阅读说明：本技术 一种冷却系统 (Cooling system ) 是由 淮晓利 付刚平 其他发明人请求不公开姓名 于 2021-08-23 设计创作，主要内容包括：本发明属于换热技术领域,公开了一种冷却系统,包括主压缩机,主压缩机包括压缩机进口；冷凝器,进口连通于主压缩机的出口,出口连通有分支管路和主管路,分支管路的流量小于主管路的流量,分支管路上设有第一节流元件；换热器,包括高压换热通道及中压换热通道,高压换热通道连通主管路,中压换热通道连通分支管路；补气压缩机,进口连通于中压换热通道的一端,出口连通于主压缩机与冷凝器之间的管路上,第二节流元件,与高压换热通道的另一端相连通；蒸发器,连通于第二节流元件和进口之间；散热冷板,安装多个功率电子元件,中压换热通道内的介质能吸收功率电子元件散发的热量。本发明提供气化潜热来对功率电子元件冷却,冷却效率更高。(The invention belongs to the technical field of heat exchange, and discloses a cooling system which comprises a main compressor, wherein the main compressor comprises a compressor inlet; the inlet of the condenser is communicated with the outlet of the main compressor, the outlet of the condenser is communicated with a branch pipeline and a main pipeline, the flow of the branch pipeline is less than that of the main pipeline, and a first throttling element is arranged on the branch pipeline; the heat exchanger comprises a high-pressure heat exchange channel and a medium-pressure heat exchange channel, the high-pressure heat exchange channel is communicated with the main pipeline, and the medium-pressure heat exchange channel is communicated with the branch pipeline; the inlet of the air supplementing compressor is communicated with one end of the medium-pressure heat exchange channel, the outlet of the air supplementing compressor is communicated with a pipeline between the main compressor and the condenser, and the second throttling element is communicated with the other end of the high-pressure heat exchange channel; the evaporator is communicated between the second throttling element and the inlet; the heat dissipation cold plate is provided with a plurality of power electronic elements, and the medium in the medium-pressure heat exchange channel can absorb the heat dissipated by the power electronic elements. The invention provides latent heat of vaporization to cool the power electronic element, and the cooling efficiency is higher.)

1. A cooling system, comprising:

a main compressor (1), the main compressor (1) comprising a compressor inlet (11);

the inlet of the condenser (2) is communicated with the outlet of the main compressor (1), the outlet of the condenser (2) is communicated with a branch pipeline (3) and a main pipeline (4), the flow of the branch pipeline (3) is smaller than that of the main pipeline (4), and a first throttling element (5) is arranged on the branch pipeline (3);

the heat exchanger (6) comprises a high-pressure heat exchange channel (61) and a medium-pressure heat exchange channel (62), one end of the high-pressure heat exchange channel (61) is communicated with the main pipeline (4), the medium-pressure heat exchange channel (62) is communicated with the branch pipeline (3), and the medium in the medium-pressure heat exchange channel (62) can absorb the heat of the medium in the high-pressure heat exchange channel (61);

the inlet of the air supply compressor (30) is communicated with one end of the medium-pressure heat exchange channel (62), and the outlet of the air supply compressor is communicated with a pipeline (40) between the main compressor (1) and the condenser (2);

the second throttling element (7) is communicated with the other end of the high-pressure heat exchange channel (61);

an evaporator (8), said evaporator (8) communicating between said second throttling element (7) and said compressor inlet (11);

the heat dissipation cold plate (9), install integrated form drive structure on the heat dissipation cold plate (9), integrated form drive structure includes a plurality of power electronic component (10), the medium in middling pressure heat transfer passageway (62) can absorb the heat that the power electronic component (10) gived off of heat dissipation cold plate (9) transmission.

2. A cooling system according to claim 1, characterised in that the flow of the medium in the branch line (3) is smaller than the flow of the medium in the main line (4).

3. A cooling system according to claim 1 or 2, wherein the heat exchanger (6) comprises a body, the high pressure heat exchange channel (61) and the medium pressure heat exchange channel (62) being both arranged in the body, the heat sink cold plate (9) being arranged fixedly on the outside of the body.

4. The cooling system according to claim 1 or 2, wherein the heat exchanger (6) comprises a first heat exchanger and a second heat exchanger, the high pressure heat exchange channel (61) is arranged in the first heat exchanger, the medium pressure heat exchange channel (62) is arranged in the second heat exchanger, and the cold plate (9) is fixedly arranged outside the second heat exchanger.

5. The cooling system according to claim 1, characterized in that the inlet of the evaporator (8) is connected to a water pump (20), the power electronics (10) of the water pump (20) being integrated on the heat sink cold plate (9).

6. Cooling system according to claim 1, characterized in that the condenser (2) is an air-cooled condenser, the power electronics (10) of the fan of which are integrated on the heat sink cold plate (9).

7. The cooling system according to claim 1, wherein the evaporator (8) comprises a first refrigerant channel communicating the first throttling element (5) and the compressor inlet (11), and a second refrigerant channel for introducing chilled water.

8. Cooling system according to claim 1, characterized in that the power electronics (10) of the main compressor (1) and the supplementary compressor (30) are integrated on the heat sink cold plate (9).

9. Cooling system according to claim 1, characterized in that the temperature of the medium in the medium pressure heat exchange channel (62) is between 18-50 ℃.

10. Cooling system according to claim 1, characterized in that a plurality of said power electronic components (10) form the following unit:

the variable-frequency power output unit comprises a rectifying module (101) and an inverting module (102) which are arranged on the heat dissipation cold plate (9), and the inverting module (102) is provided with at least two alternating current output interfaces;

the non-variable frequency power output unit (103) comprises a direct current power output module (1031) and a capacitor plate (1032), wherein the direct current power output module (1031) is installed on the heat dissipation cold plate (9), and the direct current power output module (1031) is provided with a direct current output interface;

the weak current unit (104) comprises a logic board (1041) and a control board (1042) which are installed on the heat dissipation cold plate (9), the logic board (1041) is connected to the rectifying module (101) and the inverting module (102), and the control board (1042) is connected to the logic board (1041);

and the insulating piece (105) is arranged on the heat dissipation cold plate (9) and is used for isolating and insulating the weak current unit (104) and the variable frequency power output unit and isolating and insulating the weak current unit (104) and the non-variable frequency power output unit (103).

Technical Field

The invention relates to the technical field of heat exchange, in particular to a cooling system.

Background

The cold water set of the energy storage station requires refrigeration operation under the working condition of low ambient temperature of-30-55 ℃ to dissipate heat of the battery, and the highest condensation temperature of a refrigeration system can reach about 70 ℃. In the prior art, an air cooling mode is usually adopted, a heat dissipation cold plate is placed in an air inlet flow field channel of a fan, power electronic elements of each driving part are placed on the heat dissipation cold plate, heat dissipation fins are arranged on the power electronic elements, forced convection heat transfer is performed through the fan, the heat transfer efficiency of the heat dissipation fins is low, the design size of the heat dissipation cold plate is large, the heat transfer temperature difference is considered to be more than 10 ℃, the condensation temperature is 70 ℃ at 60 ℃ of a high ambient temperature, the surface temperature of the heat dissipation cold plate can reach more than 80 ℃, the temperatures of a plurality of power electronic elements exceed 80 ℃, and the high temperature has negative influence on the reliability and the service life of the power electronic elements.

In the prior art, a high-pressure refrigerant liquid of a refrigeration system is sprayed to cool a heat dissipation cold plate so as to achieve the purpose of cooling power electronic elements, or a high-pressure refrigerant circulation channel is etched or processed in the heat dissipation cold plate, the high-pressure refrigerant liquid circulates in the channel to cool the heat dissipation cold plate so as to indirectly cool the power electronic elements, and as the heat conduction temperature difference of the heat dissipation cold plate is 3-5 ℃, the condensation temperature is 70 ℃, the supercooling degree is 3-5 ℃, the liquid phase temperature is 65-67 ℃, the temperature of the heat dissipation cold plate can reach 68-73 ℃, the temperature is still high at 60 ℃ of high ambient temperature, and negative effects are caused on the reliability and the service life of the power electronic elements.

In the water-cooled chiller unit adopting the water-cooled condenser and the water-cooled evaporator, the prior art also directly adopts cooling water or water with the mixed temperature of chilled water and cooling water to cool a heat dissipation cold plate with a power electronic element. The cooling water or the chilled water directly receives heat from the refrigerant, and the heat dissipation cold plate is cooled again in a cold-carrying mode, so that the heat dissipation cold plate has higher temperature due to the heat transfer temperature difference, and the efficiency loss is larger due to twice heat transfer.

The low-pressure refrigerant is directly cooled, the evaporation temperature of the refrigerant is reduced to 5-15 ℃, and the temperature of a heat dissipation cold plate is lower than the dew point temperature of ambient air at low ambient temperature, so that the surface of the heat dissipation cold plate is condensed, further the surface of a power electronic element is condensed, and further the safety problem of electrical short circuit is caused.

Disclosure of Invention

The invention aims to provide a cooling system, which adopts a gas-liquid mixed medium-pressure medium to provide latent heat of vaporization to reduce the heat emitted by a power electronic element on a heat dissipation cold plate, has higher cooling efficiency and does not cause the surface of the heat dissipation cold plate and the power electronic element to be condensed.

In order to achieve the purpose, the invention adopts the following technical scheme:

a cooling system, comprising:

a primary compressor including a compressor inlet;

the inlet of the condenser is communicated with the outlet of the main compressor, the outlet of the condenser is communicated with a branch pipeline and a main pipeline, the flow of the branch pipeline is less than that of the main pipeline, and a first throttling element is arranged on the branch pipeline;

the heat exchanger comprises a high-pressure heat exchange channel and a medium-pressure heat exchange channel, one end of the high-pressure heat exchange channel is communicated with the main pipeline, the medium-pressure heat exchange channel is communicated with the branch pipeline, and the medium in the medium-pressure heat exchange channel can absorb the heat of the medium in the high-pressure heat exchange channel;

the inlet of the air replenishing compressor is communicated with one end of the medium-pressure heat exchange channel, and the outlet of the air replenishing compressor is communicated with a pipeline between the main compressor and the condenser;

the second throttling element is communicated with the other end of the high-pressure heat exchange channel;

an evaporator in communication between the second throttling element and the compressor inlet;

the heat dissipation cold plate is provided with an integrated driving structure, the integrated driving structure comprises a plurality of power electronic elements, and the medium in the medium-pressure heat exchange channel can absorb the heat dissipated by the power electronic elements transferred by the heat dissipation cold plate.

Preferably, the flow rate of the medium in the branch line is smaller than the flow rate of the medium in the main line.

Preferably, the heat exchanger comprises a body, the high-pressure heat exchange channel and the medium-pressure heat exchange channel are both arranged in the body, and the heat dissipation cold plate is fixedly arranged on the outer side of the body.

Preferably, the heat exchanger comprises a first heat exchanger and a second heat exchanger, the high-pressure heat exchange channel is arranged in the first heat exchanger, the medium-pressure heat exchange channel is arranged in the second heat exchanger, and the heat dissipation cold plate is fixedly arranged on the outer side of the second heat exchanger.

Preferably, an inlet of the evaporator is communicated with a water pump, and a power electronic element of the water pump is integrated on the heat dissipation cold plate.

Preferably, the condenser is an air-cooled condenser, and power electronic elements of a fan of the air-cooled condenser are integrated on the heat dissipation cold plate.

Preferably, the evaporator includes a first refrigerant passage and a second refrigerant passage, the first refrigerant passage communicates with the first throttling element and the compressor inlet, and the second refrigerant passage is used for introducing chilled water.

Preferably, power electronic components of the main compressor and the air supply compressor are integrated on the heat dissipation cold plate.

Preferably, the medium in said medium pressure heat exchange channels is at a temperature between 18 ℃ and 50 ℃.

Preferably, a plurality of the power electronic elements form the following unit:

the variable-frequency power output unit comprises a rectifying module and an inverting module which are arranged on the heat dissipation cold plate, and the inverting module is provided with at least two alternating current output interfaces;

the non-variable frequency power output unit comprises a direct current power output module and a capacitor plate, wherein the direct current power output module is arranged on the heat dissipation cold plate and is provided with a direct current output interface;

the weak current unit comprises a logic board and a control board, the logic board is arranged on the heat dissipation cold plate and is connected with the rectification module and the inversion module, and the control board is connected with the logic board;

and the insulating piece is arranged on the heat dissipation cold plate and used for isolating and insulating the weak current unit and the variable frequency power output unit and isolating and insulating the weak current unit and the non-variable frequency power output unit.

The invention has the beneficial effects that: through export intercommunication lateral conduit and the main line at the condenser, the flow of lateral conduit is less than the flow of main line, be equipped with first throttling element on the lateral conduit, cooperation heat exchanger has high pressure heat transfer passageway and middling pressure heat transfer passageway simultaneously, refrigerant in the lateral conduit gets into middling pressure heat transfer passageway, the refrigerant of main line gets into high pressure heat transfer passageway, the medium in the middling pressure heat transfer passageway absorbs the heat of the medium in the partial high pressure heat transfer passageway, the heat absorption that the power electronic component on the cold drawing that will dispel the heat gived off simultaneously, with the cooling to power electronic component. The temperature of the medium entering the medium-pressure heat exchange channel is controlled by the first throttling element to be between 18 and 50 ℃, and the medium is in a gas-liquid two-phase mixed state, so that the power electronic element can be cooled better. And the medium-pressure medium in a gas-liquid two-phase mixed state can absorb a large amount of latent heat of vaporization in the liquid flash evaporation process to reduce the heat emitted by the power electronic element on the heat dissipation cold plate, the cooling efficiency is far higher than that of air cooling forced convection heat transfer and sensible heat transfer, and the surfaces of the heat dissipation cold plate and the power electronic element cannot be condensed.

Drawings

FIG. 1 is a schematic illustration of a cooling system provided by the present invention;

FIG. 2 is a pressure-specific enthalpy diagram of a cooling system provided by the present invention;

FIG. 3 is a schematic diagram of the present invention providing direct cooling of power electronic components using a high pressure liquid medium;

FIG. 4 is a pressure-specific enthalpy diagram for direct cooling of power electronic components using a high pressure liquid medium according to the present invention;

FIG. 5 is a schematic diagram of the present invention for directly cooling power electronic components by air cooling;

FIG. 6 is a pressure-specific enthalpy diagram for directly cooling power electronic components by air cooling according to the present invention;

fig. 7 is a schematic diagram of the integrated driving structure provided by the present invention.

In the figure:

1. a main compressor; 11. an inlet of the compressor; 2. a condenser; 21. a condensing fan; 3. a branch line; 4. a main pipeline; 5. a first throttling element; 6. a heat exchanger; 61. a high pressure heat exchange channel; 62. a medium pressure heat exchange channel; 7. a second throttling element; 8. an evaporator; 9. a heat dissipation cold plate; 10. a power electronic component; 101. a rectification module; 1011. a rectifying drive board; 1012. an AC/DC rectifier; 1013. a filter; 102. an inversion module; 1021. an inverter drive board; 1022. an inverter; 1023. a reactor; 103. a non-variable frequency power output unit; 1031. a DC power supply output module; 1032. a capacitive plate; 1033. a PTC heater output module; 1034. a direct current electrical component; 1035. a PTC heater; 104. a weak current unit; 1041. a logic board; 1042. a control panel; 105. an insulating member; 106. a first insulating member; 107. a turbulent fan; 108. a second insulating member; 20. a water pump; 30. a compressor for supplying air; 40. a pipeline.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The invention provides a cooling system which is preferably used in a scene with an energy storage station water chilling unit, can reduce the heat emitted by a power electronic element 10 on a heat dissipation cold plate 9, has higher cooling efficiency, and does not cause the surfaces of the heat dissipation cold plate 9 and the power electronic element 10 to be condensed.

As shown in fig. 1, the cooling system includes a main compressor 1, a condenser 2, a branch pipeline 3, a main pipeline 4, a first throttling element 5, a heat exchanger 6, a second throttling element 7, an evaporator 8, a heat dissipation cold plate 9, and an air make-up compressor 30, wherein:

the main compressor 1 comprises a compressor inlet 11, the compressor inlet 11 is communicated with the evaporator 8, and an outlet of the main compressor 1 is communicated with an inlet of the condenser 2.

The outlet of the condenser 2 is connected to a branch line 3 and a main line 4, wherein the branch line 3 is connected to a heat exchanger 6, a first throttling element 5 is provided on the branch line 3, the main line 4 is also connected to the heat exchanger 6, the flow rate of the branch line 3 is smaller than the flow rate of the main line 4, and the first throttling element 5 can throttle the flow rate of the branch line 3 to reduce the temperature of the medium flowing into the heat exchanger 6 from the branch line 3.

The heat exchanger 6 comprises a high-pressure heat exchange channel 61 and a medium-pressure heat exchange channel 62, wherein one end of the high-pressure heat exchange channel 61 is communicated with the main pipeline 4, most of the medium flowing out of the outlet of the condenser 2 flows into the high-pressure heat exchange channel 61 through the main pipeline 4, then flows into the second throttling element 7 through the high-pressure heat exchange channel 61, enters the evaporator 8 after being throttled by the second throttling element 7, and then flows into the compressor inlet 11 of the main compressor 1 through the evaporator 8.

The medium-pressure heat exchange channel 62 is communicated with the branch pipeline 3 and the air make-up compressor 30, a part of medium flowing out from the outlet of the condenser 2 enters the branch pipeline 3, is throttled by the first throttling element 5 and then flows into the medium-pressure heat exchange channel 62, and while the medium in the medium-pressure heat exchange channel 62 absorbs the medium heat in the high-pressure heat exchange channel 61, the medium can absorb the heat emitted by a plurality of power electronic elements 10 (in the field, the power electronic elements 10 can also be called as drives) integrated on the heat dissipation cold plate 9, so as to cool the plurality of power electronic elements 10. At the same time, the medium pressure heat exchange channel 62 also absorbs the heat of the medium in the high pressure heat exchange channel 61, so that the temperature of the medium in the high pressure heat exchange channel 61 is further reduced, and then the supercooled medium in the high pressure heat exchange channel 61 flows to the second throttling element 7.

In this embodiment, the heat exchanger 6 may be integrally formed, that is, the heat exchanger 6 may include a body, a high-pressure heat exchange passage 61 and a medium-pressure heat exchange passage 62 are disposed in the body, and the heat dissipation cold plate 9 is fixedly disposed on the outer side of the body. The heat exchanger 6 may also be a first heat exchanger and a second heat exchanger which are independent and are arranged in a laminating manner, the high-pressure heat exchange channel 61 is arranged in the first heat exchanger, the medium-pressure heat exchange channel 62 is arranged in the second heat exchanger, and the heat dissipation cold plate 9 is fixedly arranged on the outer side of the second heat exchanger.

The flow rate of the medium in the branch pipeline 3 is smaller than the flow rate of the medium in the main pipeline 4, preferably, the flow rate of the medium in the branch pipeline 3 is 2% -35% of the flow rate of the medium flowing out of the condenser 2, and the flow rate satisfies the heat dissipation of the power electronic element 10 on the heat dissipation cold plate 9, and at the same time, the heat exchange effect of the medium in the main pipeline 4 is not affected. In the present embodiment, the branch pipe 3 is throttled by the first throttling element 5, and the temperature of the medium-pressure gas-liquid medium formed by the throttling is 18 ℃ to 50 ℃. The temperature setting of the medium-pressure gas-liquid medium can cool the power electronic element 10 on the heat dissipation cold plate 9, and the temperature also enables the power electronic element 10 to be in a comfortable operation environment, and is particularly suitable for cooling the power electronic element 10 at a high ambient temperature, and compared with a mode of air cooling heat dissipation, direct cooling of the high-pressure liquid medium and direct cooling of the power electronic element 10 by the low-pressure medium, the medium-pressure medium cooling power electronic element 10 of the embodiment has a better effect.

In this embodiment, the condenser 2 is preferably an air-cooled condenser, the air-cooled condenser includes a condensing fan 21, and the power electronic component 10 of the condensing fan 21 is integrated on the heat-dissipating cold plate 9. The water path inlet of the evaporator 8 is communicated with a water pump 20, and a power electronic element 10 of the water pump 20 is integrated on the heat dissipation cold plate 9. Specifically, the evaporator 8 may include a first refrigerant channel and a second refrigerant channel, where the first refrigerant channel is communicated with the first throttling element 7 and the compressor inlet 11, and the second refrigerant channel is used for introducing chilled water, and it can be understood that a medium capable of realizing phase change heat exchange, such as ethylene glycol, may also be introduced into the second refrigerant channel.

The first throttling element 5 and the second throttling element 7 can adopt elements such as a throttling hole plug, a short pipe, a capillary tube, a thermal expansion valve TXV, an electronic expansion valve EEV and the like.

The inlet of the make-up air compressor 30 is connected to one end of the medium pressure heat exchange channel 62, and the outlet is connected to the pipeline 40 between the main compressor 1 and the condenser 2. Preferably, the displacement of the make-up compressor 30 is 11% -15% of the displacement of the main compressor 1.

When the cooling system of this embodiment is in operation, the main compressor 1 discharges high-temperature and high-pressure superheated gas medium into the condenser 2, in the condenser 2, after the heat of the gas medium is dissipated into the air, the gas medium is condensed into high-temperature and high-pressure supercooled liquid medium, and then the high-temperature and high-pressure supercooled liquid medium flows into the branch pipeline 3 and the main pipeline 4 through the outlet of the condenser 2 to form two paths of flow paths, wherein the high-temperature and high-pressure liquid medium flowing into the branch pipeline 3 is throttled by the first throttling element 5 in an isenthalpic manner and then is reduced in pressure to a gas-liquid mixed medium under intermediate pressure, and then flows into the intermediate pressure heat exchange channel 62 of the heat exchanger 6, the medium in the main pipeline 4 flows into the high-pressure heat exchange channel 61 of the heat exchanger 6, and the medium in the intermediate pressure heat exchange channel 62 can absorb the heat of the power electronic elements 10 on the heat dissipation cold plate 9 to cool down the plurality of power electronic elements 10 integrated on the heat dissipation cold plate 9, the liquid in the gas-liquid mixed medium under the intermediate pressure absorbs latent heat of gasification through flash vaporization and then becomes a gas medium under the intermediate pressure, and then the gas medium under the intermediate pressure enters the gas supplementing compressor 30, is compressed by the gas supplementing compressor 30 and then flows into the pipeline 40, and is mixed with the high-temperature and high-pressure superheated gas medium discharged by the main compressor 1.

Meanwhile, the medium of the intermediate pressure in the medium-pressure heat exchange channel 62 can also absorb the heat of the high-temperature high-pressure liquid medium in the high-pressure heat exchange channel 61, the high-temperature high-pressure liquid medium flows to the second throttling element 7 after being supercooled, is throttled by the second throttling element 7 and then is decompressed into a low-pressure gas-liquid mixed medium, then the low-pressure gas-liquid mixed medium flows into the evaporator 8 to exchange heat with chilled water, the temperature of the chilled water is reduced by the released heat, low-temperature refrigeration water supply can be provided, the gas-liquid mixed medium evaporates and absorbs the heat to realize evaporation and heat absorption to form a low-pressure gas medium, and then the low-pressure gas medium flows into the main compressor 1 through the compressor inlet 11 to complete the refrigeration cycle.

The advantages of the cooling system of the present invention will be described by comparing the cooling system of the present invention with a method of directly cooling the power electronic component 10 using a high-pressure liquid medium and a method of directly cooling the power electronic component 10 using air cooling:

as shown in fig. 1 and 2, fig. 2 is a pressure-specific enthalpy diagram of the cooling system of the present invention, in which the numbers in the parentheses and the numbers in the parentheses in the pressure enthalpy diagram are status points of the medium in the cooling system, which are in one-to-one correspondence, it can be seen that the status point of the medium flowing out from the outlet of the condenser 2 is three, the status point of the medium entering the branch pipe 3 and throttled and depressurized by the first throttling element 5 to the intermediate pressure is sixty, which becomes a gas-liquid two-phase medium, and goes from the status point (gas-liquid two-phase) to the status point (gas phase and a small portion of liquid entrainment, about 1% to 2% of liquid entrainment), the pressure of the medium under the intermediate pressure remains unchanged, the liquid medium under the intermediate pressure flashes into a gas medium, absorbs a large amount of latent heat to gasify, and a portion of the heat comes from the heat dissipating amount of the power electronic element 10 from the heat dissipating cold plate 9, the other part of the heat from the liquid medium (from the state point to the state point) in the high-pressure heat exchange channel 61 is radiated to the power electronic element 10 on the heat radiation cold plate 9, and the gas medium under the middle pressure enters the air supply compressor 30, is compressed by the air supply compressor 30, flows into the pipeline 40 (the state point) and is mixed with the high-temperature and high-pressure superheated gas medium discharged by the main compressor 1. The liquid medium in the high-pressure heat exchange channel 61 is absorbed by heat, the temperature is reduced, the specific enthalpy is reduced, namely the supercooling degree is improved, the supercooled liquid medium flows through the second throttling element 7 from the state point (state point) and is throttled and reduced to the liquid medium with low pressure (state point) and then enters the evaporator 8, the supercooled liquid medium is evaporated and absorbed by the evaporator 8 and enters the compressor inlet 11 (state point) and then forms the high-temperature high-pressure superheated gas medium (state point) after passing through the main compressor 1, and it can be seen that from the state point (state point) to the state point (state point) the specific enthalpy of the liquid medium in the high-pressure heat exchange channel 61 is reduced, the temperature is reduced, and the heat is provided for the flash of the liquid under the intermediate pressure.

Referring to fig. 3 and 4, when the power electronic component 10 is directly cooled by the high-pressure liquid medium, it can be seen that, from the state points (c) to (c), because the heat of the power electronic element 10 on the heat dissipation cold plate 9 can be directly absorbed, the supercooling degree of a part of medium can be consumed, and even a small part of liquid flash can be generated, the process from the state point (c) to the state point (c) is likely to generate, the specific enthalpy of the medium is increased, the temperature of the power electronic element 10 on the heat dissipation cold plate 9 is increased after the heat is absorbed, the specific enthalpy between the state point (r) and the state point (r) is also reduced, the design of directly cooling the power electronic components 10 with a high-pressure liquid-phase medium, results in a COP decay of the efficiency of the cooling system, compared to the design of the present invention in which the power electronic components 10 are directly cooled by a medium-pressure medium in fig. 1 and 2, it is relatively inferior to directly cool the power electronic components 10 by a medium-pressure medium that is higher than the medium-pressure medium.

Under the same working condition, when the power electronic element 10 is directly cooled by adopting a high-pressure liquid medium, the cold quantity and the efficiency are reduced by 5 percent, the temperature of the medium is 30-70 ℃, and the volume and the assembly space of the heat-radiating cold plate 9 and the heat exchanger 6 are larger on the premise that the heat transfer temperature difference of the power electronic element 10 is smaller. The invention adopts medium pressure medium to cool the power electronic element 10, the cold quantity is improved by 5.2-36%, the COP is improved by 1.4-12.3%, the liquid temperature is 18-40 ℃, compared with the direct cooling mode of high pressure liquid medium, the invention improves the heat transfer temperature difference by 12-30 ℃, the volume of the heat dissipation cold plate 9 and the heat exchanger 6 is smaller, the assembly space is smaller, and the unit size can be smaller.

Referring to fig. 5 and 6, when the power electronic component 10 is directly cooled by air cooling, the supercooling degree of the liquid medium at the outlet of the condenser 2 is not changed, and the efficiency is relatively good, but when the operating range is especially high ambient temperature, the temperature of the power electronic component 10 is still relatively high, the operating range is relatively narrow, and the reliability and the service life of the power electronic component 10 are negatively affected. Through the comparison, the cooling system of the invention can form the medium-pressure medium in a gas-liquid two-phase mixed state through the medium-pressure heat exchange channel 62 communicated with the branch pipeline and the high-pressure heat exchange channel 61 communicated with the main pipeline, can absorb a large amount of latent heat of vaporization through the medium-pressure medium, reduces the heat dissipated by the power electronic element 10 on the heat dissipation cold plate 9, has higher cooling efficiency, and does not cause the surfaces of the heat dissipation cold plate 9 and the power electronic element 10 to be condensed.

The power electronic components 10 integrated on the heat dissipation cold plate 9 may be, but are not limited to, the power electronic components 10 of the main compressor 1, the condenser 2, the water pump 20, the air make-up compressor 30, and the like, and by integrating the power electronic components 10 of each component on the heat dissipation cold plate 9, the power electronic components 10 can be dissipated more intensively, and compared with the power electronic components 10 with different components arranged at multiple places in the prior art, the power electronic components 10 integrated at one place occupy a smaller installation space, and are convenient to maintain, and in addition, multiple cooling is not required, and the efficiency of the cooling system is improved. In the present embodiment, the dashed line connections shown in fig. 1 are connections between the power electronic element 10 of each component and each component.

In order to better optimize the cooling of the cooling system, as shown in fig. 7, the integrated driving structure of the embodiment includes a plurality of power electronic components 10, where the plurality of power electronic components 10 form a variable frequency power output unit, a non-variable frequency power output unit 103, a weak current unit 104, and an insulating member 105, where the variable frequency power output unit, the non-variable frequency power output unit 103, the weak current unit 104, and the insulating member 105 are all disposed on a heat dissipation cold plate 9, and the heat dissipation cold plate 9 can transfer heat dissipated by the variable frequency power output unit, the non-variable frequency power output unit 103, and the weak current unit 104 to a heat exchanger 6, so as to cool the units. The insulating member 105 is used for isolating and insulating the weak current unit 104 from the variable frequency power output unit and the non-variable frequency power output unit 103, so that strong current and weak current do not interfere with each other. In this embodiment, the insulating member 105 may be an insulating structure such as an insulating bead.

In this embodiment, the variable frequency power output unit includes a rectifying module 101, an inverting module 102 and a reactor 1023, wherein the reactor 1023 is connected to the rectifying module 101, the rectifying module 101 is connected to the inverting module 102, the rectifying module 101 includes a rectifying driving board 1011 and an AC/DC rectifier 1012 connected to the rectifying driving board 1011, the rectifying driving board 1011 is connected to the weak current unit 104 to control the AC/DC rectifier 1012 to complete the conversion from the AC power to the DC power, after the AC/DC rectifier 1012 converts the DC power, the DC power is input to the inverting module 102, and the inverting module 102 converts the DC power into the AC power required by the functional component. In this embodiment, the functional components requiring ac power include, but are not limited to, a condensing fan 21, a water pump 20, a turbulent fan 107, a main compressor 1, and an air make-up compressor 30.

Further, a first insulating member 106 is provided between the rectifying drive board 1011 and the AC/DC rectifier 1012 to realize independent operation of the two without interference. In this embodiment, a reactor 1023 is connected to an input terminal of the AC/DC rectifier 1012.

Taking five 380V/3 Ph-50 Hz three-phase ac power supplies as an example, in the prior art, five sets of rectifying units are generally needed for the five 380V/3 Ph-50 Hz three-phase ac power supplies, and the five sets of rectifying units need to be distributed and assembled to different positions, so that the installation space requirement is larger, and the assembly is more complicated. In the embodiment, five 380V/3 Ph-50 Hz three-phase alternating current power supplies are input into one rectification module 101 through the rectification module 101, rectified by the rectification module 101 to obtain 537V direct current output, and then converted into alternating current required by different functional components through the inversion module 102 according to requirements. In this embodiment, only one set of the rectifier module 101 and the peripheral electrical components (such as the reactor 1023 described above) are required, and the power electronic components can be designed to share a common design, and the total capacity of the rectifier module 101 is designed to be larger than the sum of the powers required for the functional drives of all the functional components in consideration of satisfying the power requirements for the functional drives of all the functional components.

In this embodiment, the rectifying module 101 further includes a filter 1013, the inverting module 102 is provided with a filtering output interface, the filtering output interface is connected to the filter 1013, and the inverting module 102 provides power required by the filter 1013.

The inverter module 102 includes an inverter driving board 1021 and an inverter 1022, wherein the inverter driving board 1021 is connected to the weak current unit 104 and the inverter 1022, the weak current unit 104 controls the inverter driving board 1021 to work in coordination with the rectifying driving board 1011, and the inverter driving board 1021 controls the inverter 1022 to convert the direct current rectified by the AC/DC rectifier 1012 into the alternating current required by some functional components. At least two ac output interfaces and a filtering output interface are provided on the inverter 1022, wherein the ac output from at least two ac output interfaces may have different values to meet the power requirements of different functional components. For example, the main compressor 1 of the present embodiment has a maximum rotation speed of 3000rpm, a frequency of 50Hz, and a rated power of 8 kW; the maximum rotating speed of the fan is 4500rpm, the frequency is 75Hz, the rated power is 0.25kW, and the rotating speeds and the rated power output of the fan are different, so that the values of alternating currents output by the alternating current output interfaces connected with the fan are different. In this embodiment, it should be noted that at least two ac output interfaces of the inverter 1022 may be all connected to a functional component, or a redundant interface may be designed as needed, so that when one of the ac output interfaces has a problem, it can be replaced in time.

In this embodiment, the first insulating member 106 is also disposed between the inverter driving board 1021 and the inverter 1022, so as to realize independent operation of the two, without mutual interference. It should be noted that the first insulating member 106 of the present embodiment insulates and isolates the inverter driving board 1021 and the inverter 1022 as well as the rectification driving board 1011 and the AC/DC rectifier 1012.

As shown in fig. 7, the non-variable frequency power output unit 103 includes a DC power output module 1031 mounted on the heat dissipation cold plate 9, and a capacitor plate 1032, wherein the DC power output module 1031 (i.e. the DC/DC power output module) and the capacitor plate 1032 are both connected to the inverter 1022, and the DC power output module 1031 is provided with a DC output interface to connect to the DC electrical component 1034. It is understood that the non-variable frequency power output unit 103 may further include a power electronic component 10 such as a relay.

The non-variable frequency power output unit 103 further includes a PTC heater output module 1033, and the PTC heater output module 1033 is connected to the inverter module 102 and is connected to the PTC heater 1035 for controlling the heating of the PTC heater 1035.

The weak current unit 104 includes a logic board 1041 and a control board 1042 both mounted on the heat dissipation cold plate 9, and the logic board 1041 is connected to the rectification drive board 1011 and the inversion drive board 1021, and is configured to control the rectification drive board 1011 and the inversion drive board 1021, so as to achieve the coordinated operation of the two. The control board 1042 is connected to the logic board 1041 to implement sending a control command to the logic board 1041.

Preferably, a second insulating member 108 is disposed between the non-variable frequency power output unit 103 and the variable frequency power output unit, so as to realize mutual isolation between the two units and ensure that each unit operates well.

In the embodiment, by providing the variable frequency power output unit, the variable frequency power output unit includes the rectifier module 101 and the inverter module 102, the inverter module 102 is provided with at least two ac output interfaces, the at least two ac output interfaces can be connected to the variable frequency drives of different variable frequency components (such as the main compressor 1, the air make-up compressor 30, the condensing fan 21, the water pump 20 or the turbulent fan 107), furthermore, the power supply circuits of all frequency conversion components needing frequency modulation are integrated on one frequency conversion power output unit, so that the space required by independently installing the frequency conversion drive of each frequency conversion component can be effectively reduced, but it is also possible to design the total capacity of the rectifier module 101 to be larger than the sum of the powers required for the functional drives of all the functional components as required, the redundancy arrangement is realized, so that the aims of replacing the alternating current output interface connected with the frequency conversion component and connecting the newly added frequency conversion component are fulfilled. Meanwhile, by the arrangement of the non-variable frequency power output unit 103 and the weak current unit 104, the direct current power output module 1031, the capacitance plate 1032, the logic plate 1041, the control plate 1042 and the like which require non-variable frequency can be integrated on the heat dissipation cold plate 9, so that the space for independently installing each functional module is further reduced.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, adaptations and substitutions will occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.