Coating composition and method of forming an electronic device
阅读说明：本技术 涂层组合物及形成电子装置的方法 (Coating composition and method of forming an electronic device ) 是由 刘盛 J·F·卡梅伦 山田晋太郎 I-S·科 张可人 S·M·科莱 崔莉 P·J·拉博 于 2021-04-22 设计创作，主要内容包括：涂层组合物包含：可固化化合物,所述可固化化合物包含：核；以及三个或更多个具有式(1)的取代基；聚合物；以及一种或多种溶剂,其中总溶剂含量是基于所述涂层组合物的50至99wt％。还提供了用所述涂层组合物形成的经涂覆的基底以及使用所述组合物形成电子装置的方法。所述组合物、经涂覆的基底及方法特别适用于制造半导体装置。(The coating composition comprises: a curable compound comprising: a core; and three or more substituents having formula (1); a polymer; and one or more solvents, wherein the total solvent content is 50 to 99 wt% based on the coating composition. Also provided are coated substrates formed with the coating compositions and methods of forming electronic devices using the compositions. The compositions, coated substrates and methods are particularly useful in the manufacture ofA semiconductor device is manufactured.)
1. A coating composition comprising:
a first curable compound comprising: a core selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30Condensed carbocyclic aromatic ring system, C4-30Fused heterocyclic aromatic ring system, C1-20Aliphatic, and C3-20Alicyclic group; and three or more substituents having formula (1)
Wherein at least two substituents having formula (1) are attached to the core; and wherein:
Ar1is selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30A fused carbocyclic aromatic ring system, and C4-30A fused heterocyclic aromatic ring system; z is a substituent independently selected from: OR (OR)1Protected hydroxy, carboxy, protected carboxy, SR1Protected mercapto-O-C (═ O) -C1-6Alkyl, halogen, and NHR2(ii) a Wherein each R1Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, and C5-30An aryl group; each R2Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, C5-30Aryl, C (═ O) -R1And S (═ O)2-R1(ii) a x is 1 to Ar1An integer of the total number of aromatic ring atoms available in (a); and indicates the attachment point to the core; provided that the substituents having formula (1) on the same aromatic ring of the nucleus are not ortho to each other;
a polymer; and
one or more solvents, wherein the total solvent content is 50 to 99 wt% based on the coating composition.
2. The coating composition of claim 1, wherein the polymer is selected from the group consisting of acrylates, vinyl aromatic polymers, novolacs, polyphenylenes, polyimides, polybenzoxazoles, polybenzimidazoles, polyethersulfones, and combinations thereof.
3. The coating composition of claim 2, wherein the polymer is selected from the group consisting of acrylates, vinyl aromatic polymers, novolacs, polyphenylenes, and combinations thereof.
4. The coating composition of claim 1, wherein the polymer is a B-staged reaction product of a second curable compound comprising: a core selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30Condensed carbocyclic aromatic ring system, C4-30Fused heterocyclic aromatic ring system, C1-20Aliphatic, and C3-20Alicyclic group; and two or more substituents having formula (B-1) attached to the core:
wherein in formula (B-1): ar (Ar)1Is selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30A fused carbocyclic aromatic ring system, and C4-30Fused heterocyclic aromatic ring system: z is a substituent independently selected from: OR (OR)1Protected hydroxy, carboxy, protected carboxy, SR1Protected mercapto-O-C (═ O) -C1-6Alkyl, halogen, and NHR2: wherein each R1Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, and C5-30An aryl group; each R2Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, C5-30Aryl, C (═ O) -R1And S (═ O)2-R1(ii) a x is 1 to Ar1The total number of aromatic ring atoms available in (a): and indicates the attachment point to the core: provided that the substituents having formula (B-1) on the same aromatic ring of the nucleus are not ortho to each other.
5. The coating composition of any one of claims 1 to 4, wherein each Z in formula (1) is independently selected from OR1Protected hydroxy, carboxy, protected carboxy,SH、-O-C(＝O)-C1-6Alkyl, and NHR2。
6. The coating composition of claim 5, wherein each Z in formula (1) is a hydroxyl group.
7. A coating composition according to any one of claims 1 to 6 wherein the core of the first curable compound is selected from pyridine, benzene, naphthalene, quinoline, isoquinoline, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene.
8. The coating composition of any one of claims 1 to 7, wherein each Ar in formula (1) is1Independently selected from pyridine, benzene, naphthalene, quinoline, isoquinoline, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene.
9. The coating composition of any one of claims 1 to 8, further comprising a curing agent, a surface leveling agent, or a flow additive.
10. The coating composition of any one of claims 1 to 9, further comprising a crosslinker, the crosslinker being different from the first curable compound and the polymer.
11. A coated substrate, comprising:
an electronic device substrate; and
a layer formed from the coating composition of any one of claims 1 to 10 on a surface of the electronic device substrate.
12. A method of forming an electronic device, comprising:
(a) providing an electronic device substrate;
(b) coating a layer of the coating composition of any one of claims 1 to 10 on a surface of the electronic device substrate; and
(c) curing the layer of curable compound to form a cured layer.
13. The method of claim 12, wherein the cured layer is an underlayer of photoresist, the method further comprising:
(d) forming a photoresist layer on the bottom layer;
(e) patternwise exposing the photoresist layer to activating radiation;
(f) developing the exposed photoresist layer to form a pattern in the photoresist layer: and
(g) transferring the pattern to the substrate.
14. The method of claim 13, further comprising applying one or more of a silicon-containing layer, an organic anti-reflective coating, or a combination thereof, on the underlayer prior to step (d).
15. The method of claim 14, further comprising transferring the pattern to one or more of the silicon-containing layer, the organic anti-reflective coating layer, or a combination thereof after step (f) and before step (g).
16. The method of any one of claims 13 to 15, further comprising:
(h) transferring the pattern onto a layer of the electronic device substrate below the patterned bottom layer; and
(i) and removing the patterned bottom layer.
Background
The present invention relates generally to the field of electronic device manufacturing, and more particularly to the field of coating compositions for use in manufacturing electronic devices, such as semiconductor devices.
It is well known in the photolithography process that if a resist pattern is relatively high (high aspect ratio) with respect to its width, the resist pattern may collapse due to surface tension from a developer used. Multi-layer resist processes (e.g., tri-layer and quad-layer processes) have been designed that can address pattern collapse where high aspect ratios are desired. Such multi-layer processes use a top layer of resist, one or more intermediate layers, and a bottom layer (or underlayer). In such a multilayer resist process, the top photoresist layer is imaged and developed in a typical manner to provide a resist pattern. The pattern is then transferred to one or more intermediate layers, typically by etching. Each intermediate layer is selected such that a different etch process, such as a different plasma etch, is used. Finally, the pattern is transferred to the underlying layer, typically by etching. Such intermediate layers may be composed of a variety of materials, however the underlying material is typically composed of a high carbon content material. The underlying material is selected to provide the desired anti-reflective properties, planarization properties, and etch selectivity.
Prior techniques for underlayer formation include Chemical Vapor Deposition (CVD) carbon and solution processed high carbon content polymers. CVD materials have several significant limitations, including high cost of ownership, inability to form a planarization layer on the topography on the substrate, and high absorbance at 633nm for pattern alignment. For these reasons, the industry has turned to solution-processed high carbon content materials as underlayers. The underlayer material should ideally satisfy the following properties: can be cast onto a substrate by a spin-on process; heat-set upon heating, with low outgassing and sublimation; soluble in common processing solvents with good equipment compatibility; having appropriate n and k values to function in conjunction with the currently used silicon hard mask and Bottom Antireflective (BARC) layer to impart the low reflectivity necessary for photoresist imaging; up to >400 ℃ so as not to be damaged during subsequent processes (e.g., CVD such as silicon oxynitride (SiON) CVD processes); and resist stripping from common solvents used in overcoated photoresists or other layers.
It is well known that materials having a relatively low molecular weight have a relatively low viscosity and can flow into features in the substrate, such as vias and trenches, to provide a planarizing layer. The underlying material must be capable of planarization with relatively low outgassing up to 400 ℃. For use as a high carbon content underlayer, it is desirable that any composition be heat set upon heating. U.S. Pat. No. 9,581,905B 2 discloses compounds having the formula
Wherein R is1、R2And R3Each independently represents formula RA-C≡C-RB-, wherein RAIn particular, it may be an aryl group substituted with at least one of a hydroxyl group and an aryl group, and RBIs a single bond or an aryl group, wherein such compounds may be used to form the bottom layer in the manufacture of semiconductor devices. However, such compounds cure at relatively high temperatures.
There is a need in the art for coating compositions useful for forming electronic devices, and methods of using such compositions, that address one or more of the problems associated with the prior art.
Disclosure of Invention
According to a first aspect of the present invention, a coating composition is provided. The coating composition comprises: a first curable compound comprising: an aromatic nucleus selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30A fused carbocyclic aromatic ring system, and C4-30A fused heterocyclic aromatic ring system; and three or more substituents having formula (1)
Wherein at least two substituents having formula (1) are attached to the aromatic core; and wherein: ar (Ar)1Is selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30A fused carbocyclic aromatic ring system, and C4-30A fused heterocyclic aromatic ring system; z is a substituent independently selected from: OR (OR)1Protected hydroxy, carboxy, protected carboxy, SR1Protected mercapto-O-C (═ O) -C1-6Alkyl, halogen, and NHR2(ii) a Wherein each R1Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, and C5-30An aryl group; each R2Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, C5-30Aryl, C (═ O) -R1And S (═ O)2-R1(ii) a x is 1 to Ar1An integer of the total number of aromatic ring atoms available in (a); and indicates the attachment point to the core; provided that the substituents having formula (1) on the same aromatic ring of the nucleus are not ortho to each other; a polymer; and one or more solvents, wherein the total solvent content is 50 to 99 wt% based on the coating composition.
According to another aspect of the present invention, a coated substrate is provided. The coated substrate comprises: an electronic device substrate; and a layer formed from a coating composition as described herein on a surface of the electronic device substrate. The layer may function in one or more capabilities, for example, as a photoresist underlayer, a planarization layer, a gap fill layer, a protective layer, or a combination thereof.
According to another aspect of the invention, a method of forming an electronic device is provided. The method comprises the following steps: (a) providing an electronic device substrate; (b) coating a layer of a coating composition as described herein on a surface of the electronic device substrate; and (c) curing the layer of curable compound to form a cured layer. In another aspect of the method, the cured layer is a photoresist underlayer useful for a patterning process. The method further comprises: (d) forming a photoresist layer on the bottom layer; (e) patternwise exposing the photoresist layer to activating radiation; (f) developing the exposed photoresist layer to form a pattern in the photoresist layer; and (g) transferring the pattern to the substrate. In another aspect of the method, one or more of a silicon-containing layer, an organic anti-reflective coating, or a combination thereof, may be coated on the base layer prior to step (d). In another aspect, after step (f) and before step (g), the pattern may be transferred to one or more of the silicon-containing layer, the organic anti-reflective coating layer, or a combination thereof. In yet another aspect, the method may further comprise: (h) transferring the pattern onto a layer of the electronic device substrate below the patterned bottom layer; and (i) removing the patterned underlayer.
It will be understood that when an element is referred to as being "on" or "over" another element, it can be directly adjacent to the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It will be further understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
As used throughout this specification, the following abbreviations shall have the following meanings, unless the context clearly indicates otherwise: DEG C is centigrade; g is gram; mg ═ mg; l is liter; mL to mL;nm is nano; μ m to micrometer (micrometer); mm is millimeter; sec-seconds; min. (min.) is minutes; hr. (hr.) hours; DI is deionized; and Da ═ dalton. Unless otherwise indicated, "wt%" refers to weight percent based on the total weight of the reference composition.
Unless otherwise indicated, "aliphatic," "aromatic," "alkyl," and "aryl" include heteroaliphatic, heteroaromatic, heteroalkyl, and heteroaryl, respectively. The terms "heteroaliphatic", "heteroaromatic", "heteroalkyl", "heteroaryl", and the like, refer respectively to aliphatic, aromatic, alkyl, and aryl groups having one or more heteroatoms (such as nitrogen, oxygen, sulfur, phosphorus, or silicon) replacing one or more carbon atoms within the group, for example, as in ethers or thioethers.
Unless otherwise indicated, "aliphatic" refers to both open-chain (straight, or branched) and cyclic aliphatic. The aliphatic structure can be saturated (e.g., alkane) or unsaturated (e.g., alkene or alkyne). Aliphatic refers to aliphatic groups and includes aliphatic monovalent groups, divalent groups, and higher valent groups. Unless otherwise indicated, "aliphatic" includes "heteroaliphatic". In a preferred aspect, the aliphatic group does not contain heteroatoms.
Unless otherwise indicated, "alkyl" refers to straight, branched, and cyclic alkyl groups. As used herein, "alkyl" refers to an alkane group and includes alkane monovalent groups, divalent groups (alkylene groups), and higher valent groups. Unless otherwise indicated, "alkyl" includes "heteroalkyl. In a preferred aspect, the alkyl group does not contain heteroatoms. If no number of carbons is indicated for any alkyl or heteroalkyl group, 1-12 carbons are contemplated.
"aromatic" and "aryl" include aromatic carbocycles as well as aromatic heterocycles. The terms "aromatic" and "aryl" refer to aromatic groups and include monovalent groups, divalent groups (arylene), and higher valent groups. In a preferred aspect, the aromatic or aryl group is an aromatic carbocyclic ring.
Unless otherwise specified, "substituted" refers to moieties wherein one or more hydrogens are replaced with one or more substituents selected from the group consisting of: halogen, C1-6Alkyl, halo-C1-6Alkyl radical, C1-6Alkoxy, halo-C1-6Alkoxy, phenyl, and phenoxy, preferably selected from halogen, C1-6Alkyl, halo-C1-4Alkyl radical, C1-6Alkoxy, halo-C14Alkoxy, and phenyl, and more preferably selected from halogen, C1-6Alkyl radical, C1-6Alkoxy, phenyl, and phenoxy. Unless otherwise specified, substituted moieties preferably have 1 to 3 substituents, and more preferably 1 or 2 substituents. "Halo" (Halo) "means fluoro, chloro, bromo, and iodo.
The term "B-staged" refers to the partially cured reaction product of a particular compound or compounds. As used herein, "partially cured" refers to a reaction product that is in the form of an oligomer and that can be further polymerized or cured to form a higher molecular weight material, such as a reaction product useful when coating compositions are coated on a substrate and cured to form a layer or film of the composition. When such coating compositions are coated on a substrate to form a film, such partially cured reaction products may undergo further curing during subsequent processing steps.
"Oligomer (Oligomer and oligomeric)" refers to a low molecular weight polymer comprising a small amount (e.g., 2 to 10) total units and capable of further curing. As used herein, the term "polymer" includes oligomers. The term "curing" means any process, such as polymerization or condensation, that increases the overall molecular weight of the material, removes the solubility-enhancing groups, or both. "curable" refers to any material that is capable of being cured under certain conditions. As used herein, "gap" refers to any hole on a semiconductor substrate that is intended to be filled with a gap filling composition.
The article "a" or "an" refers to both the singular and the plural. Unless otherwise indicated, all amounts are weight percentages and all ratios are by weight. All numerical ranges are inclusive and combinable in any order, except where it is clear that such numerical ranges are limited to add up to 100%.
Detailed Description
The coating composition of the present invention comprises a curable compound comprising: a core selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30Condensed carbocyclic aromatic ring system, C4-30Fused heterocyclic aromatic ring system, C1-20Aliphatic, and C3-20Alicyclic group; and three or more substituents having formula (1)
Wherein at least two substituents having formula (1) are attached to the core; and wherein: ar (Ar)1Is selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30A fused carbocyclic aromatic ring system, and C4-30A fused heterocyclic aromatic ring system; z is a substituent independently selected from: OR (OR)1Protected hydroxy, carboxy, protected carboxy, SR1Protected mercapto-O-C (═ O) -C1-6Alkyl, halogen, and NHR2(ii) a Wherein each R1Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, and C5-30An aryl group; each R2Is independently selected fromH、C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, C5-30Aryl, C (═ O) -R1And S (═ O)2-R1(ii) a x is 1 to Ar1An integer of the total number of aromatic ring atoms available in (a); and indicates the attachment point to the core; provided that the substituents having formula (1) on the same aromatic ring of the nucleus are not ortho to each other. Thus, a substituent of formula (1) bonded to the same aromatic ring of the nucleus will not be bonded to the immediately adjacent carbon atoms of the aromatic ring, for example at the 1 and 2 positions of the benzene nucleus.
Preferably, each Z is independently selected from OR1Protected hydroxy, carboxy, protected carboxy, SH, -O-C (═ O) -C1-6Alkyl, and NHR2. More preferably, each Z is independently selected from the group consisting of hydroxy, protected hydroxy, OCH2C ≡ CH, carboxy, protected carboxy, and NHR2And yet more preferably from hydroxyl, protected hydroxyl, OCH2C ≡ CH, carboxy, and protected carboxy, even more preferably selected from hydroxy and protected hydroxy, and most preferably from hydroxy. Each R1Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, and C5-30Aryl, and more preferably selected from H, C1-10Alkyl radical, C2-10Alkenyl radical, C2-10Alkynyl, and C5-30And (4) an aryl group. In a preferred embodiment, R1Is H. Each R2Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, C5-30Aryl, C (═ O) -R1And S (═ O)2-R1. Preferably, R2Selected from H, C1-10Alkyl radical, C2-10-unsaturated hydrocarbon radical, and C5-30Aryl, and more preferably selected from H, C1-10Alkyl radical, C2-10-alkenyl and C2-10-alkynyl.
As used herein, the term "core" refers to a C to which at least 2, and preferably 2 to 6 moieties of formula (1) are attached6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30Condensed carbocyclic aromatic ring system, C4-30Fused heterocyclic aromatic ring system, C1-20Aliphatic, and C3-20Alicyclic. It is understood that in the compounds from which the curable compounds are formed, the cores described below (e.g., pyridine, benzene.) are substituted with substituents having formula (1) and optional additional substituents as described above. For example, the following compounds are understood to have a benzene nucleus and 3 substituents of formula (1):
the core is preferably C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30Condensed carbocyclic aromatic ring system, or C4-30A fused heterocyclic aromatic ring system. Suitable aromatic cores include, for example, those selected from the group consisting of: pyridine, benzene, naphthalene, quinoline, isoquinoline, carbazole, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracenes, oxazoles, isoxazoles, thiazoles, isothiazoles, triazoles, and benzols [ a]Pyrene, more preferably selected from benzene, naphthalene, carbazole, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene, and still more preferably selected from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene,And phenalene. The aliphatic core may be substituted or unsubstituted, straight, branched or cyclic, and saturated or unsaturated (alkane, alkene or alkyne). Suitable aliphatic and heteroaliphatic cores include, for example, those selected from: methane, ethane, propane, butane, pentane, hexane, heptane, octane, nonane, decane, methyl methane, dimethyl ether, butenes, butynesDimethyl sulfide, trimethylamine and tetramethylsilane, cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, cyclopropene, cyclobutene, cyclopentene, cyclohexene, cycloheptene, 1, 3-cyclohexadiene, 1, 4-cyclohexadiene, 1, 5-cyclooctadiene, norbornene, adamantane, tetrahydropyran, tetrahydrothiophene, pyrrolidine, tetrahydro-2H-pyran, tetrahydro-2H-thiopyran, piperidine and dioxane.
In formula (1), it is preferred that each Ar1Independently selected from pyridine, benzene, naphthalene, quinoline, isoquinoline, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene, more preferably selected from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene, and even more preferably selected from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene,And phenalene. Preferably, x is 1 or 2, and more preferably x is 1.
The curable compound has three or more substituents having formula (1), wherein two or more substituents having formula (1) are directly attached to the core. It is further preferred that the curable compound has 2 to 4 substituents of formula (1) attached to the core, and more preferably 3 moieties of formula (1) attached to the core. One or more substituents having formula (1) may also be present in the curable compound, but not directly attached to the core. The curable compound may have any suitable number of moieties of formula (1), such as 2 to 10, preferably 2 to 8, more preferably 2 to 6, and even more preferably 3 or 4. When the nucleus comprises an aromatic ring, the substituents having formula (1) on the same aromatic ring of the nucleus are not ortho to each other.
The curable compounds useful in the coating compositions of the present invention preferably have the formula (2)
Wherein: r0Is a nucleus as described above and is selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30Condensed carbocyclic aromatic ring system, C4-30Fused heterocyclic aromatic ring system, C1-20Aliphatic, and C3-20Alicyclic group; ar (Ar)1、Ar2And Ar3Each independently is an aromatic group independently selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30A fused carbocyclic aromatic ring system, and C4-30A fused heterocyclic aromatic ring system; y is a covalent chemical single bond, a divalent linking group, or a trivalent linking group; z1And Z2Independently selected from OR1Protected hydroxy, carboxy, protected carboxy, SR1Protected mercapto-O-C (═ O) -C1-6-alkyl, halogen, and NHR2(ii) a Each R1Selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, and C5-30An aryl group; each R2Selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, C5-30Aryl, C (═ O) -R1And S (═ O)2-R1(ii) a x1 ═ 1 to 4; x2 ═ 1 to 4; y1 ═ 2 to 4; each y2 is 0 to 4; y1+ each y2 is more than or equal to 2; w is 0 to 2; and z is equal to 0 to 2; wherein when Y is a covalent single chemical bond or a divalent linking group, z ═ 1; and when Y is a trivalent linking group, z is 2.
Preferably, R is0Is an aromatic nucleus having 5 to 30 carbon atoms, and more preferably 5 to 20 carbon atoms. R0Suitable aromatic nuclei include, but are not limited to, pyridine, benzene, naphthalene, quinoline, isoquinoline, carbazole, anthracene, phenanthrene, pyrene, coronene, triphenylene, perylene, and the like,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene, preferably benzene, naphthalene, carbazole, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene, and more preferably benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene, perylene,And phenalene. Suitable aliphatic cores include, for example, those selected from the group consisting of: methane, ethane, propane, butane, pentane, hexane, heptane, octane, nonane, decane, methyl methane, dimethyl ether, butenes, butynes, dimethyl sulfide, trimethylamine, and tetramethylsilane. Suitable cycloaliphatic cores include, for example, those selected from the group consisting of: cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, cyclopropene, cyclobutene, cyclopentene, cyclohexene, cycloheptene, 1, 3-cyclohexadiene, 1, 4-cyclohexadiene, 1, 5-cyclooctadiene, adamantane, tetrahydropyran, tetrahydrothiophene, pyrrolidine, tetrahydro-2H-pyran, tetrahydro-2H-thiopyran, piperidine, and dioxane.
Ar1、Ar2And Ar3Preferably each independently selected from pyridine, benzene, naphthalene, quinoline, isoquinoline, anthracene, phenanthrene, pyrene, coronene, triphenylene, benzophenanthrene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene, more preferably selected from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene, and yet more preferably selected from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene,And phenalene. Further preferably, R0Selected from pyridine, benzene, naphthalene, quinoline, isoquinoline, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene, and Ar1、Ar2And Ar3Each independently selected from pyridine, benzene, naphthalene, quinoline, isoquinoline, anthracene, phenanthrene, pyrene, coronene, triphenylene,Phenalene, benzo [ a ]]Anthracene, dibenzo [ a, h ]]Anthracene, and benzo [ a]Pyrene. Preferably, Z is1And Z2Each independently selected from OR1Protected hydroxy, carboxy (C (═ O) OH), protected carboxy, SH, fluoro, and NHR2More preferably selected from hydroxyl (OH), protected hydroxyl, OCH2C ≡ CH, C (═ O) OH, protected carboxy, and NHR2And even more preferably from OH, protected hydroxyl, OCH2C ≡ CH, carboxy, and protected carboxy, and still more preferably selected from OH and protected hydroxy. Each R1Independently selected from H, C1-10Alkyl radical, C2-10Unsaturated hydrocarbon group, and C5-30Aryl, and more preferably selected from H, C1-10Alkyl radical, C2-10-alkenyl, C2-10-alkynyl, and C5-30And (4) an aryl group. In a preferred embodiment, R1Is H. Preferably, R2Selected from H, C1-10Alkyl radical, C2-10-unsaturated hydrocarbon radical, and C5-30-aryl, and more preferably selected from H, C1-10Alkyl radical, C2-10-alkenyl and C2-10-alkynyl. Preferably, each Z is1Are the same. It is also preferred that each Z is2Are the same. Further preferably, Z1＝Z2. Preferably, x1 and x2 are each independently selected from 1 to 3, more preferablyIndependently 1 or 2, and yet more preferably each is 1. Preferably, each y2 is 0 to 2. Preferably, y1+ is 3 to 8, more preferably 3 to 6, and still more preferably 3 or 4 per y 2. Preferably, w is 0 to 1. In a preferred embodiment, R is 0 when w0And each Ar1Are not phenyl groups. In a preferred embodiment, Y is a covalent single bond. In another preferred embodiment, Y is a divalent or trivalent linking group. Exemplary linking groups for Y include, but are not limited to, O, S, N (R)3)r、S(＝O)2、CR4R5A bis-imide moiety, a bis-etherimide moiety, a bis-ketimide moiety, a bis-benzoxazole moiety, a bis-benzimidazole moiety, and a bis-benzothiazole moiety, wherein R is 0 or 1, and preferably the linking group for Y is O, N (R is 0 or 1)3)wAnd CR4R5。R3Is ═ C (═ O) -C5-30-aryl or-S (═ O)2-C5-30-aryl, wherein x is the point of attachment to N. R4And R5Independently selected from H, C1-10-alkyl and C5-10-aryl, and R4And R4May form a 5-or 6-membered ring together with the carbon to which they are attached, which may be fused to one or more aromatic rings.
When Y is equal to CR4R5When used, a suitable linking group is a fluorenyl moiety having the following formula (A)
Wherein indicates with R0And Ar2The attachment point of (a). Suitable bis-imide moiety linking groups for Y are shown by formula (B) and formula (C), wherein Y is1Is a covalent single bond or C5-30-arylene, wherein0And Ar2The attachment point of (a). Suitable bis-etherimide moieties and bis-ketoimide moieties are those having the formula (C) wherein, respectively, Y1O or-C (═ O) -, and wherein indicates and R0And Ar2The attachment point of (a). Suitable bis-benzoxazoles,Bis-benzimidazole, and bis-benzothiazole moieties are those having formula (D), wherein G ═ O, NH, and S, respectively, and wherein Y is2Is a covalent single bond or C5-30-arylene, and wherein0And Ar2The attachment point of (a).
Z, Z for formulas (1) and (2)1And Z2A protected carboxy group is any group that can be cleaved (deprotected) under certain conditions to yield a carboxy group. Such protected carboxyl groups may be deprotected by heat, acid, base, or a combination thereof, preferably by heat, acid, or a combination thereof, and more preferably by heat. Exemplary protected carboxy groups include esters, such as benzyl esters and esters having a quaternary carbon bonded directly to the alkoxy oxygen of the ester group. Preferably, the protected carboxyl group is an ester having a quaternary carbon directly bonded to the alkoxy oxygen of the ester group, and more preferably the ester has the formula Y-C (O) -O-CR ' R ', wherein Y is an organic residue, and R ', R ' and R ' are each independently selected from C1-10An alkyl group. Preferred protected carboxy groups include: tert-butyl ester; 1-alkylcyclopentyl esters such as 1-methylcyclopentyl ester and 1-ethylcyclopentyl ester; 2, 3-dimethyl-2-butyl ester; 3-methyl-3-pentyl ester; 2, 3, 3-trimethyl-3-butyl ester; 1, 2-dimethylcyclopentyl ester; 2, 3, 4-trimethyl-3-pentyl ester; 2, 2, 3, 4, 4-pentamethyl-3-pentyl ester; and adamantyl esters such as hydroxyadamantyl esters and C1-12Alkyl adamantyl esters. Each of the above protected carboxyl groups may be deprotected by one or more of heat, acid or base. Preferably, the protected carboxyl group is deprotected using heat, acid or a combination of heat and acid, and more preferably by heat. For example, these protected carboxyl groups can be deprotected at a pH of ≦ 4 and preferably ≦ 1. At this pH, it will typically be subjected toThe protected carboxyl group is heated to a temperature of, for example, 90 ℃ to 110 ℃, and preferably about 100 ℃ to facilitate deprotection. Alternatively, when the protected carboxyl group is an ester having a tertiary carbon directly bonded to the alkoxy oxygen of the ester group, the protected carboxyl group may be deprotected by heating to a suitable temperature, such as ≧ 125 ℃, preferably 125 ℃ to 250 ℃, and more preferably 150 ℃ to 250 ℃. Such protected carboxyl groups and conditions for their use are well known in the art. For example, U.S. Pat. No. 6,136,501 discloses various ester groups having quaternary carbons of alkoxy oxygens directly bonded to the ester group.
Z, Z for formulas (1) and (2)1And Z2A suitable protected hydroxyl group is any group that is cleavable (deprotectable) under certain conditions to yield a hydroxyl group. Such protected hydroxyl groups may be deprotected by heat, acid, base, or a combination thereof. Exemplary protected hydroxyl groups include: ethers such as methoxymethyl ether, ethoxyethyl ether, 2-methoxypropyl ether, tetrahydropyranyl ether, t-butyl ether, allyl ether, benzyl ether, t-butyldimethylsilyl ether, t-butyldiphenylsilyl ether, acetonide, and benzylidene acetal; esters, such as pivalate and benzoate; and carbonates, such as t-butyl carbonate. Each of the above protected hydroxyl groups may be deprotected under acidic or basic conditions, and preferably under acidic conditions. More preferably, the protected hydroxyl group is deprotected using an acid or a combination of an acid and heat. For example, these protected hydroxyl groups can be deprotected at a pH of 4 or less and preferably 1 or less. At this pH, the protected hydroxyl group is typically heated to a temperature of, for example, 90 ℃ to 110 ℃, and preferably about 100 ℃ to facilitate deprotection. Such protected hydroxyl groups and conditions for their use are well known in the art.
Z, Z for formulas (1) and (2)1And Z2A suitable protected thiol group is any group that can be cleaved (deprotected) under certain conditions to yield a thiol group. Such protected sulfhydryl groups may be cleaved by heat, acid, base, or combinations thereof. Exemplary protected sulfhydryl groups include: ethers, e.g. methoxymethyl sulfide, tetrahydropyranThioether, t-butyl sulfide, allyl sulfide, benzyl sulfide, t-butyldimethylsilyl sulfide, t-butyldiphenylsilyl sulfide, thioacetone compound, and benzylidene thioacetal; thioesters such as pivalic acid thioester and benzoic acid thioester; and thiocarbonates, such as tert-butyl thiocarbonate. Each of the above protected thiol groups may be deprotected under acidic or basic conditions, and preferably under acidic conditions. More preferably, the protected thiol group is deprotected using an acid or a combination of an acid and heat. For example, these protected sulfhydryl groups can be deprotected at room temperature, e.g., when exposed to a pH of ≦ 1. At this pH, the protected thiol group is typically heated to a temperature of, for example, 90 ℃ to 110 ℃, and preferably about 100 ℃ to facilitate deprotection. Such protected sulfhydryl groups and conditions for their use are well known in the art.
The curable compound may be present in the coating composition in a wide range of, for example, 1 to 99 wt.%, 10 to 99 wt.%, or 50 to 90 wt.%, based on the total solids of the coating composition. It may be desirable for the curable compound to be present in a relatively minor amount, for example 1 to 50 wt% or 1 to 30 wt%, relative to the total solids of the composition.
The curable compounds as described above can be readily manufactured by those skilled in the art using known synthetic techniques. For example, the compounds can be prepared by combining reactants (e.g., an aryl halide or an alkyl halide) with an aromatic alkyne and one or more suitable catalysts (e.g., copper and palladium catalysts), a base, and a solvent. The solvent is typically an organic solvent, which is selected from, for example, toluene, benzene, tetrahydrofuran, dioxane, and combinations thereof. The reaction is conducted at a temperature and for a time effective to cause the reactants in the reaction mixture to react to form a curable compound. The reaction temperature is typically from 0 ℃ to 200 ℃, preferably from 25 ℃ to 100 ℃. The reaction time is typically 5 minutes to 96 hours, preferably 2 to 24 hours. The product compound may be purified by techniques known in the art, such as column chromatography.
The coating composition further comprises one or more polymers. The inclusion of a polymer in the coating composition may allow for the adjustment or improvement of one or more characteristics of the composition or a layer formed therefrom, such as planarization performance, peel resistance, etch rate, or coating quality. Such properties can be adjusted by selecting the appropriate polymer and adjusting the relative amounts of curable compound and polymer in the composition. Suitable polymers include, for example, those selected from the group consisting of: acrylates, vinyl aromatic polymers, novolacs, polyphenylenes, polyarylene ethers, polyimides, polybenzoxazoles, polybenzimidazoles, polybenzothiazoles, polyquinoxalines, polyethersulfones, B-staged reaction products of the foregoing curable compounds, and combinations thereof. The polymer preferably comprises one or more functional groups selected from, for example, hydroxyl, alkoxy, epoxy, alkenyl, alkynyl, carboxylic acid, acetal, ketal, tertiary alkyl ester, and amine. Among these functional groups, an epoxy group is preferable. Suitable such polymers are known and can be readily made by those skilled in the art using known synthetic techniques. Suitable polymers are described, for example, in the following: U.S. patent nos. 5349111 a, 5965679 a, 7303855B 2, 7749681B 2, 8674052B 2, 9244353B 2, and 9540476B 2; U.S. patent application publication nos. 2008/0160460 a1, 2013/0171569 a1, 2013/0280913 a1, and 2019/0146346 a 1; DW Smith et al, Polyarylene Networks via Bergman cyclopropolymerization of Bis-ortho-diynyl Arenes [ Polyarylene Networks polymerized by the Bergman ring of Bis-ortho-diynylaromatics ], adv.Funct.Mater. [ advanced functional materials ]2007, 17, 1237-; maier, Polymers for Microelectronics, Materials Today, vol 4, No. 5, 9-10 months 2001, 22-33; and PM Hergenrother, The Use, Design, Synthesis, and Properties of High Performance/High Temperature Polymers: an Overview [ use, design, synthesis and characteristics of high Performance/high temperature polymers: review ], High Performance Polymers [ High Performance Polymers ], 15: 3-45, 2003, Sage Publications [ Seckey Press ]. Suitable polymers include, for example, homopolymers or copolymers comprising polymerized units of one or more of the following monomers, and may comprise polymerized units of other monomers:
suitable B-stage polymers comprise the reaction product of a curable compound as described above. Thus, in addition to the curable compounds described above, the coating composition may comprise the B-stage reaction product of the same curable compound present in the composition or a different such curable compound as described above. For example, the B-staged reaction product may be a curable compound comprising a core selected from C6Carbocyclic aromatic ring, C2-5Heterocyclic aromatic ring, C9-30Condensed carbocyclic aromatic ring system, C4-30Fused heterocyclic aromatic ring system, C1-20Aliphatic, and C3-20Alicyclic group; and two or more substituents having formula (B-1) attached to the core:
wherein, in the formula (B-1), Ar1Z, x and x are as defined above for formula (1) with the proviso that the substituents having formula (B-1) on the same aromatic ring of the nucleus are not ortho to each other. The B-staged reaction product of the curable compound may be prepared by methods known to those skilled in the art. For example, B-staging of a compound can be carried out by dissolving the compound in a suitable solvent having a higher boiling point than the B-staging temperature. Suitable solvents include, for example, those described below with respect to the solvent component of the coating composition. It may be desirable to use the same solvent for B-staging as later used in the coating composition. The B-staged solvent is preferably selected from propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol monomethyl ether acetate, lactic acidEthyl esters, gamma-butyrolactone, methyl hydroxyisobutyrate, cyclohexanone, and combinations thereof. The solution is heated to a temperature and for a time effective to cause partial polymerization or condensation of the compound until a target molecular weight (Mw) is reached. The B-staged reaction products of the above compounds typically have a weight average molecular weight (Mw) of 400 to 50,000Da, more preferably 400 to 5,000 Da. The B-staging temperature is typically from 50 ℃ to 250 ℃, preferably from 100 ℃ to 200 ℃. The B-staging time is typically from 5 minutes to 96 hours, preferably from 2 to 24 hours. Known methods for forming B-staged polymers are described, for example, in U.S. Pat. Nos. 5,854,302 and So, Y. -H et al, Benzocyclobutene-based polymers for microelectronics]Chemical Innovation (Chemical Innovation)]Vol.31, No. 12, pp.40-47 (2001).
The one or more polymers are typically present alone or in combination in an amount of, for example, 1 to 99 wt%, more typically 5 to 90 wt%, based on the total solids of the coating composition.
The coating composition comprises one or more solvents for dissolving the components of the composition and facilitating its coating on the substrate. Preferably, the one or more solvents are selected from organic solvents conventionally used in the manufacture of electronic devices. Suitable organic solvents include, but are not limited to; hydrocarbons such as xylene, mesitylene, cumene, and limonene (limonene); ketones such as cyclopentanone, Cyclohexanone (CHO), methyl ethyl ketone, and methyl-2-n-amyl ketone; alcohols such as 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, and 1-ethoxy-2-propanol; ethers such as Propylene Glycol Methyl Ether (PGME), Propylene Glycol Ethyl Ether (PGEE), ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, diethylene glycol dimethyl ether, anisole, and ethoxybenzene; esters such as Propylene Glycol Monomethyl Ether Acetate (PGMEA), propylene glycol monoethyl ether acetate, Ethyl Lactate (EL), methyl Hydroxyisobutyrate (HBM), ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, t-butyl acetate, t-butyl propionate, propylene glycol mono-t-butyl ether acetate, benzyl propionate, cyclic or acyclic carbonates (such as propylene carbonate, dimethyl carbonate, ethylene carbonate, and diphenyl carbonate); lactones, such as gamma-butyrolactone (GBL); lactams, such as N-methylpyrrolidone; and any combination of the foregoing. Among these, preferred solvents are PGME, PGEE, PGMEA, EL, HBM, CHO, GBL, and combinations thereof. The total solvent content (i.e., the cumulative solvent content of all solvents) in the coating composition is 50 to 99 wt.%, typically 80 to 99 wt.%, and more typically 90 to 99 wt.% based on the coating composition. The desired solvent content will depend on, for example, the desired thickness of the underlying layer being coated and the coating conditions.
The coating composition of the present invention may optionally comprise one or more monomers, such as one or more vinyl-containing monomers selected from (meth) acrylate monomers and vinyl aromatic monomers. The one or more monomers may comprise one or more functional groups selected from, for example: hydroxyl, alkoxy, epoxy, alkenyl, alkynyl, carboxylic acid, acetal, ketal, tertiary alkyl ester, and amine. Among these functional groups, an epoxy group is particularly preferable. Such additive monomers, if present, can be present in the composition in a wide range such as 1 to 90 weight percent based on the total solids of the coating composition.
The coating composition of the present invention may also comprise one or more coating additives typically used in such coatings, such as curing agents, crosslinking agents, surface leveling agents, flow additives, and the like. The selection of such optional additives and their amounts are well within the ability of those skilled in the art. The curing agent, if used in the composition, is typically present in an amount of 1 to 20 weight percent, and preferably 1 to 3 weight percent, based on total solids. If used, the crosslinking agent is typically present in an amount of 1 to 30 wt%, and preferably 3 to 10 wt%, based on total solids. If used, the surface leveling agent is typically used in an amount of 0.01 to 5 wt%, and preferably 0.01 to 1 wt%, based on the total solids. If used, the flow additive is typically used in an amount of 0.01 to 5 wt%, and preferably 0.01 to 3 wt%, based on total solids. The selection of such optional additives and their amounts of use are within the ability of those skilled in the art.
Curing agents may optionally be used in the coating composition to aid in the curing of the composition after coating. The curing agent is any component that causes the composition to cure on the surface of the substrate. Preferred curing agents are acids and thermal acid generators. Suitable acids include, but are not limited to: arylsulfonic acids such as p-toluenesulfonic acid; alkylsulfonic acids such as methanesulfonic acid, ethanesulfonic acid, and propanesulfonic acid; perfluoroalkylsulfonic acids such as trifluoromethanesulfonic acid; and perfluoroarylsulfonic acids. A thermal acid generator is any compound that releases an acid upon exposure to heat. Thermal acid generators are well known in the art and are generally commercially available as from King Industries, Norwalk, Connecticut. Exemplary thermal acid generators include, but are not limited to, amine-terminated strong acids, such as amine-terminated dodecylbenzene sulfonic acid. It will also be understood by those skilled in the art that certain photoacid generators are capable of releasing acid upon heating and can be used as thermal acid generators.
Any suitable crosslinking agent may be used in the compositions of the present invention, provided such crosslinking agent has at least 2, and preferably at least 3 moieties capable of reacting with the aromatic resin reaction product of the present invention under suitable conditions (e.g., under acidic conditions). Exemplary crosslinking agents include, but are not limited to, novolac resins, epoxy-containing compounds, melamine compounds, guanamine compounds, isocyanate-containing compounds, benzocyclobutene, and the like, and preferably 2 or more, preferably 3 or more, and more preferably 4 of the foregoing are selected from epoxy, methylol, C1-C10Alkoxymethyl group, and C2-C10Any one of substituents of acyloxymethyl. Suitable crosslinking agents are well known in the art and are commercially available from a variety of sources. Examples of suitable crosslinking agents include those having formulas (3), (4), (5), and (6):
the coating composition of the present invention may optionally comprise one or more surface leveling agents (or surfactants). Although any suitable surfactant may be used, such surfactants are typically nonionic. Exemplary nonionic surfactants are those containing alkyleneoxy linkages (e.g., ethyleneoxy, propyleneoxy, or a combination of ethyleneoxy and propyleneoxy linkages).
The coating composition and the film formed therefrom of the present invention can exhibit good gap filling, surface planarization, solvent peeling resistance, and film quality characteristics. The composition of the present invention preferably substantially fills, and more preferably completely fills, the plurality of gaps in the semiconductor substrate. Preferably, the gap is substantially or completely void-free.
In electronic device manufacturing, an aromatic layer formed from the coating composition described herein can be formed according to a method comprising: (a) providing an electronic device substrate; (b) coating a layer of a coating composition as described herein on a surface of the electronic device substrate; and (c) curing the layer of curable compound to form a cured layer. The composition may be used in electronic device manufacturing as one or more of a photoresist underlayer, a planarization layer, a gap fill layer, or a protective layer.
In an illustrative aspect of the present invention, a method of patterning an underlayer of a photoresist using the coating composition of the present invention will be described. The method comprises the following steps: (a) providing an electronic device substrate; (b) coating a layer of a coating composition as described herein on a surface of the electronic device substrate; (c) curing the layer of curable compound to form a primer layer; (d) forming a photoresist layer on the bottom layer; (e) patternwise exposing the photoresist layer to activating radiation; (f) developing the exposed photoresist layer to form a pattern in the photoresist layer; and (g) transferring the pattern to the substrate.
Suitable substrates on which the coating composition may be applied include electronic device substrates. A wide variety of electronic device substrates may be used in the present invention, such as: package substrates, such as multi-chip modules; a flat panel display substrate; an integrated circuit substrate; a substrate for a Light Emitting Diode (LED) including an Organic Light Emitting Diode (OLED); a semiconductor wafer; a polycrystalline silicon substrate; etc., wherein semiconductor wafers are preferred. Such substrates are typically composed of one or more of silicon, polysilicon, silicon oxide, silicon nitride, silicon oxynitride, silicon germanium, gallium arsenide, aluminum, sapphire, tungsten, titanium-tungsten, nickel, copper, and gold. Suitable substrates may be in the form of wafers, such as those used in the manufacture of integrated circuits, optical sensors, flat panel displays, integrated optical circuits, and LEDs. As used herein, the term "semiconductor wafer" is intended to encompass "semiconductor substrates," "semiconductor devices," and various packages for various levels of interconnection, including single chip wafers, multi-chip wafers, packages for various levels, or other components requiring solder connections. Such substrates may be of any suitable size. The preferred wafer substrate diameter is 200mm to 300mm, although wafers of smaller and larger diameters may be suitably used in accordance with the present invention. As used herein, the term "semiconductor substrate" includes any substrate having one or more layers or structures that may optionally include active or operable portions of a semiconductor device. Semiconductor devices refer to semiconductor substrates on which at least one microelectronic device has been or is being mass-produced.
Optionally, an adhesion promoter layer may be applied to the substrate surface prior to application of the coating composition of the present invention. If an adhesion promoter is desired, any suitable adhesion promoter for the polymer film may be used, such as a silane, preferably an organosilane such as trimethoxyvinylsilane, triethoxyvinylsilane, hexamethyldisilazane, or an aminosilane coupling agent such as gamma-aminopropyltriethoxysilane. Particularly suitable adhesion promoters include those available from dupont electronics & Imaging, marburg, Massachusetts under the names AP 3000, AP 8000, and AP 9000S.
The coating composition of the present invention can be coated on the electronic device substrate by any suitable means such as spin coating, slot die coating, knife coating, curtain coating, roll coating, spray coating, dip coating, and the like. Among these, spin coating is preferable. In a typical spin coating process, the composition of the present invention is applied to a substrate rotating at a rate of 500 to 4000rpm for a period of 15 to 90 seconds to obtain a desired layer of coating composition on the electronic device substrate. It will be understood by those skilled in the art that the height of the coating composition layer can be adjusted by varying the rotation speed.
After the coating composition layer is applied to the substrate, it is optionally baked at a relatively low temperature to remove any organic solvents and other relatively volatile components from the layer. Typically, the substrate is baked at a temperature of 80 ℃ to 150 ℃, although other suitable temperatures may be used. The baking time is typically 10 seconds to 10 minutes, and preferably 30 seconds to 5 minutes, although longer or shorter times may be used. When the substrate is a wafer, this baking step may be performed by heating the wafer on a hot plate. After removal of the solvent, a layer, film or coating of the curable compound on the substrate surface is obtained.
The curable compound layer is then sufficiently cured to form an aromatic underlayer under conditions such that the film is not intermixed with subsequently applied coatings (e.g., photoresist layers or other layers coated directly onto the aromatic underlayer) while still maintaining the desired antireflective properties (n and k values) and etch selectivity of the underlayer film. The primer layer may be cured in an oxygen-containing atmosphere (such as air) or in an inert atmosphere (such as nitrogen), and preferably in an oxygen-containing atmosphere. This curing step is preferably carried out on a hot plate apparatus, although oven curing may be used. Typically, this curing is carried out by heating the underlayer at a curing temperature of 150 ℃ or higher, preferably 170 ℃ or higher, and more preferably 200 ℃ or higher. The curing temperature and time are selected to be sufficient to cure the aromatic underlayer. Suitable temperature ranges for curing the aromatic base layer are from 150 ℃ to 400 ℃, preferably from 170 ℃ to 350 ℃, and more preferably from 200 ℃ to 250 ℃. This curing step may take from 10 seconds to 10 minutes, preferably from 1 to 3 minutes, and more preferably from 1 to 2 minutes, although other suitable times may be used.
An initial bake step may not be necessary if the curing step is performed in such a way that the rapid release of solvent and curing by-products does not allow for the destruction of the underlying film quality. For example, a ramp-up bake that starts at a relatively low temperature and then gradually increases to a temperature of ≧ 200 ℃ may produce acceptable results. In some cases, it may be preferred to have a multi-stage curing process, such as a two-stage process, where the first stage is a lower bake temperature of less than 150 ℃ and the second stage is a higher bake temperature of ≧ 200 ℃. The multi-stage curing process can promote uniform filling and planarization of pre-existing substrate surface topography, such as filling of trenches and vias.
After curing the underlying layer, one or more process layers, such as a photoresist, a silicon-containing layer, a hard mask layer, a bottom anti-reflective coating (or BARC) layer, etc., may be applied over the cured underlying layer. For example, a photoresist may be coated (e.g., by spin coating) directly on the surface of the silicon-containing layer or other intermediate layer directly on the resin underlayer, or alternatively, the photoresist may be coated directly on the cured underlayer. A wide variety of photoresists may suitably be used, such as those used for 193nm lithography, such as that available as Epic from DuPont electronics and imaging corporation (Marburg, Mass.)TMThose sold by the brand. Suitable photoresists may be positive or negative. After coating, the photoresist layer is then imaged (exposed) using patterned activating radiation, and the exposed photoresist layer is then developed using a suitable developer to provide a patterned photoresist layer. The exposure of the photoresist layer to activating radiation as referred to herein indicates that the radiation is capable of forming a latent image in the photoresist layer. The photoresist layer may be exposed to activating radiation through a patterned photomask having optically opaque and optically transparent regions or by direct writing. Next, the pattern is transferred from the photoresist layer to the underlying layer by an appropriate etching technique. Typically, the photoresist is also removed during this etching step. Next, the pattern is transferred to the substrate and the underlayer is removed by a suitable etching technique known in the art, such as by plasma etching. After patterning the substrate, conventional techniques are usedThe bottom layer is removed. The electronic device substrate is then processed according to conventional means.
The cured underlayer may be used as a bottom layer of a multi-layer resist process. In such a process, a layer of the coating composition is applied to the substrate and cured as described above. Next, one or more intermediate layers are coated on the aromatic base layer. For example, a silicon-containing layer or a hard mask layer may be coated directly on the aromatic underlayer. An exemplary silicon-containing layer, such as a silicon-BARC, can be deposited on the underlayer by spin coating, followed by curing, or an inorganic silicon layer, such as SiON or SiO, can be deposited on the underlayer by Chemical Vapor Deposition (CVD). Any suitable hardmask may be used and may be deposited on the underlayer by any suitable technique and cured (as appropriate). Optionally, an organic BARC layer may be placed directly on the silicon-containing layer or the hard mask layer and cured as appropriate. Next, a photoresist (such as those used in 193nm lithography) is coated directly on the silicon-containing layer (in a three layer process) or directly on the organic BARC layer (in a four layer process). The photoresist layer is then imaged (exposed) using patterned activating radiation, and the exposed photoresist layer is then developed using an appropriate developer to provide a patterned photoresist layer. Next, the pattern is transferred from the photoresist layer to the layer directly below it by a suitable etching technique known in the art, such as by plasma etching. This results in a patterned silicon-containing layer in a three layer process and a patterned organic BARC layer in a four layer process. If a four layer process is used, a pattern is then transferred from the organic BARC layer to the silicon-containing layer or the hard mask layer using an appropriate pattern transfer technique, such as plasma etching. After patterning the silicon-containing layer or the hardmask layer, an appropriate etch technique (e.g., O) is then used2Or CF4Plasma) to pattern the aromatic underlayer. During the etching of the aromatic underlayer, any remaining patterned photoresist layer and organic BARC layer are removed. Next, the pattern is transferred to the substrate, such as by an appropriate etch technique, which also removes any remaining silicon-containing layer or hard mask layer, followed by removal of any remaining patterned aromatic underlayer to provide a patternA patterned substrate.
The cured underlayer of the present invention can also be used in a self-aligned double patterning process. In such a process, a layer of the coating composition of the present invention is applied to the substrate, preferably by spin coating. Any remaining organic solvent is removed and the coating composition layer is cured to form a cured underlayer. A suitable intermediate layer, such as a silicon-containing layer, is applied over the cured primer layer. A suitable photoresist layer is then applied over the intermediate layer, such as by spin coating. The photoresist layer is then patternwise imaged (exposed) with activating radiation, and the exposed photoresist layer is then developed using a suitable developer to provide a patterned photoresist layer. Next, a pattern is transferred from the photoresist layer to the intermediate layer and the cured underlying layer by an appropriate etching technique to expose a portion of the substrate. Typically, the photoresist is also removed during this etching step. Next, a conformal silicon-containing layer is disposed over the patterned cured underlayer and exposed portions of the substrate. Such silicon-containing layers are typically inorganic silicon layers, such as SiON or SiO, conventionally deposited by CVD2. Such conformal coatings produce a silicon-containing layer on exposed portions of the substrate surface and on underlying patterns. That is, the silicon-containing layer substantially covers the sides and top of the patterned underlayer. Next, the silicon-containing layer is partially etched (trimmed) to expose a top surface of the patterned polyarylene resin underlayer and a portion of the substrate. After this partial etching step, the pattern on the substrate comprises a plurality of features, each feature comprising a cured underlayer of lines or pillars, wherein the silicon-containing layer is directly adjacent to the sides of each cured underlayer feature, also referred to as sidewall spacers. Next, the cured underlayer is removed, such as by etching, to expose a surface of the substrate underlying the cured underlayer pattern and to provide a patterned silicon-containing layer on the surface of the substrate, wherein such patterned silicon-containing layer is doubled (i.e., twice as many lines and/or pillars) as compared to the patterned cured underlayer.
In addition to their use in forming photoresist underlayers and patterns as described above, the coating compositions of the present invention can be used to form planarizing, gap-filling, and protective layers in integrated circuit fabrication. When used as such layers, one or more intervening material layers (e.g., silicon-containing layers, other aromatic resin layers, hardmask layers, etc.) are typically present between the cured layer of the coating composition of the invention and any photoresist layers. Typically, such planarization layers, gap-fill layers, and protective layers are finally patterned.
The following non-limiting examples illustrate the invention.
Examples of the invention
Synthesis examples
Synthesis example A
4-Iodophenylacetate (24.75g), cuprous iodide (0.17g) and triethylamine (27.32g) were added to 22.82g of 1, 4-dioxane at room temperature. The reaction mixture was purged with nitrogen for 1 hour. Bis (triphenylphosphine) palladium (II) chloride (0.63g) was added to the reaction mixture and the mixture was heated to 70 ℃. A solution of 1, 3, 5-triacetylbenzene (4.5g) in degassed 1, 4-dioxane (20g) was then slowly added to the reaction mixture by syringe pump. After the addition was complete, the reaction mixture was stirred at 70 ℃ under nitrogen overnight. After completion of the reaction, the reaction mixture was cooled to room temperature, and the solvent was evaporated. The residue was diluted with ethyl acetate and filtered to remove solids. The solution was evaporated and the residue was purified by column chromatography to give a light yellow solid. The solid obtained was then dissolved in THF (38g) under nitrogen. Lithium hydroxide monohydrate (3.81g) and water (16g) were added, and the mixture was stirred at 60 ℃ for 1 hour. The mixture was then cooled to room temperature and the solvent was removed. The residue was diluted with ethyl acetate and water, and then treated with hydrochloric acid until the pH of the aqueous layer was 1. The organic phase was separated and the aqueous phase was extracted with ethyl acetate. The organic layers were combined and washed with water. The solvent was removed under vacuum and the residue was purified by column chromatography to give 1, 3, 5-tris ((4-hydroxyphenyl) ethynyl) benzene as a pale yellow solid (7.7g, 61% yield). The reaction is shown in reaction scheme 1.
Synthesis example B
5, 5' -oxybis (1, 3-dibromobenzene) (3.61g), cuprous iodide (0.21g) and triethylamine (3.42g) were added to 20g of 1, 4-dioxane at room temperature. The reaction mixture was purged with nitrogen for 1 hour. Bis (triphenylphosphine) palladium (II) chloride (0.53g) was added to the reaction mixture and the mixture was heated to 70 ℃. 4-ethynylphenyl acetate (4.81g) was dissolved in degassed 1, 4-dioxane (17g) and the solution was then slowly added to the reaction mixture through the addition funnel. After the addition was complete, the reaction mixture was stirred at 70 ℃ under nitrogen overnight. After completion of the reaction, the reaction mixture was cooled to room temperature, filtered, and the solvent was evaporated. The residue was purified by chromatography to give a light yellow solid. The solid thus obtained was then dissolved in THF (40g) under nitrogen. Lithium hydroxide monohydrate (1.26g) and water (10g) were added, and the mixture was stirred at 60 ℃ for 1 hour. The reaction mixture was then diluted with ethyl acetate and then treated with hydrochloric acid until the pH of the aqueous layer was 1. The organic phase was separated and the aqueous phase was extracted with ethyl acetate. The organic layers were combined and washed with water. The solvent was removed under vacuum and the residue was purified by column chromatography to give 5, 5' -oxybis (1, 3-bis ((4-hydroxyphenyl) ethynyl) benzene) (3.1g, 65% yield) as a pale yellow solid. The reaction is shown in reaction scheme 2.
Synthesis example C
1, 3, 5-tris ((4-hydroxyphenyl) ethynyl) benzene (6.0g) in anhydrous DMF (46g) was stirred at room temperature for 15 minutes. The mixture was heated to 30 ℃ and then K was added2CO3(10.34 g). The reaction mixture was heated to 50 ℃ and 8.63g of bromopropyne (80%In toluene). The temperature was maintained at 50 ℃ for 24 hours. The reaction mixture was then cooled to room temperature and filtered to remove most of the K2CO3. The organics were precipitated into 2L of water and stirred at room temperature for 0.5 h. The precipitated polymer was collected by filtration to provide the product as a pale yellow solid (5.8g, 76% yield). The reaction is shown in reaction scheme 3.
Synthesis example D
A three-necked 50mL round bottom flask was equipped with a mechanical stirrer, a thermowell, and a condenser with a nitrogen inlet. A flask was charged with 1-pyrenyl alcohol (10.0g), 2-naphthaldehyde (7.2g), and PGME (40 mL). The reaction mixture was then stirred at room temperature under nitrogen. After 30 minutes a clear solution was obtained and methanesulfonic acid (2.2g) was added to the reaction mixture. The reaction mixture was heated to 120 ℃ for 4 hours to provide a concentrated solution. The reaction mixture was then cooled to room temperature. The mixture was added to 400mL methanol and water (v/v-4/1) resulting in a grey precipitate. The precipitated resin was filtered with a buchner funnel and dried in vacuo at 70 ℃ to give the resin as a grey solid (11.3g, Mw ═ 1229). The reaction is shown in reaction scheme 4.
Synthesis example E
1, 3, 5-tris ((4-hydroxyphenyl) ethynyl) benzene (50g), material A and PGMEA (72g) were added to a 250mL round bottom flask. The flask was charged with nitrogen and the reaction mixture was stirred at room temperature until all solids were dissolved. The solution was then heated to 140 ℃. The mixture was cooled to room temperature and diluted with PGMEA (45 g). The resulting solution was then filtered through a 0.2 micron PTFE filter to yield B-stage material E (Mw 1550). The reaction is shown in reaction scheme 5.
Synthesis example F
A mixture of 30.0g of 3, 3' - (oxybis-1, 4-phenylene) bis (2, 4, 5-triphenylcyclopentadienone), 18.1g of 1, 3, 5-tris (phenylethynyl) benzene and 102.2g of gamma-butyrolactone was heated at 185 ℃ for 14 hours. The reaction was then cooled to room temperature and diluted with 21.5g of GBL. The crude reaction mixture was added to 1.7L of a 1: 1 mixture of IPA/PGME and stirred for 30 minutes. The solid was collected by vacuum filtration and washed with a 1: 1 mixture of IPA/PGME. To this solid 0.4L of water was added and the slurry was heated to 50 ℃ and stirred at 50 ℃ for 30 minutes. The warm slurry was filtered by vacuum filtration. The wet cake was dried under vacuum at 70 ℃ for 2 days to yield polymer (34.1g, 71% yield, Mw 3588, PDI 1.38). The reaction is shown in reaction scheme 6.
Preparation of underlayer composition
Examples 1 to 26
The materials as prepared in the synthetic examples (including any added solvent) were added to the PGMEA/benzyl benzoate mixture (97/3 by weight after addition of the polymer and comparative material compositions) to form a solution having about 5 wt% total solids. Other components (if any) were combined with the solution to provide an underlayer composition formulation having the components in the relative amounts described in table 1.
TABLE 1
The content of curable compounds, polymers and other solid materials does not include solvents; GMA ═ polyglycidyl methacrylate (Miwon Commercial co., Ltd.); MF ═ MODAFLOW acrylic (allex Netherlands b.v.) resin; HM ═ hexakis (methoxymethyl) melamine (Nihon Cytec Industries Inc.); s275 ═ 1-naphthol/formaldehyde novolac polymer (Gun-Ei chemical); PHS (poly (4-hydroxystyrene) Mw 5000 (Toyota Tsusho America, Inc.)); MA ═ copolymer of hydroxyethyl methacrylate/methyl methacrylate 40/60 (st.jean photochemical company (st.jean Photochemicals)); PB PGMEA/benzyl benzoate (97/3 by weight after addition of materials and comparative material compositions); the values for the components are wt% solids based on the total primer composition.
Evaluation of solvent peeling resistance
Examples 1 to 26
Each composition was spin coated at 1500rpm on an ACT-8 Clean Track (Tokyo electronics Co.) onto a corresponding 200mm silicon wafer and then cured at the temperatures and times listed in table 2 to form a film. Using Therma-Wave OptiProbeTMThe metrology tool measures the initial film thickness. The PGMEA remover was then applied to each film for 90 seconds followed by a post peel bake at 105 ℃ for 60 seconds. The thickness of each film was again measured to determine the amount of film thickness loss. The difference in film thickness before and after contact with the PGMEA remover is listed in table 2 as a percentage of the remaining film thickness on the wafer (% remaining film). This value indicates the degree of crosslinking of the polymer layer.
TABLE 2
Examples of the invention
Underlayer composition
Curing temperature/time
% residual film
1
UC-1
350℃/60s
＞99％
2
UC-2
300℃/60s
＞99％
3
UC-3
300℃/60s
＞99％
4
UC-4
240℃/60s
＞99％
5
UC-5
240℃/60s
＞99％
6
UC-6
300℃/60s
＞99％
7
UC-7
240℃/60s
＞99％
8
UC-8
300℃/60s
95％
9
UC-9
240℃/60s
＞99％
10
UC-10
220℃/60s
＞99％
11
UC-11
220℃/60s
＞99％
12
UC-12
220℃/60s
＞99％
13
UC-13
220℃/60s
86％
14
UC-14
220℃/60s
＞99％
15
UC-15
220℃/60s
＞99％
16
UC-16
220℃/60s
＞99％
17
UC-17
350℃/90s
＞99％
18 (comparison)
UC-18
350℃/60s
85％
19 (comparison)
UC-19
300℃/60s
64％
20 (comparison)
UC-20
240℃/60s
＞99％
21 (comparison)
UC-21
300℃/60s
3％
22 (comparison)
UC-22
240℃/60s
89％
23 (comparison)
UC-23
300℃/60s
5％
24 (comparison)
UC-24
240℃/60s
4％
25 (comparison)
UC-25
220℃/60s
＜5％
26 (comparison)
UC-26
350℃/90s
＜10％
Gap filling and planarization evaluation
Examples 27 to 41
The gap fill and planarization performance of the underlying composition was evaluated using 300mm silicon wafers with various patterned features. These features are formed in a 100nm thick PECVD silicon oxide layer coated on the wafer. The wafers were dehydration baked at 150 ℃ for 60 seconds prior to application of these compositions. The compositions were each coated on the corresponding wafers using ACT-8 Clean Track (Tokyo electronics) at 1300-. The coated composition was cured by placing the wafer on a hot plate under the temperature and time conditions in table 3. The sectional images were taken on a Hitachi High Technology S4800 CD-SEM.
The gap fill performance was evaluated by visual inspection of the 45nm 1: 1(90nm pitch) line/space pattern overcoated with the underlayer using SEM images. If no voids or bubbles are observed, the gap filling performance is considered good. The planarization performance of the underlayer composition was evaluated using a pattern of trenches overcoated with the underlayer (2 micron wide spaces defined between 3 micron wide lines). The KLA Tencor P-7 stylus profiler measures the height difference between the maximum height (over the trench line pattern) and the minimum height (over the trench spacing) of the underlayer. Has the advantages ofOr less, is considered to have good planarization and to have a height difference of more thanThe film of the height difference of (a) is considered to have poor planarization. The results are shown in Table 3.
TABLE 3
Examples of the invention
Underlayer composition
Curing temperature/time
Gap filling
Planarization of
27
UC-1
350℃/60s.
Good effect
Good effect
28
UC-6
300℃/60s.
Good effect
Good effect
29
UC-7
240℃/60s.
Good effect
Good effect
30
UC-8
300℃/60s.
Good effect
Good effect
31
UC-9
240℃/60s.
Good effect
Good effect
32
UC-10
220℃/60s.
Good effect
Good effect
33
UC-11
220℃/60s.
Good effect
Good effect
34
UC-14
220℃/60s.
Good effect
Good effect
35
UC-15
220℃/60s.
Good effect
Good effect
36
UC-16
220℃/60s.
Good effect
Good effect
37
UC-17
350℃/90s.
Good effect
Good effect
38 (comparison)
UC-18
350℃/60s.
Good effect
Difference (D)
39 (comparison)
UC-19
300℃/60s.
Good effect
Difference (D)
40 (comparison)
UC-20
240℃/60s.
Good effect
Difference (D)
41 (comparison)
UC-26
350℃/90s.
Good effect
Difference (D)
Evaluation of coating quality
Examples 42 to 63
The underlayer compositions were each spin-coated on a corresponding 200mm silicon wafer at 1500rpm in ACT-8 Clean Track (tokyo electronics) and then cured under the temperature and time conditions in table 4 to form an underlayer film. The coating quality was evaluated by visual inspection of the film with both the naked eye and an optical microscope. If any streaking or dewetting is observed, the coating quality is judged to be poor quality, and in the absence of them, good quality. The results are reported in table 4.
TABLE 4
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