the above figures: 1-shell, 2-tube, 3-filling tube, 4-strip, 5-first radiating fin group, 6-second radiating fin group, 11-upper cover, 12-bottom plate, 13-capillary tissue, 14-support body, 21-micro rib structure, 22-micro channel, 100-cavity, 111-first opening, 112-second opening, 113-groove, 131-local part of capillary tissue, 132-residual part of capillary tissue and 133-extension part of capillary tissue.

Detailed Description

In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments in which the subject matter may be practiced.

Fig. 1 and fig. 2 are schematic external and sectional views of a heat dissipation device according to a first embodiment of the present invention. It includes casing 1, body 2, fills notes pipe 3 and bar 4. The housing 1 is provided with a plurality of tubes 2, and the number and positions of the tubes 2 are not limited. The housing 1 includes an upper cover 11 and a bottom plate 12, and the periphery of the upper cover 11 is welded to the bottom plate 12, and the inner space thereof forms a chamber 100. The chamber 100 contains the capillary tissue 13 and the support 14. The support 14 connects the upper cover 11 and the bottom plate 12. The capillary structure 13 may be selected as a composite structure of any one or more of a wire mesh, a metal foam, a metal felt, a fiber bundle, and a powder porous structure. The capillary tissue 13 includes a base 131 and a remainder 132 thereof. The base 131 of the capillary tissue is fixed to the bottom plate 12, and the remaining portion 132 of the capillary tissue is in contact with the upper cover 11.

The upper cover 11 has a first opening 111 and a second opening 112. The tube 2 has two ports, which are inserted into the first opening 111 and the second opening 112, and are welded and fixed. The first opening 111 has a remainder 132 of the capillary structure and the second opening 112 has no remainder 132 of the capillary structure, such that the second opening 112 is open to the chamber 100.

The strip-shaped body 4 is arranged inside the tube body 2, and the strip-shaped body 4 is close to the first opening 111 side and is contacted with or connected with the rest 132 of the capillary tissue at the position. The strip-shaped body 4 can be selected to be a solid structure; or a capillary structure; or a combination of a solid structure and a capillary structure.

One end of the filling pipe 3 is communicated with the chamber 100 to fill the working medium, and the other end is sealed.

Fig. 2a is a cross-sectional view of a tube body in a first embodiment of a heat dissipation device according to the present invention. The tube body 2 can be selected to be a round tube or a flat tube or a microchannel tube, and the inner surface is smooth or provided with a micro-rib structure 21. In a tubular body 2 having microchannels 22, a strip 4 is located in any one or more of the microchannels 22.

The specific working principle is as follows: the chamber 100 is vacuumized through the filling pipe 3, then the working medium is filled, and finally the opening end of the filling pipe 3 is welded and sealed. At least one heat source is in contact with the base plate 12 of the heat dissipation device of the present invention. The working medium in the cavity 100 of the heat sink of the present invention absorbs the heat of the heat source and vaporizes at the capillary tissue 13. Since the first opening 111 is covered with the remainder 132 of the capillary structure, the working substance in vapor state cannot penetrate through the first opening and is forced to enter the tube body 2 from the second opening 112 without capillary structure. The gaseous working medium is gradually condensed into a liquid working medium after releasing heat in the pipe body 2, and the liquid working medium flows back to the first opening 111 along the pipe body 2 under the action of pressure difference. The strip-shaped body 4 in the tube body 2 helps the liquid working medium to smoothly flow back to the remaining part 132 of the capillary tissue at the first opening 111. Thereby, the liquid working medium returns into the capillary structure 13. By so circulating, the heat is dissipated from the heat source to the environment.

Fig. 3 is a cross-sectional view of a heat dissipation device according to a second embodiment of the present invention. As shown in the figure, the strip-shaped body 4 is not present in the tube 2 near the first opening 111, but has an extension 133 of capillary tissue. The surface of the upper cover 11 on the side of the chamber 100 has grooves 113, the shape of the grooves 113 is not limited, and at least a part of the grooves 113 contact or connect with the remainder 132 of the capillary tissue. Thus, the condensed and refluxed liquid working medium is uniformly distributed through the grooves 113 and then enters the capillary structure 13 through the remaining part 132 of the capillary structure. In order to increase the condensation area and enhance the heat exchange effect, the second heat dissipation fin set 6 (shown in the figure) is laid on the outer surface of the upper cover 11 in this embodiment, but not limited thereto, and the same effect may also be achieved by processing fins (not shown in the figure) on the outer surface of the upper cover 11. The structure and the working principle of other parts of this embodiment are the same as those of the first embodiment of the heat dissipation device of the present invention, and are not described again.

Fig. 4 is a schematic perspective view illustrating a heat dissipation device according to a third embodiment of the present invention. As shown in fig. 4, the pipe body 2 is a structure in which a part is a circular pipe and a part is a flat pipe. The outer surface of the flat tube part of the tube body 2 is also laid with a plurality of groups of first radiating fin groups 5 with different structures. The tube body 2 is firstly connected and fixed with the shell 1 (for example, brazed), and then the first radiating fin group 5 is laid on the flat tube part, so that the problem that the first radiating fin group 5 deforms at high temperature due to the fact that the tube body 2 penetrates the first radiating fin group 5 firstly and then is connected and fixed with the shell 1 (for example, brazed) is solved. The filling pipe 3 (not shown) is located between the two first sets of cooling fins 5. The structure and the working principle of other parts of this embodiment are the same as those of the first embodiment of the heat dissipation device of the present invention, and are not described again.

By combining the above embodiments of the heat dissipation device of the present invention, the heat dissipation device of the present invention overcomes the defects of heat dissipation of the heat pipe and the temperature equalization plate, and can better meet the heat dissipation requirements of high power and high efficiency. The heat dissipation device has the advantages of compact structure, reliable performance, flexible use and low cost, provides a more advanced solution for the increasingly severe heat dissipation problem of power electronic products, and has higher economic value.

Finally, it should be emphasized that the above-described preferred embodiments of the present invention are merely examples of implementations, rather than limitations, and that many variations and modifications of the invention are possible to those skilled in the art, without departing from the spirit and scope of the invention.